Patent application number | Description | Published |
20080267991 | IMMUNO-MODULATING ANTITUMOR ACTIVITIES OF GANODERMA LUCIDUM (REISHI) POLYSACCHARIDES - The present invention provides methods of modulating an immune response in an organism by administering medicinally active extracts and fractions, and a method for preparing the same by extracting and fractioning constituents from the tissue of components of | 10-30-2008 |
20090075397 | Method for characterizing sugar-binding interactions of biomolecules - This invention provides a donor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a photosensitizer which, upon excitation by laser light of a suitable wavelength, converts ambient oxygen to singlet state oxygen. This invention also provides an acceptor bead for use in an assay, wherein the bead (a) is coated with a layer of hydrogel having directly or indirectly bound thereto a polyacrylamide-supported sugar or a polyacrylamide-supported glycan, and (b) comprises a chemiluminescer and a fluorophore, whereby when the bead is contacted with singlet state oxygen, the singlet state oxygen reacts with the chemiluminescer which in turn activates the fluorophore so as to cause the emission of light of a predetermined wavelength. This invention further provides related kits, detection methods and characterization methods. | 03-19-2009 |
20100057356 | NAVIGATION SYSTEM CAPABLE OF UPDATING MAP DATA AND METHOD THEREOF - A navigation system includes a plurality of navigation devices and a server. The plurality of navigation devices is used for generating a plurality of position data respectively. Each navigation device generates at least one path data according to the plurality of position data and at least one corresponding electronic map and transmits the path data to the server. Then, the server calculates at least one optimum path data and updates the plurality of navigation devices according to the optimum path data. | 03-04-2010 |
20100113519 | 1,5-Dideoxy-1,5-imino-D-glucitol Compounds - 1,5-Dideoxy-1,5-imino-D-glucitol compounds as shown in the specification. Also disclosed is a method of treating a hexosaminidase-associated disease. | 05-06-2010 |
20110065758 | Compositions and assays for treatment and diagnosis of helicobacter pylori infection and conditions - Methods of diagnosing | 03-17-2011 |
20130119532 | Bumps for Chip Scale Packaging - A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved. | 05-16-2013 |
20130175705 | Stress Compensation Layer for 3D Packaging - A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate. | 07-11-2013 |
20130187277 | CRACK STOPPER ON UNDER-BUMP METALLIZATION LAYER - A semiconductor die includes a crack stopper on an under-bump metallization (UBM) layer. The crack stopper is in the shape of hollow cylinder with at least two openings. | 07-25-2013 |
20130221522 | MECHANISMS OF FORMING CONNECTORS FOR PACKAGE ON PACKAGE - The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements. | 08-29-2013 |
20140167263 | Methods and Apparatus for Package with Interposers - Methods and apparatus for an interposer with dams used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A plurality of dams may be formed above the metal layer around each corner of the metal layer. Dams may be formed on both sides of the interposer substrate. A dam surrounds an area where connectors such as solder balls may be located to connect to other packages. A non-conductive dam may be formed above the dam. An underfill may be formed under the package connected to the connector, above the metal layer, and contained within the area surrounded by the dams at the corner, so that the connectors are well protected by the underfill. Such dams may be further formed on a printed circuit board as well. | 06-19-2014 |
20140183746 | Zero Stand-Off Bonding System and Method - A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate. | 07-03-2014 |
20140191394 | Bumps for Chip Scale Packaging - A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved. | 07-10-2014 |
20140264810 | Packages with Molding Material Forming Steps - A package includes a first package component having a top surface, a second package component bonded to the top surface of the first package component, and a plurality of electrical connectors at the top surface of the first package component. A molding material is over the first package component and molding the second package component therein. The molding material includes a first portion overlapping the second package component, wherein the first portion includes a first top surface, and a second portion encircling the first portion and molding bottom portions of the plurality of electrical connectors therein. The second portion has a second top surface lower than the first top surface. | 09-18-2014 |
20140264849 | Package-on-Package Structure - A device comprises a bottom package mounted on a printed circuit board, wherein the bottom package comprises a plurality of first bumps formed between the bottom package and the printed circuit board, a first underfill layer formed between the printed circuit board and the bottom package, a semiconductor die mounted on the bottom package and a top package bonded on the bottom package, wherein the top package comprises a plurality of second bumps and the top package and the bottom package form a ladder shaped structure. The device further comprises a second underfill layer formed between the bottom package and the top package, wherein the second underfill layer is formed of a same material as the first underfill layer. | 09-18-2014 |