Chrysler
Gregory Chrysler, Chandler, AZ US
Patent application number | Description | Published |
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20150332987 | Microelectronic Assembly including Built-In Thermoelectric Cooler and Method of Fabricating Same - A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device. | 11-19-2015 |
Gregory M. Chrysler, Chadler, AZ US
Patent application number | Description | Published |
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20090152713 | INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX - Embodiments of a thermal interface material layer comprised of an oil or a wax are disclosed. The thermal interface material may be used to thermally couple an integrated circuit die to a thermal component, such as a heat spreader. Other embodiments are described and claimed. | 06-18-2009 |
Gregory M. Chrysler, Sun Lakes, AZ US
Patent application number | Description | Published |
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20090166890 | Flip-chip package - A flip-chip package is described. The package has an integrated circuit (IC) die positioned within an epoxy layer on the top surface of a package substrate. Cooling of the IC die is facilitated by a heat spreader having two contact surfaces separated by a pedestal, the first contact surface for attachment to the epoxy layer the second contact surface for thermal attachment to the exposed backside surface of the IC die, the pedestal thickness is selected so as to create a gap between the first contact surface and the epoxy layer. | 07-02-2009 |
20090310300 | Flow-Through Air Conditioning for Electronics Racks - A cabinet adapted with a cooling system is described. Embodiments include electronics cabinets which house electronic equipment. A flow of air is set up in the interior of the cabinet by drawing in ambient air. The incoming air is cooled by an evaporator component of a cooling system. The cooled air cools the electronics and in the process becomes heated air. The heated air serves to cool a condenser component of the cooling system, thereby further heating the heated air. The heated air is then exhausted from the cabinet. | 12-17-2009 |
Gregory Martin Chrysler, Chandler, AZ US
Patent application number | Description | Published |
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20080236175 | MICROARCHITECTURE CONTROL FOR THERMOELECTRIC COOLING - An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed. | 10-02-2008 |
Gregory Martin Chrysler, Sun Lakes, AZ US
Patent application number | Description | Published |
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20090085198 | NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING - The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap. | 04-02-2009 |
20110269271 | NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING - The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap. | 11-03-2011 |
Jimmie D. Chrysler, Wyoming, MI US
Patent application number | Description | Published |
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20090242053 | DIVERTER VALVE - A diverter valve for selectively controlling the flow of fluid from a fluid source to one of several fluid outlets includes a fixed ceramic disk fixed to a housing and a rotating ceramic disk retained in the housing against the fixed disk by a retainer. An accessory mount is adhered to the rotating ceramic disk to facilitate connection to accessories and to direct fluid from the valve. Flow passages in the disks cooperate with flow passages in the housing and flow passages in the accessory mount to balance the pressure of fluid flow within the valve against the disks to minimize leaks and prolong durability. | 10-01-2009 |
Jimmie Dale Chrysler, Wyoming, MI US
Patent application number | Description | Published |
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20130257072 | Cane and Crutch grasping device - An attachment for use with a walking cane or crutch to facilitate picking up objects from the surface. The attachment is designed to attach to most walking canes and crutches without modifying the original design walking aide, having a unique adjustment system that enables use on adjustable style walking aides. Includes a trigger mechanism located under the hand grip, actuating a pivotal arm mechanism located along the side of the cane tip, and away from the operator walking side, the pivotal arms are stored in the vertical position and rotate down, to 180 degrees to clamp on objects at ground level. The parts and mechanism are designed to be symmetrical and may be positioned on either side for right hand or left hand use. Although pictured with an offset cane it is designed to be used with a straight shafted cane and also crutches. | 10-03-2013 |
Steven O. Chrysler, Canandaigua, NY US
Patent application number | Description | Published |
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20100142710 | ENHANCED RELATIONAL DATABASE SECURITY THROUGH ENCRYPTION OF TABLE INDICES | 06-10-2010 |