Patent application number | Description | Published |
20080259106 | METHOD FOR MANUFACTURING PATTERNED LAYER ON SUBSTRATE - A method for manufacturing a patterned layer ( | 10-23-2008 |
20090103023 | COLOR FILTER AND METHOD FOR MANUFACTURING SAME - A color filter includes a substrate, a black matrix formed on the substrate, and a plurality of color stripes. The black matrix defines a plurality of accommodating rooms therein, and the black matrix includes carbon black in a proportion by weight of less than or equal to 55%, polymer in a proportion by weight from 15% to 95%, and additives in a proportion by weight of less than or equal to 25%. The polymer includes at least one of a fluoro compound or a siloxane compound. The plurality of color stripes are formed by an ink-jet process in the accommodating rooms. A method for manufacturing a color filter is also provided. | 04-23-2009 |
20090256875 | METHOD FOR MANUFACTURING PATTERNED THIN-FILM LAYER - A method for manufacturing a patterned thin-film layer includes the steps of: providing a substrate with a plurality of banks thereon, the plurality of banks defining a plurality of spaces; providing an ink-jet device comprising a plurality of nozzles for depositing ink therefrom; generating a jetting information about ink volume that each of the nozzles deposits into the respective spaces by a random method, the jetting information meeting ink volume deposited into each of the spaces is in a range from about 92.5% to about 107.5% of an average volume of ink in the spaces; making the nozzles to deposit ink into the respective spaces according to the jetting information; and solidifying the ink so as to form a plurality of patterned thin-film layers formed in the spaces. | 10-15-2009 |
20100233387 | INK FOR MAKING COLOR FILTER AND COLOR FILTER MADE THEREOF - An ink includes a solvent, a colorant, an initiator or dispersant, and a mixture of polymerizable high-viscosity component and polymerizable low-viscosity component polymerizable low-viscosity component. | 09-16-2010 |
20110014576 | METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE - A method for manufacturing a substrate structure includes providing a substrate, forming a plurality of banks on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, dispensing ink into accommodating rooms in such a manner that the ink covers portions of the banks located between at least two adjacent accommodating rooms using a dispenser, and solidifying the ink in the accommodating rooms to form a patterned layer. | 01-20-2011 |
20110146905 | METHOD FOR FORMING PATTERNED LAYER ON SUBSTRATE STRUCTURE - A method for forming a patterned layer on the substrate structure, comprising the steps of providing a substrate structure, a plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, jetting ink into the accommodating rooms using an ink jet device, and solidifying the ink in the accommodating rooms to form the patterned layer on the substrate structure. | 06-23-2011 |
Patent application number | Description | Published |
20120183109 | WORLD DIGITAL RADIO RECEIVER WITH IMAGE SIGNAL REJECTION - A broadcast receiver with image rejection is proposed. The broadcast receiver includes a radio frequency processing unit and a baseband processing unit. The radio frequency processing unit receives a first input signal and a second input signal, amplifies the first input signal and the second input signal, down-converts the second input signal, and generating a first signal and a down-converted second signal. Besides, the baseband processing unit receives one of the first signal and the down-converted second signal, filters the received signal thereof, wherein the baseband processing unit comprises an anti-aliasing filter unit which attenuates adjacent channel interference of the received signal, and when the received signal is the down-converted second signal, the anti-aliasing filter unit attenuates a portion of an image signal in the received signal. | 07-19-2012 |
20140117974 | RSSI CIRCUIT WITH LOW VOLTAGE AND WIDE DETECTABLE POWER RANGE - An RSSI circuit with low voltage and wide detectable power range is provided, including a plurality of amplifiers connected in a cascade manner; a plurality of rectifiers, each of the plurality of rectifier having an input connected to an output of each of the plurality of amplifiers in turn; and a selector, connected to an output of each of the plurality of rectifiers for selecting an output among the outputs from the plurality of rectifiers. By using selector to select an output among outputs of the rectifiers, the RSSI circuit of the present invention can detect a wider power range with same voltage range because each stage can utilize the full voltage range. | 05-01-2014 |
20140146920 | MIXER WITH IQ GAIN-PHASE CALIBRATION CIRCUIT - A mixer with IQ gain-phase calibration circuit is provided, including an I-path input stage, a Q-path input stage, an I-path switching stage, a Q-path switching stage, and an output stage, wherein the output stage further includes a phase calibration module, and a gain calibration module. The I-path and Q-path input stages are to convert the input voltage signal to a current signal, and the I-path and Q-path switching stages are to perform computation on input signal from the input stages with local oscillation signal. The signals from the switching stages are then passed through the phase calibration module for phase calibration and then through the gain calibration module for gain calibration before outputting. | 05-29-2014 |
Patent application number | Description | Published |
20090009461 | OVER-DRIVING DEVICE - An over-driving device is provided. In a first frame, a compression circuit compresses a first image signal to generate a first compression image signal, and a buffer temporarily stores the first compression image signal. In a following second frame, the compression circuit compresses a second image signal to generate a second compression image signal, and the buffer outputs the first compression image signal to serve as a first buffer image signal. A comparison circuit compares the second compression image signal and the first buffer image signal and generates an enable signal according comparison result. A decompression circuit decompresses the first buffer image signal to generate a previous image signal. An over-driving unit receives the second image signal to serve to a current image signal and receives the previous image signal and the enable signal. The over-driving unit over drives the display device or not according to the enable signal. | 01-08-2009 |
20090084611 | TOUCH SENSOR LAYOUT DESIGN - The present invention relates to a touch sensing device. In one embodiment, the touch sensing device includes a plurality of sensor units arranged in the form of an M×N matrix having M rows and N columns. Each sensor unit has a first touch sensor, S | 04-02-2009 |
20090278810 | TOUCH PANEL AND PORTABLE ELECTRONIC DEVICE THEREOF - A touch panel and a portable electronic device thereof are provided. The present invention can accurately determine a position touched by a user on the touch panel by judging whether or not a potential voltage value between a reference capacitor and a sensing capacitor of a pixel having a sensing area being changed, or to determine whether a switch of a pixel having the sensing area being conducted. | 11-12-2009 |
20090284483 | Display Device and Method Having Sensing Function - A display device and method having a sensing function is described. The device includes a liquid crystal display (LCD) panel and plural sense lines. The LCD panel includes a plurality of data lines and a plurality of gate lines. Each of the data lines is connected electrically to a plurality of left pixels and a plurality of right pixels. The sense line is disposed between each two adjacent data lines, and each of the sense lines is configured to be parallel to the data lines and perpendicular to the gate lines. The sense lines are used to transmit touch signals. | 11-19-2009 |
20100039405 | Projective Capacitive Touch Apparatus, and Method for Identifying Distinctive Positions - A projective capacitive touch apparatus and a method for identifying multi-touched positions are provided. The multi-touched positions are touched on a projective capacitive touch panel. The method comprises the following steps: generating a first set of reference values according to the first touch position; generating a plurality of second sets of reference values according to a second touch position, and filtering out at least one ghost second set of reference values from the second sets of reference values. Furthermore, the plurality of second sets of reference values comprise a real second set of reference value and at least one ghost second set of reference values, while the ghost second set of reference values comprises parts of the first set of reference values. | 02-18-2010 |
20120154320 | TOUCH PANEL AND PORTABLE ELECTRONIC DEVICE THEREOF - A touch panel and a portable electronic device thereof are provided. The present invention can accurately determine a position touched by a user on the touch panel by judging whether or not a potential voltage value between a reference capacitor and a sensing capacitor of a pixel having a sensing area being changed, or to determine whether a switch of a pixel having the sensing area being conducted. | 06-21-2012 |
Patent application number | Description | Published |
20110236747 | COMPOSITE MATERIAL FOR NEGATIVE ELECTRODE, METHOD FOR FABRICATING THE SAME AND ELECTROCHEMICAL DEVICE USING THE SAME - The present invention relates to a composite material for a negative electrode, including: a plurality of iron oxide particles; and a conductivity improver, which is selected form the group consisting of copper, cobalt, nickel, tin, antimony, bismuth, indium, silver, gold, lead, cadmium, carbon black, graphite, copper salt, cobalt salt, nickel salt, tin salt, antimony salt, bismuth salt, indium salt, silver salt, gold salt, lead salt, cadmium salt, copper hydroxide, cobalt hydroxide, nickel hydroxide, stannic hydroxide, antimony hydroxide, bismuth hydroxide, indium hydroxide, silver hydroxide, gold hydroxide, lead hydroxide, cadmium hydroxide and the combination thereof. In the case of applying the composite material for a negative electrode according to the present invention in an electrochemical device, the improved charge/discharge characteristics and high capacity can be achieved. In addition, the present invention further provides a method for fabricating the above-mentioned composite material for a negative electrode and an electrochemical device using the same. | 09-29-2011 |
20140047950 | Continuous Reactor and Method for Manufacturing Nanoparticles - The present invention relates to a continuous reactor a method for manufacturing nanoparticles. The reactor of the present invention includes: a plurality of first inputs for individually inputting a plurality of reagents; a first mixing part connected to the first inputs to mix the reagents; N number of first reaction units, each comprising a plurality of first diverging channels and a first converging channel to form a channel having the first diverging channels and the first converging channels alternately connected to one another in series for N times of diverging-converging actions, wherein N≧1, and the first diverging channels of a 1 | 02-20-2014 |
20140054511 | Method for transferring phases of nanoparticles - The present invention provides a method for transferring phases of nanoparticles, which use a polymer with a molecular weight greater than 5,000 as a dispersant. The first step of the method of the present invention is to synthesize nanoparticles in the polymer aqueous solution. Next, an amphiphilic phase-transfer agent is added into the solution to coat the surface of nanoparticles with bipolar molecules, and then the mixture is added into an organic solvent to form a homogeneous solution. Finally, a salt and an alcohol are added into the homogeneous solution, and then an organic phase layer and an aqueous phase layer through a centrifugal method. The method of the present invention combines the advantages of aqueous process for preparing nanoparticles and transfers the same with a simple phase transferring process to obtain oil-phase nanoparticles, which can be applied to various fields. | 02-27-2014 |
Patent application number | Description | Published |
20080218846 | Method For Preparing A Periodically Poled Structure - A method for preparing a periodically poled structure according to this aspect of the present invention comprises the steps of providing a ferroelectric substrate and performing a poling process by applying a poling current to at least one portion of the ferroelectric substrate according to a current waveform. The current waveform include a major phase and a tailed phase accompanying the major phase; the major phase has at least one peak current (Ip) and terminates when the current drops substantially equal to Ip/e, and the charge delivered to the portion of the ferroelectric substrate during the major phase is larger than that delivered during the tailed phase. The nucleation phase is configured to generate nucleation sites in the portion of the ferroelectric substrate and the spreading phase is configured to increase the size of the nucleation sites. | 09-11-2008 |
20090080062 | METHOD FOR PREPARING A POLED STRUCTURE BY USING DOUBLE-SIDED ELECTRODES - A method for preparing a poled structure by using double-sided electrodes to perform a poling process first provides a ferroelectric substrate with a first polarization direction having a top surface and a bottom surface. Fabrication processes are then performed to form an electrode structure including a first electrode and a second electrode on the top surface and a third electrode in a portion of the bottom surface between the first electrode and the second electrode. Subsequently, a poling process is performed on the electrode structure to form a plurality of inverted domains having a second polarization direction in the ferroelectric substrate, and the second polarization direction is substantially opposite to the first polarization direction. | 03-26-2009 |
20090080063 | ARRAY WAVEGUIDE AND LIGHT SOURCE USING THE SAME - A light source comprises a light-emitting module configured to emit a first beam and an array waveguide configured to convert the first beam into a second beam. The light-emitting module includes a plurality of light-emitting units configured to emit the first beam, and the light-emitting units are positioned in an array manner. The array waveguide includes a ferroelectric crystal with a first polarization direction, a plurality of inverted domains positioned in the ferroelectric crystal and a plurality of wavelength-converting waveguides positioned in the ferroelectric crystal. The inverted domains have a second polarization direction substantially opposite to the first polarization direction, the wavelength-converting waveguides cross the inverted domains substantially in a perpendicular manner, and the inverted domains are configured to convert the first beam from the light-emitting module into second beam as the first beams propagate through the wavelength-converting waveguides. | 03-26-2009 |
20090154508 | LIGHT-GENERATING APPARATUS WITH BROADBAND PUMPING LASER AND QUASI-PHASE MATCHING WAVEGUIDE - A light-generating apparatus comprises a broadband pumping laser configured to emit a broadband pumping light having a bandwidth larger than 10 nanometers and a broadband wavelength-converting device. The broadband wavelength-converting device includes a domain-inverted structure configured to convert the broadband pumping light into at least one conversion light by using at least a sum frequency generation mechanism and at least one waveguide positioned in the domain-inverted structure, and the waveguide has an input end configured to receive the broadband pumping light and an output end configured to output the conversion light. Since the light-generating apparatus uses the broadband pumping laser and the broadband wavelength-converting device, it is temperature-insensitive and speckle-free. | 06-18-2009 |
20100141896 | WAVELENGTH CONVERTER AND GREEN LIGHT SOURCE AND PROJECTION APPARATUS USING THE SAME - A wavelength converter includes a supporting substrate and a ferroelectric substrate, the ferroelectric substrate includes at least one waveguide facing the supporting substrate and at least one wavelength-filtering pattern positioned between the waveguide and the supporting substrate, the waveguide includes a plurality of inverted domains and non-inverted domains configured to convert an infrared light into a green light, and the infrared light emitted from the semiconductor laser enters the waveguide of the wavelength converter. For example, the wavelength-filtering pattern includes a Bragg grating. | 06-10-2010 |
20120224252 | LIGHT CONVERSION MODULE AND LIGHT SOURCE SYSTEM INCLUDING THE SAME - A light conversion module includes a coupler for combining two light beams to form a combined light beam, a nonlinear crystal arranged to receive the combined light beam and configured to include a plurality of poling regions for performing successive nonlinear frequency mixing processes, a first optical device configured to focus the combined light beam onto the nonlinear crystal, a first moving stage carrying the nonlinear crystal and moving the nonlinear crystal for an adjustment of a focus position of the combined light beam on the nonlinear crystal, and an optical detector configured for measuring a power level of the light beam from the nonlinear crystal for the adjustment of the focus position of the combined light beam on the nonlinear crystal. | 09-06-2012 |
Patent application number | Description | Published |
20100251273 | Slot-In Disc Drive having Adjustable Disc Ejection Distance - A slot-in disc drive is provided to comprise an ejecting lever rotated about a rotating axis; a first sensor and a second sensor, disposed on the rotating path of the ejecting lever; and a firmware, built in the disc drive for selecting a first setting or a second setting according to the size of a loaded disc, wherein the first and the second settings are respectively related to the first and the second sensors, and the firmware controls the ejecting lever to stop rotating based on the selected setting. | 09-30-2010 |
20100251274 | OPTICAL DISC DRIVE - An optical disc drive including an outer casing, a supporting base, a main shaft motor and a position-limiting element is provided. The outer casing has an optical disc entry. The supporting base is disposed in the outer casing. The main shaft motor is disposed on the supporting base. The position-limiting element has a first pivot portion, a position-limiting part and a second pivot portion located between the first pivot portion and the position-limiting part. The first pivot portion is connected to the supporting base, and the position-limiting element is able to be swung about the second pivot serving as a fulcrum. When the supporting base is located at an upper position, the position-limiting part is located at a first position, and when the supporting base is located at a lower position, the position-limiting part is located at a second position, wherein the first position is under the second position. | 09-30-2010 |
20100299684 | Slot-In Optical Disk Drive - A disk loading device of a slot-in optical disk drive comprises two loading levers to load and eject a disk, wherein the two loading levers are connected to a pivot pin; and a guide slot having a right recess and a left recess, wherein the pivot pin is moveable along the guide slot. | 11-25-2010 |
20120023511 | Slot-In Disc Drive Having Adjustable Disc Ejection Distance - A slot-in disc drive is provided to comprise an ejecting lever rotated about a rotating axis; a first sensor and a second sensor, disposed on the rotating path of the ejecting lever; and a firmware, built in the disc drive for selecting a first setting or a second setting according to the size of a loaded disc, wherein the first and the second settings are respectively related to the first and the second sensors, and the firmware controls the ejecting lever to stop rotating based on the selected setting. | 01-26-2012 |
Patent application number | Description | Published |
20110194278 | Lighting Apparatus - A lighting apparatus includes a housing, a light source disposed in the housing and at least one adjustable assembly. The adjustable assembly disposed at an end of the housing includes a connection element fixed to the end, a cap capping the connection element, at least one electrical terminal electrically connected to the light source and a detachable fixing element. The cap includes a side wall, an end wall and an opening disposed at the side wall. The side wall is disposed at the end wall to which the opening is opposite. The connection element passes through the opening. The electrical terminal disposed at the end wall extends outside the cap. The detachable fixing element passes through the side wall to detachably fix the cap to the connection element. When the detachable fixing element is detached, the housing and the connection element are adapted to be rotated relative to the cap. | 08-11-2011 |
20110194296 | LIGHTING APPARATUS - A lighting apparatus includes a housing, a light source disposed in the housing and at least one adjustable assembly disposed at an end of the housing. The adjustable assembly includes a connection element fixed to the end of the housing, a cap capping the connection element, at least one electrical terminal and an adjusting mechanism. A part of the connection element is located in the cap. The electrical terminal is disposed at the cap and electrically connected to the light source. The adjusting mechanism includes a gear, a positioning element, a clasp and a track. The gear and the positioning element are respectively disposed at the connection element and the cap. Positions of the gear and the positioning element can be exchanged. The clasp and the track are respectively disposed at the connection element and the cap. Positions of the clasp and the track can be exchanged. | 08-11-2011 |
20120195049 | LAMP - A lamp module is provided, including an insulative member, a cover lens connected to the insulative member, and a light module disposed between the insulative member and the cover lens. The light module can emit light through the cover lens for illumination. | 08-02-2012 |
Patent application number | Description | Published |
20110156281 | Quad Flat No Lead (QFN) Package - The present invention relates to a quad flat no lead (QFN) package is provided. In the invention, a plurality of first pads are disposed outside an extension area of a conductive circuit layer, and a plurality of second pads are disposed inside a die bonding area of the conductive circuit layer, wherein the extension area surrounds the die bonding area. First ends of a plurality of traces are connected to the second pads, and second ends of the traces are located in the extension area. An insulating layer fills at least the die bonding area and the extension area, and exposes top surfaces and bottom surfaces of the second pads. A chip is mounted at the die bonding area and a plurality of wires electrically connect the chip to the first pads and the second ends of the traces respectively. An encapsulation material is used to cover the conductive circuit layer, the chip and the wires. Whereby, the package of the invention can have more inputs/outputs terminals, and the insulating layer can prevent moisture permeation from corroding the joints between the wires and the first pads and the second ends of the traces, thus increasing the reliability of the package of the invention. | 06-30-2011 |
20120091570 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGING METHOD - A chip packaging method includes the steps of: attaching a first tape to a metal plate; patterning the metal plate to form a plurality of terminal pads and a plurality of leads, wherein the plurality of terminal pads and the plurality of leads are disposed on two opposite sides of a central void region, the plurality of terminal pads on each side are arranged in at least two rows spaced apart from each other in the direction away from the central void region, and each lead has a first end portion extending to the central void region and a second end portion connecting to a corresponding terminal pad; attaching a second tape having openings to the plurality of terminal pads, wherein each of the openings exposes the central void region and the first end portions of the leads; removing the first tape; attaching a chip to the plurality of terminal pads and the plurality of leads, wherein a plurality of bond pads on the chip are corresponding to the central void region; and connecting the bond pads to the first end portions of the leads with a plurality of bonding wires through the opening. | 04-19-2012 |
20120153449 | NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a non-leaded package structure is provided. An upper surface and a lower surface of a metal base plate are patterned so as to form a plurality of first protruding parts and at least a second protruding part on the upper surface and to form a plurality of first recess patterns on the lower surface corresponding to the first protruding parts. A first solder layer is formed in each of the first recess patterns respectively. A chip is mounted on the second protruding part and electrically connected to the first protruding parts with a plurality of bonding wires. An encapsulant is formed on the upper surface. A back etching process is performed on the lower surface to partially remove the metal base plate until the encapsulant is exposed and a lead group including at least a die pad and a plurality of leads is defined. | 06-21-2012 |
20120241935 | PACKAGE-ON-PACKAGE STRUCTURE - A package-on-package structure includes first and second package structures and bumps. The first package structure includes a carrier, a chip configured on the carrier, a heat spreader, and an encapsulant. The chip is electrically connected to the carrier through conductive wires. The heat spreader includes a support portion located on the chip and connection portions located respectively at two opposite sides of the support portion. The heat spreader has a circuit layer thereon, covers the chip and the conductive wires, and electrically connects the carrier through the circuit layer on the connecting portions. The encapsulant encapsulates the chip, the conductive wires, a portion of the heat spreader, and a portion of the carrier. The bumps are configured on the support portion. The second package structure is configured on the first package structure and is electrically connected to the first package structure through the bumps. | 09-27-2012 |
20130020688 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A chip package structure including a leadframe, a chip, bonding wires and an encapsulant is provided. The leadframe includes a die pad, leads and an insulating layer. The die pad includes a chip mounting portion and a periphery portion. At the periphery portion, the die pad has a second upper surface lying between a first upper surface and a lower surface of the die pad. Each lead includes a suspending portion and a terminal portion. The suspending portion connects to the terminal portion and extends from the terminal portion towards the die pad. The insulating layer is disposed on the second upper surface of the periphery portion and connects the suspending portions to the die pad. The chip is disposed on the chip mounting portion. The bonding wires electrically connect the chip to the suspending portions. The encapsulant covers the chip, the bonding wires, the insulating layer, and the leadframe. | 01-24-2013 |
20130140686 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor package structure is provided. A heat-conductive block is adhered to a portion of a second surface of a conductive substrate via a first adhesive layer. An opening is formed by performing a half-etching process on a first surface of the conductive substrate. The remaining conductive substrate is patterned to form leads and expose a portion of the heat-conductive block. Each lead has a first portion and a second portion. A thickness of the first portion is greater than a thickness of the second portion. A first lower surface of the first portion and a second lower surface of the second portion are coplanar. A chip is disposed on the exposed portion of the heat-conductive block and electrically connected to the second portions of the leads. A first bottom surface of the heat-conductive block and a second bottom surface of a molding compound are coplanar. | 06-06-2013 |
20130181333 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor package structure is provided. A supporting plate and multiple padding patterns on an upper surface of the supporting plate define a containing cavity. Multiple leads electrically insulated from one another are formed on the padding patterns, extend from top surfaces of the padding patterns along side surfaces to the upper surface and are located inside the containing cavity. A chip is mounted inside the containing cavity, electrically connected to the leads. A molding compound is formed to encapsulate at least the chip, a portion of the leads and a portion of the supporting plate, fill the containing cavity and gaps among the padding patterns, and exposes a portion of the leads on the top surface. The supporting plate is removed to expose a back surface of each padding pattern, a bottom surface of the molding compound and a lower surface of each lead. | 07-18-2013 |
20150076670 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A chip package structure and a manufacturing method thereof are provided. The chip package structure includes a substrate, a chip, a plurality of wires, a film layer, a carrier, and an encapsulant. The substrate has an upper surface and a lower surface. The chip is mounted on the upper surface of the substrate. The wires are electrically connected to the chip and the substrate respectively. The film layer is attached to the substrate and entirely encapsulates the chip and the wires. The carrier is adhered on the film layer. The encapsulant is disposed on the upper surface of the substrate, wherein the encapsulant has an electro-magnetic shielding filler. The encapsulant at least partially encapsulates the carrier and the film layer, and the encapsulant covers the chip and the wires. | 03-19-2015 |
Patent application number | Description | Published |
20120085949 | FLUID TRANSPORTATION DEVICE - A fluid transportation device includes a valve seat, a valve cap, a valve membrane, and an actuating module. The valve seat has an outlet channel and an inlet channel. The valve cap has a tilt structure. The valve membrane has an inlet valve structure and an outlet valve structure. The actuating module has a vibration film and an actuator. When the fluid transportation device is in a non-actuation status, a pressure cavity with a gradually-increasing depth is defined. When a voltage is applied on the actuator to result in deformation of the actuator, the vibration film generates a pressure difference to push the fluid. The fluid is introduced into the inlet valve structure through the inlet channel, guided by the tilt structure of the valve cap to be flowed from the pressure cavity to the outlet valve structure, and then flowed out of the outlet channel. | 04-12-2012 |
20120090710 | CLOSED NEBULIZING SYSTEM FOR REMOVING BUBBLES - A closed nebulizing system for removing bubbles includes a first pump, a nebulizing module and a second pump. The first pump is for providing a fluid. The nebulizing module includes an outlet channel, an inlet channel connected with the first pump, and a plurality of nozzles for nebulizing and ejecting part of the fluid. The second pump is connected with the outlet channel for outputting non-nebulized fluid. The first pump, the nebulizing module and the second pump form a closed fluid loop, so that the fluid continuously contacts with the plurality of nozzles and bubbles generated during nebulization process are evacuated from the nebulizing module. | 04-19-2012 |
20120092399 | POWER SUPPLY INTEGRATED CIRCUIT FOR PIEZOELECTRIC INKJET HEAD - A power supply integrated circuit includes a DC-DC boost regulating unit and a DC-AC output controlling unit. The DC-DC boost regulating unit is used for increasing a low DC voltage into a high DC voltage. The DC-AC output controlling unit is connected with the DC-DC boost regulating unit for converting the high DC voltage into a high AC voltage. A first portion of an integrated circuit chip and a plurality of passive components are collaboratively defined as the DC-DC boost regulating unit. A second portion of the integrated circuit chip is defined as the DC-AC output controlling unit. | 04-19-2012 |
20120092418 | SINGLE-NOZZLE INKJET HEAD - A single-nozzle inkjet head includes a first chamber member and a second chamber member. The first chamber member has a first flow channel. The second chamber member is detachably connected with the first chamber member. The second chamber member includes a main body, a nozzle plate and an actuator. The main body has a second flow channel, wherein the second flow channel is in communication with the first flow channel for transporting a fluid. The nozzle plate is disposed on the main body, and has a nozzle. The actuator is disposed on the nozzle plate, and located around the nozzle. | 04-19-2012 |
20130213506 | FLUID TRANSPORTATION DEVICE - A fluid transportation device includes a valve supporting module, a first fluid transportation module and a second fluid transportation module. Through the valve supporting module, the first fluid transportation module and the second fluid transportation module may be combined together in a side-by-side arrangement or a vertically-stacked arrangement. The combination of the first fluid transportation module and the second fluid transportation module can increase the flow rate and the pumping head of transporting the fluid. Moreover, the combination of two fluid transportation modules of the present fluid transportation device can be synchronously or asynchronously actuated to increase the flow rate and the pumping head of transporting the fluid. Since the additional coupling mechanism is omitted, the fabricating cost of the present fluid transportation device is largely reduced, and the overall volume of the present fluid transportation device is reduced to comply with the miniaturization requirement. | 08-22-2013 |
20140377099 | MICRO-GAS PRESSURE DRIVING APPARATUS - A micro-gas pressure driving apparatus includes a miniature gas transportation module and a miniature valve module. The miniature gas transportation module includes a gas inlet plate, a fluid channel plate, a resonance membrane and a piezoelectric actuator. A first chamber is defined between the resonance membrane and the piezoelectric actuator. After the piezoelectric actuator is activated to feed a gas through the gas inlet plate, the gas is transferred to the first chamber through the fluid channel plate and the resonance membrane and then transferred downwardly. Consequently, a pressure gradient is generated to continuously push the gas. The miniature valve module includes a gas collecting plate, a valve membrane and a gas outlet plate. After the gas is transferred from the miniature gas transportation module to the gas-collecting chamber, the gas is transferred in one direction, so that a pressure-collecting operation or a pressure-releasing operation is selectively performed. | 12-25-2014 |
Patent application number | Description | Published |
20080303040 | BACKLIGHT MODULE AND LIGHT EMITTING DIODE PACKAGE STRUCTURE THEREFOR - A LED package structure including a carrier, LED chips, and a package body is provided. The carrier defines a cave with two opposite first side walls, two opposite second side walls and a rectangular bottom surface. An included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface. The LED chips are disposed in a straight-line arrangement on a center line of the bottom surface and electrically connected to the carrier. The center line is parallel to a long side of the bottom surface. The package body is formed on the carrier to cover the LED chips. Since the included angle between the first side wall and the bottom surface differs from that between the second side wall and the bottom surface, light provided by the LED package structure has different spatial radiation patterns in different directions. | 12-11-2008 |
20090091947 | Surface light source structure of backlight module in a flat panel display - A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions. | 04-09-2009 |
20090128471 | Integrated driving board and liquid crystal display module having the same - A liquid crystal display module and an integrated driving board thereof are disclosed. The driving board includes a substrate, a circuit pattern, a timing clock driver, a light emitting diode (LED) driving module, a color management module and a photosensitive chip. The circuit pattern is disposed on the surface of the substrate. The timing clock driver, the LED driving module, the color management module and the photosensitive chip are disposed on the substrate and electrically coupled to the circuit pattern. The LED driving module is electrically coupled to the timing clock driver. The color management module is electrically coupled to the LED driving module. The photosensitive chip is electrically coupled to the color management module. | 05-21-2009 |
20090140650 | LIGHT-EMITTING DEVICE - A light-emitting device includes a package housing, at least one light-emitting element, a plurality miniature elements, and a package filler. The package housing includes a recess. The light-emitting element is disposed in the recess. The miniature elements are formed on the light-emitting element. Light from the light-emitting element is output to the exterior of the recess in a predetermined direction by adjustment of the miniature elements. The package filler is filled in the recess and covers the light-emitting element and miniature elements. | 06-04-2009 |
Patent application number | Description | Published |
20090185385 | Optical film applied to a side-emitting backlight module - An optical film is applied to a side-emitting backlight module. The side-emitting backlight module has a light guide plate for guiding a chief light beam. The light guide plate has a light emitting surface to define a normal direction thereof. The optical film includes a lower prism structure, an intermedium layer, and an upper prism structure. The lower prism structure is disposed on the light emitting surface. The intermedium layer is connected between the lower prism structure and the upper prism structure. When the chief light beam exits from the light emitting surface of the light guide plate, and then goes through the lower prism structure, it goes through the intermedium layer along a changed traveling direction. When the chief light beam exits from the intermedium layer, and goes through the upper prism structure, it turns from the changed traveling direction to the normal direction. | 07-23-2009 |
20090207584 | Backlight module of flat panel display - A backlight module disposed under a display panel and close to a polarizer on a lower surface of the display panel is provided. The backlight module has an illumination module and an optical film disposed above the illumination module. The optical film has a lower layer and an upper layer attached to the lower layer. The upper layer is close to the polarizer and has a plurality of first micro-protrusion structures formed on an upper surface thereof. The lower layer has a plurality of second micro-protrusion structures with various heights formed on an upper surface thereof. The higher second micro-protrusion structures support the upper layer, so as to form a gap with various dimensions between the upper layer and the lower layer. | 08-20-2009 |
20100103514 | Projection screen - A projection screen is adapted to reflect the projection light generated by a projector. The projection screen includes a light absorbing layer, a light reflection layer connected adjacently to the light absorbing layer, and a light transparent layer. The light transparent layer is disposed on the light absorbing layer and the light reflection layer, and has a total reflection surface, a light emitting surface, and a light incident surface connected adjacently to the total reflection surface. The light incident surface provides a theoretical light convergence point, and the light convergence point and the location of the light reflection layer are in mirror symmetry relative to the total refection surface. The projection light enters into the light transparent layer through the light incident surface for refraction, and travels to the total reflection surface for totally reflection, and then to the light reflection layer for reflecting to the light emitting surface. | 04-29-2010 |
Patent application number | Description | Published |
20080266491 | LIQUID CRYSTAL DISPLAY - A liquid crystal display (LCD) including a backlight module and a liquid crystal display panel is provided. The backlight module has at least one white light source. BL | 10-30-2008 |
20090135338 | LIQUID CRYSTAL DISPLAY - An liquid crystal display including a backlight module and an LCD panel is disclosed. The backlight module has a white light source, and the normalized optical spectrum of the backlight module is BL(λ) The LCD panel includes a red color filter layer, a green color filter layer and a blue color filter layer. The green color filter layer and the backlight module are subject to the following relationship: E=C/D and E≧0.8, wherein A is defined as the wavelength corresponding to the maximum peak value of CF | 05-28-2009 |
20090147184 | LIQUID CRYSTAL DISPLAY - A liquid crystal display (LCD) including a backlight module and a liquid crystal display panel is provided. The backlight module has at least one white light source. BL | 06-11-2009 |
20090213043 | METHOD FOR DRIVING DISPLAY PANEL - A method for driving a display panel includes generating data signals to drive pixels in the display panel. The pixels in the display panel are arranged in a matrix. In addition, the voltage values of the data signals are adjusted to render a sum of voltage values of the data signals in a unit area as zero. | 08-27-2009 |
20100090996 | LCD DISPLAY WITH PHOTO SENSOR TOUCH FUNCTION - The present invention relates to a method for driving a display device having a panel having a display region and a peripheral region, a first photosensor member formed in the display region, and a second photosensor member formed in the peripheral region. In one embodiment, the method includes the steps of measuring an intensity of ambient light by the second photosensor member, and driving the first photosensor member according to the measured intensity of the ambient light, so as to sense a change of incident light caused by a touch on the display region. | 04-15-2010 |
Patent application number | Description | Published |
20090015936 | ZOOM LENS - A zoom lens including a first lens group with a negative refractive power and a second lens group with a positive refractive power is provided. The first lens group includes a first lens, a second lens, and a third lens arranged from an object side to an image side in sequence. The refractive powers of the first, second, and third lenses are negative, negative, and positive sequentially. The second lens group includes a fourth lens, a fifth lens, a sixth lens, and a seventh lens arranged from the object side to the image side in sequence. The refractive powers of the fourth, fifth, sixth, and seventh lenses are positive, positive, negative, and positive sequentially. The first lens group and the second lens group are capable of moving between the object side and the image side. | 01-15-2009 |
20100157444 | FIXED-FOCUS LENS - A fixed-focus lens adapted to be disposed between a magnified side and a reduced side is provided. The fixed-focus lens includes a first lens group, a second lens group, and a third lens group. The first lens group disposed between the magnified side and the reduced side includes three lenses and has a negative refractive power. The second lens group disposed between the first lens group and the reduced side includes five lenses and has a positive refractive power. The third lens group disposed between the second lens group and the reduced side includes five lenses and has a positive refractive power. The fixed-focus lens satisfies |F | 06-24-2010 |
20110157710 | ZOOM LENS - A zoom lens including a first lens group and a second lens group arranged in sequence from a magnified side toward a reduced side is provided. The first lens group has a negative refractive power and includes a first lens, a second lens, a third lens, and a fourth lens arranged in sequence from the magnified side toward the reduced side, of which the refractive powers are respectively positive, negative, negative, and positive. The second lens group has a positive refractive power and includes a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, a tenth lens, and an eleventh lens arranged in sequence from the magnified side toward the reduced side, of which the refractive powers are respectively positive, negative, positive, negative, positive, negative, and positive. The eighth lens, the ninth lens, and the tenth lens together form a triple cemented lens. | 06-30-2011 |
20120081799 | FIXED-FOCUS LENS - A fixed-focus lens disposed between an enlarged side and a reduced side is provided. An f-number of the fixed-focus lens is smaller than or equal to 2. The fixed-focus lens includes a first lens group and a second lens group. The first lens group includes a first lens, wherein the first lens is an aspheric lens. The second lens group, disposed between the first lens group and the reduced side, has a positive dioptre. The second lens group includes a second lens, wherein the second lens is an aspheric lens. The fixed-focus lens focuses by moving the first and the second lens group and satisfies 0.1<|f/f1|<1, 0.2<|f/f2|<1.5, and 1.504-05-2012 | |
20140029119 | FIXED FOCAL LENGTH LENS - A fixed focal length lens includes a first lens group and a second lens group. The first lens group is disposed between a magnified side and a minified side and has a negative refractive power. The second lens group is disposed between the first lens group and the minified side and has a positive refractive power. The fixed focal length lens satisfies F/H>0.52, where F is an effective focal length of the fixed focal length, and H is an image height. | 01-30-2014 |
20140320978 | ZOOM LENS - A zoom lens including a first lens group and a second lens group is provided. Refractive powers of the first lens group and the second lens group are respectively negative and positive. The first lens group includes a first lens, a second lens, and a third lens arranged in sequence from an object side to an image side. The second lens group is disposed between the first lens group and the image side, and includes a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens arranged in sequence from the object side to the image side. The zoom lens satisfies −2.410-30-2014 | |
20150029596 | ZOOM LENS - A zoom lens including a first lens group, a second lens group, a third lens group, and a fourth lens group with positive, negative, positive, and positive refractive powers respectively arranged in sequence from an object side to an image side is provided. The first lens group includes a first lens and a second lens. The second lens group includes a third lens, a fourth lens, and a fifth lens. The third lens group includes a sixth lens. The fourth lens group includes a seventh lens, an eighth lens, and a ninth lens. The first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, the eighth lens, and the ninth lens respectively having negative, positive, negative, negative, positive, positive, positive, negative, and positive refractive powers are arranged in sequence from the object side to the image side. | 01-29-2015 |
20150070786 | OPTICAL LENS - An optical lens includes a first lens group and a second lens group. The first lens group is disposed between a magnified side and a minified side and has a negative refractive power. The second lens group is disposed between the first lens group and the minified side and has a positive refractive power. The optical lens is capable of forming an image at the magnified side. F/H>0.52, where F is an effective focal length, and H is an image height. A viewing angle is greater than 116.7 degrees. | 03-12-2015 |