Chiu, Kaohsiung
Cheng-Hao Chiu, Kaohsiung TW
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20120236574 | LGF Plate-to-plate Manufacturing Method and Structure Thereof - A LGP plate-to-plate manufacturing includes the steps of: preparing an optical substrate with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the optical substrate; coating an optical layer on the first or second surface of the optical substrate; and curing the optical layer to directly form a second microstructure on the first or second surface of the optical substrate; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide plate structure. In an embodiment, an additional optical layer is provided on the optical substrate. | 09-20-2012 |
20120236600 | LGF Roll-to-Roll Manufacturing Method and Structure Thereof - A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer; wherein the first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer. | 09-20-2012 |
20120273983 | Adjustment Mechanism of Mold System Having Electrically Adjusting and Positioning Functions - A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivot-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members. | 11-01-2012 |
Chung-Jen Chiu, Kaohsiung TW
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20130293442 | ANTENNA HAVING CONNECTING CIRCUIT - The present invention relates to an antenna having a connecting circuit, which includes a substrate, a grounding metal strip, a first radiating metal strip, a second radiating metal strip and a connecting circuit. The first radiating metal strip is not connected to the grounding metal strip or the second radiating metal strip. The connecting circuit connects different positions on the grounding metal strip and on the second radiating metal strip, so as to form a plurality of resonant paths of different lengths between the grounding metal strip and the second radiating metal strip. Thereby, the frequency of the antenna varies between different values, so that the range of the application and the practicality of the antenna are increased. | 11-07-2013 |
Ji-Feng Chiu, Kaohsiung TW
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20090172180 | Apparatus And Method For Transmitting Streaming Services - Disclosed is a system and method for transmitting streaming services. The system may comprise a service agent having a service list. The service list records the contact addresses and priority for one or more nodes that can provide streaming services. The priority for a node represents the level that the node belongs to a path for transmitting streaming data. When a client node requests the service agent for the nodes, wherein the nodes may provide a specific streaming service, the service agent searches for the service list and responds the search result to the client node. Therefore, the client node may get the streaming data directly from the nodes being found, and these nodes form a peer-to-peer network system. | 07-02-2009 |
Pei-Cheng Chiu, Kaohsiung TW
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20130158820 | SAFETY SYSTEM FOR BACKING UP MOTOR VEHICLE - The safety system for backing up a motor vehicle contains a processing device, a switch device, and a brake control device. The processing device is connected with a gear position signal source so as to determine the motor vehicle's gear position, with a distance detection device so as to determine the presence of and distance to an obstacle along the motor vehicle's backing-up path, and with a speed detection device so as to determine the motor vehicle's speed. The processing device combines all the information and sends signals to the brake control device through the switch device to brake the motor vehicle in various manners. The driver in the meantime can be alerted about the potential hazard. | 06-20-2013 |
20130244701 | DRIVE INFORMATION NOTIFICATION SYSTEM - A drive information notification system includes at least a MCU processor, an equipment signal modulation module, a radio transmitter/receiver device, an ACC power control device, and a power stabilization device. The MCU processor is connected to at least one of an ECU vehicle computer, a controller area network, a local interconnect network, and electrical control signal sources of equipments/devices of the vehicle to retrieve drive information of the vehicle for subsequent processing and uses the radio transmitter/receiver device to transmit the drive information to be received by a corresponding intelligent mobile phone to allow the intelligent mobile phone to make a notification through graphics, text, or voice. | 09-19-2013 |
Piing Ning Chiu, Kaohsiung TW
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20140091708 | Fluorescent Display Tube With Touch Switch And Method Of Forming Electrode And Wiring Of Same - An object of the present invention is to provide a fluorescent display tube with a touch switch allowing electrodes such as touch electrode, anode electrode, and wirings thereof to be formed on the same substrate at the same time, and having an easy structure, and to provide a method of forming the electrodes and wirings of the fluorescent display tube. The anode electrodes, the touch electrodes, the shield electrode, and the anode wirings are formed on the front substrate. The shield electrode is formed in between the touch electrodes and the anode electrodes, and in between the touch electrodes and the anode wirings. The shield electrode is made of a continuous single conductive film. The touch electrodes are so formed as to surround the corresponding one of the anode electrodes. | 04-03-2014 |
Ping Ning Chiu, Kaohsiung TW
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20140117849 | Driving IC-incorporated Fluorescent Display Device - In a driving IC-incorporated fluorescent display device, a filament end-supporting member including a structure which has a short distance between a filament and an anode substrate and is not compromised to shielding effect of the driving IC is provided. An end portion of the filament is sandwiched between a tabular support which is attached to a tabular portion of a retainer plate and a ribbon, and the ribbon is fixed to the support by spot welding. The support consists of a slit. The filament is opposed to the slit and extends to longitudinal direction of the slit. The opposite side of the filament of the slit is closed by the retainer plate. | 05-01-2014 |
Shih-Feng Chiu, Kaohsiung TW
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20100168444 | DIINDENOTHIOPHENE DERIVATIVES AND USE THEREOF - A diindenothiophene derivative of the following formula (1) is disclosed: | 07-01-2010 |
Sung-Mao Chiu, Kaohsiung TW
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20150114821 | Method for Modifying Properties of Graphene - A method for modifying properties of graphene includes a graphene film provision step and a modification step. In the graphene film provision step, a graphene film is provided, and the graphene is formed on a substrate. In the modification step, the graphene film is placed in a vacuum environment and radiated by an electron beam to obtain a graphene material. | 04-30-2015 |
Tsung-Yao Chiu, Kaohsiung TW
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20130293442 | ANTENNA HAVING CONNECTING CIRCUIT - The present invention relates to an antenna having a connecting circuit, which includes a substrate, a grounding metal strip, a first radiating metal strip, a second radiating metal strip and a connecting circuit. The first radiating metal strip is not connected to the grounding metal strip or the second radiating metal strip. The connecting circuit connects different positions on the grounding metal strip and on the second radiating metal strip, so as to form a plurality of resonant paths of different lengths between the grounding metal strip and the second radiating metal strip. Thereby, the frequency of the antenna varies between different values, so that the range of the application and the practicality of the antenna are increased. | 11-07-2013 |
Wen-Chun Chiu, Kaohsiung TW
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20090294792 | CARD TYPE MEMORY PACKAGE - A card-type memory package is revealed, primarily comprising a substrate, a plurality of gold fingers, at least a memory chip, an LED chip, and an encapsulant. The memory chip and the LED chip are disposed on an encapsulated surface of the substrate with the LED chip adjacent to a rear side of the substrate. The gold fingers are attached to the substrate adjacent to a front side of the substrate. The encapsulant is formed on the encapsulated surface to encapsulate the memory chip and the LED chip with the gold fingers exposed. Therefore, the card-type memory package has the LED indication of reading and writing information with simplified assembling processes. | 12-03-2009 |
20100219521 | WINDOW TYPE SEMICONDUCTOR PACKAGE - A window-type semiconductor package is revealed, primarily comprising a substrate with an interconnection channel, a chip on the substrate, a die-attach adhesive between the chip and the substrate, and an encapsulant filling the interconnection channel. A first solder mask formed on the top surface of the substrate has a specific pattern. The die-attach adhesive bonds the active surface of the chip to the first solder mask with the bonding pads of the chip aligned inside the interconnection channel. The first solder mask has an opening to expose the interconnection channel and further to form an indentation from the interconnection channel to expose the top surface to prevent damaging of the active surface of the chip adjacent to the edges of the interconnection channel to ensure the integrity and yield of the final products. | 09-02-2010 |
20120077312 | FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL - Disclosed is a flip-chip bonding method to reduce voids in underfill material. A substrate with connecting pads is provided. At least a chip with a plurality of bumps is bonded on the substrate and then an underfill material is formed between the chip and the substrate. Finally, the substrate is placed in a pressure oven in which a positive pressure greater than one atm is provided, meanwhile, the underfill material is thermally cured with exerted pressures to reduce bubbles or voids trapped inside the underfill material to avoid popcorn issues due to CTE mismatch between the chip and the substrate. In one embodiment, another underfill material is further formed between a plurality of chips and bubbles or voids trapped between the chips are also reduced by the pressurized curing. | 03-29-2012 |
20120115277 | MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS - A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided. | 05-10-2012 |
20120264257 | MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES - Disclosed is a mold array process (MAP) method to prevent exposure of peripheries of substrate units where the major characteristic is to implement two kinds of encapsulating materials in the MAP method in mass production. A first encapsulating material for encapsulating chips is formed on a substrate strip by molding to continuously encapsulate the substrate units and the scribe lines between adjacent substrate units. Prior to forming a second encapsulating material, a plurality of cut grooves are formed along the scribing lines by pre-cutting processes to penetrate through the substrate strip but without penetrating through the first encapsulating material and have such a width that a plurality of peripheries of the substrate units are exposed outside the scribing lines. Then, the second encapsulating material is filled into the cut grooves. Accordingly, the peripheries of the substrate units are still encapsulated with the remains of the second encapsulating material after singulation processes where the substrate units are singulated into individual semiconductor packages to prevent exposure of the peripheries of the substrate units. | 10-18-2012 |
20120270368 | MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES - Disclosed is a mold array process (MAP) method to encapsulate cut edges of substrate units. A substrate strip includes a plurality of substrate units arranged in a matrix. Scribe lines are defined between adjacent substrate units and at the peripheries of the matrix where pre-cut grooves are formed along the scribe lines with a width greater than the width of the scribe lines. An encapsulant is formed on the matrix of the substrate strip to continuously encapsulate the substrate units and the scribe lines to enable the encapsulant to fill into the pre-cut grooves to further encapsulate the cut edges of the substrate units. The cut edges of the substrate units are still encapsulated by the encapsulant even after singulation processes where substrate units are singulated into individual semiconductor packages to prevent the exposure of the plated traces of the substrate units to enhance the moisture resistance capability of the semiconductor packages. | 10-25-2012 |
Yangpian Chiu, Kaohsiung TW
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20090056487 | FASTENER FOR RELEASABLE BINDING OF PLURAL ITEMS OF VARIOUS SIZES AND NUMBER WITH ADJUSTABLE TENSION - A fastener device is disclosed for binding together items of varying size and number in a releasable fashion. The binding tension is adjustable. A flexible elongated gear or rack is connected at a first end to a rotational gear and rack guide housing. The gear housing includes guide apertures for passing the second end of the rack through the gear housing for engagement with a round gear or pinion mounted in the housing wherein teeth of the pinion engage the teeth of the rack. The pinion is operatively connected to an adjustment wheel or lever that can cause rotation of the pinion. A pawl operatively connected to the gear housing operatively engages either the rack or the pinion to block relative movement of the pinion and the rack when the rack and pinion are engaged. Optional spring tensioning of the pawl can limit maximum tension of the binding and/or permit rapid release of the binding without damage to the device and/or the items being bound together. The flexible rack may be formed with a curve to facilitate insertion of the second end into the gear housing. In an optional embodiment, the second end of the rack may be inserted into the gear housing and include a stop flange to keep the rack being pulled out of the gear housing. | 03-05-2009 |
Yi-Ching Chiu, Kaohsiung TW
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20120100539 | METHOD FOR DETERMINING RISK FOR KIDNEY STONES DEVELOPING OR RECURRING AND METHOD FOR USING SINGLE-NUCLEOTIDE POLYMORPHISM RS12313273 AS BIOMARKER FOR DETERMINING DEVELOPMENT OR RECURRENCE OF KIDNEY STONE - The invention provides a method for determining a risk for kidney stones to develop in a subject, including: obtaining a biosample of the subject; detecting the presence of the single-nucleotide polymorphism rs12313273 (C/T) at position 30881 of the ORAI1 gene (SEQ ID No.: 1) in the biosample; and determining a risk for kidney stones to develop in the subject, wherein if the presence of a C allele of the single-nucleotide polymorphism rs12313273 (C/T) is detected, it indicates that the subject has an increased risk for kidney stones to develop. | 04-26-2012 |
Yi-Hong Chiu, Kaohsiung TW
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20150240863 | Microstructure Sucker Device and Operation Method Thereof - A microstructure sucker device includes a substrate, a microstructure and an operation surface. The microstructure is arranged on the first surface of the substrate to form a microstructure sucker layer. The operation surface is provided on the second surface of the substrate and corresponds to the surface sucker layer. An operation method of the microstructure sucker device includes: aligning the sucker layer with a predetermined surface; attaching the microstructure sucker layer to the predetermined surface; pressing the microstructure sucker layer to discharge an amount of air from the microstructure sucker layer to suck the predetermined surface; pulling an edge of the microstructure sucker layer to separate the microstructure sucker layer from the predetermined surface. | 08-27-2015 |
Yi-Jen Chiu, Kaohsiung TW
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20090279306 | Lighting Apparatus - A lighting apparatus is disclosed. The lighting apparatus comprises a casing, at least one light source and a microstructure cover. The light source is disposed on one side of the casing. The microstructure cover is mounted on the casing opposite to the reflective face thereof. The microstructure cover has a plurality of guiding micro-structures to guide light and a plurality of dispersing micro-structures to disperse light. | 11-12-2009 |
Yi-Wei Chiu, Kaohsiung TW
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20090152545 | Feature Dimension Measurement - A method of measuring dimensional characteristics includes providing a substrate and forming a reflective layer over the substrate. A dielectric layer is then formed over the reflective layer. The dielectric layer includes a grating pattern and a resistivity test line inset in a transparent region. Radiation is then directed onto the dielectric layer so that some of the radiation is transmitted through the transparent region to the reflective layer. A radiation pattern is then detected from the radiation reflected and scattered by the metal grating pattern. The radiation pattern is analyzed to determine a first dimensional information. Then the resistance of the resistivity test line is measured, and that resistance is analyzed to determine a second dimensional information. The first and second dimensional informations are then compared. | 06-18-2009 |
20100240220 | PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER - A process of stripping a patterned photoresist layer and removing a dielectric liner includes performing an oxygen-containing plasma dry etch process and performing a fluorine-containing plasma dry etch process in the same reaction chamber at a process temperature less than 120° C. | 09-23-2010 |
20150236155 | SEMICONDUCTOR DEVICE AND FORMATION THEREOF - A semiconductor device and method of forming the same are described. A semiconductor device includes an active area adjacent a gate structure. The gate structure includes a gate electrode over a gate dielectric, the gate dielectric having a bottom surface in a first plane. A second etch interacts with a first composition and an initial dopant to remove a bottom portion of a first sidewall spacer adjacent the gate structure, such that a bottom surface of the first sidewall spacer lies in a second plane different than the first plane. The removal of the bottom portion of the first sidewall spacer reduces a first distance between a source or drain and a bottom surface of the gate electrode, thus reducing proximity loading of the semiconductor device and improving functionality of the semiconductor device. | 08-20-2015 |
Yu-Hsien Chiu, Kaohsiung TW
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20100127878 | Alarm Method And System Based On Voice Events, And Building Method On Behavior Trajectory Thereof - Disclosed are an alarm method and system based on voice events, and a building method on behavior trajectory thereof The system comprises a signal sensor, a voice-event detector and notice and alarm element. In the method, voice signals are captured from a remote unit in an environment. The captured voice signals are classified into at least a voice event. As such, an emergent-event notice is automatically transmitted out if one of predefined emergent events is detected. In the building method on behavior trajectory, messages on voice events are continuously recorded. When the number of the recorded voice events reaches a threshold, a behavior trajectory is constructed, in which a behavior consists of two or more voice events or a single voice event. | 05-27-2010 |