Patent application number | Description | Published |
20080198669 | METHOD OF OPERATING NON-VOLATILE MEMORY - A non-volatile memory is provided. A substrate having a number of trenches and a number of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A number of select gate dielectric layers are disposed between the select gates and the substrate. A number of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A number of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers. | 08-21-2008 |
20080227282 | METHOD OF MANUFACTURING NON-VOLATILE MEMORY - A non-volatile memory is provided. A substrate having a number of trenches and a number of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A number of select gate dielectric layers are disposed between the select gates and the substrate. A number of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A number of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers. | 09-18-2008 |
20080316791 | OPERATING METHOD OF ONE-TIME PROGRAMMABLE READ ONLY MEMORY - The present invention provides a method of operating a one-time programmable read only memory (OTPROM). The OTPROM includes at least a select transistor, an electrode and a dielectric layer disposed on a substrate, wherein the electrode is set up on the source region of the select transistor and the dielectric layer is set up between the electrode and the source region. The method of operating the one-time programmable read only memory includes performing a programming operation to write a digital data value of ‘1’ into the memory and performing a programming operation to write a digital data value of ‘0’ into the memory. | 12-25-2008 |
20090021986 | OPERATING METHOD OF NON-VOLATILE MEMORY DEVICE - An operating method for a non-volatile memory device is applicable on a non-volatile memory device in which a substrate is disposed. The substrate includes a trench, a first conductive type first well region disposed in the substrate, and a second conductive type second well region disposed above the first conductive type first well region. The operating method includes applying a first voltage to a control gate, a second voltage to a drain region, and a third voltage to a source region. Besides, a channel F-N tunneling effect is employed to program a memory cell. | 01-22-2009 |
20090042350 | MANUFACTURING METHOD OF NONVOLATILE MEMORY - A manufacturing method for a non-volatile memory includes first providing a substrate with a gate structure formed thereon. The gate structure includes a first gate and a gate dielectric layer located between the first gate and the substrate. A first doping and a second doping region are formed on the substrate at two sides of the gate, respectively. A first insulating layer is formed on the substrate, and a portion of the first insulating layer and a portion of the substrate are removed to form a trench, which divides the second doping region into a third doping region and a fourth doping region. Finally, a tunneling dielectric layer, a charge-trapping layer and a top dielectric layer are formed inside the trench, and a second gate which fills the trench is formed on the substrate. | 02-12-2009 |
20090134452 | NON-VOLATILE MEMORY - A non-volatile memory includes a substrate, a memory unit array, (N+1) bit lines, M word lines, M first control gate lines, and M second control gate lines. The memory unit array includes N memory unit columns, and each memory unit column includes M memory units. The (N+1) bit lines are disposed on the substrate and arranged in parallel in the column direction, and the (N+1) bit lines are corresponding to the N memory unit columns. The M word lines are disposed on the substrate and arranged in parallel in the row direction. The M first control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the first memory cell in the same row. The M second control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the second memory cell in the same row. | 05-28-2009 |
20090235365 | DATA ACCESS SYSTEM - A data access system includes a host and a storage device. The host has a security setup function and includes a first identity code storage block to store a first identity code. The storage device has a security check function and includes a second identity code storage block. The host executes the security setup function to set a second identity code according to the first identity code, and the second identity code is stored into the second identity code storage block. The storage device executes the security check function to determine if the host is allowed to access the storage device according to the first and second identity codes. | 09-17-2009 |
20090270071 | MOBILE PHONE ACCESSING SYSTEM AND RELATED STORAGE DEVICE - The present invention provides a mobile phone accessing system. The mobile phone accessing system comprises: a mobile phone having a first International Mobile Equipment Identity (IMEI) code; and a storage device comprising a first storage region for storing data, a second storage region for storing a second IMEI code, and a controller coupled to the first storage region and the second storage region for executing a security check function to determine whether the mobile phone is qualified to access the first storage region according to the first IMEI code. | 10-29-2009 |
20090270129 | MOBILE PHONE ACCESSING SYSTEM AND RELATED STORAGE DEVICE - The present invention provides a mobile phone accessing system. The mobile phone accessing system comprises: a mobile phone having a first Subscriber Identity Module (SIM) specification corresponding to a SIM card; and a storage device comprising a first storage region for storing data, a second storage region for storing a second SIM specification, and a controller coupled to the first storage region and the second storage region for executing a security check function to determine whether the mobile phone is qualified to access the first storage region according to the first SIM specification. | 10-29-2009 |
20090271585 | DATA ACCESSING SYSTEM AND RELATED STORAGE DEVICE - A data accessing system includes a host computer and a storage device. The host computer has a first media access control (MAC) address, and the storage device includes a first storage region, a second storage region, and a controller. The first storage region is utilized for storing data. The second storage region stores a second media access control address. The controller couples to the first storage region and the second storage region for executing a security checking function to determine if the host computer is qualified to access the first storage region according to the first media access control address. | 10-29-2009 |
20110024823 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH INTRINSIC CHARGE TRAPPING LAYER - A non-volatile semiconductor memory device includes a substrate, a first gate formed on a first region of a surface of the substrate, a second gate formed on a second region of the surface of the substrate, a charge storage layer filled between the first gate and the second gate, a first diffusion region formed on a first side of the charge storage layer, and a second diffusion region formed opposite the charge storage layer from the first diffusion region. The first region and the second region are separated by a distance sufficient for forming a self-aligning charge storage layer therebetween. | 02-03-2011 |
20110031560 | READ-ONLY MEMORY AND METHOD OF MANUFACTURE THEREOF - A mask-defined read-only memory array is formed on a substrate, and includes a first ROM bit and a second ROM bit of opposite polarities. The first ROM bit has a first MOS transistor and a first block layer formed over a first region of the substrate. A second source/drain region of the first MOS transistor and a first diffusion region are formed in a first region of the substrate on opposite sides of the first block layer. The second ROM bit includes a second MOS transistor. | 02-10-2011 |
20110242893 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a first transistor pair and first and second control gates. The first transistor pair includes first and second transistors that are connected in series and of the same type. The first and second transistors have a first floating polysilicon gate and a second floating polysilicon gate, respectively. The first control gate is coupled to the first floating polysilicon gate through a tunneling junction and the second control gate is coupled to the second floating polysilicon gate through another tunneling junction. | 10-06-2011 |
20110299336 | SINGLE-POLYSILICON LAYER NON-VOLATILE MEMORY AND OPERATING METHOD THEREOF - A single-polysilicon layer non-volatile memory having a floating gate transistor, a program gate and a control gate is provided. The floating gate transistor has a floating gate and a tunneling dielectric layer. The floating gate is disposed on a substrate. The tunneling dielectric layer is disposed between the floating gate and the substrate. The program gate, the control gate and the erase gate are respectively disposed in the substrate under the floating gate separated by the tunneling dielectric layer. Therefore, during a program operation and an erase operation, charges are injected in and expelled out through different regions of the tunneling dielectric layer, so as to increase reliability of the non-volatile memory. | 12-08-2011 |
20110310669 | Logic-Based Multiple Time Programming Memory Cell - A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell comprises a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further comprises two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor. | 12-22-2011 |
20120007161 | Semiconductor Non-volatile Memory - A method of forming a charge-storing layer in a non-volatile memory cell in a logic process includes forming a select gate over an active region of a substrate, forming long polysilicon gates partially overlapping the active region of the substrate, and filling the charge-storing layer between the long polysilicon gates. | 01-12-2012 |
20120018794 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH INTRINSIC CHARGE TRAPPING LAYER - A non-volatile semiconductor memory device includes a substrate, a first gate formed on a first region of a surface of the substrate, a second gate formed on a second region of the surface of the substrate, a charge storage layer filled between the first gate and the second gate, a first diffusion region formed on a first side of the charge storage layer, and a second diffusion region formed opposite the charge storage layer from the first diffusion region. The first region and the second region are separated by a distance sufficient for forming a self-aligning charge storage layer therebetween. | 01-26-2012 |
20120087170 | Single Polysilicon Non-Volatile Memory - A one-time-programmable memory device comprises a one-time-programmable memory cell array, a voltage pumping circuit, and a programming verification circuit. The one-time-programmable memory cell array comprises a plurality of memory cells. Each memory cell is arranged at an intersection of a bit line and a word line. The voltage pumping circuit comprises a plurality of local voltage boost circuits. Each local voltage boost circuit is shared by a corresponding memory cell of the plurality of memory cells. The programming verification circuit is coupled to the one-time-programmable memory cell array for verifying that conduction current of programmed memory cells of the plurality of memory cells is greater than a predetermined current level after programming. Each local boost circuit isolates leakage current of a corresponding programmed memory cell, and prevents programming voltage failure due to current overloading at a corresponding voltage pumping circuit. | 04-12-2012 |
20120134205 | OPERATING METHOD FOR MEMORY UNIT - An operating method for a memory unit is provided, wherein the memory unit includes a well region, a select gate, a first gate, a second gate, an oxide nitride spacer, a first diffusion region, and a second diffusion region. The operating method for the memory unit comprises the following steps. During a programming operation, a breakdown voltage is coupled to the second diffusion region through a first channel region formed under the select gate. A programming voltage is sequentially or simultaneously applied to the first gate and the second gate to rupture a first oxide layer and a second oxide layer, wherein the first oxide layer is disposed between the first gate and the well region, and the second oxide layer is disposed between the second gate and the well region. | 05-31-2012 |
20120163072 | NON-VOLATILE SEMICONDUCTOR MEMORY CELL WITH DUAL FUNCTIONS - A non-volatile semiconductor memory cell with dual functions includes a substrate, a first gate, a second gate, a third gate, a charge storage layer, a first diffusion region, a second diffusion region, and a third diffusion region. The second gate and the third gate are used for receiving a first voltage corresponding to a one-time programming function of the dual function and a second voltage corresponding to a multi-time programming function of the dual function. The first diffusion region is used for receiving a third voltage corresponding to the one-time programming function and a fourth voltage corresponding to the multi-time programming function. The second diffusion region is used for receiving a fifth voltage corresponding to the multi-time programming function. | 06-28-2012 |
20120223381 | Non-volatile memory structure and method for manufacturing the same - A non-volatile memory structure is disclosed. LDD regions may be optionally formed through an ion implantation using a mask for protection of a gate channel region of an active area. Two gates are apart from each other and disposed on an isolation structure on two sides of a middle region of the active area, respectively. The two gates may be each entirely disposed on the isolation structure or partially to overlap a side portion of the middle region of the active area. A charge-trapping layer and a dielectric layer are formed between the two gates and on the active area to serve for a storage node function. They may be further formed onto all sidewalls of the two gates to serve as spacers. Source/drain regions are formed through ion implantation using a mask for protection of the gates and the charge-trapping layer. | 09-06-2012 |
20120236635 | Logic-Based Multiple Time Programming Memory Cell - A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell comprises a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further comprises two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor. | 09-20-2012 |
20120273860 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - An only-one-polysilicon layer non-volatile memory unit cell includes a first P-type transistor, a second P-type transistor, a N-type transistor pair, a first and second coupling capacitors is provided. The N-type transistor pair has a third transistor and a fourth transistor that are connected. The third transistor and the fourth transistor have a first floating polysilicon gate and a second floating polysilicon gate to serve as charge storage mediums, respectively. One end of the second coupling capacitor is connected to the gate of the second transistor and is coupled to the second floating polysilicon gate, the other end of the second coupling capacitor receives a second control voltage. One end of the second coupling capacitor is connected to the gate of the second transistor and is coupled to the second floating polysilicon gate, the other end of the second coupling capacitor receives a second control voltage. | 11-01-2012 |
20120276700 | READ-ONLY MEMORY AND METHOD OF MANUFACTURE THEREOF - A mask-defined read-only memory array is formed on a substrate, and includes a first ROM bit and a second ROM bit of opposite polarities. The first ROM bit has a first MOS transistor and a first block layer formed over a first region of the substrate. A second source/drain region of the first MOS transistor and a first diffusion region are formed in a first region of the substrate on opposite sides of the first block layer. The second ROM bit includes a second MOS transistor. | 11-01-2012 |
20120314474 | NON-VOLATILE MEMORY CELL STRUCTURE AND METHOD FOR PROGRAMMING AND READING THE SAME - The present invention provides a non-volatile memory cell structure. A first isolation structure is disposed on a substrate and a semiconductor layer is disposed on the first isolation structure to form a silicon on insulator device. A first doping region is made of a portion of the semiconductor layer. A gate is disposed on the first doping region. A gate oxide layer is sandwiched between the first doping region and the gate. A second doping region is disposed within the semiconductor layer and outside the first doping region. A second doping region is in direct contact with the first doping region. A second isolation structure is disposed on the first isolation structure. Further, the second isolation structure surrounds the first doping region and the second doping region. The second isolation structure is also in direct contact with the first doping region and the second doping region. | 12-13-2012 |
20130010518 | ANTI-FUSE MEMORY ULTILIZING A COUPLING CHANNEL AND OPERATING METHOD THEREOF - An anti-fuse memory with coupling channel is provided. The anti-fuse memory includes a substrate of a first conductive type, a doped region of a second conductive type, a coupling gate, a gate dielectric layer, an anti-fuse gate, and an anti-fuse layer. The substrate has an isolation structure. The doped region is disposed in the substrate. A channel region is defined between the doped region and the isolation structure. The coupling gate is disposed on the substrate between the doped region and the isolation structure. The coupling gate is adjacent to the doped region. The gate dielectric layer is disposed between the coupling gate and the substrate. The anti-fuse gate is disposed on the substrate between the coupling gate and the isolation structure. The anti-fuse gate and the coupling gate have a space therebetween. The anti-fuse layer is disposed between the anti-fuse gate and the substrate. | 01-10-2013 |
20130105884 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH INTRINSIC CHARGE TRAPPING LAYER | 05-02-2013 |
20130119453 | NON-VOLATILE MEMORY UNIT CELL WITH IMPROVED SENSING MARGIN AND RELIABILITY - A non-volatile memory unit cell includes a transistor pair, and first, second, third and fourth control gates. The transistor pair has a first transistor and a second transistor that are connected in parallel and of opposite types. The first transistor and the second transistor have a first floating polysilicon gate and a second floating polysilicon gate, respectively, wherein the first floating polysilicon gate and the second floating polysilicon gate are electrically or physically isolated. The first control gate is capacitively coupled to the first floating polysilicon gate through a first coupling junction. The second control gate is capacitively coupled to the second floating polysilicon gates through a second coupling junction. The third control gate is capacitively coupled to the first floating polysilicon gate through a first tunneling junction. The fourth control gate is capacitively coupled to the second floating polysilicon gates through a second tunneling junction. | 05-16-2013 |
20130119458 | NOR FLASH MEMORY CELL AND STRUCTURE THEREOF - The present invention provides a NOR flash memory cell. The NOR flash memory cell includes a a substrate, an active area, a first gate structure, a second gate structure and at least one third gate structure. The first gate structure covers a first partial region of the active area and is formed by a silicon-rich nitride material. The second gate structure covers a second partial region of the active area. The third gate structure covers a third partial region between a first opening and the first gate structure. The active area has the first opening, the first opening disposed on a first side of the first gate structure and the first side is not neighbor to the second gate structure. The NOR flash memory cell further comprises a first conducting structure for covering the first opening to form a bit line signal receiving terminal. | 05-16-2013 |
20130121079 | NOR FLAH MEMORY CELL AND STRUCTURE THEREOF - The present invention provides a NOR flash memory cell. The NOR flash memory cell includes a first transistor, a second transistor and at least one third transistor. The first transistor has a control terminal, a first terminal and a second terminal. The control terminal used to receive a word line signal and the first terminal used to receive a bit line signal. A gate of the first transistor comprises a silicon-rich nitride layer and an oxide layer, wherein the silicon-rich nitride layer is buried in the oxide layer. A control terminal of the second transistor used to receive a read signal. A second terminal of the second transistor used to transport a source line signal according to the read signal. The third transistor coupled between the first transistor and the bit line signal, and a control terminal of the third transistor receives a midway control signal. | 05-16-2013 |
20130176793 | FLASH MEMORY APPARATUS - A flash memory apparatus is provided. The flash memory apparatus includes a plurality of memory cells and a plurality of programming voltage control generators. Each of the memory cells receives a programming control voltage through a control end thereof, and executes data programming operation according to the programming control voltages. Each of the programming voltage control generators includes a pre-charge voltage transmitter and a pumping capacitor. The pre-charge voltage transmitter provides pre-charge voltage to the end of each of the corresponding memory cells according to pre-charge enable signal during a first period. A pumping voltage is provided to the pumping capacitor during a second period, and the programming control voltage is generated at the control end of each of the memory cells. | 07-11-2013 |
20130234227 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a first PMOS transistor comprising a select gate, a first p-type doped region, and a second p-type doped region, wherein the select gate is connected to a select gate voltage, and the first p-type doped region is connected to a source line voltage; a second PMOS transistor comprising the second p-type doped region, a third p-type doped region, and a floating gate, wherein the third p-type doped region is connected to a bit line voltage; and an erase gate region adjacent to the floating gate, wherein the erase gate region is connected to an erase line voltage. | 09-12-2013 |
20130234228 | ERASABLE PROGRAMMABLE SINGLE-PLOY NONVOLATILE MEMORY - An erasable programmable single-poly nonvolatile memory includes a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer. | 09-12-2013 |
20140056051 | ONE-BIT MEMORY CELL FOR NONVOLATILE MEMORY AND ASSOCIATED CONTROLLING METHOD - A one-bit memory cell for a nonvolatile memory includes a bit line and a plurality of serially-connected storage units. The bit line is connected to the serially-connected storage units. Each storage unit includes a first doped region, a second doped region and a third doped region, which are formed in a surface of a substrate. A first gate structure is disposed over a first channel region between the first doped region and the second doped region. The first gate structure is connected to a control signal line. A second gate structure is disposed over a second channel region between the second doped region and the third doped region. The second gate structure is connected to an anti-fuse signal line. | 02-27-2014 |
20150048875 | HIGH VOLTAGE POWER CONTROL SYSTEM - A high voltage power control system comprises a microcontroller unit, an embedded non-volatile memory, and a high voltage driver. The micro controller unit is configured to control high voltage outputs of the high voltage power control system. The embedded non-volatile memory is electrically connected to the micro controller. The high voltage driver is electrically connected to the micro controller and is configured to output the high voltage outputs of the high voltage power control system. The high voltage power control system is compatible with a logic process while the embedded non-volatile memory and the high voltage power control system can still support operations of high voltage. | 02-19-2015 |