Patent application number | Description | Published |
20110057766 | SURFACE MOUNT RESISTOR - A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer. | 03-10-2011 |
20110128722 | Double-Side Display Panel with Backlight Module Used Therein and Manufacture Method Thereof - A backlight module and a display device using the same are provided. The display device further includes a first panel and a second panel disposed on opposite sides of the backlight module. The backlight module has a light module and a back plate with a through hole formed on it. The light module includes a flexible circuit board having a first strip and a second strip. A plurality of first light sources and second light sources are respectively disposed on the first strip and the second strip. The flexible circuit board passes through the through hole, and the first strip and the second strip are on two opposite sides of the back plate. The first strip and the first light sources are distributed along a side of the first panel while a portion of the second strip is bent to extend along a side of the second strip. | 06-02-2011 |
20110149191 | Backlight Module with Film Positioning Function and Display Device Using the Same - A backlight module includes a back plate, an optical sheet, and a lateral frame. The back plate has a first surface, wherein the first surface includes a raised portion formed near the edge of the first surface. An insertion opening is formed between the raised portion and the first surface. The optical sheet is disposed on the first surface, wherein a protrusion is formed at one end of the optical sheet to be inserted into the insertion opening. The lateral frame is disposed on the back plate and corresponds to the edge of the first surface. The lateral frame includes at least a side wall having a sinking portion formed at the bottom of the side wall, wherein the bottom of the side wall is disposed on the optical sheet while the raised portion is received in the sinking portion. | 06-23-2011 |
20120099342 | Complex Circuit Board and Fabrication Method Thereof - A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced. | 04-26-2012 |
20130121025 | BACKLIGHT MODULE - A backlight module includes a light guide plate and a light emitting unit. The light guide plate has a first side surface, a second side surface, and a third side surface. The first side surface is located opposite to the second side surface. A height of the first side surface is greater than a height of the second side surface. The third side surface is located between the first side surface and the second side surface and has a light entrance surface and a light exit surface. The light entrance surface is connected to the first side surface and the light exit surface. The light exit surface is connected to the second side surface. An included angle is formed between the light entrance surface and the light exit surface. The light emitting unit is disposed on the light entrance surface. | 05-16-2013 |
20140109403 | Complex Circuit Board and Fabrication Method Thereof - A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced. | 04-24-2014 |
Patent application number | Description | Published |
20140333547 | TOUCH PANEL - A touch panel includes a substrate, a first sensing series, a second sensing series, a transmitting IC, a receiving IC, a plurality of first control-signal lines, a plurality of second control-signal lines, a flexible circuit board and a control unit. The transmitting IC is configured to transmit a signal to the first sensing series. The receiving IC is configured to receive a signal from the second sensing series. The flexible circuit board has a junction end bonded on a bonding area of the substrate, and is connected to the first and second control-signal lines. The control unit transmits a first control signal and a second control signal respectively to the transmitting IC and the receiving IC through the flexible circuit board. | 11-13-2014 |
20150227233 | CAPACITIVE TOUCH PANEL - A capacitive touch panel provides a partially high-resolution by mixing multiple resolutions. The capacitive touch panel includes a first electrode layer, a second electrode layer, an insulating layer, and a single one integrated circuit chip. The first electrode layer and the second electrode layer respectively include multiple sensor electrodes disposed with uneven density, so that a part of the touch panel has higher resolution, and other part of the touch panel has lower resolution. The capacitive touch panel provides partially higher resolution by adjusting the distribution of the electrodes without increasing the number of pins of the integrated circuit chip. | 08-13-2015 |
20160047974 | LIGHT EMITTING ASSEMBLY AND BACKLIGHT MODULE - A light emitting assembly, a backlight module having the light emitting assembly, and a liquid crystal display (LCD) apparatus having the backlight module are provided. The light emitting assembly includes a rigid circuit board, a plurality of light emitting diode (LED) devices, and a flexible circuit board. The rigid circuit board has a plurality of external circuits isolated from one another. The LED devices are disposed on the rigid circuit board, and each of the external circuits is connected to a corresponding one of the LED devices. The flexible circuit board has a plurality of connecting lines, and each of the connecting lines is connected to at least two of the external circuits, so as to serially connect the LED devices that are connected to the external circuits. | 02-18-2016 |
Patent application number | Description | Published |
20140252488 | Channel Epitaxial Regrowth Flow (CRF) - A Fin-FET fabrication approach and structure are provided using channel epitaxial regrowth flow (CRF). The method includes forming a Fin-FET structure including a Si line on a substrate, shallow trench isolation (STI) oxide on both sides of the Si line on the substrate, and a poly wall on top of and across the STI oxide and the Si line, wherein the Si line is higher than the STI oxide from the substrate. The method further includes thinning the STI oxide and the Si line while maintaining about the same height ratio of the Si line and the STI oxide, and forming a spacer wall adjacent to both sides of the poly wall and further adjacent to Si and STI oxide side walls under the poly wall uncovered due thinning the STI oxide and the Si line. | 09-11-2014 |
20140264725 | SILICON RECESS ETCH AND EPITAXIAL DEPOSIT FOR SHALLOW TRENCH ISOLATION (STI) - The embodiments described provide methods and semiconductor device areas for etching an active area region on a semiconductor body and epitaxially depositing a semiconductor layer overlying the active region. The methods enable the mitigation or elimination of problems encountered in subsequent manufacturing associated with STI divots. | 09-18-2014 |
20150097242 | Channel Epitaxial Regrowth Flow (CRF) - A Fin-FET fabrication approach and structure are provided using channel epitaxial regrowth flow (CRF). The method includes forming a Fin-FET structure including a Si line on a substrate, shallow trench isolation (STI) oxide on both sides of the Si line on the substrate, and a poly wall on top of and across the STI oxide and the Si line, wherein the Si line is higher than the STI oxide from the substrate. The method further includes thinning the STI oxide and the Si line while maintaining about the same height ratio of the Si line and the STI oxide, and forming a spacer wall adjacent to both sides of the poly wall and further adjacent to Si and STI oxide side walls under the poly wall uncovered due thinning the STI oxide and the Si line. | 04-09-2015 |
20150235897 | Reverse Tone Self-Aligned Contact - Some embodiments of the present disclosure relate to a method to form a source/drain self-aligned contact to a transistor or other semiconductor device. The method comprises forming a pair of gate structures over a substrate, and forming a source/drain region between the pair of gate structures. The method further comprises forming a sacrificial source/drain contact which is arranged over the source/drain region and which is arranged laterally between neighboring sidewalls of the pair of gate structures. The method further comprises forming a dielectric layer which extends over the sacrificial source/drain contact and over the pair of gate structures. The dielectric layer differs from the sacrificial source/drain contact. The method further comprises removing a portion of the dielectric layer over the sacrificial source/drain contact and subsequently removing the sacrificial source/drain contact to form a recess, and filling the recess with a conductive material to form a source/drain contact. | 08-20-2015 |
20150348796 | Nano Wire Structure and Method for Fabricating the Same - A device comprises a first group of nanowires having a first pattern, a second group of nanowires having a second pattern, a third group of nanowires having a third pattern and a fourth group of nanowires having a fourth pattern, wherein the first pattern, the second pattern, the third pattern and the fourth pattern form a repeating pattern. | 12-03-2015 |
20150348848 | SELF-ALIGNED NANOWIRE FORMATION USING DOUBLE PATTERNING - A method includes forming a pattern-reservation layer over a semiconductor substrate. The semiconductor substrate has a major surface. A first self-aligned multi-patterning process is performed to pattern a pattern-reservation layer. The remaining portions of the pattern-reservation layer include pattern-reservation strips extending in a first direction that is parallel to the major surface of the semiconductor substrate. A second self-aligned multi-patterning process is performed to pattern the pattern-reservation layer in a second direction parallel to the major surface of the semiconductor substrate. The remaining portions of the pattern-reservation layer include patterned features. The patterned features are used as an etching mask to form semiconductor nanowires by etching the semiconductor substrate. | 12-03-2015 |
20150364371 | SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER - An integrated circuit structure includes a first Inter-Layer Dielectric (ILD), a gate stack in the first ILD, a second ILD over the first ILD, a contact plug in the second ILD, and a dielectric protection layer on opposite sides of, and in contact with, the contact plug. The contact plug and the dielectric protection layer are in the second ILD. A dielectric capping layer is over and in contact with the contact plug. | 12-17-2015 |
20150364575 | SILICON RECESS ETCH AND EPITAXIAL DEPOSIT FOR SHALLOW TRENCH ISOLATION (STI) - Some embodiments of the present disclosure relate to a method. In this method, a semiconductor substrate, which has an active region disposed in the semiconductor substrate, is received. A shallow trench isolation (STI) structure is formed to laterally surround the active region. An upper surface of the active region bounded by the STI structure is recessed to below an upper surface of the STI structure. The recessed upper surface extends continuously between inner sidewalls of the STI structure and leaves upper portions of the inner sidewalls of the STI structure exposed. A semiconductor layer is epitaxially grown on the recessed surface of the active region between the inner sidewalls of the STI structure. A gate dielectric is formed over the epitaxially-grown semiconductor layer. A conductive gate electrode is formed over the gate dielectric. | 12-17-2015 |
Patent application number | Description | Published |
20120103103 | Pressure Testing Device - A pressure testing device includes: a vacuum pump having positive and negative pressure terminals; a first solenoid valve having a first intake terminal and a first exhaust terminal connected to the negative pressure terminal; a second solenoid valve having a second exhaust terminal and a second intake terminal connected to the positive pressure terminal; a pressure sensor having one end connected to the first intake terminal and the second exhaust terminal and the other end connected to a pressure testing terminal of an object; an operation module for displaying an operation interface to input pressure testing parameters; and a control unit for performing an air-extracting process through the vacuum pump and first solenoid valve or an air-exhausting process through the vacuum pump and second solenoid valve to the object according to the inputted parameters and displaying the state of the object sensed by the pressure sensor through the operation module. | 05-03-2012 |
20120103446 | Air Pressure Producing Apparatus - An air pressure producing apparatus includes: a vacuum pump having a negative pressure terminal and a positive pressure terminal; a first solenoid valve having a first intake terminal and a first exhaust terminal connected to the negative pressure terminal of the vacuum pump; a second solenoid valve having a second exhaust terminal and a second intake terminal connected to the positive pressure terminal of the vacuum pump; and a control unit connected to the vacuum pump, the first solenoid valve and the second solenoid valve for controlling the vacuum pump to extract air at the negative pressure terminal thereof so as to produce a negative pressure at the first intake terminal of the first solenoid valve and controlling the vacuum pump to exhaust air at the positive pressure terminal thereof so as to produce a positive pressure at the second exhaust terminal of the second solenoid valve. | 05-03-2012 |
20120115461 | COMMUNICATION SERVICE HANDOVER PROCESSING SYSTEM FOR FEMTOCELLS AND METHOD THEREOF - A method for processing handover of a mobile communication device between femtocell base stations, includes: setting communication alert value and signal capture time period; detecting the signal strength of the femtocell base station currently serving the mobile communication device, and when the detected signal strength is less than the communication alert value, performing a timing operation to continuously capture the signal strength of the serving femtocell base station and other femtocell base stations that allow the mobile communication device to access thereto until the elapsed time measured through the timing operation reaches the signal capture time period, and creating a priority list according to the signal strength of said other femtocell base stations; and choosing the femtocell base station with highest priority as a handover target when the signal strength of the serving femtocell base station is less than that of the femtocell base station with highest priority. | 05-10-2012 |
20120126615 | Production Line Capable of Supplying Electric Power - A production line includes a carrier board having a power socket that has a plurality of power lines and a plurality of conductive elements connected to the power lines, respectively; a track having a track body and a pair of track sidewalls; a plurality of electricity-collecting tracks provided on the track body for supplying different power signals; and a plurality of guarding units, each of which has a supporting frame perpendicularly provided on the track body and a covering sheet connected to the supporting frame for covering the electricity-collecting tracks, a plurality of crevices formed between each of the covering sheets; wherein each of the conductive elements has a contact end penetrating and extending into each of the crevices and flexibly contacting each of the corresponding electricity-collecting tracks so as to receive the different power signals and transmit the different power signals to the power lines of the power socket. | 05-24-2012 |
20120126718 | LED Array Inspection Fixture - An inspection fixture for inspecting an LED array of a circuit board under test through a power supply unit, includes: an inspection base having a testing platform with a plurality of pairs of anode and cathode probes corresponding to anode and cathode pins of the LEDs of the LED array, each pair being electrically connected to the power supply unit to constitute a power supply circuit; a carrier board used for carrying the circuit board under test and having through holes corresponding to the anode and cathode probes; and a pressing member for pressing the circuit board and driving the carrier board to move so as to enable the anode and cathode probes to pass through the through holes and come into contact with the anode and cathode pins of the LEDs, thereby supplying power to each of the LEDs to emit light through the power supply circuit. | 05-24-2012 |
20120126784 | DEVICE FOR MEASURING CURRENT - A device for measuring current is connected to a data processing apparatus loaded with a current value comparison program for performing a quality test on a portable electronic apparatus with a battery. The portable electronic apparatus has a battery compartment for receiving the battery. The device for measuring current includes: a power supplying module for generating a low-voltage current; a dummy battery with a shape of the battery for inserting into the battery compartment, the dummy battery electrically connected to the power supplying module and the portable electronic apparatus to provide the low-voltage current generated by the power supply module to the portable electronic apparatus, forming a power supply loop to the portable electronic apparatus; and a current measuring module electrically connected to the power supply loop for measuring a current value of the power supply loop when the portable electronic apparatus is performing a specific function and transmitting the measured current value to the data processing apparatus for comparison. The present invention does not heavily rely on manual operations to measure the current of the portable electronic apparatus. | 05-24-2012 |
20120132702 | Test Assist Device - A test assist device includes: a network function module having a network port that is connectible to a network device; a control module connected to the network function module and having a processing unit and a transmission port electrically connectible to an input unit for receiving from the input unit at least one of basic test data and test result messages of an object, the processing unit transmitting the received at least one of the basic test data and the test result messages via the network function module to the network device; and an output module connected to the control module and having a basic status prompt unit and a test result prompt unit, the basic status prompt unit having a plurality of LEDs for displaying corresponding information corresponding to the basic test data, the test result prompt unit displaying corresponding information corresponding to the test result messages. | 05-31-2012 |
Patent application number | Description | Published |
20140021899 | Driving circuit and method for fan - A driving circuit for driving a fan with a plurality of operational modes includes an initiation module for generating a switch signal according to a feedback signal, a control module coupled to the initiation module for utilizing a pulse frequency modulation technique to generate a control signal according to the switch signal and a predetermined comparison signal, so as to drive the fan for a rotational operation, and a feedback module coupled to the fan for generating the feedback signal according to a conduction result of the fan. The rotational operation includes the plurality of operational modes, and the fan is switched between the plurality of operational modes according to different conduction results of the fan. | 01-23-2014 |
20140021901 | Driving circuit and method for fan - A driving circuit for a fan includes an initiation module for generating a switch signal according to a feedback signal, a control module coupled to the initiation module for generating a control signal according to the switch signal and a predetermined comparison signal, so as to drive the fan for a rotational operation, and a feedback module coupled to the fan for generating the feedback signal according to a conduction result of the fan, wherein the control module utilizes a pulse frequency modulation technique to generate the control signal, and the conduction result is realized via a voltage type or a current type to correspond to a rotational speed of the rotational operation. | 01-23-2014 |
20140163700 | CONTROL DEVICE, CONTROL METHOD AND RELATED POWER MANAGEMENT SYSTEM - A control device for controlling a power management system to enter an operating mode includes a power converting device, for providing input power for the control device; an operating mode control signal, for controlling the power management system to enter the operating mode, wherein the operating mode control signal is a first signal of the power management system; and an operating result displaying signal, for displaying at least one operating result in the operating mode, wherein the operating result displaying signal is a second signal of the power management system. | 06-12-2014 |
20140186156 | FAN CONTROL CIRCUIT AND SYSTEM - A fan control circuit for controlling a two-wire or three wire fan in a fan control system includes: a rotational speed detecting module, for detecting a rotational speed of the fan, in order to generate a rotational speed signal; a rotational speed converting module, coupled to the rotational speed detecting module, for converting the rotational speed signal into a first voltage signal; and a feedback control module, coupled to the rotational speed converting module, for generating a fan control signal to control the fan according to the first voltage signal. | 07-03-2014 |
Patent application number | Description | Published |
20090153245 | VARIABLE-GAIN WIDE-DYNAMIC-RANGE AMPLIFIER - A variable-gain wide-dynamic-range amplifier including an amplifier module, a control unit, and an output current regulating circuit is provided. The amplifier module amplifies an input signal. The amplifier module includes several amplifier units coupled to each other in parallel. The gains of the amplifier units are different. The control unit enables at least one of the amplifier units according to a gain control signal. The at least one of the amplifier units which is enabled is for outputting a current signal in response to the input signal. The output regulating circuit is for receiving the current signal and outputting an output signal accordingly by regulating the magnitude of the current signal under the control of the control unit. Each of the amplifier units is coupled to the output current regulating circuit in series. The control unit is for controlling the output current regulating circuit according to the gain control signal. | 06-18-2009 |
20100291890 | RECEIVER - A receiver including an amplifier module, a control unit, a mixer and an IF amplifier is provided. The amplifier module, including multiple amplifier units with different gains, amplifies an input signal. The control unit enables at least one of the amplifier units according to a gain control signal, wherein the enabled at least one amplifier unit generates an output RF signal in response to the input signal. The mixer coupled with each amplifier unit in series down-converts the output RF signal into an IF signal according to a local oscillation frequency. The IF amplifier having a variable gain is coupled to the mixer for amplifying the IF signal to an output signal according to the gain control signal. The control unit obtains the gain control signal according to the output signal and a reference signal. | 11-18-2010 |
20110063032 | BALUN AMPLIFIER - A balun amplifier is provided, which includes two input terminals, two output terminals and two modules. The first and the second input terminals receive a single-ended input signal, respectively. The first and the second output terminals provide a differential output signal. The first module is coupled to the first input terminal, the first output terminal, and the second output terminal. The second module is coupled to the second input terminal, the first output terminal, and the second output terminal. The first and the second modules receive the single-ended input signal through the first and the second input terminals respectively, amplify the single-ended input signal respectively, and convert the single-ended input signal into the differential output signal. The circuit topologies of the first and the second modules are symmetric except that types of transistors in the first and the second modules are different. | 03-17-2011 |
Patent application number | Description | Published |
20100034198 | METHOD AND GATEWAY FOR ROUTING INTERNATIONAL MOBILE TELEPHONE CALLS - A gateway for routing an international mobile telephone call comprises a storage device and a cost-saving routing module. The storage device is configured to store a mapping table and a call record table. The mapping table records a mobile phone number of a roaming subscriber and a fixed network number, and the call record table records a caller's phone number and the mobile phone number of the roaming subscriber. The cost-saving routing module is configured to establish a connection in accordance with the mapping table and call record table. | 02-11-2010 |
20110044306 | CALL SETUP METHOD FOR MOBILE VIRTUAL PRIVATE NETWORK AND ACCESS POINT APPARATUS THEREOF - A call setup method is provided for a MVPN which includes at least one access point apparatus, at least one database, and a plurality of users. The database records a private extension number, a user phone number, and a user identity module of each user and a link address of the corresponding access point apparatus. The access point apparatus corresponding to a MO user receives a call setup request message for setting up a call with a MT user from the MO user. The access point apparatus corresponding to the MO user determines whether the link address of the access point apparatus corresponding to the MT user is valid according to the database. If the link address of the access point apparatus corresponding to the MT user is valid, the MO user and the MT user set up the call through the access point apparatuses corresponding to the link addresses. | 02-24-2011 |
20120295599 | CALL SETUP METHOD FOR MOBILE VIRTUAL PRIVATE NETWORK AND ACCESS POINT APPARATUS THEREOF - A call setup method is provided for a MVPN which includes at least one access point apparatus, at least one database, and a plurality of users. The database records a private extension number, a user phone number, and a user identity module of each user and a link address of the corresponding access point apparatus. The access point apparatus corresponding to a MO user receives a call setup request message for setting up a call with a MT user from the MO user. The access point apparatus corresponding to the MO user determines whether the link address of the access point apparatus corresponding to the MT user is valid according to the database. If the link address of the access point apparatus corresponding to the MT user is valid, the MO user and the MT user set up the call through the access point apparatuses corresponding to the link addresses. | 11-22-2012 |
20120295627 | CALL SETUP METHOD FOR MOBILE VIRTUAL PRIVATE NETWORK AND ACCESS POINT APPARATUS THEREOF - A call setup method is provided for a MVPN which includes at least one access point apparatus, at least one database, and a plurality of users. The database records a private extension number, a user phone number, and a user identity module of each user and a link address of the corresponding access point apparatus. The access point apparatus corresponding to a MO user receives a call setup request message for setting up a call with a MT user from the MO user. The access point apparatus corresponding to the MO user determines whether the link address of the access point apparatus corresponding to the MT user is valid according to the database. If the link address of the access point apparatus corresponding to the MT user is valid, the MO user and the MT user set up the call through the access point apparatuses corresponding to the link addresses. | 11-22-2012 |
Patent application number | Description | Published |
20110149563 | LINEAR SOLID-STATE LIGHTING WITH SHOCK PROTECTION SWITCHES - A linear light-emitting diode (LED)-based solid-state device comprising at least two shock protection switches, at least one each at the two ends of the device, fully protects a person from possible electric shock during re-lamping with LED lamps. | 06-23-2011 |
20110149564 | LINEAR SOLID-STATE LIGHTING WITH A DOUBLE SAFETY MECHANISM FREE OF SHOCK HAZARD - A linear light-emitting diode (LED)-based solid-state lamp having a double safety mechanism that comprises at least three shock protection switches, fully protects a person from possible electric shock during re-lamping or maintenance. One protection switch provided at each end of the lamp is able to cut off power when the associated end of the lamp is not inserted into the lamp socket. A third protection switch can be used to turn off the power from the AC main for additional shock protection. | 06-23-2011 |
20110176297 | LINEAR SOLID-STATE LIGHTING WITH BROAD VIEWING ANGLE - A linear light-emitting diode (LED)-based solid-state device comprising a curved surface to hold a flexible printed circuit board with multiple linear arrays of surface mount LEDs provides lighting applications with a broad viewing angle over 180° along the radial direction. On each of the two lamp bases of the lamp, a shock-protection switch is mounted to prevent shock hazard during re-lamping. | 07-21-2011 |
20140097757 | MULTI-PURPOSE RECHARGEABLE LED LIGHTING DEVICE - An LED lighting device includes at least one LED light source emitting light, at least one rechargeable battery for supplying power when external power is not available, at least one electrical connector for connecting the rechargeable battery to external power source for recharging, and at least one control mechanism for switching the operation mode of the device. By setting the operation mode via the control mechanism, the LED light device can be used for more than one intended purposes such as regular lighting, emergency lighting, and flashlight. | 04-10-2014 |
20140268813 | LIGHTING DEVICE WITH VIRTUAL LIGHT SOURCE - A lighting device includes a light source and an enclosure enclosing the light source wherein a portion of the enclosure has a focus-forming curvature such that when the light from the light source is reflected off the enclosure element the reflected light intersects at the focus of the curvature and creates a virtual light source at the focus. A reflective coating or a reflective material may be applied to the enclosure, or a ball lens may be used around the light source, to increase the intensity of the reflected light and of the virtual light source. A diffuser may be used to change the size and shape of the virtual light source. | 09-18-2014 |
20150108900 | Add-On Smart Controller For LED Lighting Device - An add-on smart controller for an LED lighting device includes a power input port, a power output port, a housing, a control unit in the housing, and at least one control signal receiver in the control unit. A power input of the control unit is connected to the power input port. A power output of the control unit is connected to the power output port. The control signal receiver is configured to receive external control signals. The control unit is configured to activate the power output port to supply output voltage responsive to the control unit receiving an ON signal. The control unit is configured to deactivate the power output port responsive to the control unit receiving an OFF signal. | 04-23-2015 |
20150146418 | Retractable End-Cap For LED Tube - Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, at least one elastic component, and a connecting assembly. The end-cap housing may include at least one power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. The end-cap housing may connect to a first end of the connecting assembly via an extendable connection and a second end of the connecting assembly opposite to the first end thereof connects to a body of the LED tube through at least one power connector. The power connector may connect to the at least one power pin when the elastic component is pressed. The power connector may remain separate from the at least one power pin when the elastic component is not pressed. | 05-28-2015 |
20150176771 | Retractable End-Cap For LED Tube - Embodiments of an end-cap with retractable and rotatable pin for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an end-cap base assembly, a power-pin assembly, and at least one elastic component. The power-pin assembly may include at least one power pin thereon and configured to connect to an external power source. The power-pin assembly may protrude out of a center opening of the end-cap housing. The end-cap base assembly may have at least one power connector one end of which is connected to the body of the LED tube to receive electric power. The at least one elastic components may reside inside the end-cap housing and is placed between the power-pin assembly and the end-cap base assembly. The power connector may connect to the at least one power pin when the at least one elastic component is pressed. | 06-25-2015 |
20150198291 | Retractable End-Cap For LED Tube - Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an elastic component, a power connector, and a movable assembly. The movable assembly may include a power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. A first end of the movable assembly may connect to the end-cap housing. A second end of the connecting assembly opposite to the first end thereof may connect to a body of the LED tube through the power connector. The power connector may be electrically disconnected from the power pin when the end-cap housing is pressed. The power connector may be electrically connected to the power pin when the end-cap housing is not pressed. | 07-16-2015 |
20150223301 | LED Lighting Device With Replaceable Driver-Control Module - An LED lighting device with a replaceable driver-control module interface is described. The LED lighting device may include a driver-less LED lighting device, a driver-control module with driver function, and a housing interface on the driver-less LED lighting device to house and connect the driver-control module. The driver-less LED lighting device receives AC from an external AC source and passes the AC to the driver-control module. The driver-control module receives AC from the driver-less LED lighting device and provides DC to the driver-less lighting device to drive LED diodes in the driver-less LED lighting device. The housing interface on the lighting device houses the driver-control module such that, when the driver-control module is fastened to the driver-less lighting device through the housing interface, the driver-control becomes an integral part of the lighting device. | 08-06-2015 |
Patent application number | Description | Published |
20110007452 | Lamellar Stacked Solid Electrolytic Capacitor - A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit. | 01-13-2011 |
20110216475 | STACKED SOLID-STATE ELECTROLYTIC CAPACITOR WITH MULTI-DIRECTIONAL PRODUCT LEAD FRAME STRUCTURE - A stacked solid-state electrolytic capacitor with multi-directional product lead frame structure includes a plurality of capacitor units, a substrate unit and a package unit. The capacitor units are stacked onto each other. Each capacitor unit has a positive electrode and a negative electrode, the positive electrode of each capacitor unit has a positive pin extended outwards, the positive pins are electrically stacked onto each other, and the negative electrodes are electrically stacked onto each other. The substrate unit has at least one positive guiding substrate electrically connected to the positive pins of the capacitor units and a plurality of negative guiding substrates electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit in order to expose an end of the at least one positive guiding substrate and an end of each negative guiding substrate. | 09-08-2011 |
20120099247 | SOLID ELECTROLYTIC CAPACITOR HAVING A PROTECTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage. | 04-26-2012 |
20130010404 | CAPACITANCE UNIT AND STACKED SOLID ELECTROLYTIC CAPACITOR - A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion. | 01-10-2013 |
20130258555 | CAPACITOR UNIT AND STACKED SOLID ELECTROLYTIC CAPACITOR HAVING THE SAME - The present invention relates to a capacitor unit, which includes an anode portion, a cathode portion, and an insulating portion. The insulating portion is provided for in a form of a headband to partially cover the surface of the anode portion to divide the anode and the cathode portions. The cathode portion partially covers the anode portion and is located behind the insulating portion. The cathode portion has at least one conductive layer which is made of a conductive polymer having copper, copper alloy, or a mixture thereof. | 10-03-2013 |
20140071589 | WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE - A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body. | 03-13-2014 |
20140071590 | STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE - A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body. | 03-13-2014 |
20140259580 | METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS - The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit. | 09-18-2014 |
20140262459 | WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A CARRIER BOARD AND METHOD OF MANUFACTURING THE SAME - A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface. | 09-18-2014 |
20140268500 | WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME - A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body. | 09-18-2014 |
20140268503 | WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME - A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body. | 09-18-2014 |
20140307365 | SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME - A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion. | 10-16-2014 |
20150318116 | METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS - The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit. | 11-05-2015 |
20160118196 | SEALING ELEMENT AND WOUND-TYPE SOLID STATE ELECTROLYTIC CAPACITOR THEREOF - A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved. | 04-28-2016 |
Patent application number | Description | Published |
20120278871 | USER IDENTIFICATION METHOD APPLICABLE TO NETWORK TRANSACTION AND SYSTEM THEREOF - A user identification method and a system thereof. A user device delivers a certificate packet with a unique serial number to a certificate server, and receives a reply packet with a password from a password server. The user device then uses the password and the unique serial number to produce a user terminal identification code, and then delivers an identification packet with the user terminal identification code to the certificate server. After receiving the certificate packet, the certificate server delivers an inquiry packet with the unique serial number to the password server, and then the password server inquires about password and expiration time thereof according to the unique serial number. After receiving the identification packet, the certificate server verifies the validity of the user terminal identification code and the expiration time with a database to determine if the user is admitted to proceed to the subsequent transaction. | 11-01-2012 |
20120297465 | USER IDENTIFICATION METHOD APPLICABLE TO NETWORK TRANSACTION AND SYSTEM THEREOF - A user identification method and a system thereof are provided. A user device delivers a certificate packet with a user identification number to a certificate server, and receives a reply packet with a code from a password server. The user device uses the code to produce a user terminal identification code, and delivers an identification packet with the user terminal identification code to the certificate server. After having received the certificate packet, the certificate server delivers an inquiry packet with the user identification number to the password server, for the password server to inquire about the password and expiration time according to the user identification number. After having received the identification packet, the certificate server verifies the validity of the user terminal identification code and the expiration time with a database to determine whether the user is allowed to proceed to the subsequent transaction. | 11-22-2012 |
20130206540 | CLUTCH TYPE DRIVING MECHANISM FOR HYBRID POWERED VEHICLE - A clutch type driving mechanism used in a hybrid powered vehicle is disclosed to include an axle housing mounted at a motor shaft of a motor, a sliding sleeve having a female thread meshed with a male thread of the axle housing, an axle bearing mounted in the sliding sleeve, an input shaft rotatably and slidably supported in the axle bearing with its one end normally kept apart from the axle housing and its other end provided with a gear, and an output shaft meshed with the gear of the input shaft. When the motor is started, the axle housing is driven by the motor shaft to rotate the sliding sleeve, and the sliding sleeve is moved along the axle housing toward the motor due to the effects of inertia, causing friction engagement between the input shaft and the axle housing so that the axle housing can drive the input shaft to transfer rotational motion to the output shaft. When the motor stands still, the inertia disappears, the sliding sleeve moved back from the axle housing, causing separation between the input shaft and the axle housing. | 08-15-2013 |
20130260958 | CLUTCH TYPE DRIVING MECHANISM FOR HYBRID POWERED VEHICLE - A clutch type driving mechanism used in a hybrid powered vehicle is disclosed to include a motor, a speed reducing mechanism, a hollow shaft, an output shaft and first and second one-way clutches. The motor provides a rotational kinetic energy through the hollow axle to the speed reducing mechanism. The speed reducing mechanism and the output shaft transfer a unidirectional rotary motion to the hollow shaft through the first one-way clutch and the second one-way clutch respectively. Thus, when the output shaft works as a drive shaft, it does not transfer the rotary motion to the speed reducing mechanism, avoiding power loss and allowing transfer of the rotational kinetic energy rapidly and efficiently without bearing much load. | 10-03-2013 |
20150266373 | TRANSMISSION SYSTEM FOR AN ELECTRIC VEHICLE - A transmission system for an electric vehicle includes a gearbox which produces different rotation ratio between a drive motor and drive wheels during running of the electric vehicle, a differential which serves to absorb a power of the gearbox to overcome rotation speed difference between the drive wheels, and two wheel axles which are used to deliver the power to the drive wheels from the differential, the gearbox has a housing which is connected to a vehicle frame of the electric vehicle via a universal coupling. When the electric vehicle runs on a bumpy road and makes a turn, the vehicle frame is able to swing up and down and pivot left and right with respect to the gearbox housing, so as to reduce the bounce of the vehicle and dampen the centrifugal force caused tilt or roll of the vehicle, thus improving driving comfort and stability. | 09-24-2015 |
Patent application number | Description | Published |
20110110813 | Tin-indium based lead-free solders with zinc addition - A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the assembly of electrical products, the dissolution rates of the substrates and the growth of the intermetallic compounds formed at the interfaces can be reduced; and thereby the properties of joints can be improved. | 05-12-2011 |
20140117555 | Integrated Circuit Underfill Scheme - An integrated circuit includes a substrate having at least one depression on a top surface. At least one solder bump is disposed over the substrate. A die is disposed over the at least one solder bump and electrically connected with the substrate through the at least one solder bump. An underfill surrounds the at least one solder bump and is formed between the substrate and the die. The at least one depression is disposed around the underfill to keep any spillover from the underfill in the at least one depression. | 05-01-2014 |
20140138816 | Method for Forming Package-on-Package Structure - A method comprises attaching a semiconductor die on a first side of a wafer, attaching a first top package on the first side of the wafer and attaching a second top package on the first side of the wafer. The method further comprises depositing an encapsulation layer over the first side of the wafer, wherein the first top package and the second top package are embedded in the encapsulation layer, applying a thinning process to a second side of the wafer, sawing the wafer into a plurality of chip packages and attaching the chip package to a substrate. | 05-22-2014 |
20140160688 | Methods and Apparatus for Package with Interposers - Methods and apparatus for an interposer with a dam used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure. | 06-12-2014 |
20140252657 | Package Alignment Structure and Method of Forming Same - An embodiment is a semiconductor device comprising a first bond pad on a first substrate, the first bond pad having a first center line through a center of the first bond pad and orthogonal to a top surface of the first substrate, and a first conductive connector on a second substrate, the first conductive connector having a second center line through a center of the first conductive connector and orthogonal to a top surface of the second substrate, the second substrate over the first substrate with the top surface of the first substrate facing the top surface of the second substrate. The semiconductor device further comprises a first alignment component adjacent the first bond pad on the first substrate, the first alignment component configured to align the first center line with the second center line. | 09-11-2014 |
20140353819 | Polymer Layers Embedded with Metal Pads for Heat Dissipation - An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad. | 12-04-2014 |
20150061116 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, an under bump metallurgy (UBM) pad on the carrier, and a post on a surface of the UBM pad. In some embodiments, a height of the post to a longest length of the UBM pad is between about 0.25 and about 0.7. A method of manufacturing a semiconductor device includes providing a carrier, disposing a UBM pad on the carrier and forming a post on the UBM pad. | 03-05-2015 |
20150108635 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a three dimensional stack including a first semiconductor die and a second semiconductor die. The second semiconductor die is connected with the first semiconductor die with a bump between the first semiconductor die and the second semiconductor die. The semiconductor structure includes a molding compound between the first semiconductor die and the second semiconductor die. A first portion of a metal structure over a surface of the three dimensional stack and contacting a backside of the second semiconductor die and a second portion of the metal structure over the surface of the three dimensional stack and configured for electrically connecting the three dimensional stack with an external electronic device. | 04-23-2015 |
20150130020 | SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF - The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI. | 05-14-2015 |
20150255273 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a die including a first surface, a recess extended from an aperture disposed on the first surface and including a sidewall disposed within the die, and a polymeric member configured for filling and sealing the recess and including a first outer surface and a second outer surface, wherein the first outer surface is interfaced with the sidewall of the recess. | 09-10-2015 |
20150311169 | Polymer Layers Embedded With Metal Pads for Heat Dissipation - An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad. | 10-29-2015 |