Chinda, JP
Akira Chinda, Hitachi JP
Patent application number | Description | Published |
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20080251387 | Wiring Board and Production Method Thereof - It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film. | 10-16-2008 |
20090057156 | PRODUCTION METHOD FOR WIRING AND VIAS - It is an object of the present invention to alleviate a work for removing an unnecessary metal layer when wiring and vias are formed on a substrate by electroplating. | 03-05-2009 |
20090323299 | ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME - An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer. | 12-31-2009 |
20100181100 | COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section. | 07-22-2010 |
Akira Chinda, Tokyo JP
Patent application number | Description | Published |
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20080201943 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method - An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode. | 08-28-2008 |
20090211796 | ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD - An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode. | 08-27-2009 |
Chiho Chinda, Wako-Shi JP
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20140261312 | INTAKE CONTROL SYSTEM FOR INTERNAL COMBUSTION ENGINE - An intake control system for an internal combustion engine is capable of ensuring a differential pressure across an EGR valve, and controlling an EGR amount with high accuracy. A target fresh air amount is set based on a demanded torque calculated according to operating conditions of the engine. A differential pressure across an EGR valve is set as a target differential pressure. When it is determined that the across-valve differential pressure is not in a state in which the target differential pressure can be ensured, an opening degree of the EGR valve is controlled to limit an EGR amount. An opening degree of a throttle valve is controlled based on the target fresh air amount, so as to ensure the target differential pressure. | 09-18-2014 |
Hiroshi Chinda, Saitama JP
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20090032751 | FLUID CONTROL VALVE - An object of the present invention is to obtain a quick-response fluid control valve. | 02-05-2009 |
Norio Chinda, Gunma-Ken JP
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20090011962 | FRICTION MATERIAL - To provide a friction material with an excellent balance for both service brake and parking brake usage that satisfies the required performance for the service brake and improves the static coefficient of friction for the parking brake. The friction material comprising a fibrous base material, a friction modifier, and a binder, wherein said friction modifier comprises 2-20 volume % of cashew dust, 10-25 volume % of a rubber composition, and 2-5 volume % of a solid lubricant, a total volume of the cashew dust and the rubber composition is 30 volume % or less, and said friction modifier does not use graphite because it can cause the reduction of the coefficient of friction during the parking brake operation. | 01-08-2009 |
Takeshi Chinda, Kobe-Shi JP
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20130083870 | RECEIVING DEVICE AND RECEIVING METHOD - A synthesizing unit of a receiving device according to an embodiment synthesizes fixed components, which are fixed between carriers of an effective symbol, included in inter-carrier interference (ICI) in a broadcast signal on which fast Fourier transform (FFT) has been performed in view of an adding position of the guard interval in the broadcast signal and ICI in a broadcast signal on which FFT has been performed without considering the adding position, according to an addition amount of the guard interval. The ICI calculating unit calculates ICI to be removed from the broadcast signal based on the fixed component synthesized by the synthesizing unit. | 04-04-2013 |