Patent application number | Description | Published |
20100074039 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR TESTING THE SAME - A semiconductor memory device includes a memory cell array, a data input/output terminal, a data input/output circuit, and a test circuit. The data input/output circuit is provided between the memory cell array and the data input/output terminal. The data input/output circuit includes a main amplifier that amplifies data written into selected memory cells in the memory cell array during data write operation and that amplifies data read from the selected memory cells during read operation, and a memory element provided accompanying the main amplifier in order to repair a defective memory cell in the memory cell array. The test circuit starts up in test mode, writes data into the memory element through the data input/output terminal, and read data from the memory element into the data input/output terminal regardless of access address information to the memory cell. | 03-25-2010 |
20110084744 | Semiconductor device, adjustment method thereof and data processing system - Read data that are output from core chips are accurately captured into an interface chip. Each of the core chips includes a data output circuit that outputs read data to the interface chip in response to a read command, and an output timing adjustment circuit that adjusts the period of time required from the reception of the read command to the outputting of the read data from the data output circuit. The interface chip includes a data input circuit that captures read data, and an input timing adjustment circuit that adjusts the timing for the data input circuit to allow the capturing of the read data after issuing the read command. In this manner, a sufficient latch margin for read data on the interface chip side can be secured. | 04-14-2011 |
20110087811 | Semiconductor device, control method for the semiconductor device and information processing system including the same - The core chips each include a timing control circuit that outputs a timing signal synchronized with the outputting of parallel data to the interface chip. The interface chip includes a data input circuit that captures parallel data in synchronization with the timing signal. With this arrangement, the timing to output the parallel data and the timing to capture the parallel data are both synchronized with the timing signal generated in the core chips. Therefore, even if there is a difference in operation speed between each core chip and the interface chip, the parallel data can be accurately captured on the interface chip side. | 04-14-2011 |
20110089973 | Semiconductor device and information processing system including the same - A semiconductor device includes a plurality of core chips and an interface chip stacked together. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and a bidirectional buffer circuit that drives the through silicon vias. The interface chip also includes a logic-level holding circuit that holds a logic level of the through silicon vias. The bidirectional buffer circuit includes an input buffer and an output buffer. The driving capability of a first inverter of the logic-level holding circuit is smaller than the driving capability of the output buffer of the bidirectional buffer circuit. | 04-21-2011 |
20110093735 | Semiconductor memory device, method of adjusting the same and information processing system including the same - Each of the core chips includes a data output circuit that outputs read data to the interface chip in response to a read command, and an output timing adjustment circuit that equalizes the periods of time required between the reception of the read command and the outputting of the read data from the data output circuit among the core chips. With this arrangement, a sufficient latch margin for read data to be input can be secured on the interface chip side. Furthermore, as the output timing is adjusted on each core chip side, there is no need to prepare the same number of latch timing control circuits as the number of core chips on the interface chip side. | 04-21-2011 |
20120106229 | Semiconductor device - To include stacked plural core chips, each of which includes a first through silicon via for transferring write data and a second through silicon via for transferring read data, and an interface chip commonly connected to the core chips. The interface chip includes a data input/output terminal, an input buffer provided between the data input/output terminal and the first through silicon via, and an output buffer provided between the data input/output terminal and the second through silicon via. With this configuration, the write data and the read data are transferred through the different through silicon vias, whereby the collision of data is not caused even when continuous accesses are made to different ranks. | 05-03-2012 |
20120127812 | SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM - A device includes a first semiconductor chip that includes a first memory cell array including a plurality of first memory cells, a first control logic circuit accessing the first memory cell array and producing a plurality of first data signals in response to data stored in selected ones of the first memory cells, a plurality of first data electrodes, and a first data control circuit coupled to the first control logic circuit and the first data electrodes. A second semiconductor chip includes a second memory cell array including a plurality of second memory cells, a second control logic circuit accessing the second memory cell array and producing a plurality of second data signals in response to data stored in selected ones of the second memory cells. The second control logic circuit is configured to store second timing adjustment information and to produce a second output timing signal. | 05-24-2012 |
20120250387 | SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER - Disclosed herein is a device that includes a plurality of stacked core chips and an interface chip that controls the core chips. Each of the core chips includes a memory cell array, a penetration electrode, and an output circuit that outputs read data that are read from the memory cell array to the penetration electrode. The penetration electrode respectively provided in the core chips are commonly connected with each other, and the output circuits respectively provided in the core chips are activated in response to a read clock signal supplied from the interface chip. | 10-04-2012 |
20120268170 | SEMICONDUCTOR DEVICE HAVING GEAR DOWN MODE, METHOD OF CONTROLLING SAME, AND INFORMATION PROCESSING SYSTEM - Disclosed herein is a device that includes: a frequency division circuit that divides a frequency of a first clock signal to generate a second clock signal; a first logic circuit that receives a first chip select signal and the second clock signal to generate a second chip select signal; and a command generation circuit that is activated based on the second chip select signal, and generates a second command signal based on a first command signal. | 10-25-2012 |
20130010515 | SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM - A method includes preparing a chip-stack structure in which a first memory chip is stacked over a first main surface of a second memory chip, data electrodes of the first and second memory chips being electrically connected and a data signal outputted from the data electrode of the first memory chip being conveyed on a side of the second main surface of the second memory chip, accessing the first memory chip so that the data signal is outputted from the first memory chip and appears on the side of the second main surface of the second memory chip in first access time, accessing the second memory chip so that a data signal is outputted and appears on the side of the second main surface of the second memory chip in second access time, and setting output timing adjustment information into at least one of the first and second memory chips. | 01-10-2013 |
20130077427 | SEMICONDUCTOR DEVICE HAVING CAL LATENCY FUNCTION - Disclosed herein is a semiconductor device that includes a command receiver receiving the command signal to generate a first internal command signal, and a latency control circuit activating a second internal chip select signal after elapse of first cycles of a clock signal since a first internal chip select signal is activated. The latency control circuit activates a second control signal when the chip select signal is maintained in an inactive state during second cycles of the clock signal that is larger than the first cycles. The command receiver is activated based on a first control signal. The first control signal is activated in response to the first internal chip select signal. The first control signal is deactivated in response to the second control signal. | 03-28-2013 |
20130077429 | SEMICONDUCTOR DEVICE VERIFYING SIGNAL SUPPLIED FROM OUTSIDE - Disclosed herein is a semiconductor device that includes an access control circuit generating an internal command based on a verification result signal and an external command. The external command indicates at least one of a first command that enables the access control circuit to access a first circuit and a second command that enables the access control circuit not to access the first circuit or enables the access control circuit to maintain a current state of the first circuit. The access control circuit, when the verification result signal indicates a first logic level, generates the internal command based on the external command. The access control circuit, when the verification result signal indicates a second logic level, generates the internal command that corresponds to a second command even if the external command indicates a first command. | 03-28-2013 |
20130080826 | SEMICONDUCTOR DEVICE VERIFYING SIGNAL SUPPLIED FROM OUTSIDE - Disclosed herein is a semiconductor device that includes a verification circuit and an error processing circuit. the verification circuit verifies second bits of an external command to generate the verification result signal. The error processing circuit supplies a follow-up signal to a bank control circuit after a lapse of a first period and a second period when the verification result signal indicates a fail state during a write operation. The first period corresponds to a write latency indicating a period between when a write command is generated and when a data associated with the write command is supplied from outside. The second period corresponds to a write recovery latency indicating a period between when the bank control circuit issues a write execution signal to start writing the data to memory cells and when the write operation is completed. | 03-28-2013 |
20130091327 | SEMICONDUCTOR DEVICE PERFORMING BURST ORDER CONTROL AND DATA BUS INVERSION - Disclosed herein is a device that a device including first data lines transmitting a plurality of sequential first data bits, respectively, second data lines transmitting a plurality of sequential second data bits, respectively, third data lines transmitting a plurality of sequential third data bits, respectively, a BOC circuit rearranging order of the plurality of first data bits supplied from the plurality of first data lines in accordance with address information, the BOC circuit supplying the resultant to the plurality of second data lines as the plurality of second data bits, and a DBI circuit performing inversion or non-inversion of the plurality of second data bits supplied from the plurality of second data lines independently of each other in accordance with a predetermined condition, the DBI circuit supplying the resultant to the plurality of third data lines as the plurality of third data bits. | 04-11-2013 |
20130135010 | SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING THE SAME - A device including first and second semiconductor chips, each of first and second semiconductor chips including first to M-th penetration electrodes, M being an integer equal to or greater than 3, each of the first to M-th penetration electrodes penetrating through a semiconductor substrate, and the first semiconductor chip including a first input circuit coupled to the M-th penetration electrode of the first semiconductor chip at an input node thereof, the first and second semiconductor chips being stacked with each other in which the first to M-th penetration electrodes of the second semiconductor chip are vertically arranged respectively with the first to M-th penetration electrodes of the first semiconductor chip, in which the first to (M−2)-th penetration electrodes of the second semiconductor chip are electrically coupled to the second to (M−1)-th penetration electrodes of the first semiconductor chip, respectively. | 05-30-2013 |
20130275798 | SEMICONDUCTOR DEVICE, CONTROL METHOD FOR THE SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING THE SAME - The core chips each include a timing control circuit that outputs a timing signal synchronized with the outputting of parallel data to the interface chip. The interface chip includes a data input circuit that captures parallel data in synchronization with the timing signal. With this arrangement, the timing to output the parallel data and the timing to capture the parallel data are both synchronized with the timing signal generated in the core chips. Therefore, even if there is a difference in operation speed between each core chip and the interface chip, the parallel data can be accurately captured on the interface chip side. | 10-17-2013 |
20140016388 | SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM - A system includes a first device, a second device, and a bus interconnecting the first and second devices to each other, wherein the first device includes a first semiconductor chip that includes a first memory cell array including a plurality of first memory cells, a first control logic circuit accessing the first memory cell array and producing a first data signal in response to data stored in a selected one of the first memory cells, the first control logic circuit being configured to store first timing adjustment information and to produce a first output timing signal that is adjustable in timing of change from an inactive level to an active level by the first timing adjustment information, a first data electrode, and a first data control circuit coupled to the first control logic circuit and the first data electrode. | 01-16-2014 |
20140056086 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF ADJUSTING THE SAME AND INFORMATION PROCESSING SYSTEM INCLUDING THE SAME - A semiconductor device includes an interface chip including: an internal data terminal, and a timing data storage circuit configured to output a plurality of timing set signals, and a plurality of core chips stacked with one another, each of the core chips including a plurality of memory cells, an output control circuit coupled to the timing data storage circuit of the interface chip, the output control circuit being configured to receive a corresponding one of the timing set signals and to output an output timing signal in response to the corresponding one of the timing set signals, and a data output circuit coupled to the internal data terminal of the interface chip, the data output circuit being configured to output data in response to the output timing signal, the data being derived from a corresponding one of the memory cells. | 02-27-2014 |
20140089723 | SEMICONDUCTOR DEVICE, CONTROL METHOD FOR THE SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING THE SAME - The core chips each include a timing control circuit that outputs a timing signal synchronized with the outputting of parallel data to the interface chip. The interface chip includes a data input circuit that captures parallel data in synchronization with the timing signal. With this arrangement, the timing to output the parallel data and the timing to capture the parallel data are both synchronized with the timing signal generated in the core chips. Therefore, even if there is a difference in operation speed between each core chip and the interface chip, the parallel data can be accurately captured on the interface chip side. | 03-27-2014 |
20140165018 | SEMICONDUCTOR DEVICE, ADJUSTMENT METHOD THEREOF AND DATA PROCESSING SYSTEM - A method includes resetting an output timing adjustment circuit in each of a plurality of DRAM devices to a default output timing data value, measuring a default delay from read command to read data for each of the plurality of DRAM devices, identifying a slowest DRAM device having a maximum default delay from read command to read data among the plurality of DRAM devices, writing an output timing data value to the output timing adjustment circuit in each of the plurality of DRAM devices to set the delay from read command to read data for each respective DRAM device to an amount substantially equal to the maximum default delay, and reading data from any one of the plurality of DRAM devices with a delay from read command to read data substantially equal to the maximum default delay. | 06-12-2014 |
20140185350 | SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER - A method for reading data from a plurality of DRAM devices connected to common command, address, and data busses. A clock signal is provided to the plurality of DRAM devices. A read command and address to the plurality of DRAM devices on the command and address busses in synchronization with the clock signal. A read clock signal is provided to the plurality of DRAM devices to initiate a read operation in one of the plurality of DRAM devices that is selected by the address. The one DRAM device delays the read clock signal by an amount based on a speed of the one of the plurality of DRAM devices to generate. First delayed read clock and second delayed read clock signals are provided. The read data is received on the data bus in synchronization with the second delayed read clock signal. | 07-03-2014 |
20140241103 | SEMICONDUCTOR DEVICE HAVING CAL LATENCY FUNCTION - A method for accessing a semiconductor device having a memory array, the method includes receiving a mode register command to set a command latency value in a mode register, receiving a chip select signal, activating a command receiver in response to the chip select signal, receiving, with the command receiver, an access command with a first latency from the chip select signal equal to the command latency value, accessing the memory array in response to the access command, and deactivating the command receiver with a second latency from the chip select signal equal to a deactivation latency value. | 08-28-2014 |
20140286118 | SEMICONDUCTOR DEVICE VERIFYING SIGNAL SUPPLIED FROM OUTSIDE - A method for accessing a semiconductor device having a memory array, includes receiving a chip select signal, receiving a command signal and an address signal, receiving a verification signal, calculating an error signal based on the address signal, the command signal, and the verification signal, generating an internal chip select signal based on the received chip select signal if the error signal indicates no error, and generating an external alert signal if the error signal indicates an error. | 09-25-2014 |
20140340973 | SEMICONDUCTOR DEVICE HAVING PDA FUNCTION - A method for writing a mode register in a semiconductor device, the method includes receiving a mode register command and a mode signal, generating a first mode register setting signal, delaying the first mode register setting signal in a first latency shifter to provide a second mode register setting signal, receiving a data signal in synchronization with the second mode register setting signal, and writing the mode signal to the mode register only if the received data signal has a first logic level. | 11-20-2014 |