Patent application number | Description | Published |
20100237552 | DEVICE FOR POSITIONING WORKPIECE - A positioning device with a positioning face, which comprises a combination of concaves provided on the positioning face. The boundaries of each of concaves intersect to boundaries of other concaves adjacent thereto. A positioning section is provided on the positioning face, and the periphery of the positioning section is defined by the interaction of boundaries of the combination of concaves. | 09-23-2010 |
20100264742 | POWER SOURCE SYSTEM WITH CONTINUOUSLY ADJUSTABLE OUTPUT - An exemplary power source system includes a power source, controller, and a voltage fine adjusting unit. The power source includes a number of cells and a number of switches configured for connecting the cells in series or in parallel. The controller is configured for coarsely controlling an output of the power source by selectively turning on and off the switches. The voltage fine adjusting unit is configured for further and finely adjusting the output of the power source on condition that the coarsely controlled output of the power source is outside a predetermined acceptable range of output. | 10-21-2010 |
20100277115 | SOLAR ENERGY STORING SYSTEM AND METHOD - A solar energy storing system includes a solar energy converting unit, a rechargeable battery unit, a charging unit, a switch unit, a detecting unit, and a controlling unit. The solar energy converting unit converts solar energy into electrical energy to generate a charging voltage. The rechargeable battery unit stores the electrical energy. The rechargeable battery unit includes a plurality of rechargeable batteries. The charging unit charges the rechargeable battery unit using the charging voltage. The switch unit changes electrical connections between the rechargeable batteries. The detecting unit detects the charging voltage and a voltage of each of the rechargeable batteries and determines a charging status between the charging voltage and the voltages of the rechargeable batteries. The controlling unit controls the switch unit to change the electrical connections between the rechargeable batteries according to the charging status between the charging voltage and the voltages of the rechargeable batteries. | 11-04-2010 |
20100320939 | LIGHT EMITTING DIODE ILLUMINATING SYSTEM AND CONTROLLING METHOD THEREOF - A light emitting diode (LED) illuminating system includes an LED lamp, a sensor, a memory, a controller, an AC/DC convertor, a DC/DC convertor and a current detector. The sensor detects a temperature around the LED illuminating system. The memory stores the detected temperature and a comparison table. The controller finds an optimized working voltage in the comparison table, according to the detected temperature. The AC/DC converter outputs a DC power with the optimized working voltage. The DC/DC converter converts the DC power into another DC power and supplies the another DC power to the LED lamp. The current detector detects a current variation of the another DC power. The controller stabilizes a current of the another DC power output by the DC/DC converter to the LED lamp, according to the current variation. | 12-23-2010 |
20110018352 | VARIABLE POWER SOURCE AND RELATED POWER SUPPLY METHOD - A power source includes a plurality of cells, a positive output, a negative output, a number of positive switches, a number of negative switches, and a number of serializing switches. Each of the cells includes a positive electrode and a negative electrode. Each of the positive switches is for connecting a corresponding positive electrode to the positive output. Each of the negative switches is for connecting a corresponding negative electrode to the negative output. Each of the serializing switches is for connecting a positive electrode of a corresponding cell to a negative electrode of an adjacent cell. | 01-27-2011 |
20110057219 | NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE - An exemplary nitride-based semiconductor light emitting device includes a substrate, a nitride-based multi-layered structure epitaxially formed on the substrate, a first-type electrode and a second-type electrode formed on the nitride-based multi-layered structure and connected with the first-type layer and the second-type layer, respectively. The multi-layered structure includes a first-type layer, an active layer and a second-type layer arranged along a direction away from the substrate in the order written. The second-type layer defines a number of grooves at the top surface. Each groove has a side surface and a bottom surface adjoining the side surface. The side surface and the bottom surface cooperatively form an included angle which is in a range from 140 degree to 160 degree. | 03-10-2011 |
20110084298 | LIGHT EMITTING DIODE AND METHOD FOR MAKING SAME - A light emitting diode comprises a heat conductive layer, a semiconductor layer disposed above the heat conductive substrate and consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a transparent electrode layer, a current blocking layer and an electrode contact pad. The p-type semiconductor layer has first concaves located on its surface distant from the active layer. The n-type semiconductor layer has second concaves located on its surface distant from the active layer. The transparent electrode layer is located on the surface of the n-type semiconductor layer except the second concaves. The current blocking layer is located in the first concaves of the p-type semiconductor layer. The electrode contact pad is located on the surface of the transparent electrode layer. The density of the second concaves decrease with distance from the electrode contact pad. | 04-14-2011 |
20110133204 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light emitting diode includes a thermal conductive substrate, an p-type GaN layer, an active layer and an n-type GaN layer sequentially stacked above the substrate and an electrode pad deposited on the n-type GaN layer. A surface of n-type GaN layer away from the active layer has a first diffusing section and a second diffusing section. The first diffusing section is adjacent to the electrode pad and the second diffusing section is located at the other side of the first diffusing section opposite to the electrode pad, wherein the doping concentration of the first diffusing section is less than that of the second diffusing section. The n-type GaN layer has an electrical resistance larger than that of the first diffusing section which in turn is larger than that of the second diffusing section. | 06-09-2011 |
20110140137 | LED DEVICE AND METHOD OF MANUFACTURING THE SAME - An LED device includes a heat conductive base, and a red, a green, and a blue LED chips mounted on the base. The red LED chip includes a first n-type GaN layer, a first p-type GaN layer, and a first active layer sandwiched therebetween. The first active layer of the red LED chip is added with europium to generate red light. The green LED chip includes a second n-type GaN layer, a second p-type GaN layer, and a second active layer sandwiched therebetween. The second active layer of the green LED chip is added with indium to generate green light. The blue LED chip includes a third n-type GaN layer, a third p-type GaN layer, and a third active layer sandwiched therebetween. The third active layer of the blue LED chip is added with of indium to generate blue light. | 06-16-2011 |
20110156049 | LED DEVICE AND FABRICATION METHOD THEREOF - A LED device includes a n-type first semiconductor layer, a p-type second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, an electrode positioned on a surface of the second semiconductor layer away from the active layer, and an ohmic contacting layer positioned on a surface of the second semiconductor layer away from the active layer. The ohmic contacting layer includes a resistance region corresponding to the electrode and a conductive region surrounding the resistance region, in which the conductive region having less resistance than that of the resistance region. | 06-30-2011 |
20110156594 | LIGHT EMITTING DIODE ILLUMINATING SYSTEM AND CONTROL METHOD THEREOF - A light emitting diode (LED) illuminating system includes a LED illuminating circuitry, which includes a plurality of LEDs connected in parallel, and an actuator connected to the LED illuminating circuitry to actuate the plurality of LEDs. The actuator includes a sensor and a control circuitry, which includes a controller connected to the actuator. The sensor is configured to detect an output signal of the actuator and to output the detected data value to the controller. The controller is configured to compare the detected data value with a predetermined data value, and to output a scan signal to the actuator when a LED is found to be malfunctioning. The actuator is configured to scan each LED and to output a location parameter of the malfunctioning LED to the controller based on the scan signal. A method for controlling the LED lighting system is also provided. | 06-30-2011 |
20110156633 | SOLAR POWER STORAGE SYSTEM AND CHARGE METHOD OF SAME - A solar power storage system includes a solar panel, an energy storage device, a transformer, and a controller. The solar panel collects energy from sunlight and outputs an actual output voltage. The energy storage device stores the energy collected from the solar panel. The transformer transforms the actual output voltage of the solar panel into a charge voltage and charges the energy storage device using the charge voltage. The controller is configured for comparing the actual output voltage with a first predetermined voltage to obtain a first comparative result, comparing an instant battery voltage of the energy storage device with a second predetermined voltage to obtain a second comparative result. The transformer adjusts the charge voltage according to the first and the second comparative results. | 06-30-2011 |
20110156634 | HYBRID POWER SUPPLY SYSTEM - A hybrid power supply system includes a solar panel, a rechargeable battery for receiving electrical energy from the solar panel, a line power port, a switch capable of electrically connecting the line power port and the rechargeable battery, and a power sensor for acquiring an electrical energy value from the rechargeable battery and a controller. The controller receives the electrical energy value from the power sensor, and controls the switch to electrically connect the line power port and the rechargeable battery when a voltage of the rechargeable battery falls below a predetermined value. The line power port charges the rechargeable battery to one full cycle of power output of the rechargeable. | 06-30-2011 |
20110156653 | SOLAR POWER SUPPLY SYSTEM AND DRIVING METHOD OF SAME - A solar power supply system includes a load device, a solar panel that converts light energy into electrical energy, an energy storage device storing the electrical energy from the solar panel, a charge/discharge control device, and a transformer device. The charge/discharge control device selects one of the energy storage device and the solar panel as an operation power supply to the charge/discharge control device and generates an output voltage. The transformer device transforms the output voltage of the charge/discharge control device into a driving voltage to drive the load device. A feedback circuit generates a feedback signal according to an actual power consumption of the load device. A power detector detects an instant output power of the charge/discharge control device. A power regulator minimizes the output power of the charge/discharge control device according to the instant output power of the charge/discharge control device and the actual power consumption of the load device. | 06-30-2011 |
20110158467 | SOLAR POWER DEVICE - A solar power device includes a solar panel, a rotating assembly, an image sensor, a image recognition system, and a control system. The rotating assembly is connected to the solar panel. The image sensor is positioned on the solar panel to generate an image signal. The image recognition system is connected to the image sensors to transfer the image signal to a recognition signal. The control system is connected to the image recognition system and the rotating assembly. The control system receives the recognition signal and directs the rotating assembly to re-position the solar panel according to the recognition signal. A method for controlling the solar power device is also provided. | 06-30-2011 |
20110159615 | LED UNITS FABRICATION METHOD - A method for fabricating a plurality of individual light emitting diode units includes forming a GaN epitaxial layer on a sapphire substrate, forming a plurality of exhaust trenches on the GaN epitaxial layer, wherein the exhaust trenches define a plurality of individual light emitting diode units, forming a reflective layer on the GaN epitaxial layer, attaching the reflective layer to a conductive substrate, removing the sapphire substrate from the GaN epitaxial layer via a laser lift-off process, wherein a gas produced during the laser lift-off process is exhausted via the exhaust trenches, and dicing the conductive substrate along the exhaust trenches to form the plurality of individual light emitting diode units. | 06-30-2011 |
20110159616 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE - A method for making a light emitting diode is provided, which includes first providing a light emitting diode chip. The light emitting diode chip includes a substrate and a p-type semiconductor layer, an active layer and an n-type semiconductor layer sequentially formed on the substrate. And then sections with different resistance are formed in the n-type semiconductor layer by implanting ions into the n-type semiconductor layer in an ion implanter. Finally, an electrode pad is deposited on the n-type semiconductor layer. The electrical resistances of the sections increase following an increase of a distance from the electrode pad to the sections. | 06-30-2011 |
20110233584 | LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF - A light emitting diode chip includes a thermal conductive substrate, an epi-layer, a thin-type ohmic contacting film, a transparent conducting layer, and an electrode pad. The epi-layer includes a p-type semiconductor layer, an n-type semiconductor layer, and an active layer. The n-type semiconductor layer includes a stepped surface at a side thereof facing away from the substrate, and the stepped surface includes a central portion and a peripheral portion surrounding the central portion. The n-type semiconductor layer has a thickness decreasing along directions from a center thereof to opposite lateral peripheries thereof. The ohmic contacting film is arranged on the stepped surface. The conducting layer is arranged on the ohmic contacting film. The electrode pad is arranged on the conducting layer and located corresponding to the central portion of the stepped surface. | 09-29-2011 |
20110233598 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting diode package includes a metallic substrate, a light emitting diode chip, and a buffer layer. The light emitting diode chip is arranged on the metallic substrate. The buffer layer is located between and connected to the metallic substrate and the light emitting diode chip. The buffer layer includes a base material and a number of conducting particles essentially mixed in the base material. The base material is soft epoxy. Each of the conducting particles includes a resin core and a metallic layer formed on an exterior surface of the resin core. The conducting particles are configured for electrically connecting the light emitting diode chip to the metallic substrate. | 09-29-2011 |
20110254029 | LED MODULE AND METHOD OF MANUFACTRURING THE SAME - An exemplary LED module includes a base, an anisotropic conductive film on the base, multiple LED dies on the anisotropic conductive film, multiple first electrodes between the base and the anisotropic conductive film, and multiple second electrodes on the LED dies. The LED dies are arranged in multiple rows by multiple columns. The first electrodes each are elongated and parallel to each other. The second electrodes each are elongated and parallel to each other. The LED dies of each column are connected to one of the first electrodes electrically. Each second electrode is electrically coupled to the LED dies of one row. | 10-20-2011 |
20110297953 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light emitting diode includes a conductive base, an LED die, a transparent conductive layer and at least one pad. The LED die includes a p-type GaN layer connected to the base, an active layer on the p-type GaN layer, and an n-type GaN layer on the active layer. The transparent conductive layer is coated on an exposed side of the n-type GaN layer. The exposed side has an arched central portion, which in one embodiment is concave and in another embodiment is convex. The at least one n-side pad is mounted on the transparent conductive layer. The at least one n-side pad and the conductive base are for connecting with a power source. | 12-08-2011 |
20110303937 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light emitting diode includes a heat conductive substrate and a light emitting structure formed on the substrate. A transparent conductive layer is formed on the light emitting structure and an electrode pad is deposited on the transparent conductive layer. The light emitting diode further comprises a metal layer and a buffer layer set between the light emitting structure and the transparent conductive layer. The metal layer is set on the central portion of the top surface of the light emitting structure away from the substrate and forms a Schottky connection with the light emitting structure. The buffer layer surrounds the metal layer and forms an ohmic connection with the light emitting structure. | 12-15-2011 |
20110309394 | LED AND METHOD OF MANUFACTURING THE SAME - An exemplary LED includes an epitaxial layer, an electrically conductive base, a transparent, electrically-conducting layer and a metallic pad. The epitaxial layer includes an N-type layer, a P-type layer and a light-emitting quantum-well layer between the N-type layer and P-type layer. The electrically conductive base is coupled to the P-type layer. The transparent, electrically-conducting layer is coupled to the N-type layer. The metallic pad is disposed on the transparent, electrically-conducting layer. | 12-22-2011 |
20120019451 | TOUCH PANEL AND TOUCH DISPLAY DEVICE USING SAME - A touch panel includes a first electrically conductive substrate, a second electrically conductive substrate; and a plurality of insulators located between the first electrically conductive substrate and the second electrically conductive substrate. The second electrically conductive substrate includes a first carbon nanotube film facing the first electrically conductive substrate, and a second carbon nanotube film exposed outside the touch panel. | 01-26-2012 |
20120175404 | METHOD OF MANUFACTURING LED LIGHT BAR AND MANUFACTURING EQUIPMENT THEREOF - A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device. | 07-12-2012 |
20120182746 | LED LIGHT BAR AND METHOD FOR MANUFACTURING THE SAME - An LED light bar includes a plurality of LEDs and a circuit board supporting the LEDs. Solder points are formed on a bottom surface of the LEDs. An anti-solder layer is coated on the circuit board so as to create a plurality of discrete anti-solder pads. A first tenon which is formed on each of the LEDs locates in a void in a corresponding one of the anti-solder pads so as to position the LEDs precisely on the circuit board and maintain their positions. | 07-19-2012 |
20120241801 | FLIP-CHIP LED PACKAGING AND MANUFACTURING THEREOF - A flip-chip LED package includes a transparent substrate, an LED chip and a holder. The transparent substrate is formed by heating a green piece made of a mixture of glass powders and solvent. The LED chip includes a first side and an opposite second side, and two electrodes formed on the first side. The second side of the LED chip is directly attached to the transparent substrate. The holder combines to the LED chip. The holder includes two solders connected to the electrodes of the LED chip respectively. The present disclosure also relates to a method for manufacturing such flip-chip LED package. | 09-27-2012 |
20120274921 | LASER RANGEFINDER - A laser rangefinder includes a laser emitter for emitting parallel laser beams, a micro electro mechanical system reflector including a plurality of micro reflecting units and configured for reflecting the parallel laser beams toward different points on an object, a micro electro mechanical system photoreceiver configured for receiving the laser beams reflected by and from the different points on the object, a time interval counter configured for recording the time intervals between a first time when the laser emitter emitting the parallel laser beams and second times when the laser beams are received by the micro electro mechanical system photoreceiver, and a processor configured for calculating the distances to the different points of the object based on the time intervals. | 11-01-2012 |
20130115140 | ELECTRONIC CENSER - An electronic censer includes a censer body, an incense branch and a circuit board. The circuit board is received in the censer body. The incense branch is positioned on the circuit board and includes a heat dissipating board, a light-emitting diode, a first incense core, a second incense core enclosing the first incense core and a reflecting layer on a periphery of the second incense core. A tubular passage is defined between a periphery sidewall of the first incense core and a sidewall of the heat dissipating board to receive liquid fragrance therein. Heat generated by the LED is transferred to the liquid fragrance via the heat dissipating board. Vapor of the liquid fragrance and light of the LED leave the electronic censer via a top of the incense branch. | 05-09-2013 |
20130163286 | BACKLIGHT MODULE - A backlight module includes a housing, a light emitting unit, plural supporters and a light guiding plate. The housing includes a base and a first frame and a second frame arranged on two opposite sides of the base. Each supporter includes two supporting portions placed on two opposite sides of the light emitting unit. Each supporting portion includes a supporting surface facing the light emitting unit, wherein the supporting surface is slant. A distance between two opposite supporting portions is increased along a direction from the base to a top surface of the supporter. The light guiding plate is arranged on the supporting surfaces of the supporters. The light guiding plate includes a light input surface facing to the light emitting unit and a light output surface facing the first frame. | 06-27-2013 |
20130164091 | APPARATUS AND METHOD FOR MANUFACTURING LED LIGHT BARS - A method for manufacturing LED light bars including steps: providing an LED light board comprising a first LED light bar, a second LED light bar and a connecting bridge interconnecting the first and second LED light bars; then providing a milling cutter and a retaining portion, wherein the milling cutter rotates and moves frontward to cut the connecting bridge along a side surface of the first LED light bar, and the retaining portion moves together with the milling cutter and keeps pressing against the side surface of the first LED light bar during cutting of the milling cutter to the connecting bridge. The retaining portion has a plurality of inhaling holes defined therein, which are used for sucking dust into the retaining portion during the cutting operation of the milling cutter to the connecting bridge. | 06-27-2013 |
20130168722 | SURFACE-MOUNTING LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces the other copper pad. The LED includes two pins and each pin includes a horizontal protrusion and a vertical portion. The LED is mounted on the circuit board between the two copper pads. The solders securely and electrically connect the two pins of the LED with the circuit board. | 07-04-2013 |
20130194824 | BACKLIGHT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A backlight structure includes a light source module and a light guiding plate. The light source module includes a circuit board, a lighting unit arranged on the circuit board, and a hollow baffle plate surrounding the lighting unit. The circuit board defines a groove in a surface thereof, and a bottom end of the baffle plate is embedded in the groove. The lighting unit is located between the light guiding plate and the circuit board, and the light guiding plate is disposed on the baffle plate. A method for manufacturing the backlight structure is also provided. | 08-01-2013 |
20130207662 | METHOD FOR TESTING LED LIGHT BAR - A method for testing LED light bar includes steps: providing a jig with a pair of aligning plates, and a testing device with an electrical clamp and a sensor; adjusting alignment of LEDs via the pair of aligning plates when soldering the LEDs; clamping one of the LEDs by the electrical clamp and supplying a current of microampere to the LED via the electrical clamp when soldering the LEDs; and detecting whether there is light emitted from the LED via the sensor when supplying the current of microampere to the LED. | 08-15-2013 |
20130214316 | LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON AND METHOD FOR MANUFACTURING THE SAME - An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device. | 08-22-2013 |
20130235187 | POSITION CHECKING DEVICE OF LED OF LED LIGHT BAR - A checking device of an SMT placement machine for checking positions of LEDs mounted on a circuit board includes a shell, a light source and an imaging module. The shell is used for covering the LEDs and the circuit board to be checked. The shell includes an opening and an atomized reflecting layer facing the LEDs. The opening is defined for exposing the LEDs through the shell to the imaging module whereby images of the LEDs can be taken by the imaging module and positions of the LEDs can be checked thereby. The atomized reflecting layer is formed on an inner surface of the shell. The light source is covered by the shell and faces the atomized reflecting layer. The imaging module is aligned with the opening. | 09-12-2013 |
20130240925 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package includes a base, an LED chip disposed on the base, a liquid heat conducting layer and a sealing member. The LED chip is sealed from liquid. The liquid heat conducting layer surrounds and covers the sealed LED chip. The sealing member is arranged on the substrate and encloses and seals the liquid heat conducting layer therein. The LED chip is sealed by a phosphor layer on a top surface thereof and a heat conductive layer on a side surface thereof. | 09-19-2013 |
20130242549 | TEST DEVICE FOR LED LIGHT BAR - A test device is used for testing performance of an LED light bar. The LED light bar includes a substrate and a plurality of LEDs arranged on the substrate. Each LED includes an anode and a cathode. The test device includes an elongated first plate, an elongated second plate and a circuit structure. A plurality of electrode pairs is arranged on a first surface of the first plate. Each electrode pair includes a first electrode and a second electrode. The circuit structure is arranged on the first plate. When the test device is used for testing performances of the LEDs of the LED light bar, the first electrode of each electrode pair is electrically connected to the anode of a corresponding LED, and the corresponding second electrode of each electrode pair is electrically connected to the cathode of the corresponding LED. | 09-19-2013 |
20130245988 | MACHINE FOR MOUNTING LEDS TO A CIRCUIT BOARD - A mounting machine for mounting LEDs on predetermined positions of a circuit board. The circuit board includes two positioning points. Each LED includes an optical identification point. The mounting machine includes a mounting area and a precise adjusting area located downstream of the mounting area and consisting of a sensor, a processing unit and an adjusting unit. The mounting machine places the LEDs on the circuit board. The precise adjusting area precisely adjusts the position of the LED to a predetermined position of the precise adjusting area finds that the LED is deviated from the predetermined position. | 09-19-2013 |
20130249228 | VACUUM NOZZLE DEVICE FOR SUCKING AND MOVING AN OPTOELECTRICAL ELEMENT - A vacuum nozzle device for picking up and moving a light emitting diode comprises a tube having a lower end for contacting the light emitting diode and an image sensor located in the vacuum nozzle device. A negative pressure can be generated at the lower end of the tube when the vacuum nozzle device is in operation. The image sensor detects alignment keys on a light generating chip of the LED to precisely move the vacuum nozzle device to a desired position on the light emitting diode. | 09-26-2013 |
20130264374 | THERMO COMPRESSION DEVICE FOR PRESSING PRINTED CIRCUIT BOARD ON ELECTRICAL ELEMENT - A thermo compression device includes a transmission element, a pressing head, and a guiding element. The transmission element includes a lower surface and defines a guiding recess on the lower surface. The pressing head includes a top surface and a bottom surface opposite to the top surface, and the bottom surface is a smooth surface. The guiding element is rotatably received in the guiding recess, and a part of the guiding element protrudes from the guiding recess and connects to the top surface of the pressing head. | 10-10-2013 |
20130272030 | LIGHT GUIDE PLATE INCLUDING OPTICAL FIBERS AND METHOD OF MANUFACTURING SAME - A light guide plate includes a number of optical fibers positioned side by side and transparent curable glue adhering the optical fibers together. The optical fibers and the curable glue cooperatively form a light incident surface and a light output surface connected to the light incident surface. The light output surface defines light output holes. | 10-17-2013 |
20130276301 | METHOD FOR ADJUSTING POSITIONS OF LEDS OF LED LIGHT BAR - A method for adjusting positions of LEDs of an LED light bar includes following steps: providing a circuit board with a plurality of LEDs arranged thereon; measuring offsets X0 between the LEDs and a base line; providing a first flat plate and a second flat plate paralleled to the base line and contacted with two opposite sides of the circuit board; and measuring a distance X1 between the first flat plate and the base line, and a distance X2 between the second flat plate and the base line. Therefore, offsets A between the LEDs and a central axis of a space between the first and second flat plates can be obtained by the following equation: A=X0−(X1−X2)/2. The offsets A are used to adjust the positions of the LEDs to be actually mounted on the circuit board. | 10-24-2013 |
20130286644 | LED LIGHT BAR WITH BALANCED RESISTANCE FOR LIGHT EMTITTING DIODES THEREOF - An LED light bar includes LED chips and a printed circuit board. A number of welding pads are disposed on the printed circuit board, and correspondingly connected to anodes and cathodes of the LED chips respectively. The welding pads connected to the anodes of the LED chips are connected by wire lines for connecting an anode of an electrical power source. The welding pads connected to the cathodes of the LED chips are connected by the wire lines for connecting a cathode of the electrical power source. The resistance of the wire lines connected to the LED chips increases from one near the electrical power source to the one far from the electrical power source. The resistance of the welding pads connected to the LED chips decreases from one near the electrical power source to the one far from the electrical power source. | 10-31-2013 |
20130298395 | METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a FPCB includes following steps. A support device and an unfinished FPCB are provided. The unfinished FPCB includes a substrate, a conductive trace layer, and a solder mask layer in sequence. The conductive trace layer includes exposed connecting terminals. The unfinished FPCB is divided into an effective region and an unwanted region surrounding the effective region. A blinded groove is formed at the unwanted region. The connecting terminals are located in the effective region. The unfinished FPCB is put on the support device. A heating device is inserted into the blinded groove to heat the substrate and the support device to adhere together and then the heating device is removed. A tin cream layer is dispensed on each connecting terminal. An electronic component is mounted on each tin cream layer. The unfinished FPCB is cut to separate the effective region from the unwanted region. | 11-14-2013 |
20130298900 | SOLAR ENERGY GATHERING DEVICE - A solar energy gathering device includes a heat storage unit, a number of heat gathering units and a number of Fresnel lenses. Each of the heat gathering units includes a transparent glass block having a vacuum receiving space, and a heat pipe received in the vacuum receiving space and in thermally contact with the heat storage unit. The Fresnel lenses are attached on each of the glass blocks, and configured for converging solar light to the heat pipes through the glass bocks. | 11-14-2013 |
20130301294 | LIGHT GUIDE MEMBER, BACKLIGHT MODULE AND METHOD FOR MAKING LIGHT GUIDE MEMBER - A light guide member includes an optical fiber layer and a light diffusion layer formed on the optical fiber layer. The optical fiber layer has a light incident side surface, the optical fibers are parallel with each other, and ends of the optical fibers are exposed to the light incident side surface. The light diffusion layer has a number of light scattering particles dispersed therein. The light diffusion layer has a light output top surface, and the light output top surface has a number of netted dots configured for diffusing light. Light enters the optical fibers and transmits through a wall of the optical fibers to reach at the light diffusion layer and finally output from the light output top surface of the light diffusion layer. A backlight module and a method for making the light guide member are also provided. | 11-14-2013 |
20130320557 | SEMICONDUCTOR PACKAGE HAVING RELIABLE ELECTRICAL CONNECTION AND ASSEMBLING METHOD - A semiconductor package includes a printed circuit board, a chip, a protection frame, and a covering layer. The chip is mounted on the printed circuit board and is electrically connected to the printed circuit board through a number of first bonding wires. The protection frame includes a sidewall surrounding the chip and the bonding wires and defines a number of through holes passing through an inner surface and an outer surface of the sidewall. The protection frame is filled with adhesive. The adhesive adheres to the inner surface and covers the chip and the boding wires. The covering layer is coated on the outer surface and covers the through holes. | 12-05-2013 |