| Patent application number | Description | Published |
|---|
| 20130169187 | COLOR TEMPERATURE ADJUSTING METHOD OF SOLID STATE LIGHT EMITTING DEVICE AND SOLID STATE LIGHT EMITTING DEVICE USING THE METHOD - A color temperature adjusting method of solid state light emitting device, including steps: providing a main light source which emits main light of a first color temperature; providing an adjusting light source, wherein the adjusting light source comprises a red light source, a green light source and a blue light source; and adjusting currents applied to the adjusting light sources to obtain an adjusting light, wherein the adjusting light mixes with the main light of the main light source to obtain an outgoing light of a second color temperature. The second color temperature is different from the first color temperature. The outgoing light has a chromaticity coordinate at a Plank's curve on a CIE 1931 chromaticity coordinates chart. | 07-04-2013 |
| 20130214032 | METHOD OF MANUFACTURING LED LIGHT BAR - A method of manufacturing an LED light bar comprises: providing a reflow oven and a clamping device mounted on a transmitting belt of the reflow oven, the reflow oven comprising a heating area and a cooling area; providing a semi-finished LED light bar comprising a printed circuit board and a plurality of LEDs arranged on the print circuit board with solder paste applied between the LEDs and the printed circuit board, and mounting the semi-finished LED light bar in the clamping device; and starting the reflow oven and thus the transmitting belt carrying the clamping device and the semi-finished LED light bar moving together to pass through the reflow oven, whereby the solder paste is firstly melted in the heating area and then solidified in the cooling area to fix the LEDs on the printed circuit board to form the LED light bar. | 08-22-2013 |
| 20130219653 | DUST REMOVAL SYSTEM FOR LED STRIP AND APPRATUS WITH THE DUST REMOVAL SYSTEM - A apparatus for treating an LED strip includes a warming zone, a dust removal system disposed in the warming zone, a belt transporting the LED strip through the dust removal system, a high temperature zone and a cooling zone. The dust removal system includes an airflow generating device producing an airflow removing dust away from the LED strip when the LED strip passes through the airflow generating. The high temperature zone performs a reflow soldering to the LED strip which has a plurality of LEDs mounted thereon. | 08-29-2013 |
| 20130219695 | SURFACE MOUNTER FOR MOUNTING LED AND METHOD USING THE SAME - A method for mounting an LED (light emitting diode) on a substrate, includes following steps. Firstly a substrate and an LED are provided. Secondly a surface mounter is provided, which includes a nozzle and a sensor in the nozzle. The nozzle includes a first electrode and a second electrode. Thirdly the nozzle is used to pick up the LED. The LED electrically connects with the first electrode and the second electrode of the nozzle to emit light towards the sensor, and the sensor detects optical characteristics of the light. Fourthly it is decided whether to mount the LED on the substrate or not according to the optical characteristics of the light detected by the sensor. An LED surface mounter which includes a vacuum nozzle and an optical sensor in the vacuum nozzle is also provided. | 08-29-2013 |
| 20130232775 | DIE BOND SYSTEM - A die bonding system for bonding a die on a substrate is provided. The die bonding system includes a supporting base for the substrate, a die pickup device for picking up the die, and an alerting device. The supporting base includes a number of conductive and height-adjustable upper portions. The upper portions are spaced from each other. The alerting device includes a power source and an alerting element electrically connected to the power source. Two electrodes of the power source are electrically connected to the die pickup device and the upper portions, and the alerting element generates different alerts according to different contacting status of the upper portions and the die pickup device. | 09-12-2013 |
| 20130272023 | LED DISPLAY UNIT WITH SOLAR PANELS AND LED DISPLAY DEVICE INCLUDING SAME - An LED display unit includes a light guide, a diffusion layer, an LED module, and a solar panel. The light guide includes a first light incident surface and a light emitting surface connected to the first light incident surface. The diffusion layer includes a side surface and a second light incident surface connected to the side surface. The second light incident surface is adjacent to the light emitting surface. The LED module is adjacent to the first light incident surface. The solar panel is adjacent to the side surface and electrically connected with the LED module. | 10-17-2013 |
| 20130306712 | HOT PRESS DEVICE AND HOT PRESSING METHOD - A hot press device includes a spacing strip, a winding roller, a feeding roller and a hot press head. The spacing strip includes a metal layer and a resin layer stacked on the metal layer. The resin layer has a glass transition temperature of greater than | 11-21-2013 |
| 20130328754 | LED DISPLAY DEVICE WITH AUTOMATIC BRIGHTNESS ADJUSTMENT - A display device includes a housing, a screen mounted on the housing, an imagine capture unit, a distance measuring unit, and a display module assembly received in housing. The display module assembly includes a light emitting unit, a micro reflection unit, and a micro control unit; the micro control unit includes an identify module and a reflection control module. The identify module is electrically connected to the imagine capture unit and the distance measuring unit for receiving images of a viewer to identify position of eyes of viewer and sending instruction to measure distances between eyes of viewer and the display device to the distance measuring unit; the reflection control module is electrically connected to one of the light emitting unit and the micro control unit to control the micro reflection unit to rotate relative to the light emitting unit, to reflect light into eyes of the viewer. | 12-12-2013 |
| 20140167093 | LIGHT EMITTING DIODE HAVING A PLURALITY OF HEAT CONDUCTIVE COLUMNS - An LED (light emitting diode) includes a substrate, a first electrode and a second electrode located on the substrate, and an LED chip electrically connected to the first electrode and the second electrode. The substrate includes a ceramic plate and a plurality of metallic heat conductive columns inserted in an interior of the plate. The plurality of heat conductive columns is spaced from each other and all located rightly underneath the LED chip. The LED chip is thermally connected to the plurality of heat conductive columns. | 06-19-2014 |
| 20140167615 | HEAT DISSIPATING METHOD FOR LIGHT EMITTING DIODE AND LIGHTING DEVICE USING SAME - A heat dissipating method for a light emitting diode is provided. The heat dissipating method includes following steps. Firstly, a circuit board with a light emitting diode formed on one side and a heat dissipating fan formed on the other side is provided. The heat dissipating fan is configured to dissipate heat for the light emitting diode. Secondly, a power source is provided for supplying power for the light emitting diode. Finally, a speed of the heat dissipating fan is adjusted according to an input power of the power source. A lighting device using the heat dissipating method is also provided. | 06-19-2014 |
| 20140167644 | METHOD FOR MIXING LIGHT OF LEDS AND LIGHTING DEVICE USING SAME - A method for mixing light of LEDs includes following steps: Firstly, a substrate with a red light LED, a green light LED and a blue light LED arranged thereon is provided. Secondly, a power source for supplying power to the red light LED, the green light LED and the blue light LED is provided. Thirdly, a temperature variation ΔT1 of the red light LED caused by the power source, a temperature variation ΔT2 of the green light LED caused by the power source, a temperature variation ΔT3 of the blue light LED caused by the power source are calculated. And finally, input currents applied to the red light LED, the green light LED and the blue light LED are adjusted according to the temperature variations ΔT1, ΔT2 and ΔT3. A lighting device using the method is also provided. | 06-19-2014 |
| 20140167651 | ELECTRONIC CENSER WITH CONTROL SYSTEM HAVING WIND FORCE SENSOR TO REGULATE LIGHT EMITTING STATE THEREOF - An exemplary electronic censer with control system includes a main body, an LED disposed on the main body and a control system mounted on the main body. The control system includes a driver received in the main body, a wind force sensor exposed out of the main body and a controlling unit electrically connecting the driver. The wind force sensor measures a wind force therearound and samples a wind force signal S corresponding to the measured wind force to the controlling unit. The controlling unit analyzes the wind force signal S and thereby delivers instructions to the driver to regulate a light emitting state of the LED. A method for controlling the electronic censer with control system is also provided. | 06-19-2014 |
| 20140168200 | PROJECTOR WITH MAIN IMAGE MODULE AND SECONDARY IMAGE MODULE - A projector includes a main image module and a secondary module. The main image module includes a main projecting unit and a main control unit outputting a main image signal to the main projecting unit. The main projecting unit projects a main image according to the main image signal. The secondary image module includes two secondary projecting units and a secondary control unit outputting a background image signal to the secondary projecting units. The secondary projecting units project two background images according to the background image signal. The two secondary projecting units are positioned at two sides of the main projecting unit, and the background images coordinate with the background of the main image. | 06-19-2014 |
| 20140168945 | ELECTRONIC CENSER - An electronic censer includes a censer body, a driving device and an incense branch. The censer body defines a recess on a top end thereof. The driving device is received in the recess of the censer body. The incense branch is inserted in the censer body and extends from the recess to external environment of the censer body. The incense branch includes a frame and an LED light source located at an upper end of the frame. The LED light source is electrically connected with the driving device. The frame has a first portion and a second portion. The first portion of the frame is pivotally connected with the second portion of the frame, thereby making the second portion of the frame rotatable around the first portion of the frame. | 06-19-2014 |
| 20140168979 | LIGHT EMITTING DIODE MODULE WITH HEAT-CONDUCTING POLES - An exemplary light-emitting diode (LED) module includes a base, a substrate arranged on the base, and LED chips mounted on the substrate. Through holes are defined in the substrate. The through holes are spaced from each other. Heat-conducting poles extend through the through holes, and a top end of each heat-conducting pole connects the LED chip and a bottom end of each heat-conducting pole connects the base. Heat generated from the LED chips is absorbed by the heat-conducting poles, and then transferred to the base for dissipation from the base. | 06-19-2014 |
| 20140173884 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE BACKLIGHT MODULE - A method to manufacture an LED backlight module comprising steps: providing a substrate with circuits arranged thereon; pasting a plurality of LEDs on the substrate; electrically conducting the LEDs with the circuits on the substrate; providing a luminance photometer to measure an illumination of the LEDs in luminous state and getting an actual light intensity distribution of the light of the LEDs through a brightening sheet and a diffusion sheet; providing a computer to detect whether the actual light intensity distribution has a dark/bright band/spot. If the actual light intensity distribution is uniform, the LEDs are soldered to the substrate directly. If there is dark/bright band/spot, the positions of LEDs in connection with the irregular light band/spot are adjusted to enable the light from the LED backlight module to have a uniform intensity distribution. | 06-26-2014 |
| 20140173885 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE - A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor, providing a PCB having an LED mounted on, and fixing the PCB in the SMT apparatus; providing a lens, the CCD image sensor imaging the lens, and then the SMT apparatus obtaining a location of the lens relative to the LED, and the SMT apparatus positioning the lens on the PCB to cover the LED; providing an optical diffusing board located above the lens, and electrifying the LED for emitting light towards the optical diffusing board; providing a luminance colorimeter to measure luminance and chroma of light exited from the optical diffusing board, and obtaining a light-emitting data; calculating the light-emitting data, and the SMT apparatus adjusting a position of the lens relative to the LED; and fixing the lens on the PCB. | 06-26-2014 |
| 20140173886 | METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE LIGHT BAR - A method for manufacturing an LED light bar includes steps: a nozzle picks up LEDs pending to be mounted; the electrical parameters of the LEDs detected by the nozzle are stored in a database; then, the nozzle disposes the LED on a substrate; the above steps are repeated until a plurality of LED branches are mounted on the substrate; then, differences of the electrical parameters of the LED branches are calculated according to the electrical parameters in the database; the positions of the LEDs of the LED branches are adjusted to make the electrical parameters of the LED branches equal. | 06-26-2014 |
| 20140174629 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE - A method for manufacturing an LED module includes following steps: providing a SMT apparatus having a CCD image sensor and a nozzle, and providing a PCB having a plurality of LEDs mounted on and fixing the PCB in the SMT apparatus; providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens; providing an adhesive area in the SMT apparatus, disposing a plurality of adhesive on the adhesive area, and the nozzle carrying each lens to the adhesive area; carrying each lens by the nozzle upwardly from the adhesive area, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to a corresponding LED; and positioning and fixing the lens on the PCB to cover the LEDs by the SMT apparatus. | 06-26-2014 |
| 20140175158 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package includes following steps: providing a eutectic bonding apparatus comprising a heating device, a supporting platform located in the heating device, and a nozzle; providing a resistance measuring device comprising a probe, an electrical power, and a controlling unit; providing an LED chip; providing a substrate and positioning the substrate on the supporting platform of the eutectic bonding apparatus; moving the nozzle to catch the LED chip onto the substrate; and heating the substrate and the LED chip to form a eutectic bonding process. The probe of the resistance measuring device is electrically connected to the LED chip, a total resistance of the LED chip and the substrate is measured by the resistance measuring device in real-time, when the total resistance is equal to a predetermined value, the heating device is ordered to stop heating by the controlling unit. | 06-26-2014 |
| 20140175480 | LED DIE AND METHOD FOR MANUFACTURING LED INCORPORATING THE SAME - An LED die includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first electrode and a second electrode. A phosphor layer is formed on the second semiconductor layer. The phosphor layer has a constant thickness at a main light emitting face of the second semiconductor layer. A method for manufacturing an LED incorporating the die is also disclosed. | 06-26-2014 |
| 20140175496 | CHIP UNIT AND METHOD FOR MANUFACTURING THE SAME - A chip unit includes a base and two chips. Each chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode. The substrate forms a groove in a bottom face thereof and two blocks besides the groove. The base forms a protrusion on a top face thereof and two slots besides the protrusion. The protrusion is fittingly received in the groove, and the two blocks are fittingly received in the two slots, respectively. A method for manufacturing the chip unit is also disclosed. | 06-26-2014 |
| 20140175497 | LED CHIP WITH GROOVE AND METHOD FOR MANUFACTURING THE SAME - An LED chip includes a substrate and an epitaxy structure formed on the substrate. The epitaxy structure includes a first semiconductor layer, a light emitting layer and a second semiconductor layer. A plurality of grooves are defined through the first semiconductor layer, the light emitting layer and the second semiconductor layer. The light emitting layer is exposed from the grooves. A transparent insulative layer is filled in the grooves. An electrode is further formed on the transparent insulative layer. | 06-26-2014 |
| 20140175498 | LED CHIP UNIT WITH CURRENT BAFFLE - An LED chip unit includes a base and a chip mounted on the base. The chip includes a substrate, a first semiconductor layer, a light emitting layer, a second semiconductor layer and an electrode. The base forms multiple conductive posts and current baffles therein. Widths of the current baffles gradually decrease from a central portion of the chip towards two lateral portions of the chip. | 06-26-2014 |
| 20140175499 | LIGHT EMITTING DIODE - An LED includes an LED chip, a substrate, a first electrode and a second electrode formed on the LED chip, and a first solder layer and a second solder layer formed on a top face of the substrate. The first solder layer is soldered on the first electrode and sandwiched between the LED chip and the substrate. The second solder layer is soldered on the second electrode and sandwiched between the LED chip and the substrate. A projection of the first solder layer on the top face of the substrate exceeds a periphery of a projection of the LED chip on the top face of the substrate. A projection of the second solder layer on the top face of the substrate exceeds the periphery of the projection of the LED chip on the top face of the substrate. | 06-26-2014 |
| 20140175987 | COLOR TEMPERATURE ADJUSTING METHOD AND ILLUMINATING DEVICE USING THE METHOD - A color temperature adjusting method includes steps: providing a controller storing a color temperature setting value therein, a main white light source including first and second sub-main white light sources having different color temperatures, and an adjusting light source comprising red, green and blue light sources; comparing the color temperature setting value with that of an environmental light to obtain a difference value; controlling currents to the two sub-main white light sources, the red light source, the green light source and the blue light source to obtain a compensation light according to the difference value; and mixing the compensation light and the environmental light to obtain a resulted light which has a color temperature equal to the setting value. An illuminating device using the color temperature adjusting method is also provided. | 06-26-2014 |
| 20140176072 | PORTABLE ELECTRICAL ENERGY SOURCE - A portable electrical energy source provides power for a portable electronic device and includes a base, a chargeable battery, and a connector. The base includes a first surface and a second surface facing away from the first surface. The base defines a receiving room between the first surface and the second surface. The chargeable battery is received in the receiving room. The connector is positioned on the first surface and is electrically connected to the chargeable battery, which is electrically connected to the portable electronic device. The chargeable battery charges the portable electronic device through the connector. | 06-26-2014 |
| 20140176945 | ALIGNING MODULE AND METHOD FOR ASSEMBLING LIGHT-EMITTING DIODE WITH LENS USING THE SAME - An exemplary aligning module for aligning a lens with a light-emitting diode (LED) chip includes a controlling module, a first image sensing module and a second image sensing module controlled by the controlling module, and a gripping module controlled also by the controlling module. The controlling module controls the first image sensing module and the second image sensing module to sense the light center of the LED chip and the geometric center of the lens, respectively. The controlling module controls the gripping module to bring the geometry center of lens to be aligned precisely with the light center of the LED chip according to a coordinate of the light center the LED and a coordinate of the geometric center of the lens. The present disclosure also relates to a method for aligning a lens with a light emitting diode chip. | 06-26-2014 |
| 20140177244 | LED DIE, METHOD FOR MANUFACTURING THE LED DIE AND AUTOMOBILE LAMP HAVING THE LED DIE - A light emitting diode (LED) die for use in an automobile lamp includes a light outputting surface; a concave surface is formed in a center of the light outputting surface. The concave surface is an aspheric and arc-shaped surface, with an arc-shaped edge connecting with a flat part of the light outputting surface which surrounds the concave surface. An LED automobile lamp with the LED die and a method for manufacturing the LED die are also provided. | 06-26-2014 |
| 20140177245 | LIGHT EMITTING DIODE AUTOMOBILE LAMP - An LED automobile lamp includes an LED light source, a shading portion and a lens. The shading portion is located between the LED light source and the lens. The LED light source includes a light outputting surface. The shading portion contains phosphor therein. Blue light emitted by the LED light source transmits to the shading portion and excites the phosphor to form yellow light which mixes with the blue light to generate white light. | 06-26-2014 |
| 20140177246 | LED DIE, METHOD FOR MANUFACTURING THE LED DIE AND AUTOMOBILE LAMP HAVING THE LED DIE - An LED die includes a transparent substrate, an N-type layer, an active layer and a P-type layer successively arranged on a first surface of the transparent substrate. A part of the N-type layer is exposed. The LED die further includes an electrode structure arranged on the P-type layer and the exposed surface of the N-type layer. A light outputting surface is formed on a second surface of the transparent substrate. The light outputting surface is a smoothly concave and arc-shaped surface. An LED automobile lamp with the LED die and a method for manufacturing the LED die are also provided. The light outputting surface of the LED die directly faces a lens of the LED automobile lamp. | 06-26-2014 |
| 20140177252 | VEHICLE LAMP MODULE - An exemplary vehicle lamp module includes a lighting module and a controlling system for controlling the lighting module. The lighting module includes a light source, a reflecting mirror arranged on the light path of the light source and a reflecting cup. Light emitted from the light source is reflected to the reflecting cup by the reflecting mirror. The reflecting mirror is moveable relative to the reflecting cup, by which, a direction of the light reflected to the reflecting cup is capable of being changed by moving the reflecting mirror relative to the reflecting cup correspondingly, such that light reflected to the reflecting cup by the reflecting mirror is capable of being reflected by the reflecting cup to the far front side, near front side and lateral sides of the vehicle by moving the reflecting mirror correspondingly. | 06-26-2014 |
| 20140177262 | LIGHT SOURCE AND LIGHT EMITTING DIODE AUTOMOBILE LAMP HAVING THE LIGHT SOURCE - A light source includes a light emitting diode (LED) packing structure, a fiber and a light color converting portion. An end of the fiber couples with the LED packing structure. The light color converting portion is arranged at an opposite end of the fiber. The light color converting portion contains phosphor therein. Blue light emitted by the LED package transmits to the light color converting portion via the fiber and excites the phosphor to produce yellow light which mixes with the blue light to generate white light. An LED automobile lamp having the light source is also provided. | 06-26-2014 |
| 20140177263 | ELECTRONIC INCENSE AND ELECTRONIC CENSER WITH THE SAME - An electronic censer includes a seat and multiple real incenses and an electronic incense inserted to the seat. The electronic incense includes a light guiding rod, a metal shell enclosing the rod, an LED contacting the rod and a circuit board connected to the LED. Light emitted from the LED transmits through the rod to an outside environment. | 06-26-2014 |
| 20140177264 | ELECTRONIC CENSER WITH DETACHABLE INCENSE - An electronic censer includes a seat and an incense detachably mounted on the seat. The seat includes a base, a supporting plate mounted on the base, two pins protruding from the plate and an annular rib surrounding the pins. A bottom of the incense is inserted within the annular rib. The incense includes a light guiding rod, a shell enclosing the rod, an LED, a circuit board and a battery embedded within the shell. An induction coil is fixed in the shell to control the lighting of the LED. | 06-26-2014 |
| 20140179035 | METHOD FOR DISPENSING GLUE ON LED CHIP - A method for dispensing glue on an LED chip includes following steps: providing a glue dispensing device which includes a syringe, a needle head communicating with the syringe, and a valve mounted on the needle head for controlling flowing of content in the syringe out of the syringe, wherein the valve has an aperture, and a diameter of the aperture is adjustable; providing glue and injecting the glue into the syringe; providing an LED chip which is mounted a circuit board and orientating the needle head of the glue dispensing device towards the LED chip, wherein the needle head is spaced from the LED chip, and the diameter of the aperture of the valve is adjusted to a predetermined size; squeezing the glue out of the syringe under a predetermined pressure and a predetermined time, wherein the glue dispensed on the LED chip forms an encapsulation structure. | 06-26-2014 |
| 20140179037 | METHOD FOR MANUFCTURING BACKLIGHT MODULE - A method for manufacturing a backlight module comprises following steps: providing a substrate; providing a flip chip LED and mounting the flip chip LED on a top surface of the substrate to electrically connect with two electrodes via flip chip bonding; providing a frame and mounting the frame on the top surface of the substrate, wherein the frame defines a through hole which receives the flip chip LED therein; and providing a phosphor layer and mounting the phosphor layer on a top end of the frame away from the substrate to make the phosphor layer cover a top end of the through hole and the flip chip LED. | 06-26-2014 |
| 20140179038 | METHOD FOR MANUFCTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package comprising following steps: providing a substrate and an LED chip mounted on the substrate; providing glue and arranging the glue on a periphery of the substrate and drying the glue to form a blocking loop to enclose the LED chip therein; and injecting the glue in the blocking loop, and drying the glue to form a packaging layer to encapsulate the LED chip therein. Light emitted from the LED chip travels through a top surface of the packaging layer, a periphery of the packaging layer, and the blocking loop to illuminate. | 06-26-2014 |
| 20140179039 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE MODULE - A method for manufacturing an LED module includes following steps: providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and providing a PCB and fixing the PCB in the SMT apparatus; providing a plurality of LEDs and mounting the LEDs on the PCB by the SMT apparatus; providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to the LED; positioning the lens on the PCB to cover the LED by the SMT apparatus; and fixing the lens on the PCB. | 06-26-2014 |
| 20140184084 | ELECTRONIC INCENSE ASSEMBLY - An electronic incense assembly includes a burning chamber, an electronic stick, a camera module, an image processor and a controller. The burning chamber includes a sidewall. The electronic stick is positioned on the burning chamber, and includes a light guide bar and a light source. The light guide bar includes a first end and a second end away from the first end. The light source is positioned on the second end. The camera module is positioned on the sidewall. The image processor includes an environment brightness sensor. The controller is electrically connected to the camera module and the image processor. The environment brightness sensor is configured to sense an environment brightness based on a captured image captured by the camera module. The controller is configured to receive the environment brightness and to drive the light source to emit suitable light according to the environment brightness. | 07-03-2014 |
| 20140212093 | LOW COST OPTICAL CONNECTOR - An optical connector includes a printed circuit board, a substrate, a photoelectric die, a number of wires, a lens element, and an optical fiber. The substrate is mounted on the printed circuit board. The photoelectric die is wire-bonded to the substrate by the wires. The photoelectric die is packaged by the lens element, the substrate and the printed circuit board and optically coupled to the optical fiber by the lens element. | 07-31-2014 |
| 20140215814 | DEVICE FOR PRECISE ASSEMBLY OF LIGHT RECEIVER ON SUBSTRATE - A device includes a vacuum nozzle, a driver, a light source, a measuring unit, and a controller. The vacuum in the nozzle picks up and holds a light receiver. The driver drives the nozzle to press the light receiver onto a substrate such that the light receiver is electrically connected to the substrate. A light source in the nozzle illuminates the light receiver causing the generation of a first electrical signal. The measuring unit measures a second electrical signal that is a part of the first electrical signal, and the driver is controlled drive the nozzle to press harder until the second electrical signal stops increasing, the degree of conductivity between the light receiver and the substrate being then at the maximum. | 08-07-2014 |
| 20140216338 | DEVICE FOR PROPERLY APPLYING CONDUCTIVE GLUE ON PHOTOELECTRIC ELEMENT - A device to apply and confirm the proper dispensation of conductive glue includes a nozzle vacuum-lifting a photoelectric element having a bonding surface, a base defining a receiving recess, a conductive glue received in the recess, a driver, and a controller controlling the driver to drive the nozzle to dip the photoelectric element into the conductive glue. A first camera module positioned on the base and aimed at the bonding surface takes images of the bonding surface. The controller is in communication with the first camera module and processes the images to determine if the amount of conductive glue and the spread area on the bonding surface are correct and, if yes, control the driver to pass on the photoelectric element, or if no, control the driver to reject the photoelectric element. | 08-07-2014 |
| 20140240485 | DEVICE FOR ASSEMBLING PHOTOELECTRIC ELEMENT ONTO SUBSTRATE - A device for applying conductive glue and assembling a glued photoelectric element on a substrate operates a vacuum-lift nozzle, a driver, a first camera module, a second camera module, and a third camera module. The first, second, and third camera modules take images of the photoelectric element on a supply tray, check for absence of tilt during a dipping into the conductive glue, and supervise the accurate positioning of the photoelectric element onto a substrate on an output tray. | 08-28-2014 |
| 20140250682 | DEVICE FOR ASSEMBLING LENS ELEMENT ON SUBSTRATE - A device for precisely assembling a lens element on a substrate includes a vacuum nozzle for lifting and carrying the lens element and a driver for moving and positioning the nozzle to position the lens element onto the substrate. The substrate supports a light emitter. The lens element includes a first lens facing the light emitter and a second lens optically coupled with the first lens. The device also includes a power meter arranged on the driver and aligned with the second lens when the lens element is being held in place by the vacuum nozzle. The driver adjusts the placement of the lens element on the substrate until the intensity of incident light recorded by the power meter reaches a maximum value. | 09-11-2014 |
| 20140251213 | DEVICE FOR ASSEMBLING OPTICAL CONNECTOR - A device includes an ejector, a driver, a camera module, and a processing unit. The ejector is movably arranged above a printed circuit board of an optical connector and stores adhesive. The driver connects with the ejector and drives the ejector to move to aim at predetermined points on the printed circuit board and to eject of a drop of the adhesive to each point. The camera module is arranged above the printed circuit board and captures images of each drop of the adhesive. The processing unit is in communication with the camera module and the driver and processes the images of each drop of the adhesive to determine if an amount of the adhesive applied to the corresponding point is appropriate, and, if yes, signals the driver to drive the ejector to stop ejecting and move to aim at a next point. | 09-11-2014 |
| 20140251543 | DEVICE FOR ASSEMBLING LENS ELEMENT ON SUBSTRATE - A device for precisely assembling a lens element on a substrate includes a vacuum nozzle for lifting and carrying the lens element and a driver for moving and positioning the nozzle to position the lens element onto the substrate. The substrate supports a light receiver. The lens element includes a first lens facing the light receiver and a second lens optically coupled with the first lens. The device also includes a light emitter arranged on the driver and aligned with the second lens when the lens element is being held in place by the vacuum nozzle. The driver adjusts the placement of the lens element on the substrate until the intensity of incident light recorded by the light receiver reaches a maximum value. | 09-11-2014 |
| 20140252072 | DEVICE FOR ASSEMBLING PHOTOELECTRIC ELEMENT ON SUBSTRATE - A device includes a vacuum nozzle, a driver, a measuring unit, and a controller. The nozzle lifts and holds a photoelectric element having a first electrode and a second electrode. The driver drives the nozzle to press the photoelectric element onto a substrate having a soldering pad and a contact, such that the second electrode is electrically connected to the soldering pad via a layer of conductive glue. | 09-11-2014 |
| 20140254985 | OPTICAL CONNECTOR AND METHOD FOR ASSEMBLING SAME - An optical connector includes a substrate, an optical emitter, an optical receiver, a support member, and a lens member. The optical emitter and the optical receiver are electrically connected to the substrate. The support member includes a lower end connected to the substrate and an upper end away from the substrate. The upper end includes a supporting end and a protrusion protruding from the supporting surface. The lens member includes a lens portion and an assembling portion surrounding the lens portion. A thickness of the assembling portion is less than a height of the protrusion relative to the supporting surface. The assembling portion abuts on the supporting surface and a slit is formed between a peripheral side surface of the assembling portion and an inner side surface of the protrusion. An adhesive is distributed in the slit to adhere the lens member to the support member. | 09-11-2014 |
| 20140284612 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer stacked on a face of the substrate successively, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer. The first semiconductor layer is disposed adjacent to the substrate. A plurality of nanoscale holes are defined in the face of the substrate contacting the first semiconductor layer. A method for manufacturing the light emitting diode is also provided. | 09-25-2014 |
| 20140285119 | ADAPTER CABLE HAVING LIGHT SOURCE FOR LIGHTING - An adapter cable includes a first adapter, a second adapter, and a wire. The first adapter includes a sensor, a light source, and a processor. The sensor generates a detecting signal when sensing that the first adapter is picked up. The processor is connected between the sensor and the light source. The processor turns on the light source when receiving the detecting signal output from the sensor. The wire is connected between the first adapter and the second adapter. | 09-25-2014 |
| 20140301098 | VEHICLE LAMP SYSTEM - A vehicle lamp system includes a laser source and a reflecting plate for reflecting light generated from the laser source out of a vehicle. The laser source includes a laser diode, a light splitter for splitting light generated from the laser diode into a plurality of beams, a phosphor layer for changing color of the beams transmitted from the light splitter, and a diffusing layer for diffusing the beams transmitted from the light splitter, to thereby form a surface light source. | 10-09-2014 |
| 20140313754 | VEHICLE LAMP SYSTEM - A vehicle lamp system includes a laser source, a reflecting mirror, a light converting element and a reflecting plate. The reflecting mirror is located at a position towards a light emitting direction of the laser source. Light generated from the laser source is reflected to the light converting element by the reflecting mirror. The light converting element includes a base and diffusing particles cooperating with the base. The light transmitted from the reflecting mirror is diffused via the light converting element. The reflecting plate reflects the light transmitted from the light converting element out of a vehicle. | 10-23-2014 |
| 20140340021 | PORTABLE ELECTRICAL POWER SOURCE - A portable electrical power source configured to provide power for a portable electronic device includes a base, a chargeable battery, a connector, and at least one locking structure. The base includes a first surface and a second surface facing away from the first surface. The base defines a receiving room between the first surface and the second surface and at least one cavity. The chargeable battery is received in the receiving room. The locking structures are rotatably received in the cavities to lock the portable electronic device onto the first surface of the base. The connector is positioned on the first surface and is electrically connected to the chargeable battery and the portable electronic device. The chargeable battery charges the portable electronic device through the connector. | 11-20-2014 |
| 20140347568 | DISPLAY SYSTEM HAVING DISPLAY PANAL AND PROJECTOR - A display system includes a background screen, a display device, two projectors, and a controller. The display device is placed in front of or mounted to the background screen. The projectors are positioned at two respective opposite sides of the display device and project onto the background screen. The controller is in communication with the display device and the projectors. The controller receives signals of video or still image(s) from a media source, and processes the signals such that the signals are displayable on the display device. The processor controls the display device to display the signals, and further controls the projectors to project background video or still images onto the background screen. | 11-27-2014 |
| 20140361731 | VEHICLE-MOUNTED CHARGING DEVICE - A vehicle-mounted charging device includes a charging main body, an external module, an electric wire, and a lighting module. The charging main body includes a circuit board in a first shell, a power plug, and a first shell. A power socket of a vehicle connects to the circuit board. The external module includes a charging plug and a second shell. The charging plug is arranged in the second shell. The charging plug connects to a charging socket of an electronic device to recharge a battery of the electronic device. The electric wire is configured to electrically connect to the charging main body, the external module, and the lighting module to visually indicate the state of charge of the battery of the electronic device. | 12-11-2014 |
| 20140376264 | LIGHT GUIDE PLATE, METHOD OF MANUFACTURING SAME, AND BACKLIGHT MODULE HAVING SAME - A light guide plate includes a main body including a light emitting surface. A number of glues, each with a different, and lower, refractive index when cured, are applied through a covering plate onto the light emitting surface. Each type of glue forms a layer on the layer below, the stack of layers forms a plurality of spaced micro-rods on the light emitting surface. Each layer in the micro-rod thus includes top and bottom and side surfaces. The different refraction indexes of each layer, reducing along a direction from the light emitting surface to the top surface of each rod, causes light to be emitted substantially equally from the periphery of each layer in the micro-rod as well as from the top of each rod. The maximum refraction index of any layer in the micro-rod is not greater than that of the main body. | 12-25-2014 |
| 20150094946 | LIGHT INDICATING DEVICE, POSITIONING DEVICE AND POSITIONING METHOD - A light indicating device includes a plurality of light sources located in at least two positions, and at least one driving unit configured for driving the light sources to flash. Light sources at a same position flash at a same frequency, and light sources at different positions flash at different frequencies. A positioning device and method are also provided. | 04-02-2015 |
| 20150153222 | OPTICAL COUPLING ASSEMBLY - An optical coupling assembly includes a circuit board, at least one light emitter, at least one light receiver, and an optical coupling module. The circuit board includes a mounting surface and an alignment groove formed on the mounting surface. The at least one light emitter and at least one light receiver are mounted on the mounting surface. The optical coupling module includes at least two lenses and a positioning member. The positioning member is engaged with the alignment groove, with each of the at least one light emitter and the at least one light receiver being optically aligned with a respective one of the at least two first lenses. | 06-04-2015 |
| 20150155429 | METHOD FOR MANUFACTURING LED DEVICE WITH STRUCTURE FOR PRECISELY LOCATING LEDS THEREON - A method for manufacturing an SMT LED device includes steps: providing an LED with two solder slugs extending downwardly from a bottom thereof; providing a circuit board with two first solder pads spaced from each other thereon, the first solder pads each defining a positioning hole therein corresponding to a position of each of the two solder slugs, forming a pair of second solder pads on the circuit board by directly and physically contacting with the circuit board; putting the solder slugs into the positioning holes; subjecting the circuit board and the LED to a reflow soldering, during which the solder slugs are first melted and then solidified to electrically and mechanically connect with the first and second solder pads thereby connecting the LED and the circuit board together. | 06-04-2015 |
| 20150162491 | METHOD FOR MANUFACTURING LED CHIP WITH GROOVE - A method for manufacturing an LED chip, comprising steps: making a substrate and an epitaxy structure formed on the substrate, the epitaxy structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer; defining a plurality of grooves in the epitaxy structure to expose the light emitting layer; and filling a transparent insulative material in the plurality of grooves; wherein the plurality of grooves comprise a plurality of first grooves and a plurality of second grooves different from the plurality of first grooves, wherein the plurality of second grooves are spaced differently from the plurality of first grooves. | 06-11-2015 |
| 20150185070 | PHOTOELECTRIC CONVERTING MODULE AND METHOD FOR ASSEMBLING SAME - A photoelectric converting module includes a circuit board and an optical coupling member. The circuit board includes a substrate defining a plurality of heat-conducting through holes and a hot-curable adhesive layer covering the heat-conducting through holes. The optical coupling member is fixed to the substrate via the hot-curable adhesive layer. | 07-02-2015 |
| 20150185071 | PHOTOELECTRIC CONVERTING MODULE - A photoelectric converting module includes a circuit board, at least one light emitting/receiving unit and an optical coupler both mounted on the circuit board. Each light emitting/receiving unit includes a light emitter and a light receiver, the light emitter and the light receiver each include at least one positioning projection. The optical coupler includes positioning parts to engage with the positioning projections for aligning the optical coupler with the light emitting/receiving unit precisely. | 07-02-2015 |
| 20150230370 | METHOD FOR ADJUSTING CIRCUIT BOARD - A method for adjusting a circuit board includes: providing a dispensing machine including a carrier and a glue dispensing head, a detecting module including a resistance meter and a coordinate recorder, and the circuit board including at least three through conductive vias, each conductive via including a first end surface and a second end surface; putting the circuit board on the carrier and making the first end surfaces contacting the carrier; driving the glue dispensing head to move towards the second end surfaces and recording positions of the glue dispensing head as positions of the second end surfaces when values reading from the resistance meter are no more than a predetermined value; and adjusting the carrier to make all of the second end surfaces locate at a same height according to the positions of the second end surfaces. | 08-13-2015 |
| 20150241269 | OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME - An optical communication module includes a circuit board, a photoelectric converting unit, and an optical coupler. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface, a hot-curable adhesive layer formed on the first surface, and a metal reflective layer formed on the second surface and aligned with the hot-curable adhesive layer. The photoelectric converting unit is mounted on the first surface. By virtue of the function of the metal reflective layer in the heat curing process, the optical coupler is precisely fixed to the substrate via the hot-curable adhesive layer. | 08-27-2015 |
| 20150277058 | OPTICAL FIBER CONNECTOR WITH OPTICAL FIBER HOLDER RECEIVED IN RJ45 PLUG - An optical fiber connector includes a housing, two coupling lenses, a RJ45 plug, a holder, and two optical fibers. The housing defines a receiving cavity with a bottom surface and two through holes. The coupling lens is positioned on the bottom surface and covers the through holes. The RJ45 plug is received in the receiving cavity and defines a receiving recess. The holder is received in the receiving recess and defines two receiving through holes. The optical fibers are received in the receiving through holes and optically aligned with the coupling lenses. | 10-01-2015 |
| 20150325753 | METHOD FOR MANUFACTURING LED DIE - A method for manufacturing an LED die includes following steps: a semi-finished LED die is provided; an N-type layer, an active layer, and an P-type layer are sequentially formed on the transparent substrate; the transparent substrate is etched by laser to form a light outputting surface, the light outputting surface having a smoothly concave and arc-shaped configuration; common parts of the active layer and the P-type layer are removed to expose a part of the N-type layer; and an electrode structure is disposed on exposed N-type layer and the p-type layer to complete the formation of the LED die. | 11-12-2015 |
