Patent application number | Description | Published |
20080302510 | Plasma-driven cooling heat sink - A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the electrodes coupled with dielectric pieces and heat sink fins induce the gas flow, which is used to cool down heat sources. A magnetic circuit may be coupled with plasma-drive gas flow to enhance the cooling. | 12-11-2008 |
20080302514 | Plasma cooling heat sink - One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device comprises heat sink fin assembly, plasma actuator assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. The magnetic circuit assembly provides magnetic field to interact with electrical field and plasma flow, and therefore an induced gas flow is pumped into, or pumped out from, heat sink fin assembly, to cool down heat sink fins. | 12-11-2008 |
20090052137 | Micro thrust cooling - One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source. | 02-26-2009 |
20090065177 | Cooling with microwave excited micro-plasma and ions - One embodiment of the present invention uses an actuator, which is actuated by electromagnetic microwave. The actuator is used to generate the micro-plasma and ions. The configurations of actuators may be microstrip lines structure, stripline structure, piping structure, multiplayer traces and electrodes structure, waveguide structure, and cavity structure. The generated micro-plasma and ions will induce a local turbulent gas flow and the flow is to carry the heat away from the surfaces of the heat sink fins. The actuators may be coupled to heat sink fins, heat transferring pipes, cooling fans, and heat sources in varied configurations. | 03-12-2009 |
20090308081 | INTEGRATED CIRCUIT CHIP COOLING USING MAGNETOHYDRODYNAMICS AND RECYCLED POWER - Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip. | 12-17-2009 |
20100032141 | COOLING SYSTEM UTILIZING CARBON NANOTUBES FOR COOLING OF ELECTRICAL SYSTEMS - A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module. The CNT heat exchanger module includes a member having a hole defined therethrough and a plurality of carbon nanotubes (CNTs) attached to the member. The coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system. | 02-11-2010 |
20100194278 | Flow manipulation with micro plasma - The embodiments of the present invention apply the RF or microwave energy on electrically conductive traces and waveguide structures to excite micro plasma, and the micro plasma is manipulated to drive the micro fluid flow. The micro fluid flow is used to cool down electronic device, or used for the applications of gas fluid transportation, gas fluid mixture, and gas fluid reaction. | 08-05-2010 |
20100230087 | Cooling using micro-plasma excited on transmission lines structure - One embodiment of the present invention uses transmission lines structure to excite micro-plasma. The excited micro-plasma will induce a gas flow to cool down heat sink assembly. The micro-plasma may be excited with a DC source, a RF source, or a microwave source. In one embodiment, the transmission lines structure may comprise a microstrip conductor, a stripline conductor, a conductor trace, a paired differential traces, a dielectric layer, a ground layer, a dielectric resonator, and a cavity. The transmission lines structure may have patterns to induce high electric field at local regions. The micro-plasma may be used to create local turbulence near solid surface to enhance the heat transfer efficiency. | 09-16-2010 |