Patent application number | Description | Published |
20080209816 | Tools for polishing and associated methods - Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming asperities on the working surface with a polycrystalline diamond dresser, where the asperities have a height to distance ratio of from about 1:5 to about 5:1 and where the average asperity diameter is less than about 175 μm. | 09-04-2008 |
20080248305 | Superabrasive Particle Synthesis with Controlled Placement of Crystalline Seeds - An improved method for synthesizing superabrasive particles provides high quality industrial superabrasive particles with high yield and a narrow size distribution. The synthesis method can include forming a growth precursor of a substantially homogeneous mixture of raw material and catalyst material or layers of raw material and metal catalyst. The growth precursor can have a layer of adhesive over at least a portion thereof. A plurality of crystalline seeds can be placed in a predetermined pattern on the layer of adhesive. The growth precursor can be maintained at a temperature and pressure at which the superabrasive crystal is thermodynamically stable for a time sufficient for a desired degree of growth. Advantageously, the patterned placement of crystalline seeds and disclosed processes allow for production of various morphologies of synthetic diamonds, including octahedral and cubic diamonds, and improved growth conditions generally. As a result, the grown superabrasive particles typically have a high yield of high quality particles and a narrow distribution of particle sizes. | 10-09-2008 |
20080250722 | ELECTROPLATED ABRASIVE TOOLS, METHODS, AND MOLDS - The present invention provides for an assembly for positioning and holding abrasive particles to be electroplated with a metal. The assembly can include a substrate with a surface that is configured for receiving abrasive particles. The assembly can further include an intermediate layer configured to hold the particles and mask at least a portion of each abrasive particle. Additionally, a method for making an abrasive tool using such an assembly is provided, as well as abrasive tools made thereby. In one aspect of this invention, abrasive tools can have abrasive particle tips that are arranged in accordance with a predetermined vertical pattern and a predetermined horizontal pattern as well as a predetermined particle attitude. | 10-16-2008 |
20080313968 | Diamond Growth Devices and Methods - Growth precursors to form discrete superabrasive particles including associated methods are disclosed. Such growth precursor may include a crystalline seed, an initiation material, and a feed material. The initiation material may substantially encompass the crystalline seed, and may include a catalyst and a raw material source. The raw material source makes up less than 50 wt % of the initiation material. The feed material may contact the initiation material and may also include raw material source and catalyst. The catalyst may be present in less than 50 wt % in the feed material. In one aspect, the growth precursor may be configured to form diamond particles. | 12-25-2008 |
20080315101 | DIAMOND-LIKE CARBON INFRARED DETECTOR AND ASSOCIATED METHODS - Diamond-like carbon based energy conversion devices and methods of making and using the same are disclosed. Such devices may include a surface for detection of infrared photons. Such a surface may include at least one metal cone and a diamond-like carbon layer disposed on the at least one metal cone. The at least one diamond-like carbon-coated metal cone is thus configured to receive infrared photons and generate electrons therefrom. In another aspect, the at least one metal cone may be an array of electronically coupled metal cones. | 12-25-2008 |
20090001383 | Doped Diamond LED Devices and Associated Methods - LED devices and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 01-01-2009 |
20090020153 | Diamond-Like Carbon Electronic Devices and Methods of Manufacture - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, thermoelectric conversion devices and other electronic devices are disclosed and described. In one aspect, a diamond-like carbon electronic device may include a conductive diamond-like carbon anode, an amorphous charge carrier separation layer adjacent the diamond-like carbon anode, and a cathode adjacent the charge carrier separation layer opposite the diamond-like carbon anode. Additionally, in another aspect the conductive diamond-like carbon material may have an sp | 01-22-2009 |
20090065052 | SOLAR CELL HAVING IMPROVED ELECTRON EMISSION USING AMORPHOUS DIAMOND MATERIALS - Solar cells and related methods using thin layers of amorphous diamond. A thin layer of amorphous diamond is in electrical communication with a conductor. The use of a thin layer of amorphous diamond helps to reduce back conversion of excited electrons to heat. Reduced back conversion in turn can provide an increase in the efficiency of solar cells using the presently disclosed techniques. | 03-12-2009 |
20090093195 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 04-09-2009 |
20090098814 | Polymeric Fiber CMP Pad and Associated Methods - Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is less than a stiffness of the polymeric fibers, and a working end of the plurality of polymeric fibers configured such that tips of the polymeric fibers are oriented to contact a work piece. | 04-16-2009 |
20090120009 | Polycrystalline Grits and Associated Methods - A method for forming polycrystalline grits can include forming an abrasive dough, including a plurality of abrasive particles, into a sheet. The sheet can be divided into a plurality of abrasive precursors. By placing the sheet on a stretchable surface, separations among the plurality of abrasive precursors can be revealed by stretching the stretchable surface. The stretchable surface can include a particulate separating agent, and additional particulate separating agent can be distributed in the separations. The abrasive precursors can be sintered to form polycrystalline grits. | 05-14-2009 |
20090123705 | CMP Pad Dressers - An abrasive tool includes an assembly of tool precursors. At least one of the tool precursors has a continuous polycrystalline diamond, polycrystalline cubic boron nitride, or ceramic material cutting element formed into a blade shape. The abrasive tool can additionally include a setting material, which is configured to attach the tool precursors and form a single mass. The selection, arrangement, and setting of the tool precursors can result in an abrasive tool having a predetermined cutting configuration. Methods for forming such an abrasive tool are also disclosed. | 05-14-2009 |
20090127231 | Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby - A method of forming one or more features on a working surface of a superhard carbonaceous material comprises: positioning an electrode plate adjacent the superhard carbonaceous material, the electrode plate having an electrode surface oriented toward the working surface of the superhard carbonaceous material, the electrode surface including at least one protrusion or indentation formed therein or thereon; moving the electrode plate and the working surface toward one another while removing material from the working surface via electro-discharge machining; and moving the electrode plate and the working surface laterally relative to one another while removing material from the working surface via electro-discharge machining. | 05-21-2009 |
20090127565 | P-n junctions on mosaic diamond substrates - The present invention provides methods of making and using semiconductive single crystal diamond bodies, including semiconductive diamond bodies made by such methods. In one aspect, a method of making a semiconductive single crystal diamond layer may include placing a plurality of diamond segments in close proximity under high pressure in association with a molten catalyst and a carbon source, where the diamond segments are arranged in a single crystal orientation. The plurality of diamond segments are then maintained under high pressure in the molten catalyst until the plurality of diamond segments have joined together with diamond to diamond bonds to form a substantially single crystal diamond body. Following creation of the single crystal diamond body, a homoepitaxial single crystal diamond layer may be deposited on the single crystal diamond body. A dopant may be introduced into the homoepitaxial single crystal diamond layer to form a semiconductive single crystal diamond layer. | 05-21-2009 |
20090137187 | Diagnostic Methods During CMP Pad Dressing and Associated Systems - A system for in-situ monitoring at least one aspect of a chemical mechanical planarization process can include a CMP pad, CMP pad dresser with at least a translucent portion, and an optical sensor. The optical sensor can be configured to optically engage the CMP pad through the translucent portion of the CMP pad dresser. Methods of monitoring chemical mechanical planarization processes can include using such CMP pad dresser to view a performance characteristic through the CMP pad dresser. | 05-28-2009 |
20090145045 | Methods for Orienting Superabrasive Particles on a Surface and Associated Tools - Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics. | 06-11-2009 |
20090186561 | CMP Pad Dresser with Oriented Particles and Associated Methods - CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. | 07-23-2009 |
20090189184 | Semiconductor-On-Diamond Devices and Associated Methods - Semiconductor-on-diamond (SOD) substrates and methods for making such substrates are provided. In one aspect, a method of making an SOD substrate may include depositing a base layer onto a lattice-orienting silicon (Si) substrate such that the base layer lattice is substantially oriented by the Si substrate, depositing a semiconductor layer onto the base layer such that the semiconductor layer lattice is substantially oriented with respect to the base layer lattice, and disposing a layer of diamond onto the semiconductor layer. The base layer may include numerous materials, including, without limitation, aluminum phosphide (Alp), boron arsenide (BAs), gallium nitride (GaN), indium nitride (InN), and combinations thereof. Additionally, the method may further include removing the lattice-orienting Si substrate and the base layer from the semiconductor layer. In one aspect, the Si substrate may be of a single crystal orientation. | 07-30-2009 |
20090215363 | CMP Pads and Method of Creating Voids In-Situ Therein - A method of creating pores in a CMP pad in-situ includes impregnating a first material with a second material to form a CMP pad. The second material can have a resistance to frictional erosion that is less than that of the first material. The CMP pad thus has two materials with differing frictional erosion resistances. The working surface of the CMP pad can be contacted to a wafer to be polished wherein the second material can be frictionally eroded during polishing. | 08-27-2009 |
20090257942 | DEVICE AND METHOD FOR GROWING DIAMOND IN A LIQUID PHASE - A method of growing a diamond mass in a liquid growth medium. The liquid growth medium can include a carbon source, a diamond growth catalyst such as a diamond catalyst metal-rare earth element alloy or nanocatalyst, and a dissociated hydrogen of a hydrogen source. The carbon source provides carbon atoms for growing diamond and can include a diamond seed material for diamond growth. The molten liquid phase provides a diamond growth catalyst which allows the carbon to form diamond at the temperature and low pressure conditions discussed. Furthermore, the dissociated hydrogen acts as a concentrator for assembling carbon atoms at a relatively high concentration which mimicks, in some respects, diamond growth under more conventional high pressure processes without the high pressure. | 10-15-2009 |
20090283089 | Brazed Diamond Tools and Methods for Making the Same - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 11-19-2009 |
20090286352 | Diamond Bodies Grown on SIC Substrates and Associated Methods - The present invention provides methods of forming high quality diamond bodies under high pressure, and the diamond bodies produced by such methods. In one aspect, a method is provided for growing a diamond body, including providing a non-particulate silicon carbide (SiC) mass having a pre-designed shape, placing the SiC mass under high pressure in association with a molten catalyst and a carbon source, and maintaining the SiC mass under high pressure to form a substantially monocrystalline diamond body. The diamond body may be formed across substantially all of the SiC mass having surface area exposed to the molten catalyst. As such, the diamond body may conform to the shape of the exposed surface area of the SiC mass. | 11-19-2009 |
20100006858 | Semiconductor-on-diamond devices and associated methods - Semiconductor devices and methods for making such devices are provided. One such method may include forming an epitaxial layer of single crystal SiC on a single crystal Si growth substrate, forming an epitaxial diamond layer on the layer of SiC, forming a Si layer on the diamond layer, bonding a SiO | 01-14-2010 |
20100024310 | Polycrystalline Aluminum-Containing Grits and Associated Methods - A method of forming a composite polycrystalline aluminum containing grit can include forming a dispersion of alumina and gelling the dispersion of alumina to form a gel. A nitride abrasive particle can be added to either the dispersion of alumina or the gel. After the nitride abrasive particle has been added, the gel can be processed to form a composite polycrystalline alumina nitride grit. | 02-04-2010 |
20100041315 | Self-Sharpening Grits and Associated Methods - Polycrystalline grits and methods of making grits which allow for self-sharpening are provided. In one aspect, for example, a method of sharpening a superabrasive cutting element during cutting can include abrading a self-sharpening superabrasive particle against a work piece to facilitate dulling of a cutting surface of the superabrasive particle, wherein the superabrasive particle includes a superabrasive material and a catalyst material, the catalyst material being located within inclusions in the superabrasive particle. The method can further include interacting the catalyst material and the superabrasive material to cause microfracturing of the superabrasive particle to expose a new cutting surface. | 02-18-2010 |
20100055464 | Graphene and Hexagonal Boron Nitride Planes and Associated Methods - Graphene layers, hexagonal boron nitride layers, as well as other materials made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphene layer is provided. Such a method may include mixing a carbon source with a horizontally oriented molten solvent, precipitating the carbon source from the molten solvent to form a graphite layer across the molten solvent, and separating the graphite layer into a plurality of graphene layers. | 03-04-2010 |
20100068122 | Gem Growth Cubic Press and Associated Methods - A multiple anvil press can be configured for gem-quality growth. The press can include a plurality of opposing anvils, where the anvils are configured for simultaneous movement within a tolerance of less than about 0.5 mm as measured at each anvil surface, and each anvil can be aligned to a common center of all the anvils where the alignment is tuned to a tolerance of less than about 0.1 mm during use. The press can also include a reaction volume formed by the enclosure of all anvils, where the reaction volume has a size configured to facilitate single crystal growth per cycle time. | 03-18-2010 |
20100102442 | Heat spreader having single layer of diamond particles and associated methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 04-29-2010 |
20100139174 | METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX - Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle. | 06-10-2010 |
20100147369 | SOLAR CELL HAVING NANODIAMOND QUANTUM WELLS - The present invention provides materials, devices, and methods for generation of electricity from solar power. In one aspect, the present invention includes a solar cell, including a first conductor, a doped silicon layer in electrical communication with the first conductor, a nanodiamond layer in contact with the doped silicon layer, a doped amorphous diamond layer in contact with the nanodiamond layer, and a second conductor in electrical communication with the doped amorphous diamond layer. | 06-17-2010 |
20100166635 | Interrupted Diamond Growth - A method for growing diamonds under high pressure high temperature (HPHT) is provided. In one aspect, such a method can include providing a growth precursor including a carbon source and a catalyst material, the growth precursor having a diamond precursor particle arranged at least partially therein, melting the diamond precursor particle, and growing a diamond particle by subjecting the melted diamond precursor particle and the growth precursor to temperature and pressure conditions sufficient for diamond growth. In some aspects, the resulting diamond particle can be utilized as a diamond precursor particle in a subsequent reaction to grow an even larger diamond particle. | 07-01-2010 |
20100173567 | Methods and Devices for Enhancing Chemical Mechanical Polishing Processes - The present invention discloses methods and systems for increasing polishing performance of a CMP process. In one aspect, for example, a method of increasing polishing performance of a CMP process includes vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occurs in a direction substantially parallel to a working surface of the CMP pad. In one specific aspect, vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. The vibrating can include vibrating the CMP pad, vibrating the wafer, or vibrating the CMP pad and the wafer. Such vibrations can allow the contact pressure at the contact interface to be decreased as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer. | 07-08-2010 |
20100178719 | Diamond LED Devices and Associated Methods - LED devices incorporating diamond materials and methods for making such devices are provided. One such method may include forming epitaxially a substantially single cyrstal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 07-15-2010 |
20100190423 | Thin Film Brazing of Superabrasive Tools - Methods for orienting superabrasive particles in a superabrasive tool are provided. In one aspect, for example, a method for orienting superabrasive particles in a tool is provided. Such a method can include providing a plurality of superabrasive particles having a preselected average size, preselecting a thickness for an amorphous braze layer to be applied to a substrate, wherein the thickness is based on the average size of the plurality of superabrasive particles, and applying an amorphous braze layer to the substrate at the preselected thickness. The method can further include dispersing the plurality of superabrasive particles onto the amorphous braze layer, and melting the amorphous braze layer to cause the plurality of superabrasive particles to rotate and sink into the amorphous braze layer, wherein the thickness of the amorphous braze layer is such that the rotation and sinking of the plurality of superabrasive particles is halted by the substrate in an attitude whereby substantially all working ends of the plurality of superabrasive particles are sharp portions. The amorphous braze layer can then be cooled to fix the plurality of superabrasive particles into the tool. | 07-29-2010 |
20100218801 | Graphene and Hexagonal Boron Nitride Planes and Associated Methods - Graphene layers made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphite film can include heating a solid substrate under vacuum to a solubilizing temperature that is less than a melting point of the solid substrate, solubilizing carbon atoms from a graphite source into the heated solid substrate, and cooling the heated solid substrate at a rate sufficient to form a graphite film from the solubilized carbon atoms on at least one surface of the solid substrate. The graphite film is formed to be substantially free of lattice defects. | 09-02-2010 |
20100219418 | DIAMOND LED DEVICES AND ASSOCIATED METHODS - LED devices incorporating diamond materials and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 09-02-2010 |
20100221988 | Superhard Cutters and Associated Methods - A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration. | 09-02-2010 |
20100221990 | Methods of Bonding Superabrasive Particles in an Organic Matrix - Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle. | 09-02-2010 |
20100248596 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements. | 09-30-2010 |
20100261419 | Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods - Superabrasive tools and associated methods of making and using are provided. In one aspect, for example, a superabrasive tool having improved superabrasive particle retention is provided. Such a tool can include a matrix layer and a plurality of superabrasive particles held in and protruding from the matrix layer, whereby surfaces of the plurality of superabrasive particles contacting the matrix layer have been roughened to have an RA of greater than about 1 micron, and wherein the roughened surfaces improve the retention of the plurality of superabrasive particles in the matrix layer. | 10-14-2010 |
20100272627 | Multi-Faceted Diamond and Associated Methods - A method of making a multi-faceted diamond is provided. Such a method can include obtaining a diamond having a substantially euhedral morphology and a plurality of primary crystallographic faces and polishing a plurality of primary apexes defined by the primary crystallographic faces to form a plurality of secondary faces and secondary apexes. | 10-28-2010 |
20100276702 | Doped Diamond LED Devices and Associated Methods - LED devices and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 11-04-2010 |
20100291841 | Methods and Systems for Water Jet Assisted CMP Processing - Methods and systems for removing dirt and/or debris from a CMP pad surface during CMP pad processing are provided. In one aspect, a method for removing debris from a CMP pad surface during CMP processing can include rotating a CMP pad having a polishing surface, and pressing a CMP pad dresser into the polishing surface of the CMP pad, the CMP pad dresser having a plurality of superabrasive particles coupled thereto and oriented toward the CMP pad. The method can further include spraying a jet of liquid onto the polishing surface of the CMP pad with sufficient force to dislodge debris from the polishing surface of the CMP pad. | 11-18-2010 |
20100314627 | DIAMOND GaN DEVICES AND ASSOCIATED METHODS - Semiconductor devices and methods of making thereof are provided. In one aspect, for example, a method for making a semiconductor device can include polishing a working surface of a diamond layer to a substantially flat surface, depositing a buffer layer on the working surface of the diamond layer, and depositing a semiconductor layer on the buffer layer. In one specific aspect, the c-axis of the buffer layer is oriented perpendicular to the working surface of the diamond layer. | 12-16-2010 |
20100330739 | Diamond-Like Carbon Electronic Devices and Methods of Manufacture - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, fuels cells, LEDs, thermoelectric conversion devices, and other electronic devices are disclosed and described. A diamond-like carbon electronic device can include a conductive diamond-like carbon cathode having specified carbon, hydrogen and sp | 12-30-2010 |
20110003538 | Pad Conditioner Dresser - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof; and varying the pressure and RPM between the pad and the dresser, including gradually increasing the pressure and/or the RPM between the pad and the dresser in a non-linear manner over time as the dresser is used, such that the dresser life is extended, wherein the pressure and the RPM is increased when the chemical mechanical polishing pad surface exhibits wear. | 01-06-2011 |
20110024767 | Semiconductor Substrates, Devices and Associated Methods - Semiconductor substrates and devices having improved performance and cooling, as well as associated methods, are provided. In one aspect, for example, a semiconductor device can include a matrix layer and a plurality of single crystal semiconductor tiles disposed in the matrix layer. The plurality of semiconductor tiles are positioned such that an exposed surface of each of substantially all of the plurality of diamond tiles aligns along a common plane to form a substrate surface. In one aspect, a semiconductor layer is disposed on the substrate surface. In another aspect, the semiconductor layer is a doped diamond layer. In yet another aspect, the semiconductor tiles are doped. In a further aspect, the exposed surface of each of the plurality of semiconductor tiles has a common crystallographic orientation. | 02-03-2011 |
20110056672 | Heat Spreader Having Single Layer of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 03-10-2011 |
20110068350 | Diamond semiconductor devices and associated methods - Semiconductor devices and methods for making such devices are provided. One such method may include forming a transparent diamond layer having a SiC layer coupled thereto, where the SiC layer has a crystal structure that is substantially epitaxially matched to the transparent diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer, and coupling a diamond substrate to at least one of the plurality of semiconductor layers such that the diamond support is oriented parallel to the transparent diamond layer. In one aspect such a method may further include electrically coupling at least one of a p-type electrode or an n-type electrode to at least one of the plurality of semiconductor layers. | 03-24-2011 |
20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser - Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. | 03-31-2011 |
20110108854 | SUBSTANTIALLY LATTICE MATCHED SEMICONDUCTOR MATERIALS AND ASSOCIATED METHODS - Semiconductor devices having atomic lattice matching template interlayers are provided. In one aspect, a semiconductor device can include a first semiconductor material, a second semiconductor material disposed on the first semiconductor material, and an atomic template interlayer disposed between the first semiconductor material and the second semiconductor material, the atomic template interlayer bonding together and facilitating a substantial lattice matching between the first semiconductor material and the second semiconductor material. | 05-12-2011 |
20110163298 | Graphene and Hexagonal Boron Nitride Devices - Graphene layers, hexagonal boron nitride (hBN) layers, as well as other materials made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, the present invention provides graphene and hBN devices. In one aspect, for example, an electronic device is provided including a graphene layer and a planar hBN layer operably associated with the graphene layer and forming a functional interface therebetween. Numerous functional interfaces are contemplated, depending on the desired functionality of the device. | 07-07-2011 |
20110163312 | SEMICONDUCTOR-ON-DIAMOND DEVICES AND METHODS OF FORMING - The present invention provides semiconductor-on-diamond devices, and methods for the formation thereof. In one aspect, a mold is provided which has an interface surface configured to inversely match a configuration intended for the device surface of a diamond layer. An adynamic diamond layer is then deposited upon the diamond interface surface of the mold, and a substrate is joined to the growth surface of the adynamic diamond layer. At least a portion of the mold can then be removed to expose the device surface of the diamond which has received a shape which inversely corresponds to the configuration of the mold's diamond interface surface. The mold can be formed of a suitable semiconductor material which is thinned to produce a final device. Optionally, a semiconductor material can be coupled to the diamond layer subsequent to removal of the mold. | 07-07-2011 |
20110204409 | hBN INSULATOR LAYERS AND ASSOCIATED METHODS - Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material. | 08-25-2011 |
20110212670 | METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX - Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle. | 09-01-2011 |
20110282421 | DIAMOND NEURAL DEVICES AND ASSOCIATED METHODS - The present disclosure provides devices for neuronal growth and associate methods. In one aspect, for example, a neuronal growth device is provided including a layer of nanodiamond particles having an exposed neuronal growth surface, a doped diamond layer contacting the layer of nanodiamond particles opposite the neuronal growth surface, and a semiconductor layer coupled to the doped diamond layer opposite the layer of nanodiamond particles. In one aspect, the nanodiamond particles are substantially immobilized by the doped diamond layer. | 11-17-2011 |
20110286943 | COMPOSITIONS AND METHODS FOR PROVIDING ULTRAVIOLET RADIATION PROTECTION - The present invention provides sunscreen compositions and associated methods. In one aspect, for example, a sunscreen composition can include a cosmetically acceptable carrier and a plurality of nanoparticles dispersed in the carrier with a dispersant. The nanoparticles include at least one sun-block functional group operable to provide UV radiation protection. In one aspect the nanoparticles can be nanodiamond particles. | 11-24-2011 |
20110296766 | BRAZED DIAMOND TOOLS AND METHODS FOR MAKING THE SAME - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 12-08-2011 |
20110307036 | COMPOSITIONS AND METHODS FOR ENHANCING COLLAGEN GROWTH - The present invention provides methods for enhancing collagen growth in a subject's skin. In one aspect, for example, such method can include disposing a composition including a plurality of nanodiamond particles dispersed in a cosmetically acceptable carrier onto a subject's skin, applying energy to the plurality of nanodiamond particles such that at least a portion of the energy is absorbed by the nanodiamond particles, and emitting the energy from the nanodiamond particles as IR radiation, and delivering the IR radiation to the skin in order to heat the skin and enhance collagen growth. | 12-15-2011 |
20120012169 | Diamond-Like Carbon Electronic Devices and Methods of Manufacture - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, fuels cells, LEDs, thermoelectric conversion devices, and other electronic devices are disclosed and described. A diamond-like carbon electronic device can include a conductive diamond-like carbon cathode having specified carbon, hydrogen and sp | 01-19-2012 |
20120164454 | Diamond Protected Devices and Associated Methods - Diamond-like carbon (DLC) coated devices and associated methods are provided. In one aspect, for example, a DLC-coated substrate can include a substrate, and a H-doped DLC layer disposed on the substrate, where the DLC layer is doped with a Si material at least along an interface between the substrate and the DLC layer. Additionally, the substrate can include a surface doped layer on the DLC layer opposite the substrate. | 06-28-2012 |
20120168773 | SEMICONDUCTOR-ON-DIAMOND DEVICES AND ASSOCIATED METHODS - Semiconductor-on-diamond (SOD) substrates and methods for making such substrates are provided. In one aspect, a method of making an SOD substrate may include depositing a base layer onto a lattice-orienting silicon (Si) substrate such that the base layer lattice is substantially oriented by the Si substrate, depositing a semiconductor layer onto the base layer such that the semiconductor layer lattice is substantially oriented with respect to the base layer lattice, and disposing a layer of diamond onto the semiconductor layer. The base layer may include numerous materials, including, without limitation, aluminum phosphide (AlP), boron arsenide (BAs), gallium nitride (GaN), indium nitride (InN), and combinations thereof. Additionally, the method may further include removing the lattice-orienting Si substrate and the base layer from the semiconductor layer. In one aspect, the Si substrate may be of a single crystal orientation. | 07-05-2012 |
20120181501 | Graphene on Diamond Devices and Associated Methods - Graphene layers and associated methods are disclosed. In one aspect, for example, a method of making graphene on a diamond substrate is provided. Such a method can include applying a layer of a metal to a crystallographic face of the diamond substrate, and heating the diamond substrate under vacuum to convert a portion of the diamond substrate at the crystallographic face into graphene. In another aspect, the layer of metal is applied only on diamond substrate faces having a same crystallographic orientation. In yet another aspect, the layer of metal is applied to only a single crystallographic face of the diamond substrate. Additionally, in one aspect, converting the portion of the diamond substrate at the crystallographic face into graphene includes converting the portion of the diamond substrate by a martensitic transformation. | 07-19-2012 |
20120192499 | Brazed Diamond Tools and Methods for Making the Same - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 08-02-2012 |
20120193642 | DIAMOND SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS - Semiconductor devices and methods for making such devices are provided. One such method may include forming a transparent diamond layer having a SiC layer coupled thereto, where the SiC layer has a crystal structure that is substantially epitaxially matched to the transparent diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer, and coupling a diamond substrate to at least one of the plurality of semiconductor layers such that the diamond support is oriented parallel to the transparent diamond layer. In one aspect such a method may further include electrically coupling at least one of a p-type electrode or an n-type electrode to at least one of the plurality of semiconductor layers. | 08-02-2012 |
20120196514 | METHODS AND DEVICES FOR ENHANCING CHEMICAL MECHANICAL POLISHING PAD PROCESSES - The present invention discloses a CMP device and methods that are capable of improving CMP processing through incorporation of vibration sources which produce vibrations in a direction substantially parallel to the working surface of the CMP pad. The CMP device includes a CMP pad dresser. Such a method can include steps of vibrating a CMP pad, CMP pad dresser, or wafer in a direction substantially parallel to a working surface of the CMP pad and engaging the CMP pad dresser with a working surface of a CMP pad The results of vibrating the superabrasive particles can provide benefits to both the CMP pad and dresser, according to several aspects disclosed herein. | 08-02-2012 |
20120220208 | Brazed Diamond Tools and Methods for Making the Same - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 08-30-2012 |
20120223334 | DOPED DIAMOND LED DEVICES AND ASSOCIATED METHODS - LED devices and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 09-06-2012 |
20120241943 | Diamond Particle Mololayer Heat Spreaders and Associated Methods - Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of diamond particles within a thin metal matrix and a semiconductor material thermally coupled to the heat spreader. In one aspect, the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%. | 09-27-2012 |
20120244790 | Superabrasive Tools Having Substantially Leveled Particle Tips and Associated Methods - Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer. | 09-27-2012 |
20120260582 | Brazed Diamond Tools and Methods for Making the Same - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 10-18-2012 |
20120280253 | Stress Regulated Semiconductor Devices and Associated Methods - Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/° C. | 11-08-2012 |
20120302146 | CMP PAD DRESSER HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less. | 11-29-2012 |
20130062627 | STRESS REGULATED SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS - Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/° C. | 03-14-2013 |
20130122784 | PAD CONDITIONER DRESSER - Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle wear by measuring a mechanical property of the pad, dresser, or combination thereof; and responding to the mechanical property measurement by varying pressure and RPM between the pad and the dresser in relation to the superabrasive particle wear in order to extend dresser life. Additionally, a method may include dressing the chemical mechanical polishing pad with the dresser; vibrating, in a direction substantially parallel to a working surface of the pad, a member selected from the pad, the dresser, a wafer being polished by the pad, or any combination thereof, to minimize a mechanical stress on the pad, dresser, wafer, or combination thereof. | 05-16-2013 |
20130126903 | DIAMOND GaN DEVICES AND ASSOCIATED METHODS - Semiconductor devices and methods of making thereof are provided. In one aspect, for example, a method for making a semiconductor device can include polishing a working surface of a diamond layer to a substantially flat surface, depositing a buffer layer on the working surface of the diamond layer, and depositing a semiconductor layer on the buffer layer. In one specific aspect, the c-axis of the buffer layer is oriented perpendicular to the working surface of the diamond layer. | 05-23-2013 |
20130165023 | DUAL DRESSING SYSTEM FOR CMP PADS AND ASSOCIATED METHODS - Dual dressing systems for conditioning CMP pads, including associated methods, are provided. In one aspect, for example, a method of dressing a CMP pad can include applying a deglazing dresser to a working surface of a CMP pad, deglazing the working surface of the CMP pad with the deglazing dresser, applying an asperity-forming dresser to the working surface of the CMP pad, and forming asperities in the working surface of the CMP pad with the asperity-forming dresser. | 06-27-2013 |
20130175020 | Heat Spreader Having Single Layer Of Diamond Particles and Associated Methods - A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders. | 07-11-2013 |
20130175540 | DOPED DIAMOND LED DEVICES AND ASSOCIATED METHODS - LED devices and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 07-11-2013 |
20130178007 | DIAMOND LED DEVICES AND ASSOCIATED METHODS - LED devices incorporating diamond materials and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode. | 07-11-2013 |
20130180576 | Diamond-Like Carbon Electronic Devices and Methods of Manufacture - Materials, devices, and methods for enhancing performance of electronic devices such as solar cells, fuels cells, LEDs, thermoelectric conversion devices, and other electronic devices are disclosed and described. A diamond-like carbon electronic device can include a conductive diamond-like carbon cathode having specified carbon, hydrogen and sp | 07-18-2013 |
20130200394 | SEMICONDUCTOR-ON-DIAMOND DEVICES AND ASSOCIATED METHODS - Semiconductor-on-diamond devices and methods for making such devices are provided. One such method may include depositing a semiconductor layer on a semiconductor substrate, depositing an adynamic diamond layer on the semiconductor layer opposite the semiconductor substrate, and coupling a support substrate to the adynamic diamond layer opposite the semiconductor layer to support the adynamic layer. | 08-08-2013 |
20130217308 | SELF-SHARPENING GRITS AND ASSOCIATED METHODS - Polycrystalline grits and methods of making grits which allow for self-sharpening are provided. In one aspect, for example, a method of sharpening a superabrasive cutting element during cutting can include abrading a self-sharpening superabrasive particle against a work piece to facilitate dulling of a cutting surface of the superabrasive particle, wherein the superabrasive particle includes a superabrasive material and a catalyst material, the catalyst material being located within inclusions in the superabrasive particle. The method can further include interacting the catalyst material and the superabrasive material to cause microfracturing of the superabrasive particle to expose a new cutting surface. | 08-22-2013 |
20130228120 | DEVICE AND METHOD FOR GROWING DIAMOND IN A LIQUID PHASE - A method of growing a diamond mass in a liquid growth medium. The liquid growth medium can include a carbon source, a diamond growth catalyst such as a diamond catalyst metal-rare earth element alloy or nanocatalyst, and a dissociated hydrogen of a hydrogen source. The carbon source provides carbon atoms for growing diamond and can include a diamond seed material for diamond growth. The molten liquid phase provides a diamond growth catalyst which allows the carbon to form diamond at the temperature and low pressure conditions discussed. Furthermore, the dissociated hydrogen acts as a concentrator for assembling carbon atoms at a relatively high concentration which mimicks, in some respects, diamond growth under more conventional high pressure processes without the high pressure. | 09-05-2013 |
20130267154 | DIAMOND TOOLS AND METHODS FOR MAKING THE SAME - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 10-10-2013 |
20130273820 | BRAZED DIAMOND TOOLS AND METHODS FOR MAKING THE SAME - Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material. | 10-17-2013 |
20130303056 | CMP PAD DRESSERS WITH HYBRIDIZED ABRASIVE SURFACE AND RELATED METHODS - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 11-14-2013 |
20130316629 | CMP PAD DRESSER WITH ORIENTED PARTICLES AND ASSOCIATED METHODS - CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. | 11-28-2013 |
20130341204 | Carbon Electrode Devices for Use with Liquids and Associated Methods - Electrode devices and systems for use in liquid environments, including associated methods are provided. In one aspect, for example, an electrode device for use in a liquid environment can include a proton exchange membrane having a first side and a second side, a first electrode including a carbon material, where the first electrode is positioned at the first side of the proton exchange membrane, and a second electrode including a carbon material, where the second electrode positioned at the second side of the proton exchange membrane opposite the first electrode. The proton exchange membrane spaces the first electrode and the second electrode at a distance of less than or equal to about 100 microns apart. | 12-26-2013 |
20140042473 | VERTICAL LIGHT EMITTING DIODE AND MANUFACTURING METHOD AND APPLICATION THEREOF - A vertical light emitting diode (LED) is disclosed, which includes a conductive substrate; a conductive diamond-like carbon (DLC) layer located on the conductive substrate; a first passivation layer disposed on the conductive DLC layer and formed with a first opening; a first electrode located on the conductive DLC layer and in the first opening of the first passivation layer; a semiconductor epitaxial multilayer structure disposed on the first electrode; a second passivation layer disposed on the first passivation layer and covering the lateral surface of the semiconductor epitaxial multilayer structure, wherein a second opening is formed in the second passivation layer to expose the surface of the semiconductor epitaxial multilayer structure; and a second electrode located on the semiconductor epitaxial multilayer structure and in the second opening of the second passivation layer. A method for manufacturing the vertical LED mentioned above is also disclosed. | 02-13-2014 |
20140099868 | CMP PAD DRESSER HAVING LEVELED TIPS AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a method can include pressing a CMP pad dresser against a CMP pad, where the dresser includes a monolayer of a plurality of superabrasive particles protruding from a matrix layer. The difference in protrusion distance between the highest protruding tip and the second highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 10 microns and the difference in protrusion distance between the highest 10 protruding tips of the monolayer of superabrasive particles are within about 20 microns or less. The method can further include rotating the dresser against the CMP pad such that asperities are cut into the CMP pad having a maximum cutting depth of about 60 microns. | 04-10-2014 |
20140120724 | COMPOSITE CONDITIONER AND ASSOCIATED METHODS - CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a composite conditioner can include a base plate and a plurality of polishing units secured to a surface of the base plate by an adhesive layer, where each polishing unit includes a plurality of polishing tips secured in a binding layer. Additionally, a height difference between a first highest polishing tip and a second highest polishing tip is less than or equal to about 10 μm, a height difference between the first highest polishing tip and a tenth highest polishing tip is less than or equal to about 20 μm, and a height difference between the first highest polishing tip and a 100th highest polishing tip is less than or equal to about 40 μm. Furthermore, the first highest polishing tip protrudes from the binding layer to a height of greater than or equal to about 50 μm. | 05-01-2014 |
20140120807 | CMP PAD CONDITIONERS WITH MOSAIC ABRASIVE SEGMENTS AND ASSOCIATED METHODS - A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another. | 05-01-2014 |
20140134411 | LIGHT TRANSMITTIVE AlN PROTECTIVE LAYERS AND ASSOCIATED DEVICES AND METHODS - Devices having light transmittant protective layers and methods associated with such layers are provided. In one aspect, for example, a device having a light transmittant protective layer can include a substrate having a transmittance of greater than or equal to about 85 for light having at least one wavelength from about 250 nm to about 800 nm, and a light transmittant protective layer coated on the substrate. The protective layer includes at least 50 wt % AlN and having a transmittance of greater than or equal to 80% for light having at least one wavelength from about 250 nm to about 800 nm. | 05-15-2014 |
20140158409 | hBN INSULATOR LAYERS AND ASSOCIATED METHODS - Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material. | 06-12-2014 |
20140231825 | DIAMOND GaN DEVICES AND ASSOCIATED METHODS - Semiconductor devices and methods of making thereof are provided. In one aspect, for example, a method for making a semiconductor device can include polishing a working surface of a diamond layer to a substantially flat surface, depositing a buffer layer on the working surface of the diamond layer, and depositing a semiconductor layer on the buffer layer. In one specific aspect, the c-axis of the buffer layer is oriented perpendicular to the working surface of the diamond layer. | 08-21-2014 |
20140235018 | DIAMOND PARTICLE MOLOLAYER HEAT SPREADERS AND ASSOCIATED METHODS - Thermally regulated semiconductor devices having reduced thermally induced defects are provided, including associated methods. Such a device can include a heat spreader having a monolayer of diamond particles within a thin metal matrix and a semiconductor material thermally coupled to the heat spreader. In one aspect, the coefficient of thermal expansion difference between the heat spreader and the semiconductor material is less than or equal to about 50%. | 08-21-2014 |
20140302756 | CHEMICAL MECHANICAL POLISHING CONDITIONER - The present invention (utility model application in Taiwan) relates to a chemical mechanical polishing pad dresser, comprising: a substrate; a bonding layer disposed on the substrate; an electroplating layer disposed on the bonding layer; a fixed template disposed on the electroplating layer having a plurality of apertures; and a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particle fixed in the bonding layer and the substrate by means of the electroplating layer. Therefore, the present invention is not only to avoid damaging the abrasive particles due to the high temperature heating in the production process, but also to solve the corrosion problem of the surface of the chemical mechanical polishing pad dresser by the fixed template and the electroplating layer and to solve simultaneously the pollution problem generating on the polished workpieces by using conventional brazing bonding layer; and, the present invention can also provide to adjust the abrasive particles arrangement and protrude rate through the fixed template, so as to enhance the grinding performance and quality of the chemical mechanical polishing pad dresser. | 10-09-2014 |
20140308883 | CHEMICAL MECHANICAL POLISHING CONDITIONER - The present invention relates to a chemical mechanical polishing conditioner which comprises: a substrate; a bonding layer, disposed on the substrate; and an abrasive layer, having a thin metal sheet and a first layer of abrasive particles, wherein the first layer of abrasive particles is disposed on the thin metal sheet, and the abrasive layer is coupled to the substrate with the bonding layer; wherein the first layer of abrasive particles comprises a plurality of abrasive particles, of which protruding tips has a planar leveling surface, so that the plurality of abrasive particles do not have one or more protruding tips of the plurality of abrasive particles having particular significant difference in protrusion distance, and the plurality of abrasive particles have a patterning arrangement. Therefore, the present invention can reduce damage ratio of polished workpieces by a planar leveling surface of the chemical mechanical polishing conditioner, so that the chemical mechanical polishing conditioner has more excellent polishing efficiency and working life. | 10-16-2014 |
20140314656 | GRAPHENE PRODUCTION METHODS AND RESULTANT PRODUCTS - The present invention relates to a method of mass production of graphene. In one embodiment, such a method may include providing a high temperature furnace for storing a molten solvent, wherein the high temperature furnace comprises an outlet disposed on the top of the high temperature furnace, and an inlet, providing a carbon source to mix with the molten solvent, precipitating the carbon to form a graphene layer on the surface of the molten solvent under a supersaturated state, and collecting the graphene layer from the outlet. | 10-23-2014 |
20140338962 | GRAPHENE AND HEXAGONAL BORON NITRIDE PLANES AND ASSOCIATED METHODS - Graphene layers, hexagonal boron nitride layers, as well as other materials made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphene layer is provided. Such a method may include mixing a carbon source with a horizontally oriented molten solvent, precipitating the carbon source from the molten solvent to form a graphite layer across the molten solvent, and separating the graphite layer into a plurality of graphene layers. | 11-20-2014 |
20150017884 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods - The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements. | 01-15-2015 |
20150072595 | SYSTEM FOR EVALUATING AND/OR IMPROVING PERFORMANCE OF A CMP PAD DRESSER - Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles. | 03-12-2015 |
20150072601 | Superabrasive tools having substantially leveled particle tips and associated methods - Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer. | 03-12-2015 |
20150079352 | GRAPHENE AND HEXAGONAL BORON NITRIDE PLANES AND ASSOCIATED METHODS - Graphene layers made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphite film can include heating a solid substrate under vacuum to a solubilizing temperature that is less than a melting point of the solid substrate, solubilizing carbon atoms from a graphite source into the heated solid substrate, and cooling the heated solid substrate at a rate sufficient to form a graphite film from the solubilized carbon atoms on at least one surface of the solid substrate. The graphite film is formed to be substantially free of lattice defects. | 03-19-2015 |
20150084078 | Light-Emitting Diode Having Diamond-Like Carbon Layer and Manufacturing Method and Application Thereof - A light emitting diode having a diamond-like carbon layer is disclosed, which includes: a substrate; a semiconductor epitaxial multilayer structure deposited over the substrate and including a first semiconductor epitaxial layer and a second semiconductor epitaxial layer, wherein the first and second semiconductor epitaxial layers are stacked with each other; an insulating diamond-like carbon covering partial surface of the semiconductor epitaxial multilayer structure; a first electrode provided with an electrical connection to the first semiconductor epitaxial layer; and a second electrode provided with an electrical connection to the second semiconductor epitaxial layer. A manufacturing method and application of the light-emitting diode are also disclosed. | 03-26-2015 |