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Chien-Min

Chien-Min Chang, New Taipei City TW

Patent application numberDescriptionPublished
20150020959MULTI-LAYER 3D PATTERN MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF - A multi-layer 3D pattern manufacturing method includes the steps of forming a color film on a surface of a substrate or a third pattern structure by providing a chromogenic material by lithography, gravure, flexographic printing, screen printing and physical vapor deposition in a transcribed printing process. Using the color film to match with different 3D pattern structures to form a multilayer 3D pattern which can be applied to the housing of various different electronic products not only can improve the aesthetic appearance, it can also enclose the color film within the 3D pattern to prevent the 3D pattern from falling off or fading; thus, the lifetime of the pattern can be improved.01-22-2015

Chien-Min Chang, Taipei City TW

Patent application numberDescriptionPublished
20090110947APPARATUS AND METHOD OF DECORATING A SURFACE OF A WORKPIECE AND DECORATED PART - A method of decorating a surface of a workpiece includes the step of positioning a decorating film over the surface, wherein the decorating film has a first side and an opposite second side with a decorating pattern facing the surface. The decorating film is then fitted tightly on the surface by applying negative pressure therebetween. Next, the decorating pattern is transferred onto the surface by providing a heated gas current to heat the decorating film.04-30-2009
20090236772PATTERN TRANSFER MOLD AND PATTERN TRANSFER METHOD - A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.09-24-2009
20110061798PRODUCTION METHOD OF THREE-DIMENSIONAL PATTERN - A production method of a three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured.03-17-2011
20110064915METAL WORKPIECE WITH THREE-DIMENSIONAL PATTERN AND PRODUCTION METHOD THEREOF - A production method of metal workpiece is provided. First, an adhesive layer is applied on a metal workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. The adhesive layer is then cured by implementing a plurality of heat treatments thereon. A metal workpiece with three-dimensional pattern is also provided.03-17-2011
20110064924PRODUCTION METHOD, WORKPIECE AND PRODUCTION DEVICE OF THREE-DIMENSIONAL PATTERN - A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.03-17-2011
20110183270METHOD FOR FORMING THREE-DIMENSIONAL PATTERN - A method for forming a three-dimensional pattern includes following steps. A shaped workpiece having an inner surface and an outer surface is provided, and a first photoresist layer and a second photoresist layer are respectively formed on the outer surface and the inner surface. The shaped workpiece is placed on a transparent fixture. The first photoresist layer and the second photoresist layer are exposed and developed, such that the first photoresist layer forms a patterned photoresist layer, and the second photoresist layer forms an etching protection layer. The shaped workpiece is etched to form the three-dimensional pattern on the outer surface of the shaped workpiece. The patterned photoresist layer and the etching protection layer are removed.07-28-2011
20120070631PRODUCTION METHOD OF WORKPIECE AND WORKPIECE WITH THREE-DIMENSIONAL PATTERN - A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.03-22-2012
20120070639PRODUCTION METHOD OF WORKPIECE AND WORKPIECE WITH THREE-DIMENSIONAL PATTERN - A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.03-22-2012
20120088074WORKPIECE WITH THREE-DIMENSIONAL PATTERN - A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam. The images with visual effect includes at least the first reflecting light beam, the second reflecting light beam, and the multiple three-dimensional micro patterns.04-12-2012
20120164360SHELL STRUCTURE AND MANUFACTURING METHOD FOR SHELL STRUCTURE OF ELECTRONIC DEVICE - A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.06-28-2012
20130265799ELECTRONIC DEVICE - An electronic device includes a display module, a base and a keyboard module. The display module is pivoted on the base. The keyboard module is disposed on the base. The keyboard module has a plurality of keys. Each of the keys includes a main body and an imprinted structure. The main body has a top surface. The imprinted structure is disposed on the top surface of the main body and includes a light guiding portion and a light scattering portion. A light emitted by the display module illuminates the keyboard module. The light is guided towards a specific direction when the light passes through the light guiding portion, and the light is scattered in other directions when the light passes through the light scattering portion.10-10-2013
20140116607COMPOSITE LIGHT GUIDE PLATE MANUFACTURING METHOD - A composite light guide plate manufacturing method includes the steps of providing a light guide substrate; providing a transfer membrane, which sequentially includes a substrate, a reflective layer and a diffusion microstructure; attaching the transfer membrane to the light guide substrate with a side of the transfer membrane, which has the diffusion microstructure thereon; and removing the substrate to expose the reflective layer.05-01-2014
20140205699PRODUCTION METHOD, WORKPIECE AND PRODUCTION DEVICE OF THREE-DIMENSIONAL PATTERN - A production method of three-dimensional pattern is disclosed. First, an adhesive layer is applied on a three-dimensional workpiece. Next, a film is vacuum adsorbed on the adhesive layer so that the film is impressed onto the adhesive layer to form the three-dimensional pattern on the adhesive layer. Finally, the adhesive layer is cured by implementing a plurality of heat treatments thereon. A workpiece of three-dimensional pattern and a production device of three-dimensional pattern are also disclosed.07-24-2014

Patent applications by Chien-Min Chang, Taipei City TW

Chien-Min Chen, Hukou TW

Patent application numberDescriptionPublished
20110095316LED PACKAGE STRUCTURE - An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.04-28-2011
20110156085SEMICONDUCTOR PACKAGE - A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.06-30-2011

Chien-Min Chen, Tu-Cheng TW

Patent application numberDescriptionPublished
20090236405METHOD FOR MAKING BACKLIGHT MODULE FRAME - An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.09-24-2009
20090239438METHOD FOR MAKING BACKLIGHT MODULE FRAME - An exemplary method for making backlight module frames includes: method includes: providing a first metallic sheet and a second metallic sheet, each of the first and second metallic sheets having at least two L-shaped portions connected side by side and oriented in the same direction; welding the two metallic sheets to form a plurality of connected semi-manufactured frames corresponding to s subsequent backlight module frame; and pressing the connected semi-manufactured frames to form a plurality of backlight module frames. The method costs less welding time and it is convenient for the backlight module frames to be mass-produced.09-24-2009

Patent applications by Chien-Min Chen, Tu-Cheng TW

Chien-Min Chen, Taipei TW

Patent application numberDescriptionPublished
20090116342Movable clock - A movable clock includes a control system (05-07-2009

Chien-Min Chen, Hsinchu TW

Patent application numberDescriptionPublished
20120025215SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE - A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.02-02-2012

Chien-Min Chen, Taipei County TW

Patent application numberDescriptionPublished
20150289055MOBILE DEVICE AND CORRESPONDING NOISE-CANCELING EARPHONE - A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.10-08-2015

Chien-Min Fang, Tu-Cheng TW

Patent application numberDescriptionPublished
20090049337SYSTEM AND METHOD FOR TESTING REDUNDANCY AND HOT-SWAPPING CAPABILITY OF A REDUNDANT POWER SUPPLY - A system for testing redundancy and hot-swapping capability of a redundant power supply includes a power switch fixture, a system under test (SUT), and a computing device. The power switch fixture includes a processor, an alternating current (AC) source, a first relay, a second, and two AC outputs. The processor is configured for controlling the AC source to output voltage to the two AC outputs by switching one of the first and the second relay on and the first and the second relay off, so as to ensure that one of the first power supply and the second power supply is operable to provide power to the SUT. The SUT includes a redundant power supply that includes a first power supply and a second power supply. The computing device includes a test control unit for testing redundancy and hot-swapping capability of the redundant power supply.02-19-2009

Chien-Min Hsieh, Kaohsiung City TW

Patent application numberDescriptionPublished
20150377464LIGHTING DEVICE AND OPERATING METHOD THEREOF - A lighting device includes a rotating unit, a clutching unit releasably engaging the rotating unit, and a lighting unit connected to the rotating unit. The clutching unit is operable to move between a first position, where the clutching unit engages the rotating unit to limit rotation thereof, and a second position, where the clutching unit disengages the rotating unit to permit free rotation thereof. The lighting unit is adjustable to a desired illumination angle when the clutching unit is in the second position. The clutching unit is moved from the second position to the first position to position the lighting unit at the desired illumination angle.12-31-2015

Chien-Min Hsu, Hsinchu TW

Patent application numberDescriptionPublished
20090219668CAPACITOR DEVICES HAVING MULTI-SECTIONAL CONDUCTORS - A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.09-03-2009
20100321858MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME - A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.12-23-2010

Chien-Min Hsu, Wugu Shiang TW

Patent application numberDescriptionPublished
20080239622WIRING STRUCTURE OF LAMINATED CAPACITORS - The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.10-02-2008

Chien-Min Huang, Taipei City TW

Patent application numberDescriptionPublished
20130286625PORTABLE APPARATUS - A portable apparatus includes a casing, a plastic holder and a touch pad. The casing has a fixing area, and a plurality of first through holes and at least a second through hole are formed around the fixing area. The plastic holder is disposed at the fixing area and has a plurality of first pillars and at least a second pillar. The first pillars are correspondingly disposed through the first through holes, respectively, and the second pillar is correspondingly disposed through the second through hole. The touch pad is connected with the plastic holder.10-31-2013

Chien-Min Huang, Clovis, CA US

Patent application numberDescriptionPublished
20100214425METHOD OF IMPROVING THE VIDEO IMAGES FROM A VIDEO CAMERA - A method of improving a video image by removing the effects of camera vibration comprising the steps of, obtaining a reference frame, receiving an incoming frame, determining the frame translation vector for the incoming frame, translating the incoming frame to generate a realigned frame, performing low pass filtering in the spatial domain on pixels in the realigned frame, performing low pass filtering in the spatial domain on pixels in the reference frame, determining the absolute difference between the filtered pixels in the reference frame and the filtered pixels in the realigned frame, performing low pass filtering in the temporal domain on the pixels in the realigned frame to generate the output frame if the absolute difference is less than a predetermined threshold, and providing the realigned frame as the output frame if the absolute difference is greater than the predetermined threshold.08-26-2010
20120154599ZOOMING FACTOR COMPUTATION - Systems, methods, and devices are disclosed for determining a zooming factor for a camera in a pan, tilt, and zoom (PTZ) camera tracking system to enable a camera to keep an object at a constant size within the camera's viewing area, despite changes in the object's distance from the camera. This provides a complement to a camera's pan and tilt tracking of the moving object. For example, a PTZ camera tracking system that determines an object to track, utilizes information regarding images of the object of interest are used to determine a zooming factor (or other zooming value) for a camera in the PTZ camera tracking system. This information includes variables such as tilt angles of one or more cameras and a reference zooming factor.06-21-2012
20120169923VIDEO CODING - Techniques are discussed for providing mechanisms for coding and transmitting high definition video, e.g., over low bandwidth connections. In particular, foreground-objects are identified as distinct from the background of a scene represented in a plurality of video frames received from a video source, such as a camera. In identifying foreground-objects, semantically significant and semantically insignificant movement (e.g., repetitive versus non-repetitive movement) is differentiated. Processing of the foreground-objects and background proceed at different update rates or frequencies.07-05-2012
20130155290Method and System for Image Centering during Zooming - The methods and systems described herein are directed to image processing. More specifically, the image processing described herein may include centering an object in the field of view during zooming. The image processing methods and systems may further include setting a magnification factor, positioning the camera in a first field of view capturing a first image, setting a second magnification factor, and capturing a second image. Additionally, the described techniques may include altering the first image to determine an offset and adjusting the camera based on the offset.06-20-2013
20130162838Transformation between Image and Map Coordinates - Systems and methods for transformations between image and map coordinates, such as those associated with a video surveillance system, are described herein. An example of a method described herein includes selecting a reference point within the image with known image coordinates and map coordinates, computing at least one transformation parameter with respect to a location and a height of the camera and the reference point, detecting a target location to be tracked within the image, determining image coordinates of the target location, and computing map coordinates of the target location based on the image coordinates of the target location and the at least one transformation parameter.06-27-2013
20140139680Method And System For Metadata Extraction From Master-Slave Cameras Tracking System - An embodiment of the present invention includes a master camera that may record master metadata regarding an object of interest and communicate the master metadata to a slave camera. The slave camera may zoom, pan, or tilt to isolate and record more detailed image data regarding the object of interest based on the master metadata. In addition, the slave camera may record slave metadata regarding the object of interest. The master and slave metadata may be stored associated with the recorded image data enabling a later search for the object of interest to be expedited. The recorded image data including the object of interest may be identified with greater ease as it may be guided by the master or slave metadata, or a combination thereof. According to embodiments presented herein, processing time for searching and identifying an object of interest may be reduced by enabling a search on the metadata associated with image data, rather than by searching the image data itself.05-22-2014
20140152815Window Blanking for Pan/Tilt/Zoom Camera - Network cameras employing advanced video analytics are increasingly being used in both public and private settings. Unlike fixed surveillance cameras, pan/tilt/zoom cameras provide a dynamic field-of-view. Some regions within a given field-of-view can be designated as private and may not be recorded. A window-blanking feature, according to an embodiment of the invention, enables an ability to block out defined portions of the video where a privacy zone may otherwise appear. Through use of the embodiment, consistent privacy is provided during dynamic surveillance to ensure compliance with privacy regulations or contractual arrangements relating to use of a surveillance camera having a privacy zone within the given field-of-view.06-05-2014
20140253783FOCUS CONTROL FOR PTZ CAMERAS - Systems and methods for focus control in a pan-tilt-zoom (PTZ) camera system are described herein. An example of a method described herein includes identifying a set of trace curves associated with the camera system, each of the trace curves specifying relationships between focus lens positions and zoom lens positions for a corresponding camera position, selecting a trace curve using the set of trace curves and one or more of pan angle, tilt angle or installation height of the camera system, and identifying a focus lens position for a current zooming factor of the camera system based on the selected trace curve.09-11-2014
20140267704System and Method For Audio Source Localization Using Multiple Audio Sensors - An automated security surveillance system ideally determines a location of a possible disturbance and adjusts its cameras to record video footage of the disturbance. In one embodiment, a disturbance can be determined by recording audio of the nearby area. A system, coupled to a camera, may include an arrangement of at least four audio sensors configured record audio of the nearby area to produce independent outputs. The system further may include a processing module configured to determine an angle and distance of an audio source relative to a location of the arrangement of the at least four audio sensors. The system can then adjust the camera by rotation along an azimuth or elevation angle and adjusting the zoom level to record video of the audio source. Through use of the system, a surveillance system can present an image of a source of possible disturbance to an operator more rapidly and precisely than through manual techniques.09-18-2014

Patent applications by Chien-Min Huang, Clovis, CA US

Chien-Min Hung, New Taipei TW

Patent application numberDescriptionPublished
20130288505ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly for electronically connecting a chip to a circuit board includes an electrical connector and a cover. The electrical connector includes a flip cover, a control element, a main body, and a fixing element. The flip cover is rotatably connected to the fixing element through the control element. The main body and the fixing element are located on the circuit board, and the chip is located on the main body. The cover is removably mounted on the flip cover. When the flip cover and the control element are rotated to be opened relative to the main body, the control element is rotated relative to the fixing element and is engaged with the flip cover.10-31-2013
20150116924MOUNTING DEVICE FOR HARD DISK DRIVE - A mounting device for mounting a hard disk drive (HDD) includes a frame and a fixing member. The frame includes two side boards and a connecting board connected between the side boards. Each side board defines a latching hole and a positioning hole. The fixing member includes two arms fixed to opposite sides of the HDD and a resilient handle connected between the arms. Two latching portions extend from opposite ends of the handle to be detachably engaged in the latching holes. A protrusion protrudes from each arm to be detachably inserted into a corresponding one of the positioning holes. The handle can be pulled away from the connecting board to disengage the latching portions from the corresponding latching holes.04-30-2015

Chien-Min Kao, Longtan Township TW

Patent application numberDescriptionPublished
20140153289Secondary Side Serial Resonant Full-Bridge DC/DC Converter - The present invention relates to a secondary side serial resonant full-bridge DC/DC converter, comprising: a transistor full-bridge unit, a transformer unit, a resonant unit, a rectifying unit, and an output unit. Particularly, in the present invention, a resonant inductor and a resonant capacitor of the resonant unit and a load resistor of the output unit constitute a serial resonant circuit having a serial resonant frequency; therefore, when the circuit frequency is operated on the serial resonant frequency, the resonant inductor impedance would be offset by the resonant capacitor impedance, such that the circuit is operated in the zero current switch (ZCS) region, and the output voltage variation can be controlled in ±0.2%. Moreover, through the serial resonant circuit, the issue about the resonant components hard to be designed due to their small characteristic impedance can simultaneously be improved.06-05-2014
20140153293Double-Output Half-Bridge LLC Serial Resonant Converter - The present invention relates to a double-output half-bridge LLC serial resonant converter, comprising: a half-bridge rectifying unit, a first resonant unit, a first transformer unit, a first rectifying unit, a first output unit, a second resonant unit, a second transformer unit, a second rectifying unit, a second output unit, a voltage dividing unit, a voltage regulating unit, a light-coupling isolation unit, and a control unit. In the present invention, the double-output half-bridge LLC serial resonant converter has an inventive circuit framework, which can not only solve the unbalance load current and the output voltage cross regulation occurred in the conventional double-output convertor, but also normally modulate the no-load or light-load output voltage; therefore the output voltage deviation can be effectively controlled.06-05-2014
20140169041DC TO DC CONVERTING CIRCUIT - The invention provides a DC to DC converting circuit, comprising: a transforming unit with a primary winding and a secondary winding; a bridge rectifier unit coupled to an input voltage, having a first output terminal and a second output terminal coupled to both side of the primary winding respectively; a first switch coupled between the input voltage and the first output terminal; a second switch coupled between the first output terminal and a ground terminal; a third switch coupled between the input voltage and the second output terminal; and a fourth switch coupled between the second output terminal and the ground terminal; an output unit paralleled to the secondary winding; and a clamping unit coupled to the input voltage and paralleled to the bridge rectifier unit, having an auxiliary switch coupled to the input voltage; and a clamping capacitor coupled between the auxiliary switch and the ground terminal; wherein the auxiliary switch is turned on when operation statuses of the first switch and the fourth switch or the second switch and the third switch are changed.06-19-2014

Chien-Min Lai, Taipei TW

Patent application numberDescriptionPublished
20140174788SENSING ELECTRODE STRUCTURE AND TOUCH PANEL EMPLOYING THE SAME - An embodiment of the present disclosure provides a sensing electrode structure comprising a plurality of first axial electrodes and a plurality of second axial electrodes. The second axial electrodes and the first axial electrodes are formed on same side of a substrate and are electrically insulated from each other. Each of the first axial electrodes has a plurality of first conductive patterns with grid structures, and the first conductive patterns with grid structures are electrically connected with each other. Each of the second axial electrodes has a plurality of second conductive patterns with grid structures, and the second conductive patterns with grid structures are electrically connected with each other.06-26-2014

Chien-Min Lin, Hsinchu City TW

Patent application numberDescriptionPublished
201301618113D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION - A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.06-27-2013
201303029423D IC CONFIGURATION WITH CONTACTLESS COMMUNICATION - A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.11-14-2013

Chien-Min Lin, Taichung TW

Patent application numberDescriptionPublished
20160050753INTERPOSER AND FABRICATION METHOD THEREOF - A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having opposite first and second sides and a plurality of conductive through holes communicating the first and second sides; forming an insulating layer on the first side of the substrate body, wherein the insulating layer has a plurality of openings correspondingly exposing the conductive through holes; and forming a plurality of conductive pads in the openings of the insulating layer, wherein the conductive pads are electrically connected to the corresponding conductive through holes, thereby dispensing with the conventional wet etching process and hence preventing an undercut structure from being formed under the conductive pads.02-18-2016

Chien-Min Lin, Taoyuan City TW

Patent application numberDescriptionPublished
20160039662CHIP PACKAGE AND METHOD THEREOF - A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.02-11-2016
20160039663CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A method includes forming a bump on a lower surface of an interposer. A first insulation layer is formed to cover the lower surface and bump. A trench is formed extending from the lower towards an upper surface of the interposer. A polymer supporting adhesive layer is formed to surround the bump and couples between the interposer and a semiconductor chip. The semiconductor chip has at least a sensing component and a conductive pad electrically connected to the sensing component, and the bump is connected to the conductive pad. A via is formed extending from the upper towards the lower surface. A second insulation layer is formed to cover the upper surface and the via. A redistribution layer is formed on the second insulation layer and in the via. A packaging layer is formed to cover the redistribution layer and has a second opening.02-11-2016

Chien-Min Lin, Taipei TW

Patent application numberDescriptionPublished
20090026608Crosstalk-Free WLCSP Structure for High Frequency Application - A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.01-29-2009
20090050356Capacitors with Insulating Layer Having Embedded Dielectric Rods - A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods.02-26-2009

Chien-Min Liu, Taichung City TW

Patent application numberDescriptionPublished
20130009143PHOTO SENSOR AND METHOD OF FABRICATING THE SAME - A photo sensor and a method of fabricating the same are disclosed, the photo sensor of the present invention has ultra-high Schottky junction area per unit volume, and the photo sensor comprises: a first conductive layer; plural metallic nanowires, in which one end of each metallic nanowire connects with the first conductive layer and is covered with a semiconductive layer having a width of 1 nm to 20 nm; and a second conductive layer locating opposite to the first conductive layer, whereby the plural metallic nanowires locate between the first conductive layer and the second conductive layer, and the semiconductive layer contacts with the second conductive layer, wherein the photo sensor of the present invention is used to detect ultra violet (UV) light with a wavelength of 10 nm-400 nm.01-10-2013

Chien-Min Liu, Taichung County 434 TW

Patent application numberDescriptionPublished
20110042782ON-CHIP INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a an on-chip inductor structure and a method for manufacturing the same. The an on-chip inductor structure according to the present invention comprises a substrate, a porous layer, a plurality of conductors, and an inductor. The porous layer is disposed on the substrate and has a plurality of voids; each of the plurality of conductors is disposed in the plurality of voids, respectively; and the inductor is disposed on the porous layer. Because the plurality of conductors is used as the core of the inductor, the inductance is increased effectively and the area of the an on-chip inductor is reduced. Besides the manufacturing method according to the present invention is simple and compatible with the current CMOS process, the manufacturing cost can be lowered.02-24-2011

Chien-Min Weng, Chung Li City TW

Patent application numberDescriptionPublished
20140092027TOUCH PANEL AND METHOD FOR PRODUCING SAME - The invention relates to a touch panel. The touch panel includes a plastic film substrate, whose two surfaces are provided in sequence with at least two undercoat layers and a patterned transparent conductive layer and further provided with a patterned metal circuit layer, respectively. The invention also relates to a simplified method for producing a touch panel, in which the conventional lamination process is eliminated, and the touch panel produced thereby has a reduced overall thickness and is free of the conventional image deterioration drawback. Moreover, the method generally pertains to a sheet-by-sheet process and is superior over the conventional roll-to-roll processes in which the thin layers tend to exfoliate due to the occurrence of uneven tension.04-03-2014

Chien-Min Weng, Industrial Park TW

Patent application numberDescriptionPublished
20100215931ITO layer structure - A ITO layer structure, which is composed of the ITO as the outermost layer and the first anti-reflected layer on the specific side of the transparent substrate, furthermore, the second anti-reflected layer is formed on the opposite side of substrate, can improve the total transmittance.08-26-2010

Chien-Min Weng, Tao-Yuan TW

Patent application numberDescriptionPublished
20100101937METHOD OF FABRICATING TRANSPARENT CONDUCTIVE FILM - A method of fabricating transparent conductive film including the following steps is provided. First, a reactive chamber having at least a target and at least a heating device is provided. Subsequentially, a plasma is generated in the reactive chamber, wherein the plasma is located above the target. Next, the plasma is heated by the heating device from a standby temperature to a working temperature. Simultaneously, a hard plastic substrate is passed above the plasma at a specific speed, wherein the particles of the target are bombarded by the plasma so as to form transparent conductive film on the hard plastic substrate.04-29-2010
20110056244METHOD OF STRENGTHENING GLASS PLATE - A method of strengthening glass plate is provided. A plasma treating process is performed on a glass plate so that a surface pore variation of the glass plate after the plasma treating process is reduced relative to the surface pore variation of the glass plate before the plasma treating process, wherein the surface pore variation is a variation degree of surface pores in different unit areas of the glass plate. In the mean time, a melted network crosslinking structure is formed on the surface of the glass plate. Based on the above-mentioned mechanisms, the glass plate is strengthened. The plasma treating process is conducive to strengthen the glass plate whether the plasma treating process is performed before or after the conventional chemical strengthening process.03-10-2011
20110234507INTEGRATED TOUCH PANEL AND MANUFACTURING METHOD THEREOF - The present invention provides an integrated touch panel comprising a transparent substrate, one of an icon or artwork layer, a first layer of optical film, and a first sensing layer. The icon layer or artwork layer is coated on the periphery of one side face of the transparent substrate, and the inner periphery of the icon layer or artwork layer is not perpendicular to the adjacent line of the transparent substrate. The first layer of optical film is stacked on icon layer or artwork layer and the areas on the transparent substrate uncovered with icon layer. The first sensing layer is stacked on the first layer of optical film by sputtering. The interchangeability is included in the patent claim of the present invention. As icon layer or artwork layer is not perpendicular to the transparent substrate, the subsequent cladding of the structures may be completed by sputtering or other methods.09-29-2011
20120009354Method for treating surface of glass substrate and apparatus for performing same - A method for treating a surface of a glass substrate according to the invention has the steps of placing the glass substrate into a vacuum treatment chamber, introducing a gas into the vacuum treatment chamber, providing electric power to generate an ion source and using the ion source to treat the surface of the glass substrate. By this way, the invention can achieve an effect of surface cleaning and further render the conductive film to be coated on the glass substrate in the subsequent stage to have a reduced surface resistance, thereby improving the conductivity of the glass substrate. The film coated on the glass substrate in the subsequent stage will have higher crystalline level as well.01-12-2012
20120009392Strengthened substrate structure - The substrate according to the invention includes at least one surface coated with an organic buffer layer and the organic buffer layer is provided with a coating layer on a surface thereof opposite to its surface attached to the substrate. The provision of the organic buffer layer diminishes the effect of the coating layer on the strength of the substrate, thereby maintaining the strength of the substrate.01-12-2012
20120213949METHOD FOR PRODUCING INDIUM TIN OXIDE LAYER WITH CONTROLLED SURFACE RESISTANCE - The invention relates to a method for producing a transparent indium tin oxide conductive layer on a substrate. The method involves using a target having a low indium-to-tin ratio in a low temperature manufacturing process (less than 200° C.), and introducing a plasma gas and a reaction gas into the reaction chamber to allow sputtering of an indium tin oxide layer on the substrate under a low oxygen environment, followed by subjecting the sputtered substrate to a heat treatment at 150˜200° C. for 60˜90 minutes. The indium tin oxide layer thus produced will crystallize completely and have the advantageous properties of low surface resistance and high uniformity.08-23-2012
20120247953FILM-COATING SYSTEM - The invention relates to a film coating system. The system includes serially arranged working zones including a rough vacuum feeding section, a high vacuum feeding section, an optical layer coating zone, a pretreatment zone, a transparent conductive layer coating zone and a pressure balanced exhausting zone. The system further includes a conveyor device for carrying a substrate which has been provided on its periphery with an ink frame layer and for delivering the substrate to the respective working zones, and a controlling device that controls the times for the substrate to be retained in the respective working zones based upon a time interval between the entry of two successive conveyor devices into the rough vacuum feeding section. The invention ensures a smooth operation of the production line, and the transparent conductive film coated thereby does not easily exfoliate and exhibits the advantageous properties of high optical performance and low surface resistance.10-04-2012
20140071533Transparent Conductive FILM And Touch Panel Provided With Same - The invention relates to a transparent conductive film. The transparent conductive film has a plastic film substrate, whose two surfaces are provided in sequence with at least two undercoat layers and a patterned transparent conductive layer, respectively. The invention overcomes the drawback of image deterioration caused by the patterning of the transparent conductive layers and reduces the optical difference between the patterned regions and the non-patterned regions by adjusting the refractive indexes and thicknesses of the various layers.03-13-2014

Patent applications by Chien-Min Weng, Tao-Yuan TW

Chien-Min Wu, Kaohsiung City TW

Patent application numberDescriptionPublished
20160053434COMPOSITE FILAMENT TEXTILE AND ENVIRONMENT-FRIENDLY COMPOSITE FILAMENT ARTIFICIAL LEATHER MANUFACTURED USING THE SAME - An environmental-friendly composite filament artificial leather includes a composite filament textile and an elastomer film. The composite filament textile is made of composite filament. The composite filament includes at least one core portion and a sheath portion. The at least one core portion is a polyester-type polymer, a polyamide polymer or a polypropylene polymer. The sheath portion sheathes the at least one core portion, and the sheath portion is a thermoplastic elastomer. The elastomer film is bonded with the composite filament textile. The elastomer film is made of one selected from the following materials: thermoplastic polyurethane (TPU), thermoplastic polyester elastomer (TPEE) and thermoplastic polyolefin (TPO). By this way, an environment-friendly artificial leather of lightweight, good abrasion, good touch feeling and well dimentional stability can be manufactured. Furthermore, the artificial leather can be manufactured without use of any solvent, so as to conform to the environment protection requirement.02-25-2016

Chien-Min Wu, Taipei TW

Patent application numberDescriptionPublished
20100040821Molding glass lens and mold thereof - A molding glass lens and a mold thereof are disclosed. The molding glass lens consists of an upper optical surface, a lower optical surface, two outers surrounding the optical surfaces and at least three grooves arranged in the form of a circle disposed on the lower outer and/or the upper outer. The disposition of the grooves has no affecting in original size of the outers as well as assembling with other mechanical parts in les group. The mold of the lens includes an upper molding unit and a lower molding unit. Cavity of each molding unit is composed of a central part for forming an optical surface of the lens and an outer circular part for forming outer of the lens. At least three protrudent parts with the same height are disposed in the form of a circle on the outer circular of the lower molding unit and/or the upper molding unit. Thus the air in the mold cavity is easy to exhaust through the gap formed by protrudent parts and glass preform. Therefore, air bubbles generated during the molding processes are prevented and precision of the glass lens is provided.02-18-2010
20100157428GLASS LENS ARRAY MODULE WITH ALIGNMENT MEMBER AND MANUFACTURING METHOD THEREOF - A glass lens array module with alignment fixture and a manufacturing method thereof are revealed. A glass lens array is produced by multi-cavity glass molding and alignment members are arranged on a peripheral of non-optical area of the glass lens array. Optical axis of each of two adjacent glass lens arrays is aligned by corresponding alignment members and the glass lens arrays are assembled by glue. A spacer is disposed between the two adjacent glass lens arrays to form a preset interval if needed. Thus a glass lens array module is formed after curing of the glue. Thereby the alignment of the optical axis of the glass lens is achieved easily and optical precision is also attained. Moreover, the manufacturing processes are simplified and the cost is reduced.06-24-2010
20100284089STACKED OPTICAL GLASS LENS ARRAY, STACKED LENS MODULE AND MANUFACTURING METHOD THEREOF - A stacked optical glass lens array, a stacked lens module and a manufacturing method thereof are disclosed. The stacked optical glass lens array includes at least two optical glass lens arrays whose optical axis are aligned and then stacked with each other by cement glue in glue grooves. A stacked optical glass lens element can be singularized by cutting along with the alignment notches of stacked optical glass lens array. The stacked lens module is formed by a single stacked optical glass lens element and related optical element mounted in a lens holder. Thereby the optical axis of the lenses of the stacked lens module are aligned precisely, the manufacturing processes are simplified and the production cost is reduced.11-11-2010

Chien-Min Wu, Hsinchu City TW

Patent application numberDescriptionPublished
20100015534METHOD FOR MONITORING PHOTOLITHOGRAPHY PROCESS AND MONITOR MARK - A method for monitoring a photolithography process includes providing a monitor mark having high sensitivity of the focus of the photolithography process, transferring the monitor mark together with the product patterns through the photolithography process onto a substrate, and measuring the deviation dimension of the monitor mark formed on the substrate to real-time monitor the focus of the photolithography process.01-21-2010
20100149535METHOD OF MEASURING NUMERICAL APERTURE OF EXPOSURE MACHINE, CONTROL WAFER, PHOTOMASK, AND METHOD OF MONITORING NUMERICAL APERTURE OF EXPOSURE MACHINE - A method of measuring a numerical aperture of an exposure machine is described. A control wafer having vernier marks thereon and an aberration mask having pinholes therein are provided, wherein each pinhole corresponds to a vernier mark in position. A lithography process using the exposure machine and the aberration mask is performed to the control wafer, so as to form over each vernier mark a photoresist pattern having the same shape of the illumination pattern of the light source of the exposure machine. The numerical aperture of the exposure machine is then derived from a graduation of the vernier mark corresponding to an outer edge of the photoresist pattern.06-17-2010
20100265774METHOD FOR DETERMINING NATIVE THRESHOLD VOLTAGE OF NONVOLATILE MEMORY - A method for determining native threshold voltage of nonvolatile memory includes following steps. A memory cell including a control gate, a charge storage layer, a source region, and a drain region is provided. A programming operation is performed on the memory cell by using F-N tunneling effect to obtain a programming curve of time versus threshold voltage. In the programming operation, a positive voltage is applied to the control gate. An erase operation is performed on the memory cell by using F-N tunneling effect to obtain an erasure curve of time versus threshold voltage. In the erase operation, a negative voltage is applied to the control gate. The absolute values of the positive voltage and the negative voltage are the same. The native threshold voltage of memory cell is determined from the cross point of the programming curve and the erasure curve.10-21-2010
20120070786METHOD FOR MONITORING PHOTOLITHOGRAPHY PROCESS AND MONITOR MARK - A method for monitoring a photolithography process includes providing a monitor mark having high sensitivity of the focus of the photolithography process, transferring the monitor mark together with the product patterns through the photolithography process onto a substrate, and measuring the deviation dimension of the monitor mark formed on the substrate to real-time monitor the focus of the photolithography process.03-22-2012

Patent applications by Chien-Min Wu, Hsinchu City TW

Chien-Min Yu, Taipei City TW

Patent application numberDescriptionPublished
20150112861METHOD FOR COMPUTERIZING A RECEIPT - A method for computerizing a receipt is applied to an electronic device with a touch screen, and the method includes retrieving a plurality of trading data of a trade, computing a characteristic code according to the trading data, and displaying a signature-field pattern with the computed characteristic code on the touch screen.04-23-2015
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