Chien-Hui
Chien-Hui Chen, Jhu-Dong Township TW
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20150187666 | INTEGRATED CIRCUIT COMPRISING BUFFER CHAIN - Among other things, an integrated circuit and method for routing electrical pathways of an integrated circuit is provided. The integrated circuit comprises a buffer chain coupling a first cell of the integrated circuit to a second cell of the integrated circuit. An electrical pathway coupling a first inverter of the buffer chain with a second inverter of the buffer chain extends through a first set of metal layers and is routed to form a pulse-like shape having an apex at a top layer of the first set. | 07-02-2015 |
Chien-Hui Chen, Taoyuan County TW
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20110198646 | HIGH-REFLECTION SUBMOUNT FOR LIGHT-EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - A method for fabricating a silicon submount for LED packaging. A silicon substrate is provided. A reflection layer is formed on the silicon substrate. Portions of the reflection layer and the silicon substrate are removed to form openings. A wafer backside grinding process is carried out to thin the silicon substrate thereby turning the openings into through silicon vias. An insulating layer is then deposited to cover the reflection layer and the silicon substrate. A seed layer is formed on the insulating layer. A resist pattern is then formed on the seed layer. A metal layer is formed on the seed layer not covered by the resist pattern. The resist pattern is then stripped. The seed layer not covered by the metal layer is then removed. | 08-18-2011 |
20120133049 | Process of Fabricating Semiconductor Device and Through Substrate via, and Through Substrate via Structure Therefrom - A method of fabricating a semiconductor device, a process of fabricating a through substrate via and a substrate with through vias are provided. The substrate with through vias includes a semiconductor substrate having a back surface and a via penetrating the back surface, a metal layer, a first insulating layer and a second insulating layer. The first insulating layer is formed on the back surface of the substrate and has an opening connected to the through via. The second insulating layer is formed on the first insulating layer and has a portion extending into the opening and the via to form a trench insulating layer. The bottom of the trench insulating layer is etched back to form a footing portion at the corner of the via. The footing portion has a height less than a total height of the first and second insulating layers. | 05-31-2012 |
Chien-Hui Chen, Taoyuan City TW
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20160086896 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package including a semiconductor substrate having a first surface and a second surface opposite thereto. A conducting pad is located on the first surface. A side recess is on at least a first side of the semiconductor substrate, wherein the side recess extends from the first surface toward the second surface and across the entire length of the first side. A conducting layer is located on the first surface and electrically connected to the conducting pad, wherein the conducting layer extends to the side recess. | 03-24-2016 |
Chien-Hui Hsu, Taoyuan County TW
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20130168540 | LIGHT GRATING STRUCTURE FOR A FORCE FEEDBACK DEVICE - The invention is to provide a light grating structure for a force feedback device, projecting a light beam from a light source through the pervious parts of a grating body to form pervious areas at a reception end, blocking the light beam by the shade parts of the grating body to form shade areas at the reception end, and increasing the grating distance to move the grating body close to the reception end and increasing the width of the shade part bigger than the pervious part to enable the width of the shade area to equal to the width of the pervious area. | 07-04-2013 |
Chien-Hui Lee, Hsin-Chu TW
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20150078034 | PLANAR LIGHT SOURCE - A planar light source including an LGP and first and second light sources are provided. The LGP has a first surface and a second surface opposite to each other and a first groove and a second groove. The first groove and the second groove are respectively located on the first surface and the second surface, and are respectively located at two sides of a center line of the LGP, where the center line equally divides the first surface and the second surface. The first groove has a first side surface and a first light incident surface, and the second groove has a second side surface and a second light incident surface, where the light sources are disposed in the grooves. The light sources are suitable for respectively providing a light beam entering the LGP through the corresponding light incident surface. | 03-19-2015 |
20150226901 | BACKLIGHT MODULE - A backlight module includes a light guide plate having a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure recesses into or protrudes from the bottom surface and has a first and a second surfaces. The first and the second surfaces of at least one of the microstructures are located on two sides of a first reference plane parallel to the first light incident surface. A section-line of each first surface on a second reference plane perpendicular to the first light incident surface and perpendicular to the light emitting surface is a straight line. A first angle between each first surface and a third reference plane parallel to the light emitting surface in the light guide plate is between 0 degrees and 20 degrees, and a thickness of each microstructure is between 0 micrometers and 20 micrometers. | 08-13-2015 |
20150268404 | BACKLIGHT MODULE - A backlight module including an LGP, an optical film, a first light source is provided. The LGP has a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure is recessed into or protrudes out of the bottom surface and includes at least two structural units. A section line of each structural unit on a first reference plane is a curve, and the curve has a peak point. A distance between two peak points of two adjacent structural units along a first direction is greater than 0 and smaller than a half of a total width of the two structural units along the first direction. Each microstructure has a symmetric plane perpendicular to the light emitting surface and the first light incident surface. The optical film is located on the light emitting surface. The first light source is located beside the first light incident surface. | 09-24-2015 |
Chien-Hui Lee, New Taipei TW
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20140059903 | AUTOMATIC PAGE-TURNING DEVICE AND AUTOMATIC PAGE-TURNING SCAN DEVICE USING THE SAME - An automatic page-turning scan device for automatically turning and scanning pages of a book includes an automatic page-turning device and a scan module. The automatic page-turning device includes a base, a book support, a page-pressing module, a pick-up and page-turning module, and a system controller connected with the book support, the page-pressing module and the pick-up and page-turning module. The book support slidably mounted to the base includes two supporting panels for supporting the book. The page-pressing module is mounted to the supporting panel includes a driving module, and a pressing plate driven by the driving module. The pick-up and page-turning module mounted to the base includes a pick-up holder, a pick-up arm and a path guiding mechanism. The scan module is mounted to the automatic page-turning device, and the system controller controls the scan module to scan the pages of the book. | 03-06-2014 |
Chien-Hui Lee, New Taipei City TW
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20150208505 | COMBINATION OF A FLEXIBLE PRINTED CIRCUIT BOARD AND A RIGID PRINTED CIRCUIT BOARD AND METHOD OF MAKING THE SAME - A method of making a combination of a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB), comprising steps of providing a RPCB; providing a FPCB having a panel and a hole formed through the FPCB; forming a solder layer located at the hole and between the RPCB and the FPCB; heating through the hole to melt the solder layer; and removing the heat source to solidify the solder layer to obtain a combination of the FPCB and the RPCB. Based on the steps above, there is no need to use any additional connection piece and fixture of the same and the manufacture cost is lowered. In addition, as a result that the solder layer is very thin, the combination made by the method accommodates less space and has extensive applicability. | 07-23-2015 |
Chien-Hui Lin, New Taipei TW
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20150300595 | LENS FOR LIGHT EMITTING DIODE AND LED MODULE HAVING THE LENS - A lens for an LED comprises a top face, a bottom face, and a circumferential periphery interconnecting the top and bottom faces. The top face defines a recess therein. A concave wall defines a bottom of the recess. In cross section of the lens, the concave wall consists of two symmetrical curves extending outward and upwardly from a bottom tip of the recess to connect with the top face. Each curve is a part of a hyperbola. The cavity is for receiving an LED therein. The lens further forms a cone-shaped top wall enclosing a top of the cavity. Light emitted from the LED travels through the cone-shaped top wall to strike the concave wall and be reflected thereby to radiate sideward and downwardly. The sideward and downwardly reflected light then is reflected by a reflective coating on a substrate to illuminate upwardly. | 10-22-2015 |
Chien-Hui Wang, Hsinchu City TW
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20120146608 | VOLTAGE REGULATOR AND PULSE WIDTH MODULATION SIGNAL GENERATION METHOD THEREOF - In a PWM signal generation method of a voltage regulator, an output sense signal, a first ramp signal and a second ramp signal are provided. A first time point of the first ramp signal crossing with the output sense signal is used to determine a start point of an ON-time of a PWM signal, and a second time point of the second ramp signal crossing with the output sense signal is used to determine an end point of the ON-time of the PWM signal. Moreover, the first ramp signal is reset to a reference voltage at the first time point and then maintained at the reference voltage, and further ramps down starting from the end point of the ON-time. The second ramp signal ramps up starting from the start point of the ON-time, and then is reset to a preset voltage at the second time point. | 06-14-2012 |
Chien-Hui Wang, Hsinchu TW
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20090102448 | Voltage regulator and method for generating indicator signal in voltage regulator - The present invention discloses a voltage regulator which generates a control signal to convert an input voltage to an output voltage, the voltage regulator comprising: a regulator module for generating the control signal according to comparison between a signal representative of the output voltage and a signal representative of a reference voltage; and an amplifier for generating a first index signal by amplifying a difference between the signal representative of the output voltage and the signal representative of the reference voltage. | 04-23-2009 |
20140021929 | MULTI-PHASE SWITCHING REGULATOR AND DROOP CIRCUIT THEREFOR - The present invention provides a multi-phase switching regulator and a droop circuit for use in the multi-phase switching regulator. The multi-phase switching regulator generates pulse width modulation (PWM) signals according to an output voltage and a droop signal, to drive a plurality of switching sets to convert an input voltage to the output voltage. The droop circuit detects the sum of the currents generated by the plurality of switching sets and provides the droop signal which is related to the sum of the currents to the multi-phase switching regulator. The droop signal can be used for over current protection (OCP) or for the droop control. | 01-23-2014 |
Chien-Hui Wen, Redmond, WA US
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20150091839 | Compliant Support for a Display Device - A compliant support for a display device is described. In one or more implementations, an apparatus includes an external enclosure configured to assume a mobile computing device configuration and one or more computing components secured by and disposed within the external enclosure. The one or more computing components are configured to perform one or more operations that are specified by software. A display device is secured to the external enclosure such that the display device is viewable by a user, the display device supporting touchscreen functionality. A compliant support is disposed between the one or more computing components and the display device, the compliant support configured to reduce deflection of the display device by compression of the compliant support, the deflection caused in response to contact against a surface of the display device. | 04-02-2015 |
Chien-Hui Wu, New Taipei City TW
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20130189298 | NOVEL YEAST STRAIN AND THE APPLICATION THEREOF - The present invention provides an isolated | 07-25-2013 |
Chien-Hui Yang, Taipei City TW
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20110220127 | Endotracheal Tube Holder - An endotracheal tube holder is provided. The endotracheal tube holder includes an adjustable securing clamp, an adjusting unit, a bite block, and a securing strap. The adjustable securing clamp includes a first clamping unit having a first clamping portion, and a second clamping unit having a second clamping portion. The first clamping portion and the second clamping portion are oppositely and correspondingly aligned for holding an endotracheal tube. The adjusting unit includes an elastic member, coupled between the first clamping unit and the second clamping unit. The bite block is configured at one side of the first clamping portion and includes an endotracheal tube accommodation portion. The endotracheal tube accommodation portion covers over the endotracheal tube for providing a protection to the endotracheal tube. The securing strap includes two ends respectively coupled to two lateral sides of the first clamping unit. | 09-15-2011 |