Patent application number | Description | Published |
20090046783 | Method and Related Device for Decoding Video Streams - A method for decoding a picture of a video stream includes decoding the video stream by a video decoder for generating a plurality of macroblocks corresponding to the picture, macroblock information corresponding to the plurality of macroblocks, and picture information corresponding to the picture; storing the macroblock information and the picture information into a memory buffer; and determining whether the picture is needed to be performed a de-blocking process by the video decoder according to the macroblock information and the picture information stored in the memory buffer. | 02-19-2009 |
20090060361 | METHOD FOR PROCESSING A MACRO BLOCK OF IMAGE DATA - The image data are coded with field DCT or frame DCT depending on the characteristics of the image data. However different coding types will result in different boundary marks of boundaries between adjacent blocks or adjacent macro blocks. Therefore the de-blocking of a boundary between two adjacent blocks or adjacent macro blocks should be performed according to the format of image data and the coding type of the adjacent blocks or adjacent macro blocks. | 03-05-2009 |
20090080517 | Method and Related Device for Reducing Blocking Artifacts in Video Streams - A method for reducing blocking artifacts in a video stream comprises receiving a picture of the video stream, wherein the picture includes a plurality of macroblocks and each of the plurality of macroblock includes four blocks, determining blocks with quantization parameters greater than a first threshold value in the picture, checking if block boundaries of the blocks are sharp and are real edges of objects in the picture according to pixel value differences between two adjacent pixels respectively located at both sides of the block boundaries, selecting filtering strengths of a de-blocking operation according to the pixel value differences when the block boundaries are sharp and are not real edges of the objects in the picture, and performing the de-blocking operation for two adjacent blocks at both sides of the block boundaries. | 03-26-2009 |
20100015534 | METHOD FOR MONITORING PHOTOLITHOGRAPHY PROCESS AND MONITOR MARK - A method for monitoring a photolithography process includes providing a monitor mark having high sensitivity of the focus of the photolithography process, transferring the monitor mark together with the product patterns through the photolithography process onto a substrate, and measuring the deviation dimension of the monitor mark formed on the substrate to real-time monitor the focus of the photolithography process. | 01-21-2010 |
20100149535 | METHOD OF MEASURING NUMERICAL APERTURE OF EXPOSURE MACHINE, CONTROL WAFER, PHOTOMASK, AND METHOD OF MONITORING NUMERICAL APERTURE OF EXPOSURE MACHINE - A method of measuring a numerical aperture of an exposure machine is described. A control wafer having vernier marks thereon and an aberration mask having pinholes therein are provided, wherein each pinhole corresponds to a vernier mark in position. A lithography process using the exposure machine and the aberration mask is performed to the control wafer, so as to form over each vernier mark a photoresist pattern having the same shape of the illumination pattern of the light source of the exposure machine. The numerical aperture of the exposure machine is then derived from a graduation of the vernier mark corresponding to an outer edge of the photoresist pattern. | 06-17-2010 |
20120070786 | METHOD FOR MONITORING PHOTOLITHOGRAPHY PROCESS AND MONITOR MARK - A method for monitoring a photolithography process includes providing a monitor mark having high sensitivity of the focus of the photolithography process, transferring the monitor mark together with the product patterns through the photolithography process onto a substrate, and measuring the deviation dimension of the monitor mark formed on the substrate to real-time monitor the focus of the photolithography process. | 03-22-2012 |
Patent application number | Description | Published |
20080305579 | Method for fabricating semiconductor device installed with passive components - A method for fabricating a semiconductor device installed with passive components is provided. The method includes: having at least a passive component make a bridge connection between a ground circuit and a power circuit of each of a plurality of substrate units; electrically connecting a conductive circuit on a cutting path between substrate units to the ground circuit and the power circuit, and forming a short circuit loop; or electrically connecting the conductive circuit on the cutting path between the substrate units to the power circuit and the ground circuit via bonding wires, and forming a short circuit loop; or applying a wire bonding machine to form a stud bump on the power circuit, and then forming a short circuit loop via the power circuit and ground loop of the wire bonding machine; therefore, via the short circuit loop, the passive component is capable of releasing electricity filled therein from previous plasma clean process of substrate units and chips; and grounding the chips and the substrate units and electrically connecting powers and signals to prevent the chips from being damaged due to sudden current impulses resulting from the discharging of the passive components when the passive components are electrically connected to the chips. | 12-11-2008 |
20090008760 | SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT - A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device. | 01-08-2009 |
20090202295 | Quick releasing device of actuator - A quick releasing device of an actuator comprises a quick releasing mechanism deposited on a transmission apparatus and a releasing spring for transmitting a power from the transmission apparatus to a load connector to drive the load connector to linearly move when it is normally constricted or releasing the transmission apparatus to retract the load connector when it is loosened, wherein the releasing spring has a node portion for being pulled to loosen the releasing spring, and a releasing handle settled aside the quick releasing mechanism having a operation portion and a driving portion, wherein, when pulled, the operation portion drives the driving portion to swing toward the node portion so as to pull the node portion and thereby loosen the releasing spring. | 08-13-2009 |
20110129966 | SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT - A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device. | 06-02-2011 |
Patent application number | Description | Published |
20110120540 | QUANTUM DOT DYE-SENSITIZED SOLAR CELL - A quantum dot dye-sensitized solar cell (QDDSSC) including an anode, a cathode, and an electrolyte between the anode and the cathode is provided. The anode includes a semiconductor electrode layer adsorbed with a dye, a plurality of quantum dots distributed within the semiconductor electrode layer, and a plurality of metal nanoparticles distributed within the semiconductor electrode layer. Because the absorption spectra of the quantum dots, the dye, and the semiconductor electrode layer cover the infrared (IR), visible, and ultraviolet (UV) regions of the solar spectrum, IR to UV light in the solar spectrum can be effectively absorbed, and accordingly the conversion efficiency of the solar cell can be improved. Moreover, the metal nanoparticles can increase the light utilization efficiency. | 05-26-2011 |
20110195186 | PLANE-TYPE FILM CONTINUOUS EVAPORATION SOURCE AND THE MANUFACTURING METHOD AND SYSTEM USING THE SAME - A manufacturing method and system using a plane-type film continuous evaporation source are disclosed, in which the manufacturing method comprises the steps of: providing a plane-type film continuous evaporation source, being a substrate having at least one evaporation material coated on a surface thereof while distributing the at least one evaporation material in a specific area of the substrate capable of covering all the plates to be processed by the evaporated evaporation material; arranging a heater inside the specific area to be used for enabling the at least one evaporation material to evaporate and thus spreading toward the processed plates. Thereby, the evaporated evaporation material can be controlled at the molecular/atomic level for enabling the same to form a film according to surface-nucleation, condensation and growth with superior evenness, nano-scale adjustability, specialized structure and function that can not be achieve by the films from conventional spray coating means. | 08-11-2011 |
20110271908 | LINEAR-TYPE MICROWAVE-EXCITED PLASMA SOURCE USING A SLOTTED RECTANGULAR WAVEGUIDE AS THE PLASMA EXCITER - A linear-type microwave-excited plasma source mainly comprises a reacting chamber, a rectangular waveguide and a linear biased slot in between. A linear quartz plate with an o-ring embedded in the biased slot is required so as to keep the reaction chamber in low pressure condition. Plasma will be excited in the reacting chamber by microwave powers radiating from the biased slot. A linear-type movable dielectric material can be disposed in the waveguide to control the radiation intensity of microwave, such that the length of the linear-type plasma source is able be extended without increasing input microwave powers and thus large-area low-cost plasma-processing applications can be implemented. | 11-10-2011 |
20120235121 | ORGANIC LIGHT EMITTING DEVICE AND METHOD FOR FORMING THE SAME - According to an embodiment of the disclosure, an organic light emitting device is provided, which includes: an inflexible tube comprising an external surface and an internal surface; a transparent conductive layer on the internal surface of the inflexible tube; an organic light emitting layer disposed in the inflexible tube and on the transparent conductive layer; and a conductive layer disposed in the inflexible tube and on the organic light emitting layer. According to an embodiment of the disclosure, a method for forming an organic light emitting device is also provided. | 09-20-2012 |
20130188339 | MIRROR DEVICE WITH ILLUMINATION AND MIRROR BOX USING THE SAME - The present disclosure provides a mirror device with illumination comprising a transparent conductive substrate, an isolation layer, a mirror layer and a light emitting diode (LED) layer. The isolation layer, formed on a surface of the transparent conductive substrate, divides the surface of the transparent conductive substrate into at least one first region and at least one second region. The mirror layer formed on the transparent conductive substrate within the at least one first region, while the LED layer is formed on the transparent conductive substrate within the at least one second region, wherein the mirror layer and the LED layer are electrically isolated from each other. In another embodiment, the present disclosure further provides a mirror box having the mirror device with illumination disposed therein so that the mirror device can be easily carried and kept in the pocket, or purse of user. | 07-25-2013 |
20140123900 | GAS SHOWER DEVICE HAVING GAS CURTAIN AND APPARATUS FOR DEPOSITING FILM USING THE SAME - A gas shower device having gas curtain comprises a first gas shower unit for injecting a reaction gas, thereby forming a reaction gas region, and a second gas shower unit. The second gas shower unit arranged around a periphery of the first gas shower unit comprises a buffer gas chamber for providing a buffer gas, and a curtain distribution plate. The curtain distribution plate further comprises a plurality through holes for injecting the buffer gas, thereby forming a gas curtain around a periphery of the reaction gas region. In another embodiment, an apparatus for depositing film is provided by utilizing the gas shower device having gas curtain, wherein the gas curtain prevents the reaction gas in the reaction gas region from being affected directly by a vacuum pressure so that a residence time of reaction gas can be extended thereby increasing the utilization of reaction gas and film-forming efficiency. | 05-08-2014 |
Patent application number | Description | Published |
20120145078 | SHOWERHEAD INTEGRATING INTAKE AND EXHAUST - A showerhead integrating intake and exhaust is provided for showering a gas. The showerhead at least includes a showerhead body that has a gas-active surface and a plurality of intake bores thereon. The showerhead body further includes a central exhaust vent disposed on the gas-active surface. The central exhaust vent may exhaust standing gas and further pre-exhaust byproduct from reaction process. | 06-14-2012 |
20120313113 | PHOTOVOLTAIC ORGANIC LIGHT EMITTING DIODES DEVICE AND MANUFACTURING METHOD THEREOF - A photovoltaic organic light emitting diodes (PV-OLED) device and manufacturing method thereof are introduced. The PV-OLED device includes a substrate, a solar cell module, and a plurality of organic light emitting diodes. The solar cell module is disposed on a surface of the substrate. The organic light emitting diodes are disposed on the same surface of the substrate that the solar cell module is disposed on. The organic light emitting diode is electrically isolated from the solar cell module. The solar cell module can apply power to the organic light emitting diodes for emitting light. | 12-13-2012 |
20130068160 | EVAPORATION DEVICE AND EVAPORATION APPARATUS - An evaporation device and an evaporation apparatus applying the same are adapted to performing evaporation process to an object to be coated. The evaporation device includes a tape carrier and a mask. The tape carrier has a heating region. The object to be coated is located over the heating region and is adapted to move along a feeding direction. The tape carrier is adapted to carry a coating material to pass through the heating region. The coating material is heated in the heating region and evaporated. The mask having an opening between the heating region and the object to be coated is disposed in the periphery of the heating region. The evaporated coating material is adapted to pass through the opening and coated on the object. | 03-21-2013 |
20130095658 | METAL ORGANIC CHEMICAL VAPOR DEPOSITION METHOD AND APPARATUS - A metal organic chemical vapor deposition (MOCVD) method and apparatus are provided. The MOCVD method includes: providing a substrate, in which a metal-based material layer is disposed on a first surface of the substrate; putting the substrate on a base in a chamber, in which the metal-based material layer is between the substrate and the base; and performing a MOCVD process on a second surface opposite to the first surface. The difference in thermal conductivity between the metal-based material layer and the substrate is in the range of 1 W/m° C. to 20 W/m° C., and the thermal expansion coefficients of the metal-based material layer and the substrate are of the same order. | 04-18-2013 |
20150147890 | MULTI-MODE THIN FILM DEPOSITION APPARATUS AND METHOD OF DEPOSITING A THIN FILM - A multi-mode thin film deposition apparatus including a reaction chamber, a carrying seat, a showerhead, an inert gas supplying source, a first gas inflow system and a second gas inflow system is provided. The carrying seat is disposed in the reaction chamber. The showerhead has a gas mixing room and gas holes disposed at a side of the gas mixing room. The gas mixing room is connected to the reaction chamber through the plurality of gas holes which faces the carrying seat. The first gas inflow system is connected to the reaction chamber and supplies a first process gas during a first thin film deposition process mode. The inert gas supplying source is connected to the gas mixing room for supplying an inert gas. The second gas inflow system is connected to the gas mixing room to supply a second process gas during a second thin film deposition process mode. | 05-28-2015 |
Patent application number | Description | Published |
20120229346 | HANDHELD DEVICE - A handheld device is provided, wherein the handheld device comprises a housing, a circuit board, a planar antenna and a switch. The housing comprising an outer surface is configured to define a receiving space. The circuit board is disposed in the receiving space. The planar antenna comprises a metal layer, wherein the metal layer comprising a first connecting point and a second connecting point is patterned on the outer surface. The switch comprising a first electrode and a second electrode is configured to control the electrical connection between the first connecting point and the second connecting point, wherein the first electrode and the second electrode are electrically connected between the first connecting point and the second connecting point. The planar antenna operates at a first central band when the switch is turned on, and operates at a second central band when the switch is turned off. | 09-13-2012 |
20130099996 | HANDHELD DEVICE AND PLANAR ANTENNA THEREOF - A handheld device and a planar antenna thereof are provided. The planar antenna comprises a radiator with an open terminal, a short terminal, a first feeding terminal and a second feeding terminal. The short terminal is coupled to a ground terminal. The first feeding terminal is formed between the open terminal and the short terminal, and coupled to a radio frequency (RF) signal terminal. The second feeding terminal is formed between the open terminal and the first feeding terminal, and coupled to the first feeding terminal by a transmission line and a switch element. The radiator resonates at the first central frequency when the switch element is turned off, and resonates at the second central frequency when the switch element is turned on. | 04-25-2013 |
20140080548 | Handheld Communication Device and Communication Method of the Same - A communication method used in a handheld communication device is provided. The communication method comprises the steps outlined below. Whether a voice communication is established is determined. When the voice communication is established, a sensing element is activated to determine whether the handheld communication device is operated in a hand mode. When the handheld communication device is not operated in the hand mode, an antenna module of the handheld communication device would be operated in a first operation frequency band to perform the voice communication. When the handheld communication device is operated in the hand mode, the antenna module of the handheld communication device would be operated in a second operation frequency band to perform the voice communication, in which the second operation frequency band is higher than the first operation frequency band. A handheld communication device is disclosed herein as well. | 03-20-2014 |
20150022404 | HANDHELD DEVICE - A handheld device is provided, wherein the handheld device comprises a housing, a circuit board, a planar antenna and a switch. The housing comprising an outer surface is configured to define a receiving space. The circuit board is disposed in the receiving space. The planar antenna comprises a metal layer, wherein the metal layer comprising a first connecting point and a second connecting point is patterned on the outer surface. The switch comprising a first electrode and a second electrode is configured to control the electrical connection between the first connecting point and the second connecting point, wherein the first electrode and the second electrode are electrically connected between the first connecting point and the second connecting point. The planar antenna operates at a first central band when the switch is turned on, and operates at a second central band when the switch is turned off. | 01-22-2015 |
20150077298 | MOBILE DEVICE AND ANTENNA STRUCTURE USING IONIC POLYMER METAL COMPOSITE THEREIN - A mobile device includes an antenna structure, a signal source, and an IPMC (Ionic Polymer Metal Composite). The signal source is configured to excite the antenna structure. The IPMC is configured as a flexible actuator to adjust a resonant length of the antenna structure in such a manner that the antenna structure is capable of operating in multiple bands. | 03-19-2015 |
Patent application number | Description | Published |
20130299060 | MANUFACTURING METHOD OF POROUS COMPOSITE FILM - The instant disclosure relates to a manufacturing method of a porous composite film. The manufacturing method includes processing a first porous film and a second porous film and includes the following steps: providing a pressing unit, a film-shaping unit, and a cooling unit; intersecting the first and second porous films at an angle; stacking the first and second porous films in forming a half-finished porous composite film; pressing the half-finished porous composite film by the pressing unit at a temperature T | 11-14-2013 |
20140145892 | PORTABLE COMMUNICATION DEVICE AND ADJUSTABLE ANTENNA THEREOF - A portable communication device and an adjustable antenna thereof are disclosed herein. The portable communication device includes a substrate, the adjustable antenna and a control circuit. The adjustable antenna includes an antenna body, an adjusting element, a feeding terminal and a ground terminal. The antenna body has multiple conductive portions and is disposed above the substrate. The adjusting element is coupled between the conductive portions. The feeding terminal and the ground terminal extend from the antenna body and are coupled to the substrate. The control circuit feeds a first control signal and a second control signal respectively through the feeding terminal and the ground terminal to the adjusting element, so as to adjust an electrical length of the adjustable antenna. | 05-29-2014 |
20150137742 | WIRELESS CHARGING RECEIVING DEVICE AND WIRELESS CHARGING SYSTEM USING THE SAME - A wireless charging receiving device includes a body, a metal housing, a receiving coil, and a power storage device. The metal housing is coupled to the body to form an accommodating space. The metal housing includes an aperture and at least one slit. The slit interconnects the aperture and the edge of the metal housing. The receiving coil is disposed between the metal housing and the body. The receiving coil defines a through hole by a looped configuration, and the through hole overlaps at least part of the aperture of the metal housing. The power storage device is disposed within the accommodating space and electrically connected to the receiving coil. Electromagnetic waves are able to pass through the aperture of the metal housing and are magnetically coupled to the receiving coil, such that the receiving coil transfers the energy of the electromagnetic waves to the power storage device. | 05-21-2015 |