Patent application number | Description | Published |
20120321824 | TRANSDUCER MODULE - The present invention is directed to a transducer module including a first transducer, a support member and a block member. The support member rests or is fixed on a first plate with a first end, and rests or is fixed on the central section of the first transducer with a second end. The block member rests or is fixed on the central section of the first transducer with a first end, and rests or is fixed on a second plate with a second end. | 12-20-2012 |
20130033967 | TRANSDUCER MODULE - The present invention is directed to a transducer module including a first transducer and a second transducer. The second transducer is disposed between the first transducer and a first plate. | 02-07-2013 |
20130034252 | TRANSDUCER MODULE - The present invention is directed to a transducer module including a first transducer and a second transducer. The first transducer is directly or indirectly disposed on a first plate with a first point, and the second transducer is disposed at a second point of the first transducer. In an embodiment, an inertial mass is further disposed on the second transducer. | 02-07-2013 |
20130064401 | TRANSDUCER MODULE - The present invention is directed to a transducer module, which includes an actuator that is directly or indirectly coupled to a vibration plate. The transducer module includes a plastic damper that elastically secures the vibration plate to a frame. | 03-14-2013 |
20130069483 | TRANSDUCER AND TRANSDUCER MODULE - Transducers and transducer modules having the transducers are disclosed. An embodiment discloses a transducer that includes a conductive layer having a U-shaped slit toward its swing end. The slit is configured to enhance a haptic feedback or an acoustic propagation, or adjust a resonant mode. | 03-21-2013 |
20130099907 | METHOD OF GENERATING 3D HAPTIC FEEDBACK AND AN ASSOCIATED HANDHELD ELECTRONIC DEVICE - The present invention is directed to a method of generating three dimensional (3D) haptic feedback and an associated handheld electronic device. A first, a second and a third directional actuator groups are disposed on an inner surface of a housing. The vibration inertial forces generated by the first, the second, and the third directional actuator groups are parallel with the first, the second and the third axial directions respectively. The first, the second, and the third directional actuator groups are individually or in combination driven, thereby generating haptic feedback. | 04-25-2013 |
20130100046 | HAPTIC FEEDBACK MODULE - The present invention is directed to a haptic feedback module, which includes a vibration plate, and at least one first actuator that is disposed along a lateral surface of the circumference of the vibration plate. The vibration plate contacts with a top plate member. When the first actuator presses the vibration plate, the vibration energy of the vibration plate is transferred to the top plate member to result in haptic feedback. | 04-25-2013 |
20130177182 | VIBRATION SPEAKER - A vibration speaker includes a top cover, a bottom cover, at least one transducer plate and at least one conductive connector. The top cover and the bottom cover define a space to accommodate the transducer plate and the conductive connector. Each transducer plate includes a conductive plate, a first smart material layer coated on a first surface of the conductive plate, and a first electrode layer formed on the first smart material layer. The conductive connector presses on the transducer plate, wherein an insulating layer is coated on an area between the first surface and the conductive connector but excluding the first electrode layer, such that the conductive connector electrically contacts the first electrode layer but is insulated from the conductive plate. | 07-11-2013 |
20130177183 | VIBRATION SPEAKER - A vibration speaker includes a top cover, a bottom cover, at least one transducer plate and at least one conductive connector. The top cover and the bottom cover define a space to accommodate the transducer plate and the conductive connector. Each transducer plate includes a conductive plate, a first smart material layer coated on a first surface of the conductive plate, and a first electrode layer formed on the first smart material layer. The conductive connector presses on the transducer plate, wherein an insulating layer is coated on an area between the first surface and the conductive connector but excluding the first electrode layer, such that the conductive connector electrically contacts the first electrode layer but is insulated from the conductive plate. | 07-11-2013 |