Patent application number | Description | Published |
20130009174 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
20130009175 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
20130161491 | OPTICAL TOUCH CONTROL MODULE - An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one second oscillating reflecting element oscillating depending on time. | 06-27-2013 |
20130162597 | OPTICAL TOUCH CONTROL MODULE - An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the at least one sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one lens element. | 06-27-2013 |
20130234272 | IMAGE-SENSING MODULE - An image-sensing module includes a substrate unit, a light-transmitting unit, an image-sensing unit and a lens unit. The substrate unit includes at least one flexible substrate having at least one through opening. The light-transmitting unit includes at least one light-transmitting element disposed on the top surface of the flexible substrate and corresponding to the through opening. The image-sensing unit includes at least one image-sensing element disposed on the bottom surface of the light-transmitting element and embedded in the through opening, and the image-sensing element is electrically connected to the flexible substrate. The lens unit includes an opaque frame disposed on the top surface of the flexible substrate to surround the light-transmitting element and a lens positioned on the opaque frame to correspond to the light-transmitting element. | 09-12-2013 |
20130307105 | IMAGE-SENSING MODULE FOR REDUCING ITS WHOLE THICKNESS - An image-sensing module for reducing its whole thickness includes a substrate unit, a carrier unit, an image-sensing unit and a lens unit. The substrate unit includes a substrate body and a through opening passing through the substrate body. The carrier unit includes a carrier body disposed on the bottom surface of the substrate body and corresponding to the through opening. The image-sensing unit includes an image-sensing element disposed on the top surface of the carrier body and embedded in the through opening. The lens unit includes an opaque frame disposed on the top surface of the carrier body to surround the image-sensing element and a lens connected to the opaque frame and positioned above the image-sensing element. Hence, the whole thickness of the image-sensing module can be reduced due to the design of placing the substrate body, the image-sensing element and the opaque frame on the carrier body. | 11-21-2013 |
20140125756 | AUDIOVISUAL APPARATUS FOR REDUCING ECHO - The present disclosure relates to an audiovisual apparatus, which includes an audiovisual capturing unit, an audiovisual broadcast unit, and a transmission cable module. The two ends of the transmission cable module are respectively connected to the audiovisual capturing unit and the audiovisual broadcast unit. The transmission cable module has a video cable group for transmitting video signals and an audio cable group for transmitting audio signals suitable for reducing echo. The audio cable group includes a cable for providing a digital clock for the audio signal, a cable for providing a clock for the left right channel switching audio signal, a cable for inputting serial audio signal, and a cable for outputting serial audio signal. With this arrangement, the audio signals captured by the audiovisual capturing unit and transmitted by the transmission cable module to the audiovisual broadcast unit can be effectively removed of echo. | 05-08-2014 |
20150048386 | IMAGE SENSING MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element. | 02-19-2015 |
20150053849 | SENSOR PACKAGE STRUCTURE AND PRODUCTION APPARATUS FOR MANUFACTURING THE SAME - A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure. | 02-26-2015 |