Chi-Chia
Chi-Chia Huang, Taipei TW
Patent application number | Description | Published |
---|---|---|
20090058393 | CONSTANT-CURRENT, CONSTANT-VOLTAGE AND CONSTANT-TEMPERATURE CURRENT SUPPLY OF A BATTERY CHARGER - Provided is a current supply for providing a charge current to a load. The current supply includes: a driving transistor, providing the charge current to the load; a sensing transistor, limiting the charge current; a pulling low transistor, pulling low a controlling node which controls the driving transistor and the sensing transistor; a constant voltage controller, pulling up the controlling node, controlling the conduction state of the driving transistor and accordingly maintaining the voltage across the load at the first reference voltage, when a voltage across the load rises up and comes close to a first reference voltage; and a constant current controller, controlling the controlling node and the pulling low transistor to limit the charge current to be constantly provided to the load, when the voltage across the load drops much lower than the first reference voltage. | 03-05-2009 |
20090058512 | PROCESS INDEPENDENT CURVATURE COMPENSATION SCHEME FOR BANDGAP REFERENCE - In a voltage reference circuit, a bandgap reference circuit, for generating a bandgap reference voltage and a reference current, includes an operation amplifier, and a first transistor for providing the reference current. Another transistor mirrors the reference current to provide a first current. A compensation controller converts a node voltage from the bandgap reference circuit into a second current and performs current subtraction on the first current and the second current to provide a compensation feedback current to another node of the bandgap reference circuit. So that, second order temperature compensation is performed on the bandgap reference voltage. | 03-05-2009 |
Chi-Chia Huang, Hsinchu TW
Patent application number | Description | Published |
---|---|---|
20130032939 | CHIP PACKAGE STRUCTURE - A chip package structure includes a flexible substrate having a chip mounting region, a plurality of leads disposed on the flexible substrate, an insulating layer and a chip. Each lead includes a body portion and an inner lead portion connected to each other. The body portion is located outside the chip mounting region and has a thickness greater than that of the inner lead portion. The insulating layer is disposed on the inner lead portions. The chip has an active surface on which a plurality of bumps and a seal ring adjacent to the chip edges are disposed. The chip is mounted within the chip mounting region and electrically connects the flexible substrate by connecting the inner lead portions of the leads with the bumps. The insulating layer is corresponding to the seal ring in position when the chip is electrically connected to the flexible substrate. | 02-07-2013 |
20130069228 | FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOF - A flip-chip package structure comprising a substrate, a chip, a bump structure and a solder resist is provided. The substrate has a circuit layer disposed on the surface thereof. The chip comprises a central region and two edge regions disposed on the two sides of the central region. The bump structure is disposed on the central region of the chip and faces the substrate. The solder resist is disposed on the substrate to partially cover the circuit layer. The chip is electrically connected to the substrate by the bump structure, and the solder resist is adapted to come into contact with the two edge regions of the chip to support the chip with the bump structure when the chip is disposed on the substrate. | 03-21-2013 |
Chi-Chia Lin, Tainan City TW
Patent application number | Description | Published |
---|---|---|
20130002811 | THREE-DIMENSIONAL IMAGING METHOD USING SINGLE-LENS IMAGE-CAPTURE APPARATUS AND THREE-DIMENSIONAL IMAGE ENHANCEMENT METHOD BASED ON TWO-DIMENSIONAL IMAGES - A three-dimensional (3D) imaging method using one single-lens image-capture apparatus, comprising: deriving a first two-dimensional (2D) image with the single-lens image-capture apparatus; deriving a depth map corresponding to the first 2D image; synthesizing a view synthesized image according to the depth map and the first 2D image; and deriving a second 2D image with the single-lens image-capture apparatus according to the view synthesized image, wherein the first 2D image and the second 2D image are utilized for 3D image display. | 01-03-2013 |