Patent application number | Description | Published |
20100128444 | HEAT-DISSIPATED FASTENER AND ELASTIC FRAME THEREOF - A heat-dissipated fastener including a heat-dissipated plate, an elastic frame and a heat sink module is provided. The elastic frame includes a sheet element, multiple connecting ribs and multiple attaching portions. Two elastic arms extend from two corresponding sides of the sheet element, respectively. The attaching portions are located below the sheet element and attached to the heat-dissipated plate. The connecting ribs are connected to the attaching portion and the sheet element, and an accommodating space is formed by the connecting ribs, the sheet element and the heat-dissipated plate to accommodate the heat sink module. When the heat-dissipated plate is attached to the heat source and the elastic arms are bent and fixed to the circuit board of the heat source, the connecting ribs exert force on the heat-dissipated plate vertically, respectively. | 05-27-2010 |
20120138284 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device. | 06-07-2012 |
20120170209 | HEAT DISSIPATING DEVICE AND PORTABLE ELECTRONIC DEVICE USING THE SAME - A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps. | 07-05-2012 |
20130039011 | HEAT-DISSIPATING MODULE - A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure. | 02-14-2013 |
20140043763 | PORTABLE ELECTRONIC DEVICE AND SYSTEM - A portable electronic system includes a portable device and a mobile device. The portable device includes a base, a bearing seat, and a connecting element. The base includes a fan and at least one first opening. The bearing seat includes at least one second opening. The connecting element connects the base and the bearing seat and includes a passage. The mobile device is detachably disposed at the bearing seat and includes at least one third opening. The base and the mobile device have corresponding passage and openings to bring heat airflow from inside of the mobile device to outside of the mobile device. | 02-13-2014 |
20140146472 | ELECTRONIC DEVICE - An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover. | 05-29-2014 |
20140168893 | HEAT DISSIPATION APPARATUS WITH ANTENNA AND ELETRONIC SYSTEM APPLIED THE SAME - A heat dissipation apparatus with an antenna is provided. The heat dissipation apparatus includes a housing, a heat-insulation structure, a fan and an antenna. The heat-insulation structure is disposed on the housing and the heat-insulation structure has a plurality of heat dissipation holes. The fan is disposed in the housing and an air exhaust channel is formed between the fan and the heat-insulation structure. The antenna is disposed in the air exhaust channel. | 06-19-2014 |
20140290914 | HEAT PIPE STRUCTURE - A heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined in the hollow tube body. The capillary structure is disposed on the first region. A diameter of the second region is larger than a diameter of the first region. | 10-02-2014 |
20150016061 | CENTRIFUGAL FAN MODULE AND ELECTRONIC DEVICE USING THE CENTRIFUGAL FAN MODULE - A centrifugal fan module comprising a fan housing and an impeller is provided. The fan housing includes an air inlet and a sidewall. The sidewall is pivotally disposed in the fan housing to rotate in the rotational direction relative to the fan housing. A tongue portion is formed between the sidewall and the impeller, a pressurized region is formed from the tongue portion along the rotational direction to the air outlet, the pressurized region includes a strong airflow region and the dust-discharging hole is in the strong airflow region. | 01-15-2015 |