Cheng-Tang
Cheng Tang Cheng, Hsinchu City TW
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20120066476 | MICRO-OPERATION PROCESSING SYSTEM AND DATA WRITING METHOD THEREOF - A data writing method and a micro-operation processing system are provided. The micro-operation processing system is adapted to access a plurality of registers and each of the registers defines at least one logic storing area. The data writing method comprises the following steps: executing a first micro-operation; selecting a target area of the first micro-operation, which has been updated by the second micro-operation before, as one of the logic storing areas; assigning each of the first micro-operation and the second micro-operation a respective identification number; determining that a execution order of the first micro-operation is later than a execution order of the second micro-operation according to the identification numbers of the first micro-operation and the second micro-operation; and recording that the target area has been updated by the first micro-operation. | 03-15-2012 |
Cheng Tang Huang US
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20120309186 | CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME - A conductive structure for a semiconductor integrated circuit and method for forming the conductive structure are provided. The semiconductor integrated circuit has a pad and a passivation layer partially covering the pad to define a first opening portion having a first lateral size. The conductive structure electrically connects to the pad via the first opening portion. The conductive structure comprises a support layer defining a second opening portion. A conductor is formed in the second opening portion to serve as a bump having a planar top surface. | 12-06-2012 |
Cheng Tang Huang, Hsinchu TW
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20110291273 | CHIP BUMP STRUCTURE AND METHOD FOR FORMING THE SAME - A chip bump structure is formed on a substrate. The substrate includes at least one contact pad and a dielectric layer. The dielectric layer has at least one opening. The at least one opening exposes the at least one contact pad. The chip bump structure includes at least one elastic bump, at least one first metal layer, at least one second metal layer, and at least one solder ball. The at least one elastic bump covers a central portion of the at least one contact pad. The at least one first metal layer covers the at least one elastic bump. The at least one first metal layer has a portion of the at least one contact pad. The portion of the at least one contact pad is not overlaid by the at least one elastic bump. The at least one second metal layer is formed on a portion of the at least one first metal layer. The portion of the at least one first metal layer is located on the top of the at least one elastic bump. The at least one solder ball is formed on the at least one second metal layer. The at least one solder ball is also on the top of the at least one elastic bump. | 12-01-2011 |
20130049197 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of semiconductor package structure includes: providing a first dielectric layer having multiple through holes; providing a second dielectric layer having multiple conductive vias and a chip-containing opening; laminating the second dielectric layer onto the first dielectric layer; disposing a chip in the chip-containing opening and adhering a rear surface of the chip onto the first dielectric layer exposed by the chip-containing opening; forming a redistribution circuit layer on the second dielectric layer wherein a part of the redistribution circuit layer extends from the second dielectric layer onto an active surface of the chip and the conductive vias so that the chip electrically connects the conductive vias through the partial redistribution circuit layer; forming multiple solder balls on the first dielectric layer wherein the solder balls are in the through holes and electrically connect the chip through the conductive vias and the redistribution circuit layer. | 02-28-2013 |
20130049198 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor package structure is provided. A chip is provided. An active surface of the chip is disposed on a carrier. A molding compound is formed on the carrier with a metal layer disposed thereon. The metal layer has an upper and lower surface, multiple cavities formed on the upper surface and multiple protrusions formed on the lower surface and corresponding to the cavities. The protrusions are embedded in the molding compound. The metal layer is patterned to form multiple pads on a portion of the molding compound. The carrier and the molding compound are separated. Multiple through holes are formed on the molding compound exposing the protrusions. A redistribution layer is formed on the molding compound and the active surface of the chip. Multiple solder balls are formed on the redistribution layer. A portion of the solder balls are correspondingly disposed to the pads. | 02-28-2013 |
Cheng-Tang Chang, New Taipei City TW
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20150214989 | SUPPORT BASE FOR ELECTRONIC DEVICE - A support base for an electronic device includes a base, a trigger mechanism and an operating mechanism. The base includes a limit rib. The trigger mechanism includes a trigger member and a swing member. The trigger member is movably disposed on the base and therefore has an untriggered position and a triggered position. The swing member is pivoted on the trigger member and therefore has a pressed position and a room-making position. The operating mechanism is movably disposed on the base and therefore has a first operating position and a second operating position. The operating mechanism has an operating end and a moving end opposite to each other. The moving end corresponds to the swing member and is used for rotating relative to the operating end. When the operating mechanism is at the first operating position, the moving end of the operating mechanism is hooked at the limit rib. | 07-30-2015 |
Cheng-Tang Chen, Sansia Township TW
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20080265736 | LED REFLECTIVE SPHERICAL LAMP - A LED reflective spherical lamp is disclosed. The spherical lamp comprises a transparent spherical lamp hood, a leading LED beam assembly, a linkage of the leading LED beam assembly, a heat dissipation block having good thermal conductivity and a securing base, characterized in that the leading LED beam assembly comprises a threaded connection tube, a converging lense and a conductive base board for mounting LED, and the threaded connection tube screws to a screw hole at the bottom of the transparent spherical lamp hood and the threaded connection tube extends into a tube opening of the lamp hood, overlappingly connecting the converging lense, the other end of the threaded tube is a peg tube wall for peggingly connection of a corresponding recess of the conductive base board such that the LED on the conductive base board face the converging lense, and the other end of the conductive base board mounting the LED is connected to the heat dissipation block, and then is secured with the securing base, thereby when LED is lighted, LED beams pass through the transparent lense into the lamp hood such that the entire lamp hood is lighted. | 10-30-2008 |
20080266847 | TUBULAR LAMP DEVICE USING LED - The tubular lamp device contains a passive and transparent lamp tube whose two ends are plugged into a pair of socket members, respectively. The lamp tube has an axial strip along the circumference coated with a reflective film. The socket member contains a tubular element which receives an end of the lamp tube. Inside the tubular element, a LED element is housed in a hole of a solid lens element which directs the light beams of the LED element towards the lamp tube. The light beams are then reflected by the reflective film to create a large area of illumination as the light beams propagate through the lamp tube. | 10-30-2008 |
20100214778 | TABLE LAMP - The table lamp contains a lamp base and an extension tube plugged vertically into the lamp base. A curved transparent light tube is attached along its entire length to a parallel and also curved back cover. The combination is joined to a top end of the extension tube. Two light generation assemblies are provided at the two ends of the light tube, respectively, each sequentially composed of a lens, a lens ring, a light emitting diode, a power circuit, a heat dissipation plate, and a heat dissipation element. The light from the light emitting diodes is projected into the light tube and, with a reflection layer along the inner wall of the light tube, the light is uniformly reflected towards the area beneath the table lamp. | 08-26-2010 |
Cheng-Tang Chiang, Nantou County TW
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20120024061 | TRACK MEASUREMENT APPARATUS FOR SPORTS SHOES - A track measurement apparatus for sports shoes includes a first accelerometer module located at a rear side of a sole of a shoe and a second accelerometer module located at a front side of the sole of the shoe to measure acceleration alterations of the shoe worn by a user in striding forwards during running, and also derive alterations of angular velocity and angle while the shoe is stridden forwards to get motion status of the shoe. | 02-02-2012 |
20120029388 | FORCE BEARING MONITOR APPARATUS FOR SPORTS SHOES - A force bearing monitor apparatus for sports shoes includes a first accelerometer module located at a rear end of a sole of a shoe and a second accelerometer module located at a front end of the sole to measure alterations of a first acceleration and a second acceleration borne by the shoe when a user is stridden and stepped during running. Through generation sequence of the alterations of the first and second accelerations, an exercise mode is determined. And through processing of a first signal processing unit and an interrelation processing unit, a first reacting force and a second reacting force are derived, and the ratio of the first and second reacting forces is obtained to serve as a control factor to adjust softness and hardness of the sole. According to the exercise mode, the softness and hardness of the sole can be made in response to the ground. | 02-02-2012 |
Cheng-Tang Huang, Hsinchu City TW
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20090302448 | Chip Stacked Structure and the Forming Method - A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encapsulated structure; a patterned first protective layer is formed on the portion surface of encapsulated structure, the portion of active surface of the chips, and the pads of the chip and the through holes are to be exposed; a metal layer is formed on the portion surface of the patterned first protective layer and formed to electrically connect the pads and to fill with the through holes; the patterned second protective layer is formed on the patterned first protective layer and the portion of metal layer, and the portion surface of metal layer is to be exposed; a patterned UBM layer is formed on the exposed surface of the metal layer and the portion surface of the patterned second protective layer; and the conductive elements is formed on the patterned UBM layer and electrically connect to the metal layer. | 12-10-2009 |
20090302465 | DIE REARRANGEMENT PACKAGE STRUCTURE AND METHOD THEREOF - A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer. | 12-10-2009 |
20110003431 | METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD - A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer. | 01-06-2011 |
Cheng-Tang Wu, Livermore, CA US
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20120226482 | NUMERICAL SIMUALTION OF STRUCTURAL BEHAVIORS USING A MESHFREE-ENRICHED FINITE ELEMENT METHOD - System, method and software product for numerically simulating structural behaviors of an engineering product in compressible and near-incomprssible region is disclosed. Meshfree enriched finite element method (ME-FEM) is used for such numerical simulation. ME-FEM requires an engineering product be represented by a FEM model comprising a plurality of finite elements. Finite elements used in the ME-FEM are generally low-order finite elements. Each of the finite elements in the FEM model is enriched by at least one meshfree enriched (ME) node located within the element's domain. Each ME node has additional degrees-of-freedom for the element it belongs independent from those of the corner nodes. A displacement based first-order convex meshfree approximation is applied to the ME node. The convex meshfree approximation has Knonecker-delta property at the element's boundary. The gradient matrix of ME-FEM element satisfies integration constraint. ME-FEM interpolation is an element-wise meshfree interpolation that is discrete divergence-free at the incompressible limit. | 09-06-2012 |
20130085727 | Numerically simulating structural behaviors of embedded bi-materials using meshfree method - Methods and systems for numerically simulating structural behaviors of embedded bi-materials are disclosed. At least first and second grid models are created independently for an embedded bi-material that contains an immersed material embedded entirely within a base material. First group of meshfree nodes represents the entire domain (i.e., base plus immersed materials). Second group of meshfree nodes represents the immersed or embedded material, which includes all interface nodes and nodes located within a space bordered by the material interface. Numerical structural behaviors of the embedded bi-material are simulated using the first and second set of meshfree nodes with a meshfree method that combines two meshfree approximations. The first meshfree approximation covers the first set of meshfree nodes and is based on properties of the base material, while the second meshfree approximation covers the second set of meshfree nodes and is based on a differential between the immersed and base materials. | 04-04-2013 |
20150112653 | Smoothed Particle Galerkin Formulation for Simulating Physical Behaviors in Solids Mechanics - Methods and systems for conducting numerical simulation of structural behaviors in solid mechanics using smoothed particle Galerkin formulation are disclosed. A meshfree model representing a physical domain defined by a plurality of particles is received in a computer system. Each particle is configured for material properties of portion of the physical domain it represents. A smoothed displacement field of the physical domain subject to defined boundary condition is obtained by conducting a time-marching simulation using the meshfree model based on smoothed particle Galerkin formulation. The smoothed displacement field is derived from a set of smoothed meshfree shape functions that satisfies linear polynomial reproduction condition. The set of smoothed meshfree shape functions is constructed by convex meshfree approximation scheme and configured to avoid calculation second order derivatives. The set of smoothed meshfree shape functions is a combination of regular meshfree shape function and a displacement smoothing function for the particles. | 04-23-2015 |