Patent application number | Description | Published |
20090257089 | Method and System for Managing Print Jobs for a Shared Printer - The present invention provides a method and system for managing print jobs for a shared printer. The system comprises a plurality of computers, a hub and a printer. Each of the computers coupled to the hub store a print control program for generating print jobs and sending the print jobs to the printer through the hub in response to print requests received from the computers automatically. The print control program generates an error printing control function when the printer fails to process the print jobs, and a temporary storage function when the printer is busy. | 10-15-2009 |
20110191616 | USB POWER MANAGING SYSTEM AND METHOD THEREOF - The present invention relates to a USB power managing system and a method thereof, the USB power managing system comprises an USB peripheral device and an USB interface, wherein the USB interface includes: a micro controlling unit; a data switch coupled to the micro controlling unit; an USB connecting unit coupled to the data switch; and a power switch coupled to the micro controlling unit and the USB connecting unit; wherein when the USB peripheral device is coupled to the USB connecting unit, the micro controlling unit switches the power switch for providing a power the USB peripheral device through the USB connecting unit; moreover when the USB peripheral device enters a standby mode, the micro controlling unit turns off the power switch for stopping providing the power to the USB peripheral device. | 08-04-2011 |
20110300755 | CABLE CONNECTING DEVICE ASSEMBLY AND MANUFACTURING METHOD THEREOF - The present invention relates to an improved cable connecting device assembly and a manufacturing method thereof, the improved cable connecting device assembly comprises: an electrical connector, a first circuit board, a second circuit board, at least one plugging member, at least one cable, a sheltering housing, and an outer housing, wherein the first circuit board and the second circuit board both having electronic circuits and electronic components are connected to the electrical connector, so as to facilitate the improved cable connecting device assembly possess not only the function of video signal transmission but more other functions; moreover, through the manufacturing method, the improved cable connecting device assembly is fabricated and has not only the function of video signal transmission but more other functions, besides, the whole thickness of the improved cable connecting device assembly is not increased. | 12-08-2011 |
20120137228 | POINT-TO-POINT FILE TRANSMITTING DEVICE AND FILE TRANSMITTING METHOD THEREOF - The present invention relates to a point-to-point file transmitting device and a file transmitting method thereof, the point-to-point file transmitting device comprises: at least one first USB connecting unit, at least one second USB connecting unit, at least one micro-control unit, and a network transmission application, wherein the first USB connecting unit connects to a first host, the second USB connecting unit connects to a second host, and the network transmission application are respectively installed in the first host and the second host; so that, through the network transmission application, a network transmission channel is established between the first host and the second host used for files sharing and data transmission. Besides, by way of the file transmitting method, the files sharing and data transmission can be completed between the first host and the second host when the network transmission applications installed in the two hosts are executed. | 05-31-2012 |
Patent application number | Description | Published |
20110131460 | METHOD FOR REPAIRING IMAGE - A method for repairing an image is disclosed. To repair an image, the method first applies a statistic method based on a plurality of reference data to generate a predicted value range. Then repairing data having values in the predicted value range is generated to repair the image. The reference data of low correlation is filtered out to enhance the quality of a repaired image. | 06-02-2011 |
20110142139 | DEVICE FOR DECODING AUDIO AND VIDEO DATA - A device for decoding AV data is provided. The device includes a plurality of sub-buffers to store video data, audio data and subtitle data, so that a data-decoding procedure can be efficiently performed. Besides, a method for providing each picture's information in video data is disclosed. According to the compression standard of the AV data, the method applies a corresponding procedure to provide each picture's information in video data. The picture information is useful to help a decoding unit to correctly decode the video data, so as to generate pictures. | 06-16-2011 |
20110194601 | VIDEO DECODING DEVICE - A video decoding device is provided. The device includes an error checking unit and a decoding unit. The error checking unit checks the error state of a video data, so as to produce an error information. Then, the decoding unit selectively performs an error concealment process and a decoding process for the video data according to the error information. The video decoding device of the present invention can perform error checking process, error concealment process, and video decoding process for the video data. | 08-11-2011 |
Patent application number | Description | Published |
20130161796 | THROUGH SILICON VIA AND METHOD OF FORMING THE SAME - The present invention relates to a through silicon via (TSV). The TSV is disposed in a substrate including a via opening penetrating through a first surface and a second surface of the substrate. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. The insulation layer is disposed on the surface of the via opening. The barrier layer is disposed on the surface of the insulation layer. The conductive electrode is disposed on the surface of the buffer layer and fills the via opening. The buffer layer further covers a surface of the conductive electrode at the side of the second surface. The present invention further discloses a method of forming the TSV. | 06-27-2013 |
20130256843 | WAFER SAWING METHOD AND WAFER STRUCTURE BENEFICIAL FOR PERFORMING THE SAME - A wafer sawing method comprises steps as follows: A wafer having a first surface and a second surface is firstly provided. An integrated circuit fabricating process is performed on the first surface of the wafer to define a first integrated circuit region and a periphery region surrounding around the first integrated circuit region, wherein the integrated circuit fabricating process includes an etching process used to form a first deep trench having an aspect ratio larger than 10 as well as a depth substantially ranging from one-third to two-third thickness of the wafer on the periphery region. Subsequently, an adhesive tape is disposed on the first surface at least covering the first integrated circuit region and the periphery region. A tensile stress is then imposed on the adhesive tape in order to make the wafer broken off along the first deep trench. | 10-03-2013 |
20130270712 | Through silicon via structure and method of fabricating the same - A through silicon via structure and a method of fabricating the through silicon via structure are disclosed. After an interlayer dielectric is formed, a via hole is then formed to pass through the interlayer dielectric; thereafter, a dielectric liner is formed within the via hole and extends onto the interlayer dielectric; thereafter, the via hole is filled with a conductive material; and a chemical-mechanical polishing process is performed to planarize the conductive material, using the dielectric liner on the interlayer dielectric as a stop layer of the chemical-mechanical polishing process. | 10-17-2013 |
20130299949 | Through Silicon Via and Method of Forming the Same - The present invention relates to a through silicon via (TSV). The TSV is disposed in a substrate including a via opening penetrating through a first surface and a second surface of the substrate. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. The insulation layer is disposed on a surface of the via opening. The barrier layer is disposed on a surface of the insulation layer. The buffer layer is disposed on a surface of the barrier layer. The conductive electrode is disposed on a surface of the buffer layer and a remainder of the via opening is completely filled with the conductive electrode. A portion of the buffer layer further covers a surface of the conductive electrode at a side of the second surface and said portion is level with the second surface. | 11-14-2013 |
20130337645 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE - A method of processing a substrate is provided. The method includes: providing a substrate, wherein the substrate includes a silicon layer; etching the substrate to form a cavity; filling a first conductor in part of the cavity; performing a first thermal treatment on the first conductor; filling a second conductor in the cavity to fill-up the cavity; and performing a second thermal treatment on the first conductor and the second conductor. | 12-19-2013 |
20130341799 | Through silicon via structure and method of fabricating the same - A method of fabricating a through silicon via (TSV) structure is provided, in which, a first dielectric layer is formed on the substrate, the first dielectric layer is patterned to have at least one first opening, a via hole is formed in the first dielectric layer and the substrate, a second dielectric layer is conformally formed on the first dielectric layer, the second dielectric layer has at least one second opening corresponding to the at least one first opening, and the second dielectric layer covers a sidewall of the via hole. A conductive material layer is formed to fill the via hole and the second opening. The conductive material layer is planarized to form a TSV within the via hole. A TSV structure is also provided, in which, the second dielectric layer is disposed within the first opening and on the sidewall of the via hole. | 12-26-2013 |
20140175527 | SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF - A semiconductor structure includes a gate, a dual spacer and two recesses. The gate is located on a substrate. The dual spacer is located on the substrate beside the gate. The recesses are located in the substrate and the dual spacers, wherein the sidewall of each of the recesses next to the gate has a lower tip and an upper tip, and the lower tip is located in the substrate while the upper tip is an acute angle located in the dual spacer and close to the substrate. The present invention also provides a semiconductor process formed said semiconductor structure. | 06-26-2014 |
20140273368 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A method of manufacturing a semiconductor device including the steps of providing a substrate having first type semiconductor regions and second type semiconductor regions, forming a conformal first epitaxy mask layer on the substrate, forming first type epitaxial layer in the substrate of the first type semiconductor regions, forming a conformal second epitaxy mask layer on the substrate, forming second type epitaxial layer in the substrate of the second type semiconductor regions, and removing the second epitaxy mask layer. | 09-18-2014 |
20150041961 | Through silicon via structure - A through silicon via structure is disclosed. The through silicon via includes: a substrate; a first dielectric layer disposed on the substrate and having a plurality of first openings, in which a bottom of the plurality of first openings is located lower than an original surface of the substrate; a via hole disposed through the first dielectric layer and the substrate, in which the via hole not overlapping for all of the plurality of first openings; a second dielectric layer disposed within the plurality of first openings and on a sidewall of the via hole while filling the plurality of first openings; and a conductive material layer disposed within the via hole having the second dielectric layer on the sidewall of the via hole, thereby forming a through silicon via. | 02-12-2015 |
Patent application number | Description | Published |
20090003371 | METHOD FOR TRANSMITTING PACKET AND NETWORK SYSTEM THEREOF - A method for transmitting packets and a network system thereof are provided. In the present invention, each packet entering the network system is added an assigning tag to indicate the arrival time of the packet, and at least two queues in a node of the network system are used for respectively sorting the local packets of the node and the relayed packets of the preceding node. The order of the packet for transmitting can be decided by comparing the assigning tags of the two packets positioned at first order in different queues. Therefore, a condition of First-In First-Out (FIFO) is satisfied in the network system, and the sequence for transmitting packets is arbitrated fair. | 01-01-2009 |
20090055909 | DATA TRANSMITTING METHOD WITH MULTIPLE TOKEN MECHANISM IN WIRELESS TOKEN RING PROTOCOL - A data transmission method with multiple token mechanism in wireless token ring protocol is provided. First, (a) a logical ring with M nodes is provided; (b) a k-th node is selected from the logical ring, and a token in the k-th node is generated; (c) a first message is sent to a (k+1)-th node from the k-th node with the token, and whether the (k+1)-th node responds a second message is judged, if yes, the data to be transmitted is transmitted from the k-th node, otherwise, the token of the k-th node is eliminated; (d) the token is sent to the (k+1)-th node from the k-th node after completing the transmission of the transmitted data of the k-th node, a generation token sequence is generated in a i-th node, and sent to a (i−1)-th node; and (e) the token is generated for the (i−1)-th node with the generation token sequence. | 02-26-2009 |
20100135196 | COMMUNICATION SYSTEMS AND METHODS WITH RESOURCE MANAGEMENT FOR OVERLAPPING MULTICAST AND BROADCAST SERVICE ZONES - A method for providing resource allocation in a communication network includes identifying at least two broadcast zones for receiving broadcast services in the communication network and generating a first index based on a relative relationship among the at least two broadcast zones. The first index includes information indicative of whether a first broadcast zone overlaps with at least one other broadcast zone. The method further includes generating a second index based on the relative relationship among the at least two broadcast zones; assigning at least one identifier to each of the at least two broadcast zones based on the first index and the second index; and enabling data transmissions to the at least two broadcast zones based on the assigned identifiers and using the at least one communication resource associated with the identifiers. The second index may include information indicative of a number of broadcast zones overlapped with the first broadcast zone. Each identifier may be associated with at least one communication resource, with distinct identifiers being assigned to overlapping broadcast zones of the at least two broadcast zones. | 06-03-2010 |
20100182906 | CALL ADMISSION CONTROLLER AND METHOD THEREOF AND MULTI-HOP WIRELESS BACKHAUL NETWORK SYSTEM USING THE SAME - A method for managing a call admission controller in a multi-hop wireless backhaul network is illustrated. The method provides a call access control mechanism in a multi-hop wireless backhaul network system by calculating at least one service quality parameter in the network and determining if service data transmitted from relay nodes is allowed to enter a gateway of the network according to the at least one service quality parameter. In exemplary embodiments of present invention, the service quality parameter includes a throughput, an average delay of packets, a number of remote devices, a packet loss rate, a number of the relay nodes, and an amount of service data of a specific class traffic in the network. A topology of the network may be a ring, a chain, or a tree topology, and a ripple protocol is utilized as media access control protocol in the network. | 07-22-2010 |
20100189025 | METHOD AND APPARATUS FOR RECEIVING FEEDBACK CORRESPONDING TO MULTICAST BROADCAST SERVICE - The invention is directed to a method for receiving a feedback for at least a multicast broadcast service flow transmitting to a plurality of subscriber stations. The method comprises steps of assigning a plurality of code division multiple access (CDMA) codes to a feedback corresponding to the multicast broadcast service flow and then performing an allocation process for allocating a feedback channel for the subscriber stations. Thereafter, an announcement process is performed to announce a multiple feedback condition, the CDMA codes and the feedback channel to the subscriber stations. A channel monitoring process is performed for receiving a negative-acknowledgment (NACK)-based feedback sending from one of the subscriber stations unsatisfied with the multiple feedback condition and the NACK-based feedback is in a form of one of CDMA codes corresponding to the multicast broadcast service flow and is transmitted through the feedback channel. | 07-29-2010 |
20120213099 | METHOD AND SYSTEM FOR DYNAMICALLY ADAPTING A MODULATION AND CODING SCHEME - The invention is directed to a method for dynamically adapting a modulation and coding scheme for a base station transmitting a multicast-and-broadcast service to a plurality of subscribers. The method comprises periodically performing a transmission adapting process. The transmission adapting process comprises steps of setting a feedback condition according to a coverage corresponding to the multicast-and-broadcast service and sending a negative-acknowledge-based feedback query including the feedback condition, a feedback channel and feedback information corresponding to the multicast-and-broadcast service to the subscribers. According to a feedback-receiving status, the base station adapts a modulation and coding scheme for transmitting the multicast-and-broadcast service. | 08-23-2012 |
20120213100 | METHOD FOR SELECTING TRANSMISSION ARCHITECTURE AND TRANSMISSION SYSTEM - A method for a transmission system selecting one of a plurality of transmission architectures to transmit a multicast-and-broadcast service is provided. The transmission system comprises at least one base station participating the transmission of the multicast-and-broadcast service. The method comprises recording a number of subscribers for subscribing the multicast-and-broadcast service within the coverage range of each of the base stations. According to the subscriber number and the number of the base stations, each of the transmission architectures is mapped to average cell efficiency. The average cell efficiency of each of the transmission architectures is analyzed. The transmission architecture corresponding to the maximum average cell efficiency is selected for the transmission system transmitting the multicast-and-broadcast service. | 08-23-2012 |
20140328258 | DYNAMIC RESOURCE ALLOCATION METHOD - A dynamic resource allocation method is introduced herein. The method is adapted to a base station. The method includes the following steps. A number of contending devices in the random access slot is estimated. A reference value is calculated according to the number of the contending devices and a resource allocation parameter. A number of specific resources is calculated according to the number of the contending devices, a number of acknowledgeable machine-type communication devices of the base station at the random access slot and a preamble detection probability. A number of reserved random access opportunities is determined according to a maximum number of the random access opportunities, the number of the specific resources and the reference value. The resources are allocated to the at least one machine-type communication device according to the number of the reserved random access opportunities. | 11-06-2014 |