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Cheng, Hsinchu City

C. H. Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080217719Method For Reducing Crosstalk In Image Sensors Using Implant Technology - The present disclosure provides an image sensor semiconductor device. A semiconductor substrate having a first-type conductivity is provided. A plurality of sensor elements is formed in the semiconductor substrate. An isolation feature is formed between the plurality of sensor elements. An ion implantation process is performed to form a doped region having the first-type conductivity substantially underlying the isolation feature using at least two different implant energy.09-11-2008

Chang-Kai Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100306454ELECTRONIC DEVICES AND OPERATION METHODS OF A FILE SYSTEM - An operation method of file system includes retrieving the first header of the first file, adding the auxiliary data to the first header to generate the second header, writing the dummy data into the second header to adjust the data length of the second header, thereby serving as the third header, and modifying the link relation of clusters recorded in the file allocation table such that the third header and the second data segment are linked together, thereby generating the second file.12-02-2010
20130145078METHOD FOR CONTROLLING MEMORY ARRAY OF FLASH MEMORY, AND FLASH MEMORY USING THE SAME - A control method for a Flash memory array and a Flash memory is disclosed. The Flash memory array includes a plurality of blocks which are classified into groups and each group includes at least one block. The control method includes the steps of: recognizing an attribute of data transferred from a host, obtaining a storage group selected from the groups based on the attribute of the data, and storing the data into the blocks of the storage group and thereby the blocks of a same group store data of a same attribute; and performing a valid data collection, restricted to the blocks belonging to a same group, to release blocks of space.06-06-2013
20130311698DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - The invention provides a data storage device. In one embodiment, the data storage device comprises a flash memory and a controller. The flash memory comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks. The controller determines a minimum erase count from the erase counts of the spare blocks and the data blocks, adds a first difference to the minimum erase count to obtain a jail threshold, compares the erase counts of the spare blocks with the jail threshold to obtain a plurality of jail blocks with the erase counts greater than the jail threshold, and confines the jail blocks to a jail pool.11-21-2013
20130311701DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - The invention provides a data storage device. In one embodiment, the data storage device is coupled to a host, and comprises a flash memory and a controller. The flash memory comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks. The controller receives target data from the host, writes the target data to a current data block, and determines whether the current data block is full. When the current data block is full, the controller updates at least one table according to the information of the current data block.11-21-2013
20130311702DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - A data storage device is coupled to a host and includes a flash memory and a controller. The flash memory comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks, wherein a spare block count indicates a total number of the spare blocks. The controller receives target data from the host, writes the target data to a current data block, determines whether a current programming page is the first page of the current data block, determines whether the spare block count is less than a spare block count threshold when the current programming page is the first page, and sets data move information for a data merge process when the spare block count is less than the spare block count threshold.11-21-2013
20130311703DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - A data storage includes a flash memory and a controller. The flash memory comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks, wherein the spare blocks with erase counts higher than a hot threshold are determined as hot spare blocks, and a hot spare block count indicates a total number of the hot spare blocks. The controller receives target data from the host, writes the target data to a current data block, determines whether a current programming page is the first page of the current data block, determines whether the hot spare block count is greater than zero when the current programming page is the first page, and sets data move information for a wear-leveling process when the hot spare block count is greater than zero.11-21-2013
20130311704DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - The invention provides a data storage device. In one embodiment, the data storage device is coupled to a host, and comprises a flash memory and a controller. The flash memory comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks. The controller receives target data from the host, writes the target data to a current programming data block, determines whether a current programming page is a first page of the current programming data block, determines whether data move information is set when the current page is not the first page, and when the data move information is set, perform a data move process according to the data move information within a limited time period.11-21-2013
20130311705DATA STORAGE DEVICE AND METHOD FOR FLASH BLOCK MANAGEMENT - The invention provides a data storage device. In one embodiment, the data storage device is coupled to a host, and comprises a plurality of flash memory areas and a controller. Each of the flash memory areas comprises a spare block pool and a data block pool, wherein the spare block pool comprises a plurality of spare blocks, and the data block pool comprises a plurality of data blocks. The controller receives target data from the host, selects a target memory area to which the target data is to be written from the flash memory areas, sets a physical address range parameter according to the target memory area, sets a spare block pool parameter according to the target memory area, and writes the target data to a current data block of the target memory area.11-21-2013
20130326120DATA STORAGE DEVICE AND OPERATING METHOD FOR FLASH MEMORY - A data storage device and operating method for a FLASH memory are disclosed. The data storage device includes a FLASH memory and a controller. The FLASH memory includes a first block and a second block. The first and second blocks each includes a plurality of pages. The controller executes a firmware to determine whether a data segment from a host is a complete page segment. When the data segment is a complete page segment, the controller stores the data segment into the first block. When the data segment is an incomplete page segment, the controller stores the data into segment the second block.12-05-2013
20130326121DATA-STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD - FLASH memory is allocated to provide a data-storage device and management tables. The management tables may record logical-to-physical address mapping information in a hierarchical structure consisting of at least two levels. Further, in addition to the logical-to-physical address mapping information, the management tables may further provide a valid page count table and an invalid block record. The logical-to-physical address mapping information is updated after an update of the valid page count table is completed. The invalid block record is maintained based on the valid page count table.12-05-2013
20130339575DATA STORAGE DEVICE AND DATA TRIMMING METHOD - A data storage device is disclosed. In one embodiment, the data storage device comprises a flash memory and a controller. The flash memory comprises a plurality of blocks, wherein each block comprises a plurality of pages, and each page comprises a plurality of data trimming units which is a smallest unit for data modification. After a data trimming process has been performed on an address range of the flash memory, the controller determines a last page corresponding to an ending address of the address range, determines whether data values stored in the last page with addresses subsequent to the ending address are all equal to a specific data pattern, and sets the value of a trimming flag corresponding to the last page to be 1 when the data values stored in the last page with addresses subsequent to the ending address are all equal to the specific data pattern.12-19-2013
20140068158FLASH STORAGE DEVICE AND CONTROL METHOD FOR FLASH MEMORY - A FLASH memory is used in data storage and is further stored with a logical-to-physical address mapping table and a write protection mapping table. The write protection mapping table shows the write protection statuses of the different logical addresses. In accordance with logical addresses issued via a dynamic capacity management command from a host, a controller of the data storage device modifies the logical-to-physical address mapping table to break the logical-to-physical mapping relationship of the issued logical addresses. Further, the controller asserts a flag, corresponding to the issued logical addresses, in the write protection mapping table, to a write protected mode. According to a change in the amount of write-protected flags of the write protection mapping table, the controller adjusts an end-of-life judgment value of the FLASH memory and thereby a lifespan of the FLASH memory is prolonged.03-06-2014
20140078825DATA STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD THEREOF - Storage space allocation and a wear leveling technique for a FLASH memory module are disclosed. The FLASH memory module includes a plurality of FLASH chips. A controller for the FLASH memory module divides the storage space of the FLASH memory module into Xblocks for management of the FLASH memory module. The controller erases at least one Xblock for space release and moves data on Xblocks for wear leveling.03-20-2014
20140082265DATA STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD THEREOF - A mapping table H2F update technique for a FLASH memory is disclosed. In a disclosed data storage device, the controller updates a logical-to-physical address mapping table between a host and the FLASH memory in accordance with a group count of a buffer block of the FLASH memory. The group count reflects a logical address distribution of write data buffered in the buffer block and with non-updated logical-to-physical address mapping information. The higher the group count, the more dispersed the logical address distribution. In this manner, each update of the logical-to-physical address mapping table just takes a short time.03-20-2014
20140250258DATA STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD - A data storage device with a FLASH memory accessed via multiple channels and a FLASH memory control method. The control method includes the following steps: dividing a plurality of blocks of the FLASH memory into groups to be accessed via different channels; allocating at least one set of cache spaces in a random access memory for temporary write data storage for the different channels; separating write data issued from a host to correspond to the plurality of channels; and, when data arrangement for every channel has been completed in one set of cache spaces, writing the data that has been arranged in the set of cache spaces to the FLASH memory via the plurality of channels corresponding to the different cache spaces of the set of cache spaces.09-04-2014
20140379964DATA STORAGE DEVICE AND DATA FETCHING METHOD FOR FLASH MEMORY - A data storage device is provided. The data storage device, coupled to a host, includes: a flash memory; and a controller, configured to control accessing of the flash memory; wherein when the host performs random data accessing to the flash memory, the controller retrieves address information of a corresponding block and a corresponding page in the flash memory associated with first data to be read based on a global mapping table, and pre-fetches the corresponding page from the flash memory based on the address information; wherein when the controller obtains the address information, the controller further determines whether the first data is located in a current buffer block based on a local mapping table; wherein when the first data is located in the current buffer block, the controller further cancels the pre-fetched corresponding page, and reads the first data from the current buffer block.12-25-2014
20150067233DATA STORAGE DEVICE AND FLASH MEMORY CONTROL METHOD THEREOF - A mapping table H03-05-2015

Patent applications by Chang-Kai Cheng, Hsinchu City TW

Chao-Chen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080308829VERTICAL LED WITH CURRENT GUIDING STRUCTURE - Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.12-18-2008
20100258834VERTICAL LED WITH CURRENT GUIDING STRUCTURE - Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.10-14-2010
20110101400LIGHT EMITTING DIODES (LEDS) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING - Systems and methods are disclosed for fabricating a semiconductor light-emitting diode (LED) device by forming an n-doped gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.05-05-2011
20110316039VERTICAL LED WITH CURRENT GUIDING STRUCTURE - Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.12-29-2011
20120074384PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES - Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed.03-29-2012
20120146083VERTICAL LED WITH CURRENT-GUIDING STRUCTURE - Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current-guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a substrate) may be provided. For some embodiments, both a current-guiding structure and second current path may be provided.06-14-2012
20120168714VERTICAL LIGHT EMITTING DIODE (VLED) DIE AND METHOD OF FABRICATION - A vertical light emitting diode (VLED) die includes a first metal having a first surface and an opposing second surface; a second metal on the second surface of the first metal; a p-type semiconductor layer on the first surface of the first metal; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer.07-05-2012
20120168716Light Emitting Diode (LED) Die Having Stepped Substrates And Method Of Fabrication - A light emitting diode (LED) die includes a first substrate having a first surface and an opposing second surface; a second substrate on the second surface of the first substrate; a p-type semiconductor layer on the first surface of the first substrate; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer.07-05-2012
20130334982METHOD FOR GUIDING CURRENT IN A LIGHT EMITTING DIODE (LED) DEVICE - Methods for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current-guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a substrate) may be provided. For some embodiments, both a current-guiding structure and second current path may be provided.12-19-2013
20140051197METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYER - A method for fabricating a vertical light emitting diode (VLED) die includes the steps of: providing a substrate; forming an epitaxial structure on the substrate; forming an electrically insulative insulation layer covering the lateral surfaces of the epitaxial structure; forming an electrically non-conductive material on the electrically insulative insulation layer; and forming a mirror on the p-doped layer, with the electrically insulative insulation layer configured to protect the epitaxial structure during formation of the mirror.02-20-2014
20140151630PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES - Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed.06-05-2014
20140151635METHOD FOR FABRICATING A LIGHT EMITTING DIODE (LED) DIE HAVING PROTECTIVE SUBSTRATE - A method for fabricating a light emitting diode die includes the steps of providing a carrier substrate and forming an epitaxial structure on the carrier substrate including a first type semiconductor layer, a multiple quantum well (MQW) layer on the first type semiconductor layer configured to emit light, and a second type semiconductor layer on the multiple quantum well (MQW) layer. The method also includes the steps of forming a plurality of trenches through the epitaxial structure, forming a reflector layer on the second type semiconductor layer, forming a seed layer on the reflector layer and in the trenches, and forming a substrate on the seed layer having an area configured to protect the epitaxial structure.06-05-2014
20140339496Vertical Light Emitting Diode (VLED) Dice Having Confinement Layers With Roughened Surfaces And Methods Of Fabrication - A vertical light emitting diode (VLED) die includes an epitaxial structure having a first-type confinement layer, an active layer on the first-type confinement layer configured as a multiple quantum well (MQW) configured to emit light, and a second-type confinement layer having a roughened surface. In a first embodiment, the roughened surface includes a pattern of holes with a depth (d) in a major surface thereof surrounded by a pattern of protuberances with a height (h) on the major surface. In a second embodiment, the roughened surface includes a pattern of primary protuberances surrounded by a pattern of secondary protuberances.11-20-2014

Patent applications by Chao-Chen Cheng, Hsinchu City TW

Chen-Chin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110118973IMAGE PROCESSING METHOD AND SYSTEM - An image processing method and a system are provided. The image processing method of moving camera comprises the following steps. An image of a road is captured by a first camera unit. A coordinate of the image of an object shown in the image of the road is captured when the image of the object shown in the image of the road is selected. At least an aiming angle of a second camera unit is adjusted according to the coordinate to make the field-of-view of the second camera unit aligned with the object. The image of the object is captured by the second camera unit. The image of the object is enlarged.05-19-2011
20110141279SURVEILLANCE CAMERA SYSTEM AND METHOD - A surveillance camera system including an optical imaging apparatus, a first reflective device and a second reflective device is provided. The optical imaging apparatus is capable of switching between a first magnification level and a second magnification level. The first reflection device is disposed at a position relative to the optical imaging apparatus for guiding a first field of view into the optical imaging apparatus, wherein the first reflective device has an opening region. The second reflective device is disposed within the opening region of the first reflection device for guiding a second field of view into the optical imaging apparatus. The second reflection device can have a relative motion relative to the first reflection device.06-16-2011

Cheng-Liang Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090159322THROUGH HOLE CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.06-25-2009
20090161298HYBRID CAPACITOR - A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.06-25-2009
20110157775DECOUPLING DEVICE - A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.06-30-2011
20120162852DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.06-28-2012
20120171573HYBRID MATERIALS USING IONIC PARTICLES - A separator substrate include a substrate having a bulk portion and a surface portion, the surface portion having at least one porous area with a net charge; and ionic particles coupling to at least a part of the at least one porous area. The ionic particles have a net charge of an opposite sign to the net charge of the at least one porous area. The coupling between the part of the at least one porous area and the ionic particles may result in at least one of a good electrochemical performance, chemical stability, thermal stability, wettability, and mechanical strength of the separator substrate.07-05-2012
20120171576NON-AQUEOUS ELECTROLYTE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - A non-aqueous electrolyte including a lithium salt, an organic solvent, and an electrolyte additive is provided. The electrolyte additive is a meta-stable state nitrogen-containing polymer formed by reacting Compound (A) and Compound (B). Compound (A) is a monomer having a reactive terminal functional group. Compound (B) is a heterocyclic amino aromatic derivative as an initiator. A molar ratio of Compound (A) to Compound (B) is from 10:1 to 1:10. A lithium secondary battery containing the non-aqueous electrolyte is further provided. The non-aqueous electrolyte of this disclosure has a higher decomposition voltage than a conventional non-aqueous electrolyte, such that the safety of the battery during overcharge or at high temperature caused by short-circuit current is improved.07-05-2012
20120171579NON-AQUEOUS ELECTROLYTE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME - A non-aqueous electrolyte including a lithium salt, an organic solvent, and an electrolyte additive is provided. The electrolyte additive is a meta-stable state nitrogen-containing polymer formed by reacting Compound (A) and Compound (B). Compound (A) is a monomer having a reactive terminal functional group. Compound (B) is a heterocyclic amino aromatic derivative as an initiator. A molar ratio of Compound (A) to Compound (B) is from 10:1 to 1:10. A lithium secondary battery containing the non-aqueous electrolyte is further provided. The non-aqueous electrolyte of this disclosure has a higher decomposition voltage than a conventional non-aqueous electrolyte, such that the safety of the battery during overcharge or at high temperature caused by short-circuit current is improved.07-05-2012
20120172558META-STABLE STATE NITROGEN-CONTAINING POLYMER - A meta-stable state nitrogen-containing polymer formed by reacting Compound (A) and Compound (B) is described. Compound (A) is a monomer having a reactive terminal functional group. Compound (B) is a heterocyclic amino aromatic derivative as an initiator. The molar ratio of Compound (A) to Compound (B) is from 10:1 to 1:10. The meta-stable state nitrogen-containing polymer has a variance less than 2% in its narrow molecular weight distribution after being retained at 55° C. for one month.07-05-2012
20120172593META-STABLE STATE NITROGEN-CONTAINING POLYMER - A meta-stable state nitrogen-containing polymer formed by reacting Compound (A) and Compound (B) is described. Compound (A) is a monomer having a reactive terminal functional group. Compound (B) is a heterocyclic amino aromatic derivative as an initiator. The molar ratio of Compound (A) to Compound (B) is from 10:1 to 1:10. The meta-stable state nitrogen-containing polymer has a variance less than 2% in its narrow molecular weight distribution after being retained at 55° C. for one month.07-05-2012
20130120903DECOUPLING DEVICE AND FABRICATING METHOD THEREOF - A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.05-16-2013
20140233158DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.08-21-2014
20140318612MANUFACTURING METHOD OF SILICON SOLAR CELL AND SILICON SOLAR CELL - A manufacturing method of a silicon solar cell and the silicon solar cell thereof are provided. A silicon substrate formed with a doped layer on a light receiving surface thereof is provided. First and second dielectric layers are respectively formed on the light receiving surface and the rear surface of the silicon substrate. A patterned second dielectric layer with an opening and a groove in the silicon substrate are formed by partially removing the second dielectric layer and the silicon substrate. First and second electrode compositions are respectively formed on the light receiving surface and the rear surface, and the second electrode composition is filled into the groove. After performing a high temperature process to co-firing the silicon substrate and the first and second electrode compositions, a first electrode and a second electrode are respectively formed on the light receiving surface and the rear surface.10-30-2014

Patent applications by Cheng-Liang Cheng, Hsinchu City TW

Chia-Ming Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110128354SYSTEM AND METHOD FOR OBTAINING CAMERA PARAMETERS FROM MULTIPLE IMAGES AND COMPUTER PROGRAM PRODUCTS THEREOF - Systems and methods for obtaining camera parameters from images are provided. First, a sequence of original images associated with a target object under circular motion is obtained. Then, a background image and a foreground image corresponding to the target object within each original image are segmented. Next, shadow detection is performed for the target object within each original image. A first threshold and a second threshold are respectively determined according to the corresponding background and foreground images. Each original image, the corresponding background image, the first and second threshold are used for obtaining silhouette data and feature information associated with the target object within each original image. At least one camera parameter is obtained based on the entire feature information and the geometry of circular motion.06-02-2011
20130058561PHOTOGRAPHIC SYSTEM - A photographic system for generating photos is provided. The photographic system comprises a photo composition unit, and a photo synthesizer. The photo composition unit is capable of determining an extracted view from a three dimensional (3D) scene. The photo synthesizer, coupled to the photo composition unit, is capable of synthesizing an output photo according to the extracted view.03-07-2013
20130163854IMAGE PROCESSING METHOD AND ASSOCIATED APPARATUS - An image processing method includes: receiving a plurality of images, the images being captured under different view points; and performing image alignment for the plurality of images by warping the plurality of images, where the plurality of images are warped according to a set of parameters, and the set of parameters are obtained by finding a solution constrained to predetermined ranges of physical camera parameters. In particular, the step of performing the image alignment further includes: automatically performing the image alignment to reproduce a three-dimensional (3D) visual effect, where the plurality of images is captured by utilizing a camera module, and the camera module is not calibrated with regard to the view points. For example, the 3D visual effect can be a multi-angle view (MAV) visual effect. In another example, the 3D visual effect can be a 3D panorama visual effect. An associated apparatus is also provided.06-27-2013
20130342735IMAGE PROCESSING METHOD AND IMAGE PROCESSING APPARATUS FOR PERFORMING DEFOCUS OPERATION ACCORDING TO IMAGE ALIGNMENT RELATED INFORMATION - An image processing method includes: receiving a plurality of input images; deriving an image alignment related information from performing an image alignment upon the input images; and generating a processed image by performing a defocus operation upon a selected image selected from the input images according to the image alignment related information. For example, the image processing method may be employed by an electronic device such as a mobile device. Thus, the mobile device may capture two or more images to generate the defocus visual effect, which is similar to professional long-focus lens.12-26-2013
20140075382IMAGE VIEWING METHOD FOR DISPLAYING PORTION OF SELECTED IMAGE BASED ON USER INTERACTION INPUT AND RELATED IMAGE VIEWING SYSTEM AND MACHINE READABLE MEDIUM - An image viewing method includes: determining at least a first partial image corresponding to a portion of a first image directly selected from a plurality of images, and driving a display apparatus according to the first partial image; in accordance with a user interaction input, determining a second partial image corresponding to a portion of a second image directly selected from the images; and driving the display apparatus according to at least the second partial image. In one implementation, the first image and the second image are spatially correlated, and a field of view (FOV) of each of the first image and the second image is larger than an FOV of the display apparatus.03-13-2014
20140160245METHOD AND APPARATUS FOR STEREOSCOPIC FOCUS CONTROL OF STEREO CAMERA - A stereoscopic control method includes: establishing a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera; and controlling stereoscopic focus of the stereo camera according to the specific mapping relation. Besides, a stereoscopic control apparatus includes a mapping unit and a focus control unit. The mapping unit is arranged for establishing at least a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera. The focus control unit is arranged for controlling stereoscopic focus of the stereo camera according to the specific mapping relation.06-12-2014
20140254917AUTO-CONVERGENCE SYSTEM WITH ACTIVE LEARNING AND RELATED METHOD AND MACHINE-READABLE MEDIUM THEREOF - An auto-convergence system includes a disparity unit, a convergence unit and an active learning unit. The disparity unit performs a disparity analysis upon an input stereo image pair, and accordingly obtains a disparity distribution of the input stereo image pair. The convergence unit adjusts the input stereo image pair adaptively according to the disparity distribution and a learned convergence range, and accordingly generates an output stereo image pair for playback. The active learning unit actively learns a convergence range during playback of stereo image pairs, and accordingly determines the learned convergence range.09-11-2014
20140285621VIDEO FRAME PROCESSING METHOD - A video frame processing method, which comprises: (a) capturing at least two video frames via a multi-view camera system comprising a plurality of cameras; (b) recording timestamps for each the video frame; (c) determining a major camera and a first sub camera out of the multi-view camera system, based on the timestamps, wherein the major camera captures a major video sequence comprising at least one major video frame, the first sub camera captures a video sequence of first view comprising at least one video frame of first view; (d) generating a first reference video frame of first view according to one first reference major video frame of the major video frames, which is at a reference timestamp corresponding to the first reference video frame of first view, and according to at least one the video frame of first view surrounding the reference timestamp; and (e) generating a multi-view video sequence comprising a first multi-view video frame, wherein the first multi-view video frame is generated based on the first reference video frame of first view and the first reference major video frame.09-25-2014
20140285635VIDEO FRAME PROCESSING METHOD - A video frame processing method, which comprises: (a) capturing at least one first video frame via a first camera; (b) capturing at least one second video frame via a second camera; and (c) adjusting one candidate second video frame of the second video frames based on one of the first video frame to generate a target single view video frame.09-25-2014
201402856373D IMAGE CAPTURE METHOD WITH 3D PREVIEW OF PREVIEW IMAGES GENERATED BY MONOCULAR CAMERA AND RELATED ELECTRONIC DEVICE THEREOF - A three-dimensional (3D) image capture method, employed in an electronic device with a monocular camera and a 3D display, includes at least the following steps: while the electronic device is moving, deriving a 3D preview image from a first preview image and a second preview image generated by the monocular camera, and providing 3D preview on the 3D display according to the 3D preview image, wherein at least one of the first preview image and the second preview image is generated while the electronic device is moving; and when a capture event is triggered, outputting the 3D preview image as a 3D captured image.09-25-2014
20140286567IMAGE PROCESSING METHOD AND ASSOCIATED APPARATUS - An image processing method includes: receiving a plurality of images, the images being captured under different view points; and performing image alignment for the plurality of images by warping the plurality of images, where the plurality of images are warped according to a set of parameters, and the set of parameters are obtained by finding a solution constrained to predetermined ranges of physical camera parameters. In particular, the step of performing the image alignment further includes: automatically performing the image alignment to reproduce a three-dimensional (3D) visual effect, where the plurality of images is captured by utilizing a camera module, and the camera module is not calibrated with regard to the view points. For example, the 3D visual effect can be a multi-angle view (MAV) visual effect. In another example, the 3D visual effect can be a 3D panorama visual effect. An associated apparatus is also provided.09-25-2014
20140340491APPARATUS AND METHOD FOR REFERRING TO MOTION STATUS OF IMAGE CAPTURE DEVICE TO GENERATE STEREO IMAGE PAIR TO AUTO-STEREOSCOPIC DISPLAY FOR STEREO PREVIEW - A stereo preview apparatus has an auto-stereoscopic display, an input interface, a motion detection circuit, and a visual transition circuit. The input interface receives at least an input stereo image pair including a left-view image and a right-view image generated from an image capture device. The motion detection circuit evaluates a motion status of the image capture device. The visual transition circuit generates an output stereo image pair based on the input stereo image pair, and outputs the output stereo image pair to the auto-stereoscopic display for stereo preview, wherein the visual transition circuit refers to the evaluated motion status to configure adjustment made to the input stereo image pair when generating the output stereo image pair.11-20-2014

Patent applications by Chia-Ming Cheng, Hsinchu City TW

Chia-Yun Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090214136IMAGE PROCESSING APPARATUS FOR SCALING AN INPUT IMAGE ACCORDING TO VARIOUS IMAGE PROCESSING REQUIREMENTS AND METHOD THEREOF - An image processing apparatus and method for scaling an input image are disclosed. The image processing apparatus includes a buffer module, a scaling unit, and a determining unit. The buffer module includes at least a line buffer for buffering pixel data of the input image. The scaling unit is coupled to the buffer module and includes a plurality of filters having different filter tap numbers, wherein the scaling unit utilizes a target filter having a specific filter tap number selected from the plurality of filters to scale the input image according to the pixel data retrieved from the line buffer. The determining unit is coupled to the scaling unit and utilized for receiving an image processing requirement and setting a pixel precision of the input image and selecting the target filter having the specific filter tap number from the filters in the scaling unit according to the image processing requirement.08-27-2009
20090316775VIDEO ENCODING AND DECODING METHOD AND SYSTEM THEREOF - A video encoding system for encoding at least one frame, which includes a plurality of data units, to a bit stream. The system includes: a scaling unit, for scaling a data unit of a current frame to generate a scaled data unit in a first mode; and a video encoder, coupled to the scaling unit, for directly retrieving the scaled data unit from the scaling unit and encoding the scaled data unit to generate a coded data unit in the first mode.12-24-2009
20100027973IMAGE PROCESSING CIRCUIT AND METHOD CAPABLE OF PERFORMING ONLINE COLOR SPACE CONVERSION - An image processing circuit includes: a video decoder for decoding at least one block image source to generate first decoded data, where the block image source and the first decoded data correspond to a first color space; a color space converting unit, coupled to the video decoder, for performing color space conversion on the first decoded data to generate second decoded data, where the second decoded data corresponds to a second color space; a block based scaling unit, coupled to the color space converting unit, for performing a scaling operation on the second decoded data to generate scaled data, where the scaled data corresponds to the second color space; and a frame buffer, coupled to the block based scaling unit, for temporarily storing the scaled data, where the scaled data temporarily stored in the frame buffer is utilized in the second color space.02-04-2010
20100034288VIDEO DECODING METHOD AND SYSTEM THEREOF - A video decoding method for decoding a bit stream to a plurality of frames, includes: determining whether a size of a current picture is equal to that of a next picture according to the bit stream; scaling a corresponding reference frame for the next picture to generate a scaled frame when the size of the current picture is not equal to that of the next picture; and storing the scaled frame in a first frame buffer of a storage unit, wherein at least a portion of a first frame originally stored in the first frame buffer is displayed.02-11-2010
20120185620BUFFERING APPARATUS FOR BUFFERING MULTI-PARTITION VIDEO/IMAGE BITSTREAM AND RELATED METHOD THEREOF - An exemplary buffering apparatus for buffering a multi-partition video/image bitstream which transmits a plurality of compressed frames each having a plurality of partitions includes a first bitstream buffer and a second bitstream buffer. The first bitstream buffer is arranged to buffer data of a first partition of the partitions of a specific compressed frame. The second bitstream buffer is arranged to buffer data of a second partition of the partitions of the specific compressed frame.07-19-2012

Patent applications by Chia-Yun Cheng, Hsinchu City TW

Chieh-Wen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100259233Direct Current Converter - A direct current converter includes a first node, a second node, an input voltage terminal, an output voltage terminal, a bootstrap source terminal, a low-voltage terminal, a control module for generating a control signal, a driving-stage circuit coupled to the input voltage terminal, the first node, the second node, the control module, and the low-voltage terminal, an output-stage circuit coupled to the second node and the output voltage terminal, and a bootstrap circuit including a capacitor coupled between the first node and the second node, a fault detector for outputting a switch signal, and a cascade unit coupled to the bootstrap source terminal, the first node, the control module, and the fault detector for controlling connection between the bootstrap source terminal and the first node according to the switch signal and the control signal.10-14-2010
20100259238Direct Current Converter - A direct current converter includes a first node, a second node, an input voltage terminal end, an output voltage terminal, a control power terminal, a low-voltage end, a control module for generating a control signal, a driving-stage circuit coupled to the input voltage terminal, the first node, the second node, the control module, and the low-voltage end, an output-stage circuit coupled to the second node and the output voltage terminal, and a bootstrap circuit including a capacitor coupled between the first node and the second node, and a cascade unit coupled to the control power terminal, the first node, and the control module for controlling connection between the control power terminal and the first node according to the control signal.10-14-2010
20110043178Electronic Device with Power Switch Capable of Regulating Power Dissipation - An electronic device with a power switch capable of regulating power dissipation includes a power supply device; a power switch, for providing an output voltage; and a current regulating circuit, which includes an adaptive control unit, for outputting a regulating signal, according to the voltage difference between the power supply device and the output voltage; and a switch control unit, for outputting a switch control signal to control the magnitude of the current through the power switch, according to the regulating signal.02-24-2011
20110317314Short Circuit Protection Circuit, Short Circuit Protection Method and Power Supply Device Thereof - A short circuit protection circuit for a power supply device includes a driving transistor, for controlling to output an input voltage to a load according to a first control voltage; a shutdown transistor, coupled with the driving transistor, for controlling a level of the first control voltage according to a second control voltage; and an energy storage module, coupled with the shutdown transistor, for storing energy of the input voltage, to output a specific voltage as the second control voltage in a specific interval after short-circuit occurs.12-29-2011
20140015503BOOT-STRAP CIRCUIT AND VOLTAGE CONVERTING DEVICE THEREOF - A boot-strap circuit for a voltage converting device includes a boot-strap capacitor; a charging module, for charging the boot-strap capacitor; and a protection module, for detecting a capacitor voltage of the boot-strap capacitor and adjusting conducting statuses of one of an upper-bridge switch and a lower-bridge switch of the voltage converting device according to the capacitor voltage and a duty cycle signal utilized for controlling conducting statuses of the upper-bridge switch and the lower-bridge switch.01-16-2014
20140062535Power-on Reset Circuit - A power-on reset circuit is disclosed. The power-on reset circuit includes a first resistor; a first transistor, including a first terminal coupled to a second terminal of the first resistor, and a control terminal for receiving a reference voltage; a second resistor, including a first terminal coupled to a second terminal of the first transistor; a second transistor, including a first terminal coupled to a second terminal of the first resistor, and a control terminal coupled to a second terminal of the second transistor and utilized for receiving an input voltage; and a comparator, including a first input terminal for receiving a comparison voltage, and a second input terminal for receiving the reference voltage, for generating a power-on reset signal according to the comparison voltage and the reference voltage.03-06-2014
20140145641Single Wire Signal Process Method and Circuit - A signal processing method for a single wire, includes receiving an input signal via the single wire, wherein the input signal includes a plurality of pulse signals; generating a plurality of bits corresponding to the plurality of pulse signals according to a plurality of widths of the plurality of pulse signals and forming a source code; and decoding the source code to generate a control code; wherein when a width of a first pulse signal of the plurality of pulse signals is smaller than a first duration, a first bit corresponding to the first pulse signal is a first bit value and when a width of a second pulse signal of the plurality of pulse signals is greater than a second duration, a second bit corresponding to the second pulse signal is a second bit value.05-29-2014

Patent applications by Chieh-Wen Cheng, Hsinchu City TW

Chien-Hong Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110198571ORGANIC COMPOUND AND ORGANIC ELECTROLUMINESCENCE DEVICE EMPLOYING THE SAME - Organic compounds and organic electroluminescence devices employing the same are provided. The organic compound has a chemical structure represented as follows:08-18-2011
20120001537ORGANIC COMPOUND AND ORGANIC ELECTROLUMINESCENCE DEVICE EMPLOYING THE SAME - Organic compounds and organic electroluminescence devices employing the same are provided. The organic compound has a chemical structure represented as follows:01-05-2012
20130041153DERIVATIVES HAVING VINYL GROUP AND ITS USE IN ELECTROLUMINESCENT ELEMENT - The present invention relates to imidazole derivatives having vinyl group represented by general formula (I) which possess electron transporting character, have a high glass transition temperature (T02-14-2013
20140191205BIPOLAR COMPOUND AND ORGANIC ELECTROLUMINESCENT DEVICE EMPLOYING THE SAME - The present disclosure relates to a bipolar compound represented by the following formula (I); and an organic luminescent diode device containing the same.07-10-2014

Patent applications by Chien-Hong Cheng, Hsinchu City TW

Chi-Feng Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080265256MOS devices with improved source/drain regions with SiGe - A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; a SiGe region in the semiconductor substrate and adjacent the gate stack, wherein the SiGe region has a first atomic percentage of germanium to germanium and silicon; and a silicide region over the SiGe region. The silicide region has a second atomic percentage of germanium to germanium and silicon. The second atomic percentage is substantially lower than the first atomic percentage.10-30-2008

Chin Chung Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100060190LIGHT-EMITTING DIODE DRIVING CIRCUIT - A light-emitting diode driving circuit includes an AC/DC converting circuit for converting an AC power source into a DC power source; a switching element having an input contact connected to the AC/DC converting circuit; a control unit for outputting a control signal to the switching element at a set frequency to turn on or turn off the switching element, wherein a first resistor is disposed between a power contact thereof and the input contact of the switching element; a second resistor for enabling the control unit to detect a half-cycle voltage of the DC power source; a capacitor having a first end connected to the power contact, and a second end connected to a ground contact of the control unit; and an inductor having a first end connected to the ground contact and the second end of the capacitor, and a second end connected to a light-emitting diode.03-11-2010
20110012522FIXED FREQUENCY DIMMING METHOD AND FIXED FREQUENCY DIMMING CIRCUIT FOR LIGHT EMITTING MODULE - A fixed frequency dimming method and fixed frequency dimming circuit for a light emitting module can control light emitting brightness of the light emitting module through a hysteresis control circuit. A voltage difference between an upper limit voltage and a lower limit voltage of a hysteresis width of the hysteresis control circuit is maintained at a fixed value, and a driving current flowing through the light emitting module is changed by changing the upper limit voltage or the lower limit voltage.01-20-2011
20130320872LIGHT-EMITTING DIODE DRIVING CIRCUIT - A light-emitting diode (LED) driving circuit includes a power factor correction (PFC) circuit and a driving controller. The PFC circuit controls a power factor of the LED driving circuit. The LED driving circuit includes an inductor, a switch, a current detection circuit, and a time detection circuit. The inductor senses an inductor current and provide energy to at least one LED. The switch connected to the inductor is conducted according to a driving signal. The current detection circuit connected to the switch detects inductor current information. The time detection circuit connected to the switch detects an energy discharging time during which the inductor current decrease from a peak value to zero. The driving controller connected to the switch, the current detection circuit, and the time detection circuit outputs the driving signal to the switch according to the voltage level and the energy discharging time.12-05-2013

Patent applications by Chin Chung Cheng, Hsinchu City TW

Ching-Tai Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080303157HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.12-11-2008
20110111537HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.05-12-2011

Ching-Yuan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090167944Video-signal receiving apparatus and method - A video-signal receiving method is provided. First, receive an analog video signal, wherein the analog video signal comprises a specific video signal and a synchronization signal. Next, at least perform an analog-to-digital conversion on the synchronization signal of the analog video signal according to a sampling signal to generate a digital signal. Then, receive the digital signal and decoding the digital signal to obtain a digital synchronization signal corresponding to the synchronization signal. Afterward, adjust a phase of the sampling signal according to the digital synchronization signal.07-02-2009

Chin-Wen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080201509Component, device and operation method for digital data integration - A component, device and operation method for digital data integration solves the shortcoming of the prior art that playing audio recordings and reading/writing AV data cannot be performed simultaneously. The digital data integration device receives a start signal from a computer to enable a plurality of endpoints declared in a program memory unit of the digital data integration component. The present invention utilizes a bulk mode for audio input/output endpoint to play/record audio data and a bulk mode for mass-storage read/write endpoint to upload/download digital data through a control endpoint combination with an interrupt read endpoint and an interrupt write endpoint. The present invention can play/record sound data and upload/download digital data simultaneously.08-21-2008

Chuan-Te Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100290224DUAL LAMP ILLUMINATION SYSTEM AND ITS VARIFOCAL LIGHT-MIXING DEVICE - A dual lamp illumination system includes a first light source, a second light source, a light-deflecting device, a light-homogenizing device, and a lens assembly. The light-deflecting device is positioned in both a first light path of the first light beam and a second light path of the second light beam to combine the first light beam with the second light beam. The lens assembly includes a first set of varifocal lenses neighboring the light-deflecting device and a second set of varifocal lenses neighboring the light-homogenizing device. The composition of the first set of varifocal lenses is identical to the composition of the second set of varifocal lenses, and the first set of varifocal lenses and the second set of varifocal lenses are positioned substantially in symmetry.11-18-2010

Chun-Hu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100317184METHOD FOR REDUCING INTERFACIAL LAYER THICKNESS FOR HIGH-K AND METAL GATE STACK - A method for reducing interfacial layer (IL) thickness for high-k dielectrics and metal gate stack is provided. In one embodiment, the method includes forming an interfacial layer on a semiconductor substrate, etching back the interfacial layer, depositing a high-k dielectric material over the interfacial layer, and forming a metal gate over the high-k dielectric material. The IL can be chemical oxide, ozonated oxide, thermal oxide, or formed by ultraviolet ozone (UVO) oxidation process from chemical oxide, etc. The etching back of IL can be performed by a Diluted HF (DHF) process, a vapor HF process, or any other suitable process. The method can further include performing UV curing or low thermal budget annealing on the interfacial layer before depositing the high-k dielectric material.12-16-2010
20120322253METHOD FOR REDUCING INTERFACIAL LAYER THICKNESS FOR HIGH-K AND METAL GATE STACK - This description relates to a method including forming an interfacial layer over a semiconductor substrate. The method further includes etching back the interfacial layer. The method further includes performing an ultraviolet (UV) curing process on the interfacial layer. The UV curing process includes supplying a gas flow rate ranging from 10 standard cubic centimeters per minute (sccm) to 5 standard liters per minute (slm), wherein the gas comprises inert gas, and heating the interfacial layer at a temperature less than or equal to 700° C. The method further includes depositing a high-k dielectric material over the interfacial layer.12-20-2012
20130126818RESISTIVE RANDOM ACCESS MEMORY (RRAM) USING STACKED DIELECTRICS AND METHOD FOR MANUFACTURING THE SAME - Resistive random access memory (RRAM) using stacked dielectrics and a method for manufacturing the same are disclosed, where a setting power of only 4 μW, an ultra-low reset power of 2 nW, good switching uniformity and excellent cycling endurance up to 5×1005-23-2013
20130256812METHOD FOR REDUCING INTERFACIAL LAYER THICKNESS FOR HIGH-K AND METAL GATE STACK - A method of performing an ultraviolet (UV) curing process on an interfacial layer over a semiconductor substrate, the method includes supplying a gas flow rate ranging from 10 standard cubic centimeters per minute (sccm) to 5 standard liters per minute (slm), wherein the gas comprises inert gas. The method further includes heating the interfacial layer at a temperature less than or equal to 700° C. Another method of performing an annealing process on an interfacial layer over a semiconductor substrate, the second method includes supplying a gas flow rate ranging from 10 sccm to 5 slm, wherein the gas comprises inert gas. The method further includes heating the interfacial layer at a temperature less than or equal to 600° C.10-03-2013

Patent applications by Chun-Hu Cheng, Hsinchu City TW

Chun-Yuan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090128783Ocular-protection projector device - The present invention discloses an ocular-protection projector device, wherein the projector is additionally equipped with an image-capture unit. When the projector projects information onto a screen, the image-capture unit captures the human-shape image of a user. An image-processing unit, which is arranged inside the projector or an external electronic device, receives the human-shape image, creates a human-shape black mask, and outputs the human-shape black mask via the projector onto an area of the screen corresponding to the user's position. Thereby, the present invention can effectively protect the user's eyes from the harm of intense light.05-21-2009

Hao-Ying Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080240500IMAGE PROCESSING METHODS - A method of image processing, the method comprising receiving an image frame including a plurality of pixels, each of the plurality of pixels including an image information, conducting a first extraction based on the image information to identify foreground pixels related to a foreground object in the image frame and background pixels related to a background of the image frame, scanning the image frame in regions, identifying whether each of the regions includes a sufficient number of foreground pixels, identifying whether each of regions including a sufficient number of foreground pixels includes a foreground object, clustering regions including a foreground object into at least one group, each of the at least one group corresponding to a different foreground object in the image frame, and conducting a second extraction for each of at least one group to identify whether a foreground pixel in the each of the at least one group is to be converted to a background pixel.10-02-2008
201300285072D to 3D IMAGE CONVERSION APPARATUS AND METHOD THEREOF - A 2D to 3D image conversion apparatus includes a data queue, a conversion unit and an offset calculation unit. The data queue receives and temporarily stores an input data value corresponding to a current pixel. The conversion unit outputs a current offset table corresponding to a current depth parameter of the current pixel. The current offset table includes (m+1) reference offsets corresponding to the current pixel and neighboring m pixels. The offset calculation unit selects one of the reference offsets corresponding to the current pixel in the current offset table and multiple previous offset tables as a data offset corresponding to the current pixel. The data queue selects and outputs an output data value corresponding to the current pixel according to an integer part of the data offset and the input data value.01-31-2013
20130188027IMAGE DEPTH GENERATION DEVICE AND METHOD THEREOF - An image depth generation device and method thereof is disclosed in the present invention. The device includes at least a processing circuit and at least a calculator. The processing circuit receives an input image and determines a visual distance of a pixel Pi according to a color of the pixel in the input image and at least a reference value to generate a depth offset of each pixel. The calculator is coupled to the processing circuit and uses the depth offset of each pixel and a predetermined depth to generate an output depth value of each pixel in the input image.07-25-2013

Hong-Chen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080258813Sense Amplifiers Operated Under Hamming Distance Methodology - A semiconductor device includes a first sense amplifier coupled to an input for generating a first output; a second sense amplifier couple to the input for generating a second output; and a third sense amplifier coupled to the input for generating a third output, wherein a fourth output amplifying the input is generated based on combinations of logic states of the first, second and third outputs.10-23-2008
20090290446Memory Word-line Tracking Scheme - A word-line tracking system for a memory array having a plurality of memory cells, the word-line tracking system comprises a dummy row having substantially identical structure as one or more regular rows of the memory cells, the dummy row including a dummy word-line having a first and a second end at the opposite longitudinal ends of the dummy word-line, the first end being connected to a word-line driver, a self timing generator configured to receive a clock signal and generate a pulse signal in sync with the clock signal for the dummy word-line driver, the self timing generator having a first terminal for receiving a feedback signal to determine the falling edge of the pulse signal, a voltage-to-current converter connected to the second end of the dummy word-line, a current-to-voltage converter connected to the feedback terminal, and a wire connecting the voltage-to-current converter to the current-to-voltage converter.11-26-2009
20110158007MULTI-POWER DOMAIN DESIGN - In some embodiments related to a memory array, a sense amplifier (SA) uses a first power supply, e.g., voltage VDDA, while other circuitry, e.g., signal output logic, uses a second power supply, e.g., voltage VDDB. Various embodiments place the SA and a pair of transferring devices at a local IO row, and a voltage keeper at the main IO section of the same memory array. The SA, the transferring devices, and the voltage keeper, when appropriate, operate together so that the data logic of the circuitry provided by voltage VDDB is the same as the data logic of the circuitry provided by voltage VDDA.06-30-2011
20110188326DUAL RAIL STATIC RANDOM ACCESS MEMORY - A static random access memory (SRAM) macro includes a first power supply voltage and a second power supply voltage that is different from the first power supply voltage. A precharge control is connected to the second power supply voltage. The precharge control is coupled to a bit line through a bit line precharge. At least one level shifter receives a level shifter input. The level shifter converts the level shifter input having a voltage level closer to the first power supply voltage than the second power supply voltage to a level shifter output having a voltage level closer to the second power supply voltage than the first power supply voltage. The level shifter output is provided to the precharge control.08-04-2011
20110194362WORD-LINE DRIVER USING LEVEL SHIFTER AT LOCAL CONTROL CIRCUIT - A representative circuit device includes a local control circuit having a level shifter, wherein in response to receipt of a first address signal the level shifter shifts the first address signal from a first voltage level to a second voltage level, providing a level shifted first address signal; and a word-line driver having at least one input for receiving a plurality of address signals, wherein the at least one input includes a first input that is coupled to the local control circuit to receive the level shifted first address signal, and an output that is electrically coupled to a word line of a memory cell array.08-11-2011
20120020176GENERATING AND AMPLIFYING DIFFERENTIAL SIGNALS - Some embodiments regard a circuit comprising: a first left transistor having a first left drain, a first left gate, and a first left source; a second left transistor having a second left drain, a second left gate, and a second left source; a third left transistor having a third left drain, a third left gate, and a third left source; a first right transistor having a first right drain, a first right gate, and a first right source; a second right transistor having a second right drain, a second right gate, and a second right source; a third right transistor having a third right drain, a third right gate, and a third right source; a left node electrically coupling the first left drain, the second left drain, the second left gate, the third right gate, and the third left drain; and a right node electrically coupling the first right drain, the second right drain, the second right gate, the third left gate, and the third right drain.01-26-2012
20120061764MODIFIED DESIGN RULES TO IMPROVE DEVICE PERFORMANCE - The layouts, device structures, and methods described above utilize dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures to the dummy device. Such extension of diffusion regions resolves or reduces LOD and edge effect issues. In addition, treating the gate structure of a dummy device next to an edge device also allows only one dummy structure to be added next to the dummy device and saves the real estate on the semiconductor chip. The dummy devices are deactivated and their performance is not important. Therefore, utilizing dummy devices to extend the diffusion regions of edge structures and/or non-allowed structures according to design rules allows the resolution or reduction or LOD and edge effect issues without the penalty of yield reduction or increase in layout areas.03-15-2012
20120092939SINGLE-ENDED SENSING SCHEME FOR MEMORY - A memory having a single-ended sensing scheme includes a bit line, a memory cell coupled to the bit line, and a precharge circuit. The precharge circuit is configured to precharge the bit line to a precharge voltage between a power supply voltage and a ground.04-19-2012
20120195139MULTI-POWER DOMAIN DESIGN - In some embodiments related to a memory array, a sense amplifier (SA) uses a first power supply, e.g., voltage VDDA, while other circuitry, e.g., signal output logic, uses a second power supply, e.g., voltage VDDB. Various embodiments place the SA and a pair of transferring devices at a local IO row, and a voltage keeper at the main IO section of the same memory array. The SA, the transferring devices, and the voltage keeper, when appropriate, operate together so that the data logic of the circuitry provided by voltage VDDB is the same as the data logic of the circuitry provided by voltage VDDA.08-02-2012
20120206953MEMORY EDGE CELL - A circuit comprises a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor, and a fourth NMOS transistor. The PMOS transistors and the NMOS transistors are configured to provide a first voltage reference node having a first reference voltage and a second voltage reference node having a second reference voltage. The first reference voltage and the second reference voltage serve as a first reference voltage and a second reference voltage for a memory cell, respectively.08-16-2012
20130010560GENERATING AND AMPLIFYING DIFFERENTIAL SIGNALS - A circuit includes a first node, a second node, a first current mirror circuit, and a second current minor circuit. The first current mirror circuit has a reference end and a mirrored end. The reference end of the first current minor circuit is coupled to the first node, and the mirrored end of the first current minor circuit is coupled to the second node. The second current minor circuit has a reference end and a mirrored end. The reference end of the second current minor circuit is coupled to the second node, and the mirrored end of the second current minor circuit is coupled to the first node.01-10-2013
20130094307BIT LINE VOLTAGE BIAS FOR LOW POWER MEMORY DESIGN - In a digital memory with an array of bit cells coupled to word lines and bit lines, each bit cell having cross coupled inverters isolated from bit lines by passing gate transistors until addressed, some or all of the bit cells are switchable between a sleep mode and a standby mode in response to a control signal. A bit line bias circuit controls the voltage at which the bit lines are caused to float when in the sleep mode. A pull-up transistor for each bit line BL or BLB in a complementary pair has a conductive channel coupled to a positive supply voltage and a gate coupled to the other bit line in the pair, BLB or BL, respectively. A connecting transistor also can be coupled between the bit lines of the complementary pair, bringing the floating bit lines to the supply voltage less a difference voltage ΔV.04-18-2013
20130128655METHOD AND APPARATUS FOR DUAL RAIL SRAM LEVEL SHIFTER WITH LATCHING - An apparatus includes a level shifter and a switching circuit. The level shifter includes an input, a first output, and second output having a logic value complementary to a logic value of the first output. The switching circuit includes a data input, a feedback input coupled to the second output of the level shifter, and an output coupled to the input of the level shifter. The switching circuit is configured to selectively latch, based on a select signal, a logic state of the level shifter at the second output.05-23-2013
20130194860Tracking for Write Operations of Memory Devices - Some aspects of the present disclosure relate to write tracking techniques for memory devices. In some embodiments, a memory device includes an array of SRAM cells, wherein each SRAM cell includes a pair of cross-coupled inverters having complimentary storage nodes, and a pair of access transistors that allow selective access to the complimentary storage nodes, respectively. To help ensure that wordline and bitline pulses are of sufficient length and intensity, one or more write tracking cells track a wordline tracking signal, which is representative of a wordline pulse applied to a wordline. In response to the wordline tracking signal, the write tracking cell internally generates a signal that models bitline loading, and provides an output tracking signal based on the wordline tracking and bitline loading signals. Bitline and/or wordline pulses can then be set based on the output tracking signal.08-01-2013
20130194877MEMORY AND METHOD OF OPERATING THE SAME - A memory includes a plurality of memory blocks, a plurality of global bit lines, a common pre-charging circuit, and a selection circuit. Each memory block includes a pair of bit lines, and a plurality of memory cells coupled to the pair of bit lines. Each global bit line is coupled to at least one of the memory blocks. The pre-charging circuit is configured to pre-charge the global bit lines, one at a time, to a pre-charge voltage. The selection circuit is coupled between the pre-charging circuit and the global bit lines, and configured to couple the global bit lines, one at a time, to the pre-charging circuit.08-01-2013
20130208533MEMORY HAVING READ ASSIST DEVICE AND METHOD OF OPERATING THE SAME - A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.08-15-2013
20130286708MEMORY EDGE CELL - A column of a memory includes a first edge cell and at least one memory cell. The first edge cell is located at a first edge of the column and includes a first edge cell reference node and a second edge cell reference node. Each of the at least one memory cells includes a first memory reference node. The first edge cell reference node is coupled to respective first memory reference nodes of the at least one memory cell. The second edge cell reference node serves as second memory reference nodes of the at least one memory cell. Front-end layers of the first edge cell are the same as front-end layers of a memory cell of the at least one memory cell.10-31-2013
20130311964MODIFIED DESIGN RULES TO IMPROVE DEVICE PERFORMANCE - A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.11-21-2013
20140035664VOLTAGE PROVIDING CIRCUIT - A voltage providing circuit includes a first circuit, a second circuit coupled with the first circuit, and a third circuit coupled with the second circuit. The first circuit is configured to receive a first input signal and to generate a first output signal. The second circuit is configured to receive the first input signal and the first output signal as inputs and to generate a second output signal. The third circuit is configured to receive the second output signal and to generate an output voltage.02-06-2014
20140036608TRACKING SIGNALS IN MEMORY WRITE OR READ OPERATION - A signal generating circuit includes a first circuit, a tracking circuit, and a delay circuit coupled with the first circuit and the tracking circuit. The first circuit is configured to receive a first clock signal and an output signal from an output of the delay circuit and to generate a second clock signal and at least one first tracking signal. The tracking circuit is configured to receive the at least one first tracking signal and to generate a second tracking signal. The delay circuit is configured to receive the second clock signal and the second tracking signal and to generate the output signal.02-06-2014
20140084374CELL DESIGN - One or more techniques or systems for designing a cell are provided. The cell generally includes one or more transistors, such as a pass gate transistor, a pull up transistor, or a pull down transistor, respectively associated one or more gate to gate distances. In some embodiments, a second gate to gate distance is selected based on a first gate to gate distance. For example, the first gate to gate distance and the second gate to gate distance are associated with a first transistor. In another example, the first gate to gate distance is associated with a first transistor and the second gate to gate distance is associated with a second transistor. In this manner, a cell design is provided to improve a static noise margin (SNM) or a write margin (WM) for the cell, for example.03-27-2014
20140211570Memory Read Techniques using Miller Capacitance Decoupling Circuit - Some embodiments relate to a sense amplifier output buffer configured to buffer an output of a sense amplifier. The sense amplifier output buffer includes a first pull-up element having a source coupled to a first DC supply terminal and having a drain coupled to an output terminal of the sense amplifier output buffer. A first pull-down element is in series with the first pull-up element and has a source coupled to a second DC supply terminal and has a drain coupled to the output terminal. A miller capacitance decoupling circuit is coupled between the drain of the first pull-up element and the drain of the first pull-down element. The miller capacitance decoupling circuit is configured to decouple miller capacitance associated with the drains of the pull-up and pull-down elements from the output terminal. Other embodiments are also disclosed.07-31-2014
20140266436Sense Amplifier - The present disclosure relates to a differential sense amplifier comprising first and second cross-coupled inverters with first and second complimentary storage nodes. A first current control element changes a current through the first cross-coupled inverter based upon an output of a second cross-coupled inverter, and a second current control element changes a current through the second cross-coupled inverter based upon an output of the first cross-coupled inverter. Other devices and methods are also disclosed.09-18-2014
20140269128SENSE AMPLIFIER - A sense amplifier includes a cross latch, a first pass gate, a second pass gate, a first data line, a second data line, a first circuit, and a second circuit. The cross latch has a first input/output (I/O) node and a second I/O node. The first pass gate is coupled between the first data line and the first I/O node. The second pass gate is coupled between the second data line and the second I/O node. The first circuit is coupled with the first I/O node and the second data line. The second circuit is coupled with the second I/O node and the first data line. The first circuit is configured to be turned off when the second data line has a first logical value and to be at least lightly turned on when the second data line has a voltage level between the first logical value and a second logical value different from the first logical value. The second circuit is configured to be turned off when the first data line has the first logical value and to be at least lightly turned on when the first data line has a voltage level between the first logical value and the second logical value.09-18-2014
20150021701MEMORY CELL ARRAY - A semiconductor memory cell array is disclosed that includes a memory cell unit. The memory cell unit includes an active region, a first transistor, a second transistor, a gate structure, and an interconnect. The first transistor and the second transistor are formed on the active region. The gate structure is formed on the active region and between the first transistor and the second transistor. The interconnect connects the gate structure and at least one of sources of the first transistor and the second transistor to a power line.01-22-2015

Patent applications by Hong-Chen Cheng, Hsinchu City TW

Hsien-Chie Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090184393MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF - The structure strength of a memory capacitor is reduced as the height of the memory capacitor is increased, which results in collapse and a short circuit. This invention provides a capacitor with a special reinforced structure outside, wherein the reinforced structure extends upward from the bottom of the lower electrode of the capacitor to a height, thus reducing the deformation caused by the process loading and supplying sufficient capacitance. In addition, the height of the reinforced structure is adaptable to requirement. Thereby, even when the capacitors are connected with one another because the capacitors collapse, the capacitors are prevented from malfunction. Moreover, the reinforced structures can be connected to one another or not, and thus the structure strength of the capacitor arrays is increased. Besides, the process is simplified and the cost is also reduced.07-23-2009
20090257169STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF - In order to avoid the capacitors in a stacked capacitor structure suiting a miniaturization process from collapsing to cause a short-circuit, separated reinforced structures are used and disposed at the outer-sidewalls of the capacitor, which not only reduces the space occupied by the reinforced structure to increase the surface areas of the upper electrode and the lower electrode of the capacitor, but also allows the capacitor to be deflected but collapse-proof and there are more spaces between the capacitors, so as to solve the filling difficulty problem due to a too small filling space in a successive process of depositing conductive material into the filling space.10-15-2009

Patent applications by Hsien-Chie Cheng, Hsinchu City TW

Hsin-An Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080284963Liquid crystal panel for liquid crystal display device - To utilize effectively the panel space of the liquid crystal panel, this invention has provided a wiring structure, in which the seal material and BM are coated in a superposition and the UV light is irradiated from one side of the TFT substrate; this invention has also provided a wiring structure, in which the seal material can still be irradiated by the UV light with high efficiency, meanwhile, the drop of the resistance value of the metal wiring on the TFT substrate can be restricted to a specific range. The solution is: the liquid crystal dropped is sandwiched between the TFT substrate and the CF substrate, meanwhile the liquid crystal panel is formed by adhering the light cured seal material disposed at the peripheral area of two substrates. In the adhering-formed liquid crystal panel, for the wiring portion, which is the portion of wiring disposed on the TFT substrate superposing the light cured seal material, the wiring structure is formed as follows, that is, the region of the seal material is divided into three regions, an adjacent region, a middle region and an outer region. The function of the respective regions must be held, and the resistance of the metal wiring is minimized under the precondition that the respective function is satisfied sufficiently.11-20-2008

Hsiu-Yu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100270238METHOD FOR TRANSFERRING INORGANIC OXIDE NANOPARTICLES FROM AQUEOUS PHASE TO ORGANIC PHASE - A method for transferring inorganic oxide nanoparticles from aqueous phase to organic phase. A modifier is used to change the surface polarity of inorganic oxide nanoparticles, followed by using proper solvents to transfer the modified inorganic oxide nanoparticles form aqueous phase to organic phase. The organic dispersion of modified inorganic oxide nanoparticles can be combined with a polymer to provide a polymer composite with the nanoparticles uniformly dispersed therein.10-28-2010

Hsu-Chen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080291720SPIN TORQUE TRANSFER MRAM DEVICE - The present disclosure provides a magnetic memory element. The memory element includes a magnetic tunnel junction (MTJ) element and an electrode. The electrode includes a pinning layer, a pinned layer, and a non-magnetic conductive layer. In one embodiment, the MTJ element includes a first surface having a first surface area, and the electrode includes a second surface. In the embodiment, the second surface of the electrode is coupled to the first surface of the MTJ element such that an interface area is formed and the interface area is less than the first surface area.11-27-2008
20090290410SPIN TORQUE TRANSFER MRAM DEVICE - The present disclosure provides a magnetic memory element. The memory element includes a magnetic tunnel junction (MTJ) element and an electrode. The electrode includes a pinning layer, a pinned layer, and a non-magnetic conductive layer. In one embodiment, the MTJ element includes a first surface having a first surface area, and the electrode includes a second surface. In the embodiment, the second surface of the electrode is coupled to the first surface of the MTJ element such that an interface area is formed and the interface area is less than the first surface area.11-26-2009
20100118603DEVICE AND METHOD OF PROGRAMMING A MAGNETIC MEMORY ELEMENT - The present disclosure provides a non-volatile memory device. A memory device includes a first magnetic element having a fixed magnetization. The memory device also includes a second magnetic element having a non-fixed magnetization. The memory device further includes a barrier layer between the first and second magnetic elements. A unidirectional current source is electrically coupled to the first and second magnetic elements. The current source is configured to provide a first current to the first and second memory elements. The first current has a first current density and is in a first direction. The current source is also configured to provide a second current to the first and second magnetic elements. The second current has a second current density, different than the first current density, and is in the first direction. The first and second currents cause the non-fixed magnetization of the second magnetic element to toggle between substantially parallel to the fixed magnetization of the first magnetic element and between substantially antiparallel to the fixed magnetization of the first magnetic element.05-13-2010

Patent applications by Hsu-Chen Cheng, Hsinchu City TW

Huai Yu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090250816ULTRA-THIN DIFFUSION-BARRIER LAYER FOR CU METALLIZATION - Diffusion barrier layer is required during copper metallization in IC processing to prevent Cu from diffusion into the contacting silicon material and reacting to form copper silicide, which consumes Cu and deteriorates electrical conduction. With decreasing feature sizes of IC devices, such as those smaller than 90 nano-meter (nm), the thickness of diffusion barrier layer must be thinner than 10 nm. For example, a thickness of 2 nm will be called for at the feature size 27 nm. Disclosed in the present invention is ultra-thin barrier materials and structures based on tantalum silicon carbide, and its composite with another metallic layer Ru film. The retarding temperature, by which no evidence of copper diffusion can be identified, is 600˜850° C. depending on thickness, composition and film structure, at a thickness 1.6˜5 nm.10-08-2009
20130105759STRESSED PHASE CHANGE MATERIALS05-02-2013

Huang-Chung Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100133544THIN FILM TRANSISTOR AND FABRICATING METHOD THEREOF - A thin film transistor (TFT) includes a poly-silicon island, a gate insulating layer, a gate stack layer, and a dielectric layer. The poly-silicon island includes a source region and a drain region. The gate insulating layer covers the poly-silicon island. The gate stack layer is disposed on the gate insulating layer and includes a first conductive layer and a second conductive layer. A length of the first conductive layer is less than a length of the second conductive layer. The dielectric layer covers the gate insulating layer and the gate stack layer, and therefore a number of cavities are formed between the second conductive layer and the gate insulating layer.06-03-2010
20100258808THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF - A thin film transistor and a manufacturing method thereof are provided. A bottom gate, a gate insulating layer and an amorphous semiconductor layer are formed on a substrate. The amorphous semiconductor layer has an uneven upper surface. A laser annealing process is performed on the amorphous semiconductor layer through the uneven upper layer to transform the amorphous semiconductor layer into a polycrystalline semiconductor layer having a smaller-crystallizing-section and a greater-crystallizing-section. Another gate insulating layer, an upper gate and patterned photoresist layer are formed on the polycrystalline semiconductor layer. Patterns of the upper gate and the bottom gate are defined by the same photo-mask. A source/drain is formed in the polycrystalline semiconductor layer. An etching process with etching selectivity is performed on the upper gate and the patterned photoresist layer to make a length of the upper gate shorter than that of the bottom gate.10-14-2010
20110084283THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF - A thin film transistor and a manufacturing method thereof are provided. An insulating pattern layer having at least one protrusion is formed on a substrate. Afterwards, at least one spacer and a plurality of amorphous semiconductor patterns separated from each other are formed on the insulating pattern layer. The spacer is formed at one side of the protrusion and connected between the amorphous semiconductor patterns. Later, the spacer and the amorphous semiconductor patterns are crystallized. Subsequently, the protrusion and the insulating pattern layer below the spacer are removed so that a beam structure having a plurality of corners is formed and suspended over the substrate. Then, a carrier tunneling layer, a carrier trapping layer and a carrier blocking layer are sequentially formed to compliantly wrap the corners of the beam structure. Hereafter, a gate is formed on the substrate to cover the beam structure and wrap the carrier blocking layer.04-14-2011
20120135571MANUFACTURING METHOD OF A THIN FILM TRANSISTOR - A manufacturing method of a thin film transistor is provided. An insulating pattern layer having at least one protrusion is formed on a substrate. At least one spacer and a plurality of amorphous semiconductor patterns separated from each other are formed on the insulating pattern layer. The spacer is formed at one side of the protrusion and connected between the amorphous semiconductor patterns. The spacer and the amorphous semiconductor patterns are crystallized. The protrusion and the insulating pattern layer below the spacer are removed so that a beam structure having a plurality of corners is formed and suspended over the substrate. A carrier tunneling layer, a carrier trapping layer and a carrier blocking layer are sequentially formed to compliantly wrap the corners of the beam structure. Hereafter, a gate is formed on the substrate to cover the beam structure and wrap the carrier blocking layer.05-31-2012

Patent applications by Huang-Chung Cheng, Hsinchu City TW

Hui Wen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100275335SCANNING PROBE AND METHOD FOR ATTACHING CONDUCTIVE PARTICLE TO THE APEX OF THE PROBE TIP OF THE SCANNING PROBE - A method for attaching a conductive particle to the apex of a probe tip comprises the steps of: moving the apex of a probe tip close to a conductive particle and applying a bias voltage between the probe tip and the conductive particle so that the conductive particle can permanently attach to the apex. The method uses only a bias voltage to transfer and attach conductive particles to the apex of a probe tip, and no surface treatment of the probe tip is required.10-28-2010

Hung-Chiao Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090038547AUTOMATIC WAXING APPARATUS AND METHOD - An automatic waxing apparatus and a method thereof are provided. The automatic waxing apparatus includes a movable door-shaped module, at least a waxing module and a controlling module. The movable door-shaped module includes a door-shaped structure capable of moving with respect to the vehicle. The waxing module disposed on the door-shaped structure includes a wax-supplying unit and a wax-polishing unit. The controlling module is coupled to the door-shaped structure, the wax-supplying unit and the wax-polishing unit. The controlling module, according to the information of the vehicle, determines a moving path of the door-shaped structure, a waxing path of the wax-supplying unit, and a polishing path of the wax-polishing unit with respect to the vehicle.02-12-2009
20090105112Nono-clay composite and composition for fabricating the same - The present invention relates to a nano-clay composite and a composition for fabricating the same. The nano-clay composite of the invention is formed by compounding a composition comprising a polymer, a surfactant, a polymer modification component, and micro/nano powders. The nano-clay composite is flexible to completely adhere to cleaning surfaces to remove unwanted materials via the release of surfactant, as well as the scrubbing effect produced by the friction between micro/nano powders and the surface.04-23-2009
20090117794Composition for forming antifogging coating and fabric textile applying the same method of forming the antifogging coating - A composition for forming an antifogging coating is provided. The composition includes substantially 0.1 to 10 parts by weight of numerous ultrafine particles, substantially 0.1 to 10 parts by weight of a polymeric electrolyte and substantially 80 to 100 parts by weight of water. When a layer of the composition on a material surface is dried, the antifogging coating of super-hydrophilic nanostructure constructed by these ultrafine particles is formed on the material surface.05-07-2009
20100151776Polishing body and device for removing stain - A polishing body for removing stains is provided. The polishing body includes a fiber material or a fabric and a concave is formed in the polishing body to achieve the effects of slowly releasing polishing agent and effort-saving.06-17-2010
20100317780Removable Hydrophobic Composition, Removable Hydrophobic Coating Layer and Fabrication Method Thereof - A removable hydrophobic composition, a removable hydrophobic coating layer and a fabrication method thereof are provided. The removable hydrophobic composition comprises 0.1-50 parts by weight of nano-particles having diameters smaller than 100 nm and of which surfaces are modified with silicon hydride compound, 0.1-5 parts by weight of an adhesion regulator or adhesion inhibitor, 100 parts by weight of a solvent, and 0.1-50 parts by weight of a polymer compound.12-16-2010

Patent applications by Hung-Chiao Cheng, Hsinchu City TW

Jing-Yuan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080278242Amplifier - An amplifier has a self-bias circuit to generate the bias voltage for the input of the amplifying circuit in the amplifier, thereby simplifying the circuit complexity to reduce the size and cost of the amplifier.11-13-2008

Jui-Chung Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090174927Method and Apparatus for Manufacturing Electrophoretic Displays - A method for manufacturing an electrophoretic display includes the steps of: providing a substrate; forming a flexible plate on the substrate; forming an electrophoretic layer on the flexible plate; forming a transparent protection layer on the electrophoretic layer; forming an edge protection member between the flexible plate and the transparent protection member, the edge protection member surrounding the electrophoretic layer; and providing a laser beam to irradiate the flexible plate from a side of the substrate facing away from flexible plate, so as to release the substrate from the flexible plate.07-09-2009
20090230280Carrier and Method for Manufacturing Flexible Display Panel - A carrier applicable to a laser releasing process and for carrying at least a flexible display panel is provided. The flexible display panel is formed on a transparent substrate and includes a display main body and a driving circuit module connected to an edge of the display main body. The carrier includes a carrying plate having at least a carrying area for carrying the flexible display panel and a protecting cover disposed on the carrying plate and located at an edge of the carrying area. A receiving space is formed between the protecting cover and the carrying plate for receiving the driving circuit module. The protecting cover is for shielding the driving circuit module to prevent the driving circuit module from being irradiated by a laser beam in the laser releasing process. A method for manufacturing flexible display panel also is provided.09-17-2009

Kong-Wei Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100151153METHOD AND APPARATUS FOR GROWING A COMPOSITE METAL SULPHIDE PHOTOCATALYST THIN FILM - A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS06-17-2010
20120031774ELECTRODE FOR AN ELECTROCHEMICAL DEVICE AND METHOD FOR DETECTING HYDROGEN PEROXIDE USING THE ELECTRODE - An electrode for an electrochemical device includes a conductor, and an active layer formed on the conductor and including a polybenzimidazole polymer that contains at least one of the functional group of the following formula:02-09-2012
20120035334METHOD FOR PREPARING CARBOXYLIC POLYBENZIMIDAZOLE - A method for preparing a carboxylic polybenzimidazole includes reacting a polybenzimidazole polymer with a cyclic acid anhydride to form the carboxylic polybenzimidazole.02-09-2012
20130247823METHOD AND APPARATUS OF GROWING A THIN FILM - A method and apparatus of growing a thin film are provided. The method comprises at least (a) providing a number of substrates; (b) cleaning the substrates; and (c) placing the substrates into a reaction liquid; (d) vibrating the reaction liquid by ultrasonic waves such that a thin film is grown on the substrates evenly.09-26-2013

Patent applications by Kong-Wei Cheng, Hsinchu City TW

Kung-Yu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100164369APPARATUS OF ORGANIC LIGHT EMITTING DIODE AND PACKAGING METHOD OF THE SAME - A packaging method of an organic light emitting diode (OLED) is described. First, a substrate is provided, and the substrate has the OLED device formed thereon. Thereafter, at least one protection layer is formed on the substrate, so as to cover the peripheral sidewall of the OLED device entirely. The step of forming the protection layer includes forming an organic layer on the substrate, and then forming a metal layer on the organic layer, wherein the metal layer at least covers a sidewall of the OLED device. Afterwards, an oxidation treatment is performed, so as to oxidize a portion of the metal layer.07-01-2010
20120012246ENCAPSULATION METHOD OF ENVIRONMENTALLY SENSITIVE ELECTRONIC ELEMENT - An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.01-19-2012

Li-Ju Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110097617Battery Set with Heat Conducting Jelly - A battery set filled with heat conducting jelly is disclosed, which comprises a shell, for housing a cooling unit; and a plurality of battery cells, each battery cell being disposed inside the shell while having a heat conducting jelly, featuring with electric insulation and heat conduction abilities, to be filled surrounding the periphery thereof and contacting with the outer surface of each battery cell.04-28-2011
20110215667MAGNETIC TRANSMISSION ASSEMBLY - A magnetic transmission assembly is adapted to integration with a motor or generator. The magnetic transmission assembly includes a rotor, a stator, and a magnetically conductive element. The rotor and the stator are sleeved coaxially and respectively have R and ST09-08-2011
20110215668MAGNETIC TRANSMISSION ASSEMBLY - A magnetic transmission assembly is adapted to integration with a motor or generator. The magnetic transmission assembly includes a rotor, a stator, and a magnetically conductive element. The rotor and the stator are sleeved coaxially and respectively have R and ST09-08-2011
20120169157COOLING MODULE AND WATER-COOLED MOTOR SYSTEM USING THE SAME - A cooling module and a water-cooled motor system using the same are provided. The cooling module comprises a main body and a first flow passage assembly. The main body comprises a first lateral portion and a second lateral portion opposite the first lateral portion. The first flow passage assembly, disposed in the main body, comprises a first flow passage and a second flow passage. The first flow passage has a first end and a second end, wherein the first end is adjacent to the first lateral portion, and the second end is adjacent to the second lateral portion. The second flow passage has a third end and a fourth end, wherein the third end is connected to the second end of the first flow passage, and the fourth end is adjacent to the first lateral portion.07-05-2012
20130140920STATOR ASSEMBLY STRUCTURE FOR AXIAL FLUX ELECTRIC MACHINE - A stator assembly structure for an axial flux electric machine is designed. The back iron for each silicon steel disk stator is formed into a specific structure with tooth-like protrusions for allowing the same to be integrated with the disk-type stator seat, while the disk-type stator seat is made of a material suitable for casting or mold forming. A coil is mounted on the disk stator, and a stator assembly is achieved by integrating the stator, the coil and the stator seat. The stator and the disk-type stator seat of the stator assembly are manufactured by using a one-piece cast or one-piece mold forming method so as to enable the contact surfaces of the stator and the stator seat to engage with each other even more tightly, and consequently enable the heat generated from the coil to be transmitted rapidly from the disk stator to the disk-type stator seat.06-06-2013
20140183930DETACHABLE POWER MODULE - A disassembled and assembled power module includes: a wheel shaft; a power module; a central shaft, arranged in the power module and passing through the wheel shaft; and an engaging unit, capable of fastening the central shaft to the wheel shaft. In an embodiment when the detachable power module is applied in an electric driven wheelchair, it enables the weight of the wheelchair to be reduced by simply detach and remove the detachable power from the wheelchair so that the electric driven wheelchair without the heavy power module can be carry and transport easily, and also the moving range of the electric driven wheelchair can be increased as its power module can be easily detached and replaced with another fully charged power module so that the range anxiety of the disabled person using the same or the assistant can be relieved.07-03-2014

Patent applications by Li-Ju Cheng, Hsinchu City TW

Li-Wei Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090242997METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE AND STRUCTURE OF STATIC RANDOM ACCESS MEMORY - A method for fabricating a semiconductor structure is disclosed. A substrate with a first transistor having a first dummy gate and a second transistor having a second dummy gate is provided. The conductive types of the first transistor and the second transistor are different. The first and second dummy gates are simultaneously removed to form respective first and second openings. A high-k dielectric layer, a second type conductive layer and a first low resistance conductive layer are formed on the substrate and fill in the first and second openings, with the first low resistance conductive layer filling up the second opening. The first low resistance conductive layer and the second type conductive layer in the first opening are removed. A first type conductive layer and a second low resistance conductive layer are then formed in the first opening, with the second low resistance conductive layer filling up the first opening.10-01-2009
20110031558GATE STRUCTURE OF SEMICONDUCTOR DEVICE - A gate structure of a semiconductor device includes a first low resistance conductive layer, a second low resistance conductive layer, and a first type conductive layer disposed between and directly contacting sidewalls of the first low resistance conductive layer and the second low resistance conductive layer.02-10-2011
20110034019METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE - A method for fabricating a semiconductor structure is disclosed. A substrate with a first transistor having a first dummy gate and a second transistor having a second dummy gate is provided. The conductive types of the first transistor and the second transistor are different. The first and second dummy gates are simultaneously removed to form respective first and second openings. A high-k dielectric layer, a second type conductive layer and a first low resistance conductive layer are formed on the substrate and fill in the first and second openings, with the first low resistance conductive layer filling up the second opening. The first low resistance conductive layer and the second type conductive layer in the first opening are removed. A first type conductive layer and a second low resistance conductive layer are then formed in the first opening, with the second low resistance conductive layer filling up the first opening.02-10-2011
20110294287METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING DUAL FULLY-SILICIDED GATE - A method of manufacturing the semiconductor device having a dual fully-silicided gate includes the following steps. A substrate having a first transistor and a second transistor formed thereon is provided, wherein the first transistor includes a first gate and a first source/drain and the second transistor includes a second gate and a second source/drain. The gate height of the first gate is different from that of the second gate. A first silicidation process is performed to respectively transform the first gate and the second gate into a first silicided gate and a second silicided gate simultaneously, wherein the material of the first silicided gate is different from that of the second silicided gate.12-01-2011

Patent applications by Li-Wei Cheng, Hsinchu City TW

Long-Cheng Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090016551ELECTROSTATIC ELECTROACOUSTIC TRANSDUCERS - An electrostatic electroacoustic device comprising a first electrode configured to receive an audio signal, a second electrode configured to receive the audio signal, a first electret between the first electrode and the second electrode, the first electret including at least one dielectric layer containing electrostatic charges, a second electret between the first electrode and the second electrode, the second electret including at least one dielectric layer containing electrostatic charges, and a conductive layer sandwiched between the first electret and the second electret, the conductive layer, the first electret and the second electret being capable of vibratory motion relative to the first electrode and the second electrode based on the audio signal.01-15-2009

Ming-Hsin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090221144Manufacturing method for nano scale Ge metal structure - Manufacturing methods for nano scale Ge include: Form dielectric layer on the substrate surface, then etch the dielectric layer to form openings of three different dimensions, then use chemical vapor deposition process to deposit Ge metal layer to cover the substrate, dielectric layer and the openings; then on the opening of three different dimensions, nano-dot, nano-disk and nano-ring are formed.09-03-2009
20100216298Method for growing Ge expitaxial layer on patterned structure with cyclic annealing - A Ge epitaxial layer is grown on a silicon substrate with a patterned structure. Through a cyclic annealing, dislocation defects are confined. The present invention provides a method for manufacturing a high-quality Ge epitaxial layer with a low cost and a simple procedure. The Ge epitaxial layer obtained can be applied to high mobility Ge devices or any lattice-mismatched epitaxy on a photonics device.08-26-2010

Ming-Jen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090042894NOVEL SPECIES OF ACROCARPOSPORA, A METHOD OF PREPARING IODININ, AND THE USES OF IODININ - The present invention provides a novel species of 02-12-2009
20110165186NOVEL PYRIDINE ALKALOIDS, PREPARATION PROCESS THEREOF, AND THE USES OF THE PYRIDINE ALKALOIDS - The present invention relates to novel pyridine alkaloid compounds of formula (I):07-07-2011
20120164120NOVEL MONASCUSPURPURONES, PREPARATION PROCESS THEREOF, AND USES OF THE MONASCUSPURPURONES - The present invention relates to a novel monascuspurpurone compound of formula (I):06-28-2012
20140357555NOVEL MONASCUSPURPURONES, PREPARATION PROCESS THEREOF, AND USES OF THE MONASCUSPURPURONES - The present invention relates to a novel monascuspurpurone compound of formula (I):12-04-2014

Patent applications by Ming-Jen Cheng, Hsinchu City TW

Nai-Han Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100221849METHOD AND SYSTEM FOR CONTROLLING AN IMPLANTATION PROCESS - A method for implant uniformity is provided that includes determining a variation of critical dimensions (CD) of a semiconductor wafer, moving the semiconductor wafer in a two-dimensional mode during an implantation process, and controlling a velocity of the movement of the semiconductor wafer so that an implant dose to the semiconductor wafer is varied based on the variation of CD.09-02-2010
20130075623MULTI-ION BEAM IMPLANTATION APPARATUS AND METHOD - An multi-ion beam implantation apparatus and method are disclosed. An exemplary apparatus includes an ion beam source that emits at least two ion beams; an ion beam analyzer; and a multi-ion beam angle incidence control system. The ion beam analyzer and the multi-ion beam angle incidence control system are configured to direct the emitted at least two ion beams to a wafer.03-28-2013
20130075624Beam Monitoring Device, Method, And System - A beam monitoring device, method, and system is disclosed. An exemplary beam monitoring device includes a one dimensional (1D) profiler. The 1D profiler includes a Faraday having an insulation material and a conductive material. The beam monitoring device further includes a two dimensional (2D) profiler. The 2D profiler includes a plurality of Faraday having an insulation material and a conductive material. The beam monitoring device further includes a control arm. The control arm is operable to facilitate movement of the beam monitoring device in a longitudinal direction and to facilitate rotation of the beam monitoring device about an axis.03-28-2013
20130110276MULTI-FACTOR ADVANCED PROCESS CONTROL METHOD AND SYSTEM FOR INTEGRATED CIRCUIT FABRICATION05-02-2013
20130140987ION IMPLANTATION WITH CHARGE AND DIRECTION CONTROL - The present disclosure provides for various advantageous methods and apparatus of controlling electron emission. One of the broader forms of the present disclosure involves an electron emission element, comprising an electron emitter including an electron emission region disposed between a gate electrode and a cathode electrode. An anode is disposed above the electron emission region, and a voltage set is disposed above the anode. A first voltage applied between the gate electrode and the cathode electrode controls a quantity of electrons generated from the electron emission region. A second voltage applied to the anode extracts generated electrons. A third voltage applied to the voltage set controls a direction of electrons extracted through the anode.06-06-2013
20130171336WAFER PROCESSING METHOD AND SYSTEM USING MULTI-ZONE CHUCK - In a wafer processing method and a wafer processing system, a first property on a back side of a wafer is measured. The back side of the wafer is supported on a multi-zone chuck having a plurality of zones with controllable clamping forces. The wafer is secured to the multi-zone chuck by controlling the clamping forces in the corresponding zones in accordance with measured values of the first property in the zones.07-04-2013
20130295753ION BEAM DIMENSION CONTROL FOR ION IMPLANTATION PROCESS AND APPARATUS, AND ADVANCED PROCESS CONTROL - A process control method is provided for ion implantation methods and apparatuses, to produce a high dosage area on a substrate such as may compensate for noted non-uniformities. In an ion implantation tool, separately controllable electrodes are provided as multiple sets of opposed electrodes disposed outside an ion beam. Beam blockers are positionable into the ion beam. Both the electrodes and beam blockers are controllable to reduce the area of the ion beam that is incident upon a substrate. The electrodes and beam blockers also change the position of the reduced-area ion beam incident upon the surface. The speed at which the substrate scans past the ion beam may be dynamically changed during the implantation process to produce various dosage concentrations in the substrate.11-07-2013
20140202383WAFER PROCESSING SYSTEM USING MULTI-ZONE CHUCK - A wafer processing system includes at least one metrology chamber, a process chamber, and a controller. The at least one metrology chamber is configured to measure a thickness of a first layer on a back side of a wafer. The process chamber is configured to perform a treatment on a front side of the wafer. The front side is opposite the back side. The process chamber includes therein a multi-zone chuck. The multi-zone chuck is configured to support the back side of the wafer. The multi-zone chuck has a plurality of zones with controllable clamping forces for securing the wafer to the multi-zone chuck. The controller is coupled to the metrology chamber and the multi-zone chuck. The controller is configured to control the clamping forces in the corresponding zones in accordance with measured values of the thickness of the first layer in the corresponding zones.07-24-2014
20140235071SUBSTRATE RAPID THERMAL HEATING SYSTEM AND METHODS - A method and apparatus for rapid thermal heat treatment of semiconductor and other substrates is provided. A number of heat lamps arranged in an array or other configuration produce light and heat radiation. The light and heat radiation is directed through a heat slot that forms a radiation beam of high intensity light and heat. The radiation beam is directed to a platen that includes multiple substrates. The apparatus and method include a controller that controls rotational and translational motion of the platen relative to the heat slot and also controls the power individually and collectively supplied to the heat lamps. A program is executed which maneuvers the platen such that all portions of all substrates receive the desired thermal treatment, i.e. attain a desired temperature for a desired time period.08-21-2014
20140273420ION IMPLANTATION - One or more techniques or systems for ion implantation are provided herein. A pressure control module is configured to maintain a substantially constant pressure within an ion implantation or process chamber. Pressure is maintained based on an attribute of an implant layer, pressure data, feedback, photo resist (PR) outgassing, a PR coating rate, a space charge effect associated with the implant layer, etc. By maintaining pressure within the process chamber, effects associated with PR outgassing are mitigated, thereby mitigating neutralization of ions. By maintaining charged ions, better control over implantation of the ions is achieved, thus allowing ions to be implanted at a desired depth.09-18-2014

Patent applications by Nai-Han Cheng, Hsinchu City TW

Nai-Sheng Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090131176GAME PROCESSING DEVICE - A game processing device in a displaying apparatus is capable of receiving a game data from an electronic device outside the displaying apparatus. The game processing device comprises: a transmission interface module, for receiving a game data, wherein the game data is used for rendering at least one game image; and a processing module, coupled to the transmission interface module, for rendering the game image according to the game data.05-21-2009

Patent applications by Nai-Sheng Cheng, Hsinchu City TW

Pi-Ying Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080271528SENSING DEVICE - The present invention discloses a sensing device, wherein a hemispherical container containing a liquid dielectric, and the hemispherical container has more than two pairs of electrodes, and the liquid dielectric can trigger the conduction states of the electrodes. A corrosion-resistant material envelops the container. A precision valve is arranged in the container and used to adjust the level of the liquid dielectric and the sensitivity of the sensing device. A buffer necking part is also arranged in the container and used to prevent from non-expected vibration-induced contact between the electrodes and the liquid dielectric. A leakage-proof detection device envelops the hemispherical container, the liquid dielectric, the precision valve, and the buffer necking part and functions to prevent from the leakage of the liquid dielectric. Thus, the present invention can provide an adjustable multi-directional tilt-sensing device for level control.11-06-2008

Po-Tai Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110080157FLUX LINKAGE COMPENSATOR FOR UNINTERRUPTIBLE POWER SUPPLY - The present invention discloses a flux linkage compensator, which applies to an UPS system and comprises a load transformer flux linkage observer, a compensation voltage command generator, and a flux linkage command generator. The load transformer flux linkage observer generates a load transformer flux linkage signal. The flux linkage command generator generates a flux linkage command signal. The difference between the load transformer flux linkage signal and the flux linkage command signal forms a flux linkage deviation signal. The compensation voltage command generator generates a voltage compensation signal to make the flux linkage deviation signal approach zero. Thereby, the flux linkage compensator can compensate for the flux linkage deviation occurring in starting the UPS system. Thus, the present invention can perform voltage compensation fast and reliably and inhibit the inrush current effectively.04-07-2011
20130057236LOW VOLTAGE RIDE-THROUGH CONTROL METHOD FOR GRID-CONNECTED CONVERTER OF DISTRIBUTED ENERGY RESOURCES - An LVRT control method for a grid-connected converter of distributed energy resources comprises steps of: obtain a positive sequence electrical component and a negative sequence electrical component during an LVRT period; outputting a compensation signal according to a power threshold withstood by a grid-connected converter to undertake reactive power compensation; and constraining the output power lower than the power threshold. The present invention uses the positive and negative sequence electrical components to undertake reactive power compensation, whereby to improve balance and stability of voltage during the LVRT period, avoid reverse torque and mechanical resonance, and prolong the service life of the power generator. Moreover, the present invention constrains the sum of the compensation currents below the power threshold to prevent the circuit of the power generator from being overloaded and damaged, whereby is prolonged the service life of the power system.03-07-2013
20130073109DROOP CONTROL SYSTEM FOR GRID-CONNECTED SYNCHRONIZATION - A droop control system for grid-connected synchronization connects to a plurality of distributed power generation modules and a utility grid system. The droop control system includes a detection processing module and a plurality of regulation control modules corresponding to the distributed power generation modules. The detection processing module is coupled with the distributed power generation modules and utility grid system in parallel to obtain a voltage difference, a phase angle difference and a frequency difference. The regulation control modules perform droop control of real power-frequency variety and reactive power-voltage variety and phase angle compensation. Through reactive power-voltage variety droop control approach, impact of impedance alterations in the power system can be eliminated and voltage fluctuations can also be minimized to achieve stable effect. Hence electric power of the utility grid system and distributed power generation modules can be regulated synchronously.03-21-2013

Po-Wen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100315269Decoding Method - A decoding method comprising the following steps is provided. The m12-16-2010

Terry Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100212100Cleaning Apparatus for Sophisticated Electric Device - A cleaning apparatus is provided to clean a sophisticated electric device. The apparatus has cleaning units and each of the cleaning units has a cambered top. Thus, coordinated with an actuating device, a sophisticated electric device can be cleaned by using the cleaning apparatus with cleaning units having cambered tops.08-26-2010

Tsung-Chieh Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100216298Method for growing Ge expitaxial layer on patterned structure with cyclic annealing - A Ge epitaxial layer is grown on a silicon substrate with a patterned structure. Through a cyclic annealing, dislocation defects are confined. The present invention provides a method for manufacturing a high-quality Ge epitaxial layer with a low cost and a simple procedure. The Ge epitaxial layer obtained can be applied to high mobility Ge devices or any lattice-mismatched epitaxy on a photonics device.08-26-2010

Tun-Jen Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090039425HIGH-VOLTAGE MOS TRANSISTOR DEVICE - A HV MOS transistor device having a substrate, a gate, a source, a drain, a first ion well of a first conductive type disposed in the substrate, and a plurality of field plates disposed on the substrate is disclosed. The HV MOS transistor device further has a first doped region of a second conductive type positioned in the first ion well. Therefore, a first interface and a second interface between the first ion well and the first doped region are formed, and the first interface and the second interface are respectively positioned near the drain and the source. In addition, the first interface is positioned under a respective field plate to produce a smooth field distribution and to increase the breakdown voltage of the HV transistor device.02-12-2009

Wei-Kai Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110018819Touch Panel Interface System Used on Touch Panel, Touch device, and Method thereof - For solving the defect that a hardware clock of a serial peripheral interface bus has to cooperate with slower software-simulated clocks used by a microprocessor while applying serial peripheral interface buses on a large-scale touch panel, a programmable logic device is used as a bridge of communicating information between the micro processor and sensors. Therefore, the microprocessor no longer has to take execution time to simulate serial peripheral interface buses by software, and is able to program hardware clocks of each of the serial peripheral interface buses according to speed requirements of different sensors, so that sensing signals of a plurality of sensors may be integrated on a touch device having the large-scale touch panel, and a processing speed of the touch device in processing the sensing signals may be optimized as a result.01-27-2011
20110025641TOUCH SCREEN APPLIED TO ELECTRONIC APPARATUS - A touch screen includes a substrate, a plurality of conductive areas and a controller. The conductive areas are disposed on the substrate. The controller is electrically connected to the conductive areas. When one of the conductive areas is touched, the controller determines a coordinate where the touched conductive area is located on the substrate according to the capacitance change of the touched conductive area.02-03-2011

Wen-Cheng Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100051581PLASMA CLEANING FOR PROCESS CHAMBER COMPONENT REFURBISHMENT - A method for cleaning and refurbishing a chamber component includes placing a chamber component having process deposits on an exterior surface in a plasma vapor deposition chamber. The chamber component is bombarded with a plasma comprising Argon for a period of time sufficient to remove the process deposits from the exterior surface of the chamber component.03-04-2010

Wen-Chin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110100556Plasma System with Injection Device - A plasma system with an injection device is provided. The plasma system comprises a plasma cavity and an injection device. The plasma cavity comprises a first electrode and a second for generating plasma. The injection device comprises a plasma injection tube and at least a reactant injection tube. The plasma injection tube is connected to the plasma cavity. The plasma injection tube comprises an inlet, an outlet and an outer sidewall. The plasma injection tube injects the plasma from the inlet and guides the plasma out through the outlet. The outer sidewall has a width decreasing from the inlet to the outlet. The reactant injection tube is disposed outside of the outer sidewall. The reactant injection tube injects a reactant to the outer sidewall so that the reactant flows along the outer sidewall toward the outlet and mixes with the plasma at the outlet.05-05-2011

Wenchu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100241414DEBUGGING SIMULATION WITH PARTIAL DESIGN REPLAY - A virtual platform simulates behavior of a modular circuit based on a circuit design including both high-level and low-level models of circuit modules. A compiler that converts the high-level and low-level models into executable models prior to an initial simulation also generates a separate “replay engine” corresponding to each low-level module for use during subsequent replay simulations. During the initial simulation, the virtual platform simulates circuit behavior by concurrently executing the high-level and low-level executable models and recording data representing behavior of output signals of the low-level design modules modeled by the executable models. To speed up subsequent replays of the simulation, the virtual platform executes one or more of the replay engines in lieu of executing their corresponding low-level executable models. Each executed replay engine simulates behavior of each output signal of a corresponding low-level module in response to the data recorded during the initial simulation representing the behavior of that output signal.09-23-2010

Wen-Fang Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080201451SYSTEMS AND METHODS FOR REAL-TIME MEDIA COMMUNICATIONS - A system for real-time media communication comprises a first server unit configured to interface between at least one user and a blog and a second server unit configured to process the real-time media content in a streaming mode. The first server unit comprises a publishing control module configured to identify an identity of a publisher of the at least one user, allow the publisher to transmit real-time media content if the identity of the publisher is authentic and receive a description of the real-time media content from the publisher, and a link module configured to obtain a location of the real-time media content so that the location of the real-time media content is accessible to the at least one user. The second server unit comprises a receiving module configured to receive the real-time media content, a recording module configured to record the real-time media content, and a dispatching module configured to provide the location of the real-time media content to the publishing module.08-21-2008

Wen-Hsin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100271294Method for Reducing Resonance Energy of an LCD panel and Related LCD Device - A method for reducing resonance energy of an LCD panel includes providing a plurality of driving signal patterns, each defining a non-overlap area width of a synchronization signal and a scan-line charging frequency, and determining an order of the plurality of driving signal patterns to modulate driving signals of the LCD panel accordingly.10-28-2010
20110242031DISPLAY DEVICE WITH TOUCH FUNCTION AND 2D SENSING METHOD THEREOF - A display device with a touch function is provided. The display device includes a display panel and a touch panel. The display panel has a plurality of image scan lines, and the image scan lines are respectively activated by a plurality of scan signals generated by a gate driver according to a time sequence. The touch panel has a plurality of touch scan lines and a plurality of touch sensing lines, wherein the touch scan lines and the touch sensing lines are disposed crossing each other for sensing a touched position. The gate driver also provides a plurality of touch scan signals to the touch scan lines according to a time sequence.10-06-2011
20130113776Power Management Circuit and Gate Pulse Modulation Circuit Thereof - A power management circuit for a liquid crystal display device is disclosed. The power management circuit includes one or more power generating circuits, for receiving one or more input voltages and generating one or more output voltages, respectively; a gate pulse modulation circuit, coupled between a gate high-level voltage source and a discharging control terminal, for generating a gate control signal; and a discharging controller, coupled to the discharging control terminal, for providing a discharging path for the gate pulse modulation circuit, wherein one of the gate pulse modulation circuit and the discharging controller is further coupled to a power supply such that the gate pulse modulation circuit discharges to the power supply during a gate discharging period, and the power supply is one of the one or more input voltages and the one or more output voltages.05-09-2013
20140042917LED DEVICE, LED DRIVING CIRCUIT AND METHOD - A light-emitting diode (LED) driving circuit includes an LED control circuit and a power stage circuit. The LED control circuit shifts an input pulse width modulation (PWM) signal toward a higher frequency direction in a frequency domain to generate an output PWM signal having a duty cycle substantially the same as a duty cycle of the input PWM signal. The power stage circuit outputs an LED driving current according to the output PWM signal.02-13-2014

Patent applications by Wen-Hsin Cheng, Hsinchu City TW

William Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20080296571MULTI-PROJECT WAFER AND METHOD OF MAKING SAME - A semiconductor wafer is fabricated. The wafer has a plurality of dies. The plurality of dies include at least operable dies of a first type and operable dies of a second type different from the first type. The dies of the second type are rendered inoperable, while keeping the dies of the first type operable. The wafer is provided with the operable dies of the first type and the inoperable dies of the second type on it, for testing of the dies of the first type.12-04-2008
20110006404STRUCTURE AND METHOD OF WAFER LEVEL CHIP MOLDED PACKAGING - A wafer is provided having a chip side and a non-chip side, the chip side comprising a plurality of semiconductor chips. A plurality of dies are provided, each of the dies is bonded to one of the plurality of semiconductor chips. One or more trenches are formed on the chip side of the wafer. The chip side of the wafer and the plurality of dies are encapsulated with a protecting material, the protecting material substantially filling the one or more trenches. The wafer is diced to separate it into individual semiconductor packages.01-13-2011
20140117568STRUCTURE OF WAFER LEVEL CHIP MOLDED PACKAGE - An integrated circuit structure includes a semiconductor chip having a die side and a non-die side, the die side having one or more trenches formed therein. The integrated circuit structure further includes at least one die bonded onto the die side of the semiconductor chip. The integrated circuit structure further includes a protecting material encapsulating the at least one die and substantially filling the one or more trenches.05-01-2014

Patent applications by William Cheng, Hsinchu City TW

Yao-Chin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090117701METHOD FOR MANUFACTURING A MOS TRANSISTOR - A method for manufacturing a MOS transistor includes performing a thermal treatment to repair damaged substrate before forming source/drain extension regions, accordingly negative bias temperature instability (NBTI) is reduced. Since the thermal treatment is performed before forming the source/drain extension regions, heat budget for forming the source/drain extension regions and junction depth and junction profile of the source/drain extension would not be affected. Therefore the provided method for manufacturing a MOS transistor is capable of reducing short channel effect and possesses a superior process compatibility.05-07-2009
20090186475Method of manufacturing a MOS transistor - A method of manufacturing a MOS transistor, in which, a tri-layer photo resist layer is used to form a patterned hard mask layer having a sound shape and a small size, and the patterned hard mask layer is used to form a gate. Thereafter, by forming and defining a cap layer, a recess is formed through etching in the substrate. The patterned hard mask is removed after epitaxial layers are formed in the recesses. Accordingly, a conventional poly bump issue and an STI oxide loss issue leading to contact bridge can be avoided.07-23-2009
20090246922METHOD OF FORMING CMOS TRANSISTOR - A method of forming CMOS transistor is disclosed. A CMOS transistor having a first active area and a second active area is provided. In order to maintain the concentration of the dopants in the second active area, according to the method of the present invention an ion implantation process is performed to form a lightly doped drain (LDD) in the second active area after an epitaxial layer is formed in the first active area. On the other hand, the ion implantation process is performed to form the respective LDD of the first active area and the second active area. After the epitaxial layer in the first active area is formed, another ion implantation process is performed to implant dopants into the LDD of the second active area again.10-01-2009

Yen-Chien Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110055857MOVE-SLED-HOME DEVICE AND METHOD FOR USE IN OPTICAL DISC DRIVE - A move-sled-home device is used in an optical disc drive. The move-sled-home device includes a processing unit, a motor actuator, a sled, a sled motor, and a current-detecting unit. The processing unit outputs a control signal. The motor actuator generates a driving voltage according to the control signal. The sled motor generates a driving current according to the driving voltage to move the sled. The current-detecting unit is used for receiving and converting the driving current into an indicating signal, and issuing the indicating signal to the processing unit. During a move-sled-home action, the processing unit realizes a magnitude of the driving current according to the indicating signal, thereby determining whether the move-sled-home action is finished.03-03-2011
20110158614MOTOR ROTATION SPEED CONTROL DEVICE AND METHOD THEREOF - A motor rotational speed control device for controlling a direct current (DC) brush motor is provided, which includes a motor driver, a detection unit and a central processing unit (CPU). The motor driver is coupled to a first control terminal and a second control terminal of the DC brush motor. The detection unit detects a back electromotive force (EMF) of the DC brush motor through the first control terminal and the second control terminal when the motor driver is set to a disable state, and accordingly generates back EMF information. The CPU determines whether the direct current brush motor has stopped rotating according to the back EMF information, and determines whether to generate a brake control signal according to a determination result. The motor driver reduces a rotation speed of the DC brush motor according to the brake control signal when the motor driver is set to an enable state.06-30-2011
20120221925DATA RECOVERY METHOD AND ASSOCIATED DEVICE - A data recovery method includes the following steps. Firstly, plural sampling values are classified into a first group, a second group, a third group and a fourth group. A first channel estimation value and a second channel estimation value are generated according to the sampling values of the second group and the third group. A judging step is performed to judge whether a first sampling value of the first group is lower than the first channel estimation value or a second sampling value of the fourth group is higher than the second channel estimation value. If the judging condition is satisfied, a polarity of the first sampling value or the second sampling value is changed and then the plural sampling values are outputted. If the judging condition is not satisfied, the plural sampling values are directly outputted.08-30-2012
20130070578DATA RECOVERY DEVICE AND METHOD - A data recovery device including a filter, a tilt detection unit, a tilt cancellation unit and a data conversion unit is provided. The filter filters a radio-frequency data stream to generate an original data stream. The tilt detection unit synthesizes a tangential push-pull data stream by employing a first to a fourth data streams, and generates a tilt direction signal according to symmetry of a curve composed by the tangential push-pull data stream. The tilt cancellation unit detects a plurality of rising areas and falling areas of the original data stream, and reconstructs a plurality of data points corresponding to the rising areas or falling areas in the original data stream so as to generate a tilt repair data stream. The data conversion unit recovers the tilt repair data stream to a modulation signal.03-21-2013
20130194119ANALOG-TO-DIGITAL CONVERSION DEVICE AND METHOD THEREOF - An analog-to-digital conversion device and a method thereof are provided. The analog-to-digital conversion device includes a first level adjustment unit, an analog-to-digital converter (ADC), and a linear range detection unit. The ADC converts a test signal or a first input signal to generate a test data stream or a first output data stream. In an adjustment mode, the linear range detection unit obtains a conversion curve of the ADC by using the test data stream and determines whether to adjust offset control information according to a linear range of the conversion curve. In an operation mode, the linear range detection unit continues outputting the offset control information. Additionally, before transmitting the first input signal, the first level adjustment unit adjusts a direct-current level of the first input signal according to the offset control information to allow the first input signal to be within the linear range of the conversion curve.08-01-2013

Patent applications by Yen-Chien Cheng, Hsinchu City TW

Ying-Chuan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110141099DRIVING METHOD FOR PIXELS OF BISTABLE DISPLAY - A driving method for pixels of bistable display is adapted into a bistable display having a plurality of pixels. The driving method comprises: increasing predetermined driving forces of the pixels to increased driving forces in a predetermined period; employing the increased driving forces to drive the pixels in the predetermined period respectively; and employing the predetermined driving forces configured for driving the pixels to drive the pixels out of the predetermined period respectively.06-16-2011

Yi-Shan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090118231Pectin-modified resistant starch, a composition containing the same and method for preparing resistant starch - This invention relates to a pectin-modified resistant starch prepared by cross-linking starch with pectin by pectinesterase reaction. Such resistant starch is low amylase digestible and thus is useful in food products, including nutritional supplements, to reduce calorie content and increase fiber content. This invention also relates to a composition containing the resistant starch and a process for the preparation of the same.05-07-2009

Yu Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090212868LOW POWER COMSUMPTION, LOW NOISE AND HIGH POWER GAIN DISTRIBUTED AMPLIFERS FOR COMMUNICATION SYSTEMS - Provided is a distributed amplifier in communication systems, including: an input transmission line; an output transmission line; an input impedance match and an output impedance match, for providing termination of the input transmission line and the output transmission line, respectively and for preventing signal reflection in the input transmission line and the output transmission line, respectively; multi-stage Gm cells with common mode feedback, the input transmission line being coupled to the output transmission line by the transconductance of the Gm cells; and an input gate bias circuit, for providing bias for the multi-stage Gm cells. In at least one of the Gm cells, one inverter performs V/I conversion while other inverters provide negative resistance to control common mode of output voltage and to enhance DC gain of the Gm cell. Due to common mode feedback, no output gate bias is needed.08-27-2009

Yuh Chuan Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20100142754INSPECTION METHOD AND SYSTEM FOR DISPLAY - A ghost image inspection system comprises a carrier, a reflectance measurement apparatus, and a processing apparatus. The carrier is configured to support the electronic paper display, and the electronic paper display is configured to show a test pattern and at least one sub-frame. The test pattern has a plurality of optical states. The reflectance measurement apparatus is coupled to the carrier and is configured to measure reflectances of the test pattern and at least one sub-frame, and the processing apparatus is coupled to the reflectance measurement apparatus and is configured to determine whether the reflectance is worse than a threshold value of a ghost image index.06-10-2010

Yu Hsain Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090018241HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION - The present invention relates to a halogen-free phosphorous epoxy resin composition, primarily used as an adhesive for the printed circuit board. The composition comprises a halogen-free phosphorous contained epoxy resin which reduces the addition amount of additional flame retardant; in order to offer flame retardancy while maintaining high flexibility of flexible printed circuit board.01-15-2009
20100048766HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION - The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.02-25-2010

Yu-Lin Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090251477MEMORY SAVING DISPLAY DEVICE - A display device capable of saving memory storage used for an overdriving function includes a compression unit, a frame buffer, a decompression unit and a look-up table (LUT) unit. The compression unit includes a decimation filter and is used for compressing data of a received frame and reducing a size of the received frame, to generate a compression frame. The frame buffer is coupled to the compression unit and used for storing the compression frame. The decompression unit includes an interpolation filter and is used for decompressing data of the compression frame outputted by the frame buffer and reducing a size of the compression frame, to generate a decompression frame. The LUT unit is coupled to the decompression unit and used for comparing the decompression frame with a next received frame of the received frame to determine an overdriving voltage.10-08-2009

Yung-Cheng Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20090256908INTEGRATED IMAGE SURVEILLANCE SYSTEM AND IMAGE SYNTHESIS METHOD THEREOF - Disclosed is an integrated multi-view surveillance system which integrates multiple surveillance camera images of an area into a large-coverage image of the area in order to monitor the area. The system includes a first camera, a second camera, a third camera, an image processing device, and a display device. The image processing device includes a first defining component, a first synthesis component, a second defining component, an adjusting component, a transforming component, a third defining component, and a second synthesis component.10-15-2009

Yu-Ting Cheng, Hsinchu City TW

Patent application numberDescriptionPublished
20110136662CATALYTIC SEEDING CONTROL METHOD - A catalytic seeding control method is disclosed. A catalytic metal film is deposited on a substrate with a nonwettable inclined surface. The catalytic metal film is then melted to form metal droplets. The metal droplets roll along the nonwettable inclined surface and aggregate to form a singular catalytic seed on the bottom of the nonwettable inclined surface. Then, the location of the singular catalytic seed is precisely controlled. Also, the size of the catalytic seed is controlled by adjusting the size of the inclined surface and the thickness of the catalytic metal layer to grow a one-dimensional structure with specific localization and single well-aligned manipulated size. The structure is utilized for the integrated microelectronic device fabrication.06-09-2011
20120032320FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF - A fabrication method for integrating chip(s) onto a flexible substrate in forming a flexible micro-system. The method includes a low-temperature flip-chip and a wafer-level fabrication process. Using the low-temperature flip-chip technique, the chip is bonded metallically onto the flexible substrate. To separate the flexible substrate from the substrate, etching is used to remove the sacrificial layer underneath the flexible substrate. The instant disclosure applies standardized micro-fabrication process for integrating chip(s) onto the flexible substrate. Without using special materials or fabrication procedures, the instant disclosure offers a cost-effective fabrication method for flexible micro-systems.02-09-2012
20120162852DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.06-28-2012
20120323539Method and Non-Transitory Computer Readable Medium Thereof for Thermal Analysis Modeling - A method and a non-transitory computer readable medium thereof for thermal analysis modeling are provided. The method includes establishing an electrothermal network π model on the basis of electronic modules of an electronic system to define a heat source, propagation paths and a common base of the electronic system. Observation points in the electronic system are defined, in which each observation point is located at an isothermal surface enclosing a volume surrounding a reference point, and where the reference point is the heat source or one observation point. A heat conduction temperature difference and a heat convection temperature difference are calculated according to a power density function, a thermal conductivity coefficient and a distance vector between the reference point and each observation point. A temperature distribution is established according to the heat conduction and the heat convection temperature difference and a defined temperature of the common base.12-20-2012
20130120903DECOUPLING DEVICE AND FABRICATING METHOD THEREOF - A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.05-16-2013
20130234314FLEXIBLE MICRO-SYSTEM AND FABRICATION METHOD THEREOF - A fabrication method for integrating chip(s) onto a flexible substrate in forming a flexible micro-system. The method includes a low-temperature flip-chip and a wafer-level fabrication process. Using the low-temperature flip-chip technique, the chip is bonded metallically onto the flexible substrate. To separate the flexible substrate from the substrate, etching is used to remove the sacrificial layer underneath the flexible substrate. The instant disclosure applies standardized micro-fabrication process for integrating chip(s) onto the flexible substrate. Without using special materials or fabrication procedures, the instant disclosure offers a cost-effective fabrication method for flexible micro-systems.09-12-2013
20140071591DECOUPLING DEVICE WITH THREE-DIMENSIONAL LEAD FRAME AND FABRICATING METHOD THEREOF - A decoupling device including a lead frame and at least one capacitor unit set is provided. The lead frame includes a cathode terminal portion and at least two anode terminal portions disposed at two sides of the cathode terminal portion and opposite to each other. The anode terminal portions are electrically connected through a conductive line. One of the anode terminal portions extends along a first direction to form an extending portion, and the extending portion is bended along a second direction perpendicular to the first direction to form an anode side plate. Each capacitor unit set includes a plurality of capacitor units. The capacitor unit sets are connected in parallel on a same plane and disposed on the lead frame. Each capacitor unit has a cathode portion electrically connected to the cathode terminal portion and an anode portion electrically connected to the anode side plate along the first direction.03-13-2014
20140233158DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.08-21-2014

Patent applications by Yu-Ting Cheng, Hsinchu City TW

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