Patent application number | Description | Published |
20090169796 | Large laminated structure - A large laminated structure includes a surface material, an ink layer, an adhesive layer and a release paper layer. The surface material has a bottom surface. The ink layer is disposed on the bottom surface in a predetermined pattern. The adhesive layer has a first planar surface and a second planar surface corresponding to each other. The adhesive layer has a plurality of channels connecting the first planar surface and the second planar surface. The first planar surface leans against and covers the bottom surface and the ink layer. The release paper layer is connected with the second planar surface. When the adhesive layer is attached to an attaching member, the gas between the adhesive layer and the attaching member may enter the channels of the adhesive layer such that the gas will not be trapped between the adhesive layer and the attaching member, thereby increasing the beauty of the attaching structure. In addition, the ink layer is disposed between the surface material and the adhesive layer to prevent the ink layer from wear, thereby maintaining integrity of the ink layer. | 07-02-2009 |
20090195926 | Removable hard-disk structure without screws - The present invention relates to a removable hard-disk structure without screws at least comprising a housing, a first elastic arm, a second elastic arm and a removable component. The housing having a placing space is connected to an opening end to enable the hard disk be placed into the placing space, and a door plate is further installed at the opening end to avoid the hard disk departing from the housing. The first and the second elastic arms are installed at the top surface and two side surfaces respectively, and these elastic arms are cantilever type and extend a pressing end into the placing space, which holds and presses the hard disk, and the hard disk is correctly being placed into the placing space. The removable component has a connecting end which is connected into the placing space, as the hard disk is placed in the placing space, the removable component fits the hard disk, and thus the hard disk can be easily removed by applying force on the removable end of the removable component. | 08-06-2009 |
Patent application number | Description | Published |
20100102294 | ORGANIC LIGHT EMITTING DIODE WITH NANO-DOTS AND FABRICATION METHOD THEREOF - An organic light emitting diode (OLED) with nano-dots and a fabrication method thereof are disclosed. The OLED apparatus comprises a substrate, a first electrically conductive layer, a first emission-auxiliary layer, an emissive layer, a second emission-auxiliary layer and a second electrically conductive layer. Its fabrication method is described below. Nano-dots with functional groups on the surface are incorporated into the emissive layer, the first emission-auxiliary layer or the second emission-auxiliary layer to form a layered electro-luminescent structure. By using the fabrication method, the resultant efficiency of the OLEDs can be markedly enhanced. | 04-29-2010 |
20100224832 | Modified nano-dot, fabrication method thereof and composition element thereof - The present invention discloses a modified nano-dot and a fabrication method thereof. The modified nano-dot comprises a surface portion having a functional group and a core portion comprising a polymeric metal oxide, polymeric metalloid oxide or polymeric metal alloy oxide. The mean particle size of the modified nano-dot is 1-100 nm, preferably 1-10 nm. The modified nano-dot capable of modulating a carrier flux can be further applied to the element manufacture in the organic semiconductor industry, optoelectronics industry, and solar cell industry. | 09-09-2010 |
20120061616 | MODIFIED NANO-DOT, FABRICATION METHOD THEREOF AND COMPOSITION ELEMENT THEREOF - The present invention discloses a modified nano-dot and a fabrication method thereof. The modified nano-dot comprises a surface portion having a functional group and a core portion comprising a polymeric metal oxide, polymeric metalloid oxide or polymeric metal alloy oxide. The mean particle size of the modified nano-dot is 1-100 nm, preferably 1-10 nm. The modified nano-dot capable of modulating a carrier flux can be further applied to the element manufacture in the organic semiconductor industry, optoelectronics industry, and solar cell industry. | 03-15-2012 |
Patent application number | Description | Published |
20100026252 | Low Drop-Out Voltage Regulator with Efficient Frequency Compensation - A low drop-out (LDO) voltage regulator with efficient frequency compensation is disclosed. The LDO voltage regulator includes an error amplifier, a transmission element, a voltage divider and a pole control unit. The error amplifier generates a control signal according to a reference voltage and a feedback voltage. The transmission element is coupled to the error amplifier, and adjusts an input voltage to generate an output voltage according to the control signal. The voltage divider is coupled to the transmission element, and performs a voltage division operation on the output voltage to generate the feedback voltage. The pole control unit is coupled to the transmission element, and provides and adjusts an output capacitor of the LDO voltage regulator to fix a frequency of a pole according to variation of an output impedance of the transmission element, so as to maintain loop stability. | 02-04-2010 |
20110102217 | Analog-to-digital Converter and Related Calibrating Comparator - An analog-to-digital converter includes a sample and hold unit, a successive control unit, a look-up memory, and a calibrating comparator, which further includes a positive input end, a negative input end, a timing signal input end, a data port, a latch unit, an enable switch, a first controllable resistor, a second controllable resistor, a reset switch assembly, a controllable capacitive device, and an output end. | 05-05-2011 |
Patent application number | Description | Published |
20130232512 | OPTICAL DISC DRIVE AND DAMPER POSITIONING STRUCTURE THEREOF - The present invention provides an optical disc drive and a damper positioning structure thereof. The optical disc drive includes a top cover, a traverse, and a chassis, and the damper positioning structure comprising: a bent element provided on the top cover and having an extension portion and a fixing portion, wherein the fixing portion has a through hole; a positioning pillar provided on the chassis; and a damper for supporting and securing the traverse on the chassis, wherein the damper has a positioning hole through which the positioning pillar is insertable; wherein, when the top cover is assembled to the chassis, the positioning pillar passes through the through hole of the fixing portion, and the fixing portion presses against the damper. | 09-05-2013 |
20130338853 | NAVIGATION DEVICE AND METHOD FOR AUTO-DOCKING OF A ROBOT - A robot device includes a base station and a robot. The base station transmits guiding signals. The robot receives the guiding signal by three receivers. A receiver is disposed at the robot, and the other two receivers are disposed at the right and left of the receiver at different angles. The robot bypasses toward right or left according to the guiding signal received by the receivers. When the strength of the guiding signal received by the central receiver decreases, the robot stops bypassing to spin and searches the guiding signal again till the strength of the guiding signal received, by the central receiver is a maximum value. The robot has a fine tuning to return to the base station to have a charge. | 12-19-2013 |
20150205191 | PICO PROJECTION FIXING MODULE - A pico projection fixing module includes a bracket main body, at least two collimator lenses, and at least two color light sources. The bracket main body includes an upper part, a lower part, a connecting part and at least two assembling seats. The upper part and the lower part are located at bilateral sides of the connecting part. Each of the assembling seats includes an opening and a clamping part. The opening is formed on the connecting part. The clamping part is disposed on the upper part and the lower part. The at least two collimator lenses are installed on the connecting part and corresponded to the corresponding openings. The at least two color light sources are installed on the corresponding clamping parts and aligned with the corresponding collimator lenses. The clamping parts corresponding to the assembling seats are separated from each other. | 07-23-2015 |
Patent application number | Description | Published |
20140320172 | CURRENT-TO-VOLTAGE CONVERTER AND ELECTRONIC APPARATUS THEREOF - A current-to-voltage converter comprises a gain circuit, a flip circuit, and a chopper circuit. The gain circuit receives an input current, and amplifies the input current to generate an amplified current. The flip circuit receives the amplified current, and uses the amplified current to charge or discharge a capacitor thereof according to a charge signal and a discharge signal, so as to generate an output voltage, wherein before using the amplified current to charge or discharge the capacitor, the flip circuit resets the output voltage respectively to a charge reset voltage and a discharge reset voltage according to a charge reset signal and a discharge reset signal. When the capacitor is charged, the chopper circuit samples and holds the output voltage to generate a recovered voltage. When the capacitor is discharged, the chopper circuit samples, holds, and flips the output voltage to generate the recovered voltage. | 10-30-2014 |
20140333348 | CURRENT-TO-VOLTAGE CONVERTER AND ELECTRONIC APPARATUS THEREOF - A current-to-voltage converter which is used to receive an input current and to generate an output voltage accordingly comprises a current tracking bias circuit, a current-to-voltage unit, and a voltage clamp bias circuit. The current tracking bias circuit generates a first bias according to the input current. The current-to-voltage unit receives the first bias and the input current, and generates the output voltage according to the input current, wherein the first bias determines a range of the input current, the current-to-voltage unit has a first current control device, and the first current control device changes a current conduction level thereof in response to the first bias, such that a rising or falling speed of the output voltage is enhanced. The voltage clamp bias circuit clamps voltage levels of two ends where the voltage clamp bias circuit is connected to the current-to-voltage unit. | 11-13-2014 |
20150029137 | NOISE COMPENSATING TOUCH PANEL AND TOUCH DEVICE THEREOF - A noise compensating touch panel includes a touch module and a signal compensating module. The touch module includes transmission electrodes and sensing electrodes. The signal compensating module has a first input, a second input and an output. The signal compensating module couples to the touch module. The transmission electrodes receive scanning voltage signals sequentially. When the scanning voltage signals sense the touching by object at crossover points of a first transmission electrode and the sensing electrodes, the sensing electrodes provide sensing signals. The sensing signals include the value of a first parasitical capacitor. The second transmission electrode senses the value of a second parasitical capacitor which the second transmission electrode isn't touched by object when the second transmission electrode receives the scanning voltage signals. Then the second transmission electrode provides compensating signals. Signal compensating module receives the sensing signals and the compensating signals separately. | 01-29-2015 |
20150062092 | BASELINE CALIBRATION METHOD AND SYSTEM THEREOF FOR TOUCH PANEL - An exemplary embodiment of the present disclosure illustrates a baseline calibration method for touch panel. Firstly, the baseline calibration method calculates each first differential value associated with each respective transmission electrode through a first-axis calculation procedure. Next, the baseline calibration method calculates each second differential value associated with each respective sensing electrode through a second-axis calculation procedure. Finally, the baseline calibration method calculates a baseline calibration value based on each of the first differential values and each of the respective second differential values calculated. | 03-05-2015 |
20160004338 | STYLUS, SYNCHRONIZATION SYSTEM AND METHOD THEREOF FOR TOUCH DETECTION - A synchronization system for touch detection is provided. The synchronization system includes at least one stylus and a touch device. The at least one stylus includes a signal generator, a first micro control unit and a first communication unit. The first micro control unit couples to the signal generator. The first communication unit couples to the first micro control unit. The signal generator generates at least one output signal. The first micro control unit controls the signal generator according to a regulation signal to regulate the at least one output signal. The first communication unit receives the regulation signal and transmits to the first micro control unit. The touch device receives the at least one output signal, and generates the regulation signal based on the at least one output signal to transmit to the at least one stylus. | 01-07-2016 |
Patent application number | Description | Published |
20100306790 | OPTICAL DISC DRIVE - An optical disc drive including a chassis, a circuit board and a traverse is provided. The traverse includes a carrier, a pick-up head module, a spindle motor module and a flexible flat cable. The carrier has an opening. The pick-up head module is movably disposed in the opening. The spindle motor module disposed on the carrier is located at one side of the pick-up head module. The flexible flat cable disposed in the opening has two connection ends respectively connected to the pick-up head module and the circuit board. The pick-up head module located at a first position enables the flexible flat cable to have a bending portion protruding towards a direction opposite to the position of the spindle motor module. The pick-up head module located at a second position extends the bending portion. The first position is closer to the spindle motor module than the second position is. | 12-02-2010 |
20110099566 | OPTICAL DISC DRIVE - An optical disc drive includes a main body, a cover, an extension, and an elastic element. The cover includes a pivoting portion and is pivotably connected to the main body via the pivoting portion. The extension is connected to the pivoting portion. The cover is adapted for pivoting relative to the main body to drive the extension to move along a movement path. The elastic element is disposed on the main body and includes two first limiting portions opposite to each other. The movement path extends through a gap between the two first limiting portions. A distance between the two first limiting portions is smaller than an outer diameter of the extension. | 04-28-2011 |
20120227062 | OPTICAL PICK-UP HEAD MODULE - An optical pick-up head module includes a base, an optical pick-up head adjusting mechanism, two guiding rods, a spring and an optical pick-up head slidably disposed on the guiding rods. The optical pick-up head adjusting mechanism includes a protrusion, a pillar and an adjusting element. The protrusion connected to the base has a sliding slot. The pillar having first and second flat surfaces is slidably disposed in the sliding slot. The first flat surface contacts an inner wall of the sliding slot. The adjusting element is screwed on the base. The spring disposed on the base pushes the pillar to contact the adjusting element by the second flat surface. When the adjusting element is rotated, the adjusting element pushes the pillar toward the base. | 09-06-2012 |
20130283300 | TRAY LOCKING DEVICE OF OPTICAL DISC DRIVE - A tray locking device of an optical disc drive adapted to lock and release a tray is provided. The optical disc drive has an optical head engaged with a lead screw and driven to move by the lead screw. The tray locking device includes a pushing member disposed on the optical head, a latching hook for latching and releasing a pin, and a transmission assembly disposed between the pushing member and the latching hook. The transmission assembly includes first and second lever elements. The first lever element pivoted in the tray has a slide slot having a first protrusion portion therein. The second lever element has a second protrusion portion adapted to move within the slide slot. When the tray is to be ejected, the lead screw drives the pushing member to push the second lever element, such that the second protrusion portion is aligned with the first protrusion portion. | 10-24-2013 |
20130298144 | TRAY LOCKING DEVICE FOR OPTICAL DISC DRIVE - A tray locking device adapted to an optical disc drive for locking and releasing a tray is provided. The optical disc drive has an optical head connected to a lead screw and driven to move by the lead screw. The tray locking device includes a pushing member driven to move by the lead screw, a latching hook for locking and releasing a protruding pin, and a transmission assembly configured between the pushing member and the latching hook. The transmission assembly includes a first rod and a second rod movably configured in the tray. The first rod has a first driving portion, and the second rod has a second driving portion. When the transmission assembly is located at an initial position, the first driving portion is located on a moving path of the pushing member, while the second driving portion is not located on the moving path of the pushing member. | 11-07-2013 |
20140016106 | Light Source Module and Micro Projector Using the Same - A light-source module including a light-source holder, a light source, a collimator lens holder, a collimator lens, a fasten member and an elastic member is suitable for being disposed in a housing. The light-source holder having a convex portion engaged with a concave portion of the housing is adapted to rotate about an axis. The light source disposed in the light-source holder emits a light beam along a beam path. The collimator lens is disposed in the collimator lens holder disposed in the light source holder on the beam path and a distance is maintained between the light source and the collimator lens. When fastened into a positioning hole of the housing, the fasten member pushes the light-source holder to rotate about the axis and the light-source holder presses the elastic member leaned against the light-source holder. | 01-16-2014 |
20140152963 | ALIGNING METHOD AND OPTICAL APPARATUS - An aligning method is provided. The aligning method includes: fixing a plurality of lenses and a beam combining unit in a fixing base; respectively disposing a plurality of light emitting units in a plurality of holders; leaning the holders on the fixing base, and respectively corresponding locations of the light emitting units to locations of the lenses; turning on the light emitting units, and enabling the light beams respectively emitted by the light emitting units to be combined by the beam combining unit after respectively passing through the lenses; and respectively adjusting positions of at least part of the light emitting units by using at least one jig to respectively hold the at least part of the light emitting units until an overlapping degree of the light beams combined by the beam combining unit matches a preset requirement. In addition, an optical apparatus is provided as well. | 06-05-2014 |
20140160448 | OPTICAL MODULE USED IN PROJECTION DEVICE - An optical module used in a projection device is provided. The optical module includes a base and a filter mirror. The base has an inclined leaning surface and a sidewall surface. The sidewall surface is located at a periphery of the base and forms a through hole along a direction. The inclined leaning surface is extended from the sidewall surface and an inclined angle is formed between the inclined leaning surface and the direction. The filter mirror is disposed on the inclined leaning surface. | 06-12-2014 |
20150160538 | MICRO-PROJECTION SYSTEM - A micro-projection system applied to a portable electronic device, comprising an optical engine, a control module, and a flat cable. The optical engine projects an image. The control module provides at least one control signal to control the optical engine. The flat cable is detachably connected to the optical engine and the control module respectively. Wherein, the optical engine and the control module are configured in the portable electronic device separately, and the flat cable has a corresponding configuration state for connecting the optical engine to the control module. | 06-11-2015 |
Patent application number | Description | Published |
20110001534 | Voltage Generator Capable of Preventing Latch-up and Method Thereof - A voltage generator capable of preventing latch-up is disclosed. The voltage generator includes a positive charge pump unit, a negative charge pump unit, a second stage charge pump unit, and a control unit. The positive charge pump unit is utilized for generating a positive charge pump voltage according to a first enable signal. The negative charge pump is utilized for generating a negative charge pump voltage according to a second enable signal. The second stage charge pump unit is utilized for generating a gate-on voltage and a gate-off voltage according to a third enable signal and a fourth enable signal. The control unit is utilized for generating the first enable signal, the second enable signal, the third enable signal, and the fourth enable signal and make the second stage charge pump unit generate the gate-on voltage (or the gate-off voltage) in a successively-increasing (or decreasing) manner. | 01-06-2011 |
20110012671 | Charge Pump Circuit - A charge pump circuit includes an input end, a first reservoir capacitor, a second reservoir capacitor, a first output end, a second output end, and a charge pump unit. The input end is utilized for receiving an input voltage. The charge pump unit includes a first flying capacitor, a second capacitor, a plurality of switches, and a control unit. The control unit is utilized for controlling on/off state of the plurality of switches so that the first flying capacitor provides a positive charge pump voltage to the first output end or a negative charge pump voltage to the second output and the second flying capacitor provides a positive charge pump voltage to the first output end through charge and discharge process. | 01-20-2011 |
Patent application number | Description | Published |
20080247907 | Dual inlet microchannel device and method for using same - A dual inlet microchannel device and a method for using the device to perform a flow-through kinetic assay are described. A microplate having an array of the dual inlet microchannel devices and in particular their specially configured flow chambers is also described. Several embodiments of the dual inlet microchannel devices and specially configured flow chambers are also described. | 10-09-2008 |
20110151585 | DUAL INLET MICROCHANNEL DEVICE AND METHOD FOR USING SAME - A dual inlet microchannel device and a method for using the device to perform a flow-through kinetic assay are described. A microplate having an array of the dual inlet microchannel devices and in particular their specially configured flow chambers is also described. Several embodiments of the dual inlet microchannel devices and specially configured flow chambers are also described. | 06-23-2011 |
20130071935 | Dual Inlet Microchannel Device And Method For Using Same - A dual inlet microchannel device and a method for using the device to perform a flow-through kinetic assay are described. A microplate having an array of the dual inlet microchannel devices and in particular their specially configured flow chambers is also described. Several embodiments of the dual inlet microchannel devices and specially configured flow chambers are also described. | 03-21-2013 |
20130342971 | EDGE ARMORED DISPLAY COVER PLATE - A display device comprising a display panel and a display cover plate positioned between the display panel and an observer. The display cover plate is housed within a protective frame (edge bracket) that protects edges of the display cover plate from damage. The edge bracket supports the edge portions of the display cover plate that are most likely to have flaws resulting from such operations as cutting and grinding, and minimizes flexing of the display cover plate, particularly at an edge, which could result in the formation of cracks at the flaw site and propagation of those cracks. | 12-26-2013 |
20140125900 | LCD ASSEMBLIES AND METHODS FOR MAKING THE SAME - An LCD assembly may include an LCD cell, a front cover glass sheet, and a back cover glass sheet. The LCD cell may include a first surface and a second surface. The front cover glass sheet may include a first surface and a second surface. The second surface of the front cover glass sheet may be directly bonded to the first surface of the LCD cell. The front cover glass sheet may be strengthened glass. The back cover glass sheet may include a first surface and a second surface. The first surface of the back cover glass sheet may be directly bonded to the second surface of the LCD cell. The back cover glass sheet may be strengthened glass. The LCD assembly may be transparent to light projected onto the second surface of the back cover glass sheet to enable display of an image. | 05-08-2014 |
Patent application number | Description | Published |
20080260946 | CLEAN METHOD FOR VAPOR DEPOSITION PROCESS - A method for cleaning a reaction chamber having a pedestal and a carrier ring is provided. First, the pedestal and the carrier ring are cleaned with a high pressure gas. Next, the carrier ring is moved to leave the pedestal, and a low pressure gas is provided to clean the pedestal, the carrier ring, and an area lay between the pedestal and the carrier ring. Thereafter, a full flush is performed to clean the pedestal and the carrier ring. | 10-23-2008 |
20080295867 | METHOD OF CLEANING TURBO PUMP AND CHAMBER/TURBO PUMP CLEAN PROCESS - A method of cleaning a turbo pump is described. The turbo pump is coupled with a CVD chamber of depositing a material and thus accumulates the material therein. The method includes using another pump to pump a reactive gas, which can react with the material to form gaseous products, through the turbo pump. Thereby, the turbo pump is cleaned up and is prevented from being a particle source in subsequent CVD operations. | 12-04-2008 |
20100043701 | BUFFER APPARATUS AND THIN FILM DEPOSITION SYSTEM - A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole. | 02-25-2010 |
20110284035 | METHOD OF CLEANING TURBO PUMP AND CHAMBER/TURBO PUMP CLEAN PROCESS - A method of cleaning a turbo pump is described. The turbo pump is coupled with a CVD chamber of depositing a material and thus accumulates the material therein. The method includes switching off the turbo pump and using another pump to pump a reactive gas, which can react with the material to form gaseous products, through the turbo pump. Thereby, the turbo pump is cleaned up and is prevented from being a particle source in subsequent CVD operations. | 11-24-2011 |
Patent application number | Description | Published |
20140212815 | Charged Particle Lithography System With a Long Shape Illumination Beam - A system includes an integrated circuit (IC) design data base having a feature, a source configured to generate a radiation beam, a pattern generator (PG) including a mirror array plate and an electrode plate disposed over the mirror array plate, wherein the electrode plate includes a lens let having a first dimension and a second dimension perpendicular to the first dimension with the first dimension larger than the second dimension so that the lens let modifies the radiation beam to form the long shaped radiation beam, and a stage configured secured the substrate. The system further includes an electric field generator connecting the minor array plate. The mirror array plate includes a mirror. The mirror absorbs or reflects the radiation beam. The radiation beam includes electron beam or ion beam. The second dimension is equal to a minimum dimension of the feature. | 07-31-2014 |
20140268078 | ELECTRON BEAM LITHOGRAPHY SYSTEMS AND METHODS INCLUDING TIME DIVISION MULTIPLEX LOADING - The present disclosure provides a systems and methods for e-beam lithography. One system includes an electron source operable to produce a beam and an array of pixels operable to pattern the beam. Control circuitry is spaced a distance from and coupled to the array of pixels. The control circuitry uses time domain multiplex loading (TMDL) to control the array of pixels. | 09-18-2014 |
20150131077 | ELECTRON BEAM LITHOGRAPHY METHODS INCLUDING TIME DIVISION MULTIPLEX LOADING - An embodiment of a method of lithography includes generating a beam of electrons. A first pixel and a second pixel are each configured to pattern the beam. Using time domain multiplex loading, the first and second pixels are controlled such that the beam is patterned. The patterning includes receiving a first clock signal and using the first clock signal to generate a second clock signal and a third clock signal. The second clock signal is sent to the first pixel and sending the third clock signal is sent to the second pixel. | 05-14-2015 |
20150286760 | SCAN CELL ASSIGNMENT - One or more systems and methods for scan cell assignment for a design layout of a semiconductor arrangement are provided. The design layout is evaluated to identify a set of sequential cells, such as flip flops connected to circuitry by data paths. Sequential cells within the set of sequential cells are assigned to either a scan cell assignment or a non-scan cell assignment based upon a control path criterion, a register bank criterion, a pipeline depth criterion, a sequential loop criterion, or other criteria to create a cell assignment list. Scan paths are connected to sequential cells assigned to the scan cell assignment so that test patterns can be sent to and received from such sequential cells during testing of the semiconductor arrangement for defects. Power, performance, and area utilization are improved because at least some sequential cells are assigned to the non-scan cell assignment. | 10-08-2015 |
Patent application number | Description | Published |
20110092064 | Preventing UBM Oxidation in Bump Formation Processes - A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer. | 04-21-2011 |
20120018878 | Doping Minor Elements into Metal Bumps - A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump. | 01-26-2012 |
20120088362 | Thermal Compressive Bond Head - A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump. | 04-12-2012 |
20120111922 | Thermal Compressive Bonding with Separate Die-Attach and Reflow Processes - A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump. | 05-10-2012 |
20120286423 | Doping Minor Elements into Metal Bumps - A method of forming a device includes providing a substrate, and forming a solder bump over the substrate. A minor element is introduced to a region adjacent a top surface of the solder bump. A re-flow process is then performed to the solder bump to drive the minor element into the solder bump. | 11-15-2012 |
20130214401 | System and Method for Fine Pitch PoP Structure - A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection. | 08-22-2013 |
20130214431 | Fine-Pitch Package-on-Package Structures and Methods for Forming the Same - A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings. | 08-22-2013 |
20140151878 | System and Method for Fine Pitch PoP Structure - A fine pitch package-on-package (PoP), and a method of forming, are provided. The PoP may be formed by placing connections, e.g., solder balls, on a first substrate having a semiconductor die attached thereto. A first reflow process is performed to elongate the solder balls. Thereafter, a second substrate having another semiconductor die attached thereto is connected to the solder balls. A second reflow process is performed to form an hourglass connection. | 06-05-2014 |
20140363966 | Pillar Bumps and Process for Making Same - Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular, or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art. | 12-11-2014 |
Patent application number | Description | Published |
20110133331 | INTERFACE STRUCTURE FOR COPPER-COPPER PEELING INTEGRITY - An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface. | 06-09-2011 |
20110266667 | CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE - A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof. | 11-03-2011 |
20120007230 | CONDUCTIVE BUMP FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer. | 01-12-2012 |
20120280388 | COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND METHOD OF MAKING THE SAME - This description relates to an integrated circuit device including a conductive pillar formed over a substrate. The conductive pillar has a sidewall surface and a top surface. The integrated circuit device further includes an under-bump-metallurgy (UBM) layer between the substrate and the conductive pillar. The UBM layer has a surface region. The integrated circuit device further includes a protection structure on the sidewall surface of the conductive pillar and the surface region of the UBM layer. The protection structure is formed of a non-metal material. | 11-08-2012 |
20130149856 | Interface Structure for Copper-Copper Peeling Integrity - An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface. | 06-13-2013 |
20140335687 | METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE - A method of making a semiconductor device includes forming an under bump metallurgy (UBM) layer over a substrate, the UBM layer comprising sidewalls and a surface region. The method further includes forming a conductive pillar over the UBM layer, the conductive pillar includes sidewalls, wherein the conductive pillar exposes the surface region of the UBM layer. The method further includes forming a non-metal protective structure over the sidewalls of the conductive pillar, wherein the non-metal protective structure contacts the surface region of the UBM layer, and the non-metal protective structure exposes the sidewalls of the UBM layer. | 11-13-2014 |
Patent application number | Description | Published |
20120257141 | LIQUID CRYSTAL DISPLAY DEVICE WITH TRANSMISSIVE AND REFLECTIVE UNITS - A liquid crystal display device with transmissive and reflective units is provided. At least a bare unit is formed in a predetermined portion of the first electrode. A reflective layer is disposed on the second electrode at a location corresponding to the bare unit. A liquid crystal display unit is defined in an extension direction between the second and first electrodes. The liquid crystal display unit has a portion corresponding to the bare unit and defined as a reflective unit and another portion that surrounds outside the reflective unit and defined as a transmissive unit. The liquid crystal layers show an effective electrical field that is weaker within the reflective unit than within the transmissive unit. The transmissive unit has a circumferential edge portion spaced away from the reflective unit and forming an additional reflective unit for the liquid crystal display unit. | 10-11-2012 |
20130148065 | LIQUID CRYSTAL DISPLAY AND METHOD FOR FABRICATING THE SAME - The invention provides a liquid crystal display, including: a substrate, wherein the substrate includes a first flat electrode formed thereon; a first alignment layer formed on the first flat electrode; a second substrate disposed oppositely to the first substrate, wherein the second substrate includes a gate line, a data line and a second flat electrode, wherein the gate line intersects with the date line to define a pixel region, the pixel region includes at least one sub-pixel electrode region, and an area of the second flat electrode is smaller than that of the first flat electrode; a second alignment layer formed on the second flat electrode; and a liquid crystal layer formed between the first substrate and the second substrate, wherein the liquid crystal layer has chirality, wherein the sub-pixel electrode region has a multidomain pretilt angle. | 06-13-2013 |
20130201430 | LIQUID CRYSTAL DISPLAY DEVICE - A new type of liquid crystal display (LCD) device with improved high transmittance and wide-view-angle characteristics while without gray-level inversion at an inclined viewing angle is provided. The LCD device includes a first substrate with common electrodes, a second substrate with at least one pixel unit, a liquid crystal (LC) layer disposed between the first substrate and the second substrate, a first polarizer, and a second polarizer. The pixel unit has a pixel electrode, which is formed by at least one dense electrode area and at least one sparse electrode area. The LC molecules of the LC layer form a continuous-domain alignment after being driven by a voltage. | 08-08-2013 |
20130258264 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device is disclosed, which includes a first substrate, a second substrate and a liquid crystal layer containing Chiral dopants. The second substrate includes a blue sub-pixel region and a blue sub-pixel electrode unit disposed in the blue sub-pixel region. The numerical ranges of the characteristic parameters of the liquid crystal layer are 0.33≦Δnd≦0.62 and 0.2≦d/p≦0.36. The ratio of the area of the hollowed regions in the blue sub-pixel region, to the area of the blue sub-pixel region, is larger than or equal to 54%. | 10-03-2013 |