Patent application number | Description | Published |
20130025926 | CIRCUIT SUBSTRATE - A circuit substrate having a base layer, a patterned conductive layer, a dielectric layer and a conductive block is provided. The patterned conductive layer is disposed on the base layer and having an inner pad. The dielectric layer is disposed on the base layer and covering the patterned conductive layer. The conductive block penetrates the dielectric layer, the conductive block being substantially coplanar with the dielectric layer and connecting the inner pad. | 01-31-2013 |
20130213692 | FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD - A method of fabricating a circuit board includes the following steps. A first and a second patterned conductive layer are plated on the first and the second surface of a core substrate, respectively. A first and a second extending pad are individually plated on a first and a second pad of the first and the second patterned conductive layer, respectively. A first and a second thermal-curing type dielectric layer are individually formed on the first and the second surface to cover the first and the second patterned conductive layer and the first and the second extending pad, respectively. A portion of the first and the second thermal-curing type dielectric layer respectively covering the top of the first and the second extending pad are removed. A protective film covers the second extending pad. The extending pad is removed by an etching process. | 08-22-2013 |
20140000953 | CIRCUIT SUBSTRATE | 01-02-2014 |
20140077357 | CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME - A circuit substrate includes a dielectric layer and a plurality of conductive structures. The dielectric layer has a plurality of conductive openings, a first surface, and a second surface opposite to the first surface. Each of the conductive openings connects the first surface and the second surface. The conductive openings are respectively filled with the conductive structures. Each of the conductive structures is integrally formed and includes a pad part, a connection part, and a protruding part. Each of the connection parts is connected to the corresponding pad part and the corresponding protruding part. Each of the protruding parts has a curved surface that protrudes from the second surface. A process for fabricating the circuit substrate is also provided. | 03-20-2014 |
20140293547 | CIRCUIT SUBSTRATE, SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING THE SAME - A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here. | 10-02-2014 |
20150061119 | CIRCUIT SUBSTRATE, SEMICONDUTOR PACKAGE STRUCTURE AND PROCESS FOR FABRICATING A CIRCUIT SUBSTRATE - A circuit substrate includes a circuit stack, a patterned conductive layer, a dielectric layer, and a plurality of thickening conductive layers. The circuit stack has a surface. The patterned conductive layer is located on the surface of the circuit stack and has a plurality of traces. Each of the traces has a bonding segment. The dielectric layer is located on the surface of the circuit stack and covers the patterned conductive layer. Besides, the dielectric layer has a plurality of bonding openings Each of the bonding openings exposes the corresponding bonding segment. Each of the thickening conductive layers is located on the corresponding bonding segment. A semiconductor package structure having the above circuit substrate and a process for fabricating a circuit substrate are also provided. | 03-05-2015 |
20150123690 | PROBE CARD - A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board. | 05-07-2015 |
20150303074 | PROCESS FOR FABRICATING THE SAME - A process for fabricating a circuit substrate is provided. The process includes the following steps. A carrier is provided. A conductive layer and a dielectric layer are placed on the carrier, and the conductive layer is located between the carrier and the dielectric layer. The dielectric layer is patterned to form a patterned-dielectric layer having first openings partially exposing the conductive layer. Arc-shaped grooves are formed on the exposed part of the conductive layer. A first-patterned-photoresist layer having second openings respectively connecting the first openings is formed. Conductive structures are formed, wherein each of the conductive structures is integrally formed and includes a pad part, a connection part, and a protruding part; the second openings, the first openings and the arc-shaped grooves are respectively filled with the pad parts, the connection parts and the protruding parts. The first patterned photoresist layer, the carrier and the conductive layer are removed. | 10-22-2015 |