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Chen-Han

Chen-Han Chao, New Taipei City TW

Patent application numberDescriptionPublished
20140113592Process Method for System Login in Light-Operated Manner, Light-Operated Electronic Equipment and Mobile Electronic Device for Controlling Electronic Equipment with Light - A light-operated electronic equipment and a mobile electronic device for controlling an electronic equipment with light are provided. The light-operated electronic equipment with a light sensing receiving unit and a control unit is controlled by the mobile electronic device with a light source, a light control code module and a light display process module. Besides, further provides a process method of performing system registration by a light control way. By the process method, an information process device receives the input of the light signal through a transmission equipment, such that the light sensing receiving unit of the transmission equipment converts the brightness change of the light signal into the electric control code for the control unit of the transmission equipment to receive the electric control code and transmit the electric control code to the information process device through a transmission interface.04-24-2014

Chen-Han Chiang, Jhongli City TW

Patent application numberDescriptionPublished
20130187263SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME - A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided.07-25-2013

Chen-Han Chiang, Luodong Township TW

Patent application numberDescriptionPublished
20120313222CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively and a cutting support structure located on peripheries of the chip support rings, and the spacing layer has a gap pattern separating the cutting support structure from the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure.12-13-2012
20120313261CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defining a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively, a cutting support structure located on peripheries of the chip support rings, a plurality of stop rings surrounding the chip support rings respectively, wherein a gap pattern separating the stop rings from the cutting support structure and the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure.12-13-2012
20130207240CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively and a cutting support structure located on peripheries of the chip support rings, and the spacing layer has a gap pattern separating the cutting support structure from the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure.08-15-2013
20140015111CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a device region disposed in the substrate; a dielectric layer located on the first surface of the semiconductor substrate; a plurality of conducting pads located in the dielectric layer and electrically connected to the device region; at least one alignment mark disposed in the semiconductor substrate and extending from the second surface towards the first surface.01-16-2014
20140264771CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively and a cutting support structure located on peripheries of the chip support rings, and the spacing layer has a gap pattern separating the cutting support structure from the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure.09-18-2014

Patent applications by Chen-Han Chiang, Luodong Township TW

Chen-Han Chu, Taipei City TW

Patent application numberDescriptionPublished
20130216107METHOD OF SURVEILLANCE BY FACE RECOGNITION - A method of surveillance by face recognition is disclosed. The method includes the steps of: first building up the face recognition database library in a storage medium comprising a plurality of face images; taking dynamic videos via an image capture device and showing the dynamic videos in the display device; performing face recognition to find the target face image in each dynamic video, and then determine the target face image as the matched or mismatched face image by comparing the target face image with the face images in the face recognition database library; and finally marking the matched and mismatched face images by different colored frames, respectively. Therefore, the method of the present invention can dynamically mark the target face images by images, colored frames and/or text to provide a solution of surveillance with high safety and efficiency.08-22-2013

Chen-Han Lee, Diamond Bar, CA US

Patent application numberDescriptionPublished
20100182344SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR DETERMINING A TRANSLATION VECTOR - A method for determining a minimal translation vector (MTV) between a first object and a second object represented in a CAD system, and a CAD system and computer readable medium for performing a similar method. The method includes retrieving the first object and the second object and tessellating the first object and second object into respective facets. The method includes creating a bounding volume tree of facets corresponding to each of the first object and the second object. The method includes performing a greedy process on the bounding volume to produce an initial MTV, and performing a successive clipping process according to the bounding volume trees and the initial MTV, to produce a final MTV. The method includes storing the final MTV in a computer readable medium. The greedy process can be a 2-step process as described.07-22-2010

Chen-Han Lee, Xizhi City TW

Patent application numberDescriptionPublished
20120123872COOPERATIVE PERSONALIZED PROMOTION METHOD ACCORDING TO CONSUMER-STORE INTERACTIVE TRANSACTION HISTORY AND SYSTEM USING THE SAME - A system performs cooperative personalized promotion based on consumer-store interactive transaction history at multiple stores of different categories. The system includes a cooperative personal promotion platform. The cooperative personal promotion platform is provided for multiple stores of different categories to register a number of promotion information and to display at least one preferential-combination-information constituted by the promotion information. The promotion platform includes a data exchange interface, a remote-end server and a consumer record unit. The data exchange interface is used for reading a consumer's basic information into the platform, and connecting to the remote-end server via a network. The remote-end server is used for checking the consumer's basic information and recording consumer's latest interactive transaction in the consumer record unit for updating a consumer-store interactive transaction history. The cooperative personal promotion platform matches at least one preferential combination information for the consumer's choice according to the consumer-store interactive transaction history.05-17-2012

Chen-Han Lin, Tu-Cheng TW

Patent application numberDescriptionPublished
20160069531LED LAMP - An LED lamp includes a substantially enclosed space and an LED light source. The substantially enclosed space includes a first incident element and a second incident element located on the opposite sides thereof, an first portion connecting top ends of the first incident element and the second incident element and a second portion connecting with bottom ends of the first incident element and the second incident element. The second portion includes a first reflective plate and a second reflective plate bended from a top end of the first reflective plate. An angle between the first incident element and the first reflective plate, and an angle between the second incident element and the second reflective plate are less than an angle between the first reflective plate and the second reflective plate. The LED light source is below a top end of the second portion.03-10-2016
20160070045BACK LIGHT MODULE - A back light module includes a lens and a plurality of LED elements. The lens includes a light incident surface and a light extraction surface, a plurality of first recesses being defined in the light extraction surface, a plurality of second recesses being defined in the light incident surface. Each first recess has a pair of first inclined surfaces, and an angle between the first inclined surface and a plane where the light incident surface located is larger than or equal to a critical angle of total reflection of the lens. Each second recess has a pair of second inclined surfaces, and an angle between the second inclined surface and the plane where the light incident surface located is less than or equal to the angle between the first inclined surface and the plane where the light incident surface located.03-10-2016
20160070050LED MODULE - An LED module, includes a heat sink, an LEDs mounted on a side of the heat sink and a light guide plate spaced from the LED light source. A flexible light guiding tube is disposed between the light guide plate and the LED light source. The flexible light guiding tube has an first end. A bore diameter of the outmost end of the first end is larger than or equal to a diameter of a top end of the LED light source. The outmost end covers the top end of the LEDs therein. Compared to the prior art, The LED module of the present disclosure has high luminous efficiency and good thermal performance.03-10-2016
20160076725VEHICLE LAMP - A vehicle lamp includes a light bar, a plurality of circuit boards, a plurality of light emitting diode (LED) elements and a heat dissipating structure. The light bar has an annular top surface and an annular bottom surface. A coupling portion is formed on the bottom surface of the light bar. The LED elements are arranged on the circuit board. Light emitted from the LED elements are incident into the light bar through the coupling portion. The heat dissipating structure is coupled to the light bar with the LED elements and the circuit boards mounted between the light bar and the heat dissipating structure.03-17-2016
20160091163AUTOMOTIVE DAYTIME RUNNING LIGHTS - Automotive daytime running lights, includes a light source and reflecting plates arranged on a light path of the light source. A substrate is arranged near the reflecting plates. A plurality of reflecting cups is formed on a surface of the substrate. Every reflecting plate faces a corresponding reflecting cup. The reflecting plates can rotate around light source to change the light exiting from the light source. The invention uses a laser source with reflecting plates to make the automotive daytime running lights have high visibility and be aesthetic in appearance.03-31-2016

Chen-Han Lin, Taichung TW

Patent application numberDescriptionPublished
20140117537SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a semiconductor package including an encapsulant having a top surface and a bottom surface opposite to the top surface; a semiconductor chip embedded in the encapsulant having an active surface, an inactive surface opposite to the active surface, and lateral surfaces interconnecting the active surface and the inactive surface, wherein the active surface protrudes from the bottom surface of the encapsulant and the semiconductor chip further has a plurality of electrode pads disposed on the active surface; a positioning member layer formed on a portion of the bottom surface of the encapsulant, covering the lateral surfaces of the semiconductor chip that protrude therefrom, and exposing the active surface; and a build-up trace structure disposed on the active surface of the semiconductor chip and the positioning member layer formed on the bottom surface of the encapsulant. The present invention also provides a method of fabricating a semiconductor package.05-01-2014

Chen-Han Lin, New Taipei TW

Patent application numberDescriptionPublished
20140175479LED UNIT WITH LIGHT MIXING ELEMENT - An LED unit includes an LED, a light mixing element mounted on the LED and a lens covering the light mixing element. The light mixing element is transparent and includes a top face, a bottom face and a circumferential face. Light emitted from the LED with a large output angle is refracted by the bottom face, reflected by the circumferential face and refracted by the top face of the light mixing element to radiate out of the light mixing element with a small light emergent angle.06-26-2014
20140176514LIGHT EMITTING DIODE DISPLAY PANEL - A light emitting diode display panel includes a control circuit and a plurality of pixels arranged in a matrix. Each of the pixels includes a first light source and a first light sensing element. The first light sensing element receives a first optical signal from a lighting pen and generates a first control signal to the control circuit. According to the first control signal, the control circuit turns on the first light source in the pixel. The pixels further comprise a first polarizer covering the first light sensing element. When the lighting pen emits the first optical signal, a polarization direction of the light from the lighting pen is parallel to a polarization direction of the first polarizer. Therefore, the first optical signal can pass through the first polarizer and be received by the first light sensing element.06-26-2014
20140177205ELECTRONIC INCENSE AND ELECTRONIC INCENSE CENSER HAVIGN THE SAME - An electronic incense includes a hollow tube, a laser light source arranged at a light incident end of the hollow tube, and a light outputting portion arranged at a light output end of the hollow tube. The light emitting portion contacts and covers the light output end of the hollow tube for diverging light from the laser light source. The light generated by the laser light source moves directly through a void in the hollow tube to reach the light outputting portion without a guidance of a light guiding medium, for example, an optical fiber in the hollow tube. An electronic incense including a plurality of electronic incenses which share light from a single laser light source is also provided.06-26-2014
20140177235OPTICAL LENS AND LIGHTING DEVICE HAVING THE SAME - An optical lens includes a light incident surface, a light emitting surface, and a side surface between the light incident surface and the light emitting surface. The light emitting surface is a convex and curved surface opposite to the light incident surface. The light incident surface defines a receiving chamber. The receiving chamber is cone-shaped and concave in a direction from the light incident surface toward the light emitting surface. The side surface has a rugged structure and is a frosted surface to diffuse light therethrough. A lighting device having the optical lens is also provided.06-26-2014
20140177275LED BACKLIGHT MODULE HAVING REDUCED LIGHT LEAKAGE AND INCREASED LIGHT EXTRACTION EFFICIENCY - An LED backlight module includes a light guiding board, a plurality of LED light sources located at an edge side of the light guiding board and a glue layer. The glue layer is located between the edge side of the light guiding board and the LED light sources. The LED light sources are securely attached to the edge side of the light guiding board via the glue layer. The glue layer has a refractive index larger than a refractive index of air.06-26-2014
20140178517DEVICE FOR MANUFACTURING PHOSPHOR FILM FOR USE IN LED - A device for manufacturing a phosphor film, includes a container for receiving and mixing a raw material of the phosphor film which includes phosphor powders and glue; a conveyor belt for transporting the mixed raw material from the container, the conveyor belt comprising two horizontal portions and an arc portion arranged between the two horizontal portions, the arc portion defining a recess downwardly; and a roller located above the arc portion of the conveyor belt and partly received in the recess, a distance being kept between the arc portion and the roller, the raw material being pressed by the roller during transportation by the conveyor belt to form the phosphor film. A curing device radiates ultraviolet to the mixed material on the arc portion of the conveyor belt to cure the glue thereof.06-26-2014
20140215734CLAMPING DEVICE AND WASHING DEVICE USING SAME - A clamping device is capable of clamping different types of workpieces. The clamping device includes a bracket, two rails, and two pairs of holding assemblies. The bracket includes a number of supporting poles. The two rails are movably supported on opposite two of the supporting poles. Each pair of holding assemblies are movably assembled to a rail. Each holding assembly holds a corner of a workpiece.08-07-2014
20140286042BACKLIGHT MODULE AND MANUFACTURING METHOD OF THE SAME - An exemplary backlight module includes a light guide film and a light bar. The light guide film includes a top surface, a bottom surface, and a light incident surface connected between the top surface and the bottom surface. The light bar includes a light-emitting surface. The light-emitting surface is attached to the light incident surface. A method for manufacturing the backlight module is also provided.09-25-2014
20140293652LIGHT GUIDE PLATE AND MOLD FOR MANUFACTURING SAME - A light guide plate includes a rough light emitting surface, a bottom surface opposite to the light emitting surface, and a plurality of microstructures formed on the bottom surface. A cross-sectional surface of each of the microstructures is trapezoidal shaped.10-02-2014
20140307303ELECTRICAL WRITING BOARD - An electrical writing board includes a bottom color plate, an electrochromic board, a touch panel, and a driving circuit module. The electrochromic board is covered on the bottom color plate, and includes a plurality of electrochromic units. The touch panel is covered on the electrochromic board, and outputs a touch signal when the touch panel is touched. The driving circuit module is electrically connected between the electrochromic board and the touch panel, and enables a part of the electrochromic units according to the touch signal to display a handwriting. The handwriting displaying on the electrochromic board is the same as a touch route sensed by the touch panel.10-16-2014
20140313767ELECTRONIC INCENSE ASSEMBLY - An electronic incense assembly includes a light guide member, a light combining member, a substantially hemispherical member, a first light source and a second light source. The light guide member includes a light incident end and a light output end. The light combining member is located at the light incident end. The substantially hemispherical member is located at the light output end. The first and the second light sources emit light with different color chosen from red, green and blue. The light combining member synthesizes light emitted from the first and the second light sources to form a synthesized light. The synthesized light enters the light guide member from the light incident end, reaches the substantially hemispherical member directly and then emits out of the substantially hemispherical member to simulate a burning incense stick.10-23-2014
20140313768LIGHT GUIDE PLATE AND BACKLIGHT MODULE HAVING THE LIGHT GUIDE PLATE - A light guide plate includes a light incident surface for incident light, a light emitting surface for emitting the light, and microstructures formed on the light emitting surface to collimate the light.10-23-2014
20140313769BACKLIGHT MODULE HAVING POINT LIGHT SOURCES - A backlight module includes a light guide plate, a number of point light sources, and a prism sheet. The light guide plate includes a light incident surface and a light emitting surface perpendicularly connected with the light incident surface. The point light sources are positioned in front of the light incident surface. The light guide plate includes first microstructures, such as a matrix of grooves. on the light emitting surface. The prism sheet is positioned in front of the light emitting surface and includes a first surface arranged substantially parallel with the light emitting surface and a second surface opposite to the first surface. The prism sheet includes second microstructures, such as triangular prisms parallel with an intersection line of the light incident surface and the light emitting surface, on the first surface.10-23-2014
20140319109LASER MACHINING DEVICE - A laser machining device with a proximity-warning function in relation to a workpiece being machined includes a laser element and a position feedback unit. The laser element includes a laser head for emitting a focused laser beam and a movable member for moving the laser head. The position feedback unit is positioned on the movable member and connected to an alerting circuit. When an elastic contacting member in the position feedback unit is compressed because the distance between the laser head and the workpiece is less than a minimum permitted distance the alerting circuit issues an alert.10-30-2014
20140321159LIGHT GUIDE PLATE AND BACKLIGHT MODULE HAVING SAME - A backlight module includes a light guide plate and a light source module. The light guide plate includes a light incident surface. The light incident surface forms a sector-cylinder-shaped cutout on the light guide plate. The light source module includes tricolor lasers, two spectroscopes and a MEMS mirror. The tricolor lasers are arranged opposite to the light guide plate. The two spectroscopes are respectively arranged opposite to two of the tricolor lasers. The two spectroscopes respectively reflect light emitted from two of the tricolor lasers, and transmit the light emitted from the others. Thus, white light is achieved after the light emitted from the tricolor lasers passes through the two spectroscopes. The MEMS mirror is arranged opposite to the light incident surface for reflecting the white light and rotating to form a scanning light beam, which finally enters into the light guide plate through the light incident surface.10-30-2014
20140322454METHOD FOR MANUFACTURING ARTIFICIAL SMOULDERING SCENT-STICK - A method for manufacturing the hemispherical light emitting portion of an artificial smouldering scent-stick comprises the steps of providing a light guide pipe and a light emitting element. The light guide pipe includes a bottom portion and a top portion opposite to the bottom portion. The light emitting element is fixed on the bottom portion. A colloid is dripped on an end face of the top portion and the colloid cured, to obtain the shape of the required light-emitting portion.10-30-2014
20140340933LIGHT GUIDE ELEMENT AND BACKLIGHT MODULE - A light guide element includes a wedge-shaped light coupling member and a rectangular light guide plate. The light coupling member includes a first bottom surface, a top surface opposite to the first bottom surface, a light incident surface interconnected between the first bottom surface and the top surface, a first connecting surface parallel with and opposite to the light incident surface, a slanted surface connecting the first connecting surface to the top surface, and a reflection film formed on the top surface and the slanted surface. The light guide plate includes a second bottom surface, a light output surface opposite to the second bottom surface, and a second connecting surface perpendicularly interconnected between the second bottom surface and the light output surface. The second connecting surface connects and overlaps the first connecting surface. The height of the light incident surface is larger than that of the second connecting surface.11-20-2014
20140340935BACKLIGHT MODULE HAVING NON-DOT AREA AND LIGHT GUIDE PLATE USING SAME - A light guide plate includes a light mixing part and a visual part. The light mixing part includes a light mixing bottom surface, a light incident surface, and a top surface opposite to the light mixing bottom surface. The light incident surface is substantially perpendicular to the light mixing bottom surface and the top surface. The visual part is adjoined to the light mixing part and includes a visual bottom surface and a light emitting surface opposite to the visual bottom surface. The visual bottom surface and the light mixing bottom surface are substantially coplanar and are divided by an imaginary adjoining line. The top surface and the light emitting surface are substantially coplanar. The visual bottom surface has at least one non-dot area. The visual bottom surface forms a plurality of reflective dots except for the non-dot area.11-20-2014
20140347603LIGHT GUIDE PLATE, BACKLIGHT MODULE, AND LIQUID CRYSTAL DISPLAY DEVICE - A light guide plate includes an optically effective portion and an optical coupling portion adjoining the optically effective portion. The optically effective portion includes a first bottom surface, a light output surface opposite to the first bottom surface, and a side surface connected between the first bottom surface and the light output surface. The optical coupling portion includes a second bottom surface, a first light incident surface opposite to the side surface, a second light incident surface, a first connecting surface, and a second connecting surface. The second bottom surface is coplanar with the first bottom surface. The second light incident surface extends from the first light incident surface away from the side surface. The first connecting surface extends from the second light incident surface toward the side surface. The second connecting surface is connected between the first connecting surface and the light output surface.11-27-2014
20140353297LASER CUTTING DEVICE AND LASER CUTTING METHOD - A laser cutting device for cutting an original product includes a laser device which is movable along a first direction and a second direction perpendicular to the first direction, and rotatable reflecting mirrors. The original product includes a stub bar, optical lenses, and connection portions corresponding to the optical lenses. The rotatable reflecting mirrors correspond to the connection portions and are positioned above the original product and aligned with the connection portions. At least two rotatable reflecting mirrors are arranged in a straight line. The laser device is located on the straight line and is configured for emitting laser beams. Each of the rotatable reflecting mirrors is configured for reflecting laser beams from the laser device toward the corresponding connection portion and is configured for rotating so as to allow the laser beams from the laser device to reach the next rotatable reflecting mirror on the straight line.12-04-2014
20140368348LASER PROCESSING SYSTEM AND METHOD OF SAME - A laser processing system for accurate detection of how far away the surface of a workpiece may be includes a platform, a laser processing device, a distance detection device, and a driving device. The platform is configured for carrying at least one workpiece. Both the laser processing device and the distance detection device are arranged upon the platform. The distance detection device detects an actual distance between a surface of the workpiece and the laser processing device, and compares the preset height with the actual height. If the preset height is less than the actual height, the distance detection device emitting a warning signal to remind a worker to re-enter a new preset height.12-18-2014
20140369029DIFFUSION PLATE AND BACKLIGHT MODULE HAVING SAME - A backlight module employing a diffusion plate is provided. The diffusion plate includes a main body and antireflection films formed on surfaces of the main body. The main body includes a light incident surface, and a light emitting surface opposite to the light incident surface. Each antireflection film has a number of antireflection film layers. A thickness of each antireflection film layer is less than a wavelength of visible light.12-18-2014
20150029755LIGHT GUIDE PLATE AND METHOD FOR MANUFACTURING SAME - A light guide plate includes a first transparent base layer, an adhesive layer and a transparent composite layer. The adhesive layer is configured for bonding the transparent composite layer on the first transparent base layer. The transparent composite layer is located on the adhesive layer, and the transparent composite layer comprising a light emitting surface, the light emitting surface includes a plurality of microstructures.01-29-2015
20150185405LASER DIODE LIGHT SOURCE AND BACKLIGHT MODULE INCORPORATING THE SAME - A laser diode (LD) light source includes a laser diode array including a plurality of red, blue and green laser diodes, and an optical lens array optically coupled to the laser diode array. The optical lens array includes a plurality of cylindrical lenses, and each cylindrical lens corresponding to one of the red, blue, and green laser diodes. Light emitted from the red, blue and green laser diodes is respectively diverged by the corresponding cylindrical lenses in a lateral direction thereof. A backlight module incorporating the laser diode light source is also provided.07-02-2015
20160047968REFLECTOR, ILLUMINATING DEVICE AND BACKLIGHT MODULE USING THE REFLECTOR - A reflector configured for guiding light emitted from a light emitting diode (LED) light source includes four reflective walls. The reflective walls are connected side-by-side to cooperatively define a cavity. The cavity has a first opening and a second opening at opposite ends thereof. An inner diameter of the cavity gradually decrease as it extends from the second opening toward the first opening. The LED light source is located at the second opening of the cavity. Light emitted from the LED light source enters into the cavity and is reflected by the at least one reflective wall toward the first opening of the cavity. An illuminating device and a backlight module using the reflector are also provided.02-18-2016

Patent applications by Chen-Han Lin, New Taipei TW

Chen-Han Yang, Taipei City TW

Patent application numberDescriptionPublished
20120300386EXPANSION CARD - The invention provides an expansion card adapted for a motherboard, in which the motherboard includes a first slot, and the first slot is located at a surface of the motherboard. The expansion card includes a circuit board, a heat-dissipating module and a supporter. The circuit board includes a connecting interface configured for being inserted into the first slot of the motherboard. The heat-dissipating module is disposed at a side of the circuit board and has a bottom surface. When the expansion card is inserted into the first slot, the supporter is disposed at the bottom surface of the heat-dissipating module so that the bottom surface of the heat-dissipating module is substantially parallel to the surface of the motherboard.11-29-2012
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