Patent application number | Description | Published |
20120081860 | PRE-TREATMENT OF MEMORY CARDS FOR INK JET PRINTING - A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface. | 04-05-2012 |
20120146247 | PRE-TREATMENT OF MEMORY CARDS FOR BINDING GLUE AND OTHER CURABLE FLUIDS - A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of a curable fluid such as glue or ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface. | 06-14-2012 |
20130006564 | DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE FORWARD TRACEABILITY - A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device. | 01-03-2013 |
20130015589 | CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKSAANM Liao; Chih-ChinAACI Changhua CountyAACO TWAAGP Liao; Chih-Chin Changhua County TWAANM Chiu; Chin-TienAACI Taichung CityAACO TWAAGP Chiu; Chin-Tien Taichung City TWAANM Yu; CheemanAACI FremontAAST CAAACO USAAGP Yu; Cheeman Fremont CA USAANM Upadhyayula; Suresh KumarAACI San JoseAAST CAAACO USAAGP Upadhyayula; Suresh Kumar San Jose CA USAANM Li; Wen ChengAACI Taichung CityAACO TWAAGP Li; Wen Cheng Taichung City TWAANM Lu; ZhongAACI ShanghaiAACO CNAAGP Lu; Zhong Shanghai CN - A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound. | 01-17-2013 |
20140015116 | EMI SHIELDING AND THERMAL DISSIPATION FOR SEMICONDUCTOR DEVICE - A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device. | 01-16-2014 |
20140183727 | WATERFALL WIRE BONDING - A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact. | 07-03-2014 |
20140346686 | METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY - A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device. | 11-27-2014 |
20150061157 | HIGH YIELD SEMICONDUCTOR DEVICE - A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device. | 03-05-2015 |