Patent application number | Description | Published |
20080315388 | VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE - In some embodiments, vertical controlled side chip connection for 3D processor package is presented. In this regard, an apparatus is introduced having a substrate, a substantially horizontal, in relation to the substrate, integrated circuit device coupled to the substrate, and a substantially vertical, in relation of the substrate, integrated circuit device coupled to the substrate and adjacent to one side of the substantially horizontal integrated circuit device. Other embodiments are also disclosed and claimed. | 12-25-2008 |
20110140268 | HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump. | 06-16-2011 |
20120319293 | MICROELECTRONIC DEVICE, STACKED DIE PACKAGE AND COMPUTING SYSTEM CONTAINING SAME, METHOD OF MANUFACTURING A MULTI-CHANNEL COMMUNICATION PATHWAY IN SAME, AND METHOD OF ENABLING ELECTRICAL COMMUNICATION BETWEEN COMPONENTS OF A STACKED-DIE PACKAGE - A microelectronic device comprises a first surface ( | 12-20-2012 |
20130341803 | METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGRATED PACKAGING SYSTEM - Semiconductor multi-die structures having intermediate vertical side chips, and packages housing such semiconductor multi-die structures, are described. In an example, a multi-die semiconductor structure includes a first main stacked dies (MSD) structure having a first substantially horizontal arrangement of semiconductor dies. A second MSD structure having a second substantially horizontal arrangement of semiconductor dies is also included. An intermediate vertical side chip (i-VSC) is disposed between and electrically coupled to the first and second MSD structures. | 12-26-2013 |
20140091442 | HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY - An apparatus including a die including a device side; and a build-up carrier including a body including a plurality of alternating layers of conductive material and dielectric material disposed on the device side of the die, an ultimate conductive layer patterned into a plurality of pads or lands; and a grid array including a plurality of conductive posts disposed on respective ones of the plurality of pads of the ultimate conductive layer of the body, at least one of the posts coupled to at least one of the contact points of the die through at least a portion of the conductive material of the body. A method including forming a body of a build-up carrier including a die, the body of the build-up carrier including an ultimate conductive layer and forming a grid array including a plurality of conductive posts on the ultimate conductive layer of the body. | 04-03-2014 |
20140291866 | EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE - An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate. | 10-02-2014 |
20150201497 | HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless mounting substrate and an interposer disposed on the coreless mounting substrate with a chip disposed in a recess in the interposer and upon the coreless substrate. The apparatus may include an inter-package solder bump in contact with an interconnect channel in the interposer, and a top chip package including a top package substrate and a top die disposed on the top package substrate. The top package substrate is in contact with the inter-package solder bump. | 07-16-2015 |
20150277505 | LOW-PROFILE HINGE FOR AN ELECTRONIC DEVICE - Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees. | 10-01-2015 |
20150277506 | MICRO-HINGE FOR AN ELECTRONIC DEVICE - Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods. | 10-01-2015 |
20160005718 | MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE CHIP AND SEMICONDUCTOR PACKAGE FOR SAME - Semiconductor multi-die structures having intermediate vertical side chips, and packages housing such semiconductor multi-die structures, are described. In an example, a multi-die semiconductor structure includes a first main stacked dies (MSD) structure having a first substantially horizontal arrangement of semiconductor dies. A second MSD structure having a second substantially horizontal arrangement of semiconductor dies is also included. An intermediate vertical side chip (i-VSC) is disposed between and electrically coupled to the first and second MSD structures. | 01-07-2016 |
Patent application number | Description | Published |
20080237310 | Die backside wire bond technology for single or stacked die package - Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described. | 10-02-2008 |
20080315421 | Die backside metallization and surface activated bonding for stacked die packages - Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be coupled to an active metal layer of a second die through silicon vias and/or a die backside metallization layer of the second die. Other embodiments are also described. | 12-25-2008 |
20090019196 | Quality of Service (QoS) Processing of Data Packets - The present disclosure provides a method for providing Quality of Service (QoS) processing of a plurality of data packets stored in a first memory. The method may include determining a queue of a plurality of queues causing an interrupt using contents of an interrupt status register, the queue comprising address of at least one data packet of the plurality of data packets. The method may further include performing a logical operation between the contents of the interrupt status register and an interrupt mask of a plurality of interrupt masks, the plurality of interrupt masks stored in a second memory. The method may also include processing the plurality of data packets based on the logical operation and incrementing an interrupt mask address pointer stored in a third memory, thereby pointing to another interrupt mask of the plurality of interrupt masks. Of course, many alternatives, variations and modifications are possible without departing from this embodiment. | 01-15-2009 |
20090065951 | STACKED DIE PACKAGE - The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed. | 03-12-2009 |
20100169750 | FIRMWARE VERIFICATION USING SYSTEM MEMORY ERROR CHECK LOGIC - Embodiments of an invention for verifying firmware using system memory error check logic are disclosed. In one embodiment, an apparatus includes an execution core, firmware, error check logic, non-volatile memory, comparison logic, and security logic. The error check logic is to generate, for each line of firmware, an error check value. The comparison logic is to compare stored error check values from the non-volatile memory with generated error check values from the error check logic. The security logic is to prevent the execution core from executing the firmware if the comparison logic detects a mismatch between the stored error code values and the generated error code values. | 07-01-2010 |
20120003792 | STACKED DIE PACKAGE - The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed. | 01-05-2012 |
20140175670 | STACKED DIE PACKAGE - The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed. | 06-26-2014 |
Patent application number | Description | Published |
20110102442 | Recording Contents of Display Screens - Screen recording may be implemented with better security, performance, power savings and cost without the need of additional software to support the screen recording feature, in some embodiments, by using a keyboard, video, mouse functionality already provided in a computer system chipset on a motherboard. Frames of video may be stored on that system or, in some cases, may be selectively provided to a local area network. | 05-05-2011 |
20120151109 | Method and apparatus to reduce serial bus transmission power - In some embodiments, a serial bus interface circuit includes at least two serial ports, a memory to store a relationship between serial bus addresses and the at least two serial ports, and a controller to control access to the at least two serial ports. The controller may be configured to receive an access request for a serial bus address, determine a first port of the at least two serial ports corresponding to the serial bus address using the relationships stored in the memory, and disable a second port of the at least two serial ports. Other embodiments are disclosed and claimed. | 06-14-2012 |
20140108845 | METHOD AND APPARATUS TO REDUCE SERIAL BUS TRANSMISSION POWER - In some embodiments, a serial bus interface circuit includes at least two serial ports, a memory to store a relationship between serial bus addresses and the at least two serial ports, and a controller to control access to the at least two serial ports. The controller may be configured to receive an access request for a serial bus address, determine a first port of the at least two serial ports corresponding to the serial bus address using the relationships stored in the memory, and disable a second port of the at least two serial ports. Other embodiments are disclosed and claimed. | 04-17-2014 |
20150127983 | TEST, VALIDATION, AND DEBUG ARCHITECTURE - An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and de-bug of a part/platform under test. In essence, a complete test architecture stack is described herein for test, validation, and debug of electronic parts, devices, and platforms. | 05-07-2015 |