Patent application number | Description | Published |
20110031606 | PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP - A packaging substrate includes: a core board having opposite first and second surfaces and a cavity penetrating therethrough; a semiconductor chip disposed in the cavity and having an active surface with electrode pads and an opposite inactive surface; a first reinforcing dielectric layer containing a reinforcing material disposed on the first surface and the active surface and filling the gap between the chip and the cavity; a second reinforcing dielectric layer containing a reinforcing material disposed on the second surface and the inactive surface and filling the gap between the chip and the cavity; and first and second wiring layers disposed on the first and second reinforcing dielectric layers respectively and the first wiring layer electrically connecting to the electrode pads. The first and second reinforcing dielectric layers enhance the support force of the entire structure to thereby prevent delamination of the wiring layers from the dielectric layers and increase product yield and reliability. | 02-10-2011 |
20130318785 | METHOD FOR MANUFACTURING IC SUBSTRATE - A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units. | 12-05-2013 |
20130341073 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A packaging substrate includes an insulating layer, a wiring layer and a solder mask. The insulating layer and the solder mask being arranged on two opposite sides of the wiring layer. The insulating layer defines a via hole. The wiring layer covers the via hole. The wiring layer includes a pad area. Two sides of the pad area are respectively exposed outside from the solder mask and in the via hole. | 12-26-2013 |
20140000950 | MULTI-LAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | 01-02-2014 |
20160135295 | MULTI-LAYER CIRCUIT BOARD - A multi-layer circuit board includes a plurality of circuit substrates, a plurality of dielectric layers, and a plurality of metal bumps. Each circuit substrate includes two first trace layers and an insulating layer between the two trace layers. Each electric layer is laminated between two neighboring circuit substrates. At latest one metal bump is arranged between each two neighboring circuit substrates. Each metal bump passes through one dielectric layer. Two opposite ends of each metal bump are connected with the trace layer of the circuit substrate to be electrically connected to the two neighbor circuit substrates. | 05-12-2016 |
Patent application number | Description | Published |
20100277887 | POLARIZED WHITE LIGHT EMITTING DIODE - A polarized white light emitting diode is provided, including a substrate with an ultraviolet light emitting diode (UV LED) chip disposed thereover for emitting ultraviolet (UV) light, a phosphor layer coated around the UV LED chip to be excited by the UV light from the UV LED chip to thereby emit white light, an omni-directional reflector disposed over the phosphor layer, a medium layer disposed between the omni-directional reflector and the phosphor layer, wherein the omni-directional reflector allows the UV light from the UV LED chip to be multiply and omni-directionally reflected in between the phosphor layer and the medium layer, a transparent substrate disposed over the omni-directional reflector, and a metal-containing polarization layer disposed over the transparent substrate for polarizing the white light emitted from the phosphor layer to thereby emit a polarized white light | 11-04-2010 |
20140268877 | LUMINOUS ELEMENT, BAR-TYPE LUMINOUS ELEMENT AND APPLICATIONS THEREOF - A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors. | 09-18-2014 |
Patent application number | Description | Published |
20120080364 | WATER PROVISIONING SYSTEM FOR KITCHEN - The water provisioning system mainly contains a selection switch, a water volume switch, a human-machine interface (HMI), a RO waste water recycling device, an electromagnetic valve, a RO water purification device, an antichlor device, a aeration pipe assembly, a first ozone module, and a second ozone module. The selection switch selects a type of water to use. The RO water purification device filters water from a low-temperature water source, stores purified water in a storage barrel, and provides high-quality drinking water. The 70% water from the RO water purification process that fails the drinking water standard is recycled through the RO waste water recycling device. The low-temperature water source is connected to a antichlor device and the water is therefore dechlorinated. The first and second ozone modules are used to produce ozonated water and to release ozone through the aeration pipe assembly into the kitchen cabinet for deodorization and sterilization. | 04-05-2012 |
20160064317 | INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above. | 03-03-2016 |
20160073516 | INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME - A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer; forming a second wiring layer on the first insulating layer and the conductive pillars; disposing a plurality of external connection pillars on the second wiring layer; forming a second insulating layer on the first insulating layer, with the external connection pillars being exposed from the second insulating layer; forming at least a trench on the second insulating layer; and removing the carrier. Through the formation of the interposer substrate, which does not have a core layer, on the carrier, a via process is omitted. Therefore, the method is simple, and the interposer substrate thus fabricated has a low cost. The present invention further provides the interposer substrate. | 03-10-2016 |
Patent application number | Description | Published |
20120181824 | SEAT ADJUSTING MODULE - A seat adjusting module suitable to connect the saddle including at least a seat rail and a seat tube of a bicycle is provided, wherein the module includes a base assembled to an end of the seat tube, a clamp unit including two clamp elements and a fastening unit including two fasteners. The first clamp element has at least a first clamp portion and a shaft portion matched to the base at a first or a second position so as to rotate relatively to the base on a first or a second rotation axis. The second clamp element has at least a second clamp portion, which with the first clamp portion together clamps the seat rail. The two fasteners together fasten the two clamp elements to the base so that the first and second clamp portions together clamp tightly the seat rail. | 07-19-2012 |
20140069226 | HANDLEBAR ASSEMBLY - A handlebar assembly suitable to be installed on a steerer tube of a bicycle is provided. The handlebar assembly includes a stem, a handlebar, and a fastener. The stem has a first end and a second end opposite to the first end, wherein the stem has a first fastening surface positioned at the first end, and wherein the second end is suitable to be assembled to the steerer tube. The handlebar includes a middle portion and two handle portions, wherein the handle portions are positioned on two opposite sides of the middle portion respectively, and wherein the middle portion has a second fastening surface to be infixed to the first fastening surface. The fastener crosses the first fastening surface and the second fastening surface infixed to each other to fasten the stem and the handlebar and is positioned within the stem and the middle portion. | 03-13-2014 |
20140070576 | BICYCLE SEAT - A bicycle seat includes a deformation space that corresponds to a pressure deformation of a bicycle rider. Wherein, a plurality of filler particles is filled in the deformation space. Therefore, the plurality of filler particles in the deformation space is sliding and rolling under pressure, and the bicycle seat can average support the body of the rider and bring lower friction. | 03-13-2014 |
20140182456 | Debinder Trap - A debinder trap for treating binder gas thermal-cracked in sintering process of metal injection molding includes a hollow barrel body having a barrel cover, a barrel wall and a barrel bottom, and a plurality of baffles disposed in the barrel body to define a guide channel. An inlet and an outlet are apart opened in the barrel cover. The entrance of the guide channel is communicated with the inlet of the barrel body and the exit of the guide channel is communicated with the outlet of the barrel body. The barrel body contains oil material therein. In use, the binder gas enters the barrel body through the inlet and flows along the guide channel for being adsorbed by the oil material and rapidly condensed into solid binder, and the solid binder is dissolved and precipitated in the oil material to make the oil material continue to adsorb the binder gas. | 07-03-2014 |
20140190354 | DEBINDER TRAP - A debinder trap for treating binder gas thermal-cracked in sintering process of metal injection molding includes a barrel body defining an inflow hole, a drain hole, an inlet and an outlet, baffles disposed in the barrel body to define a guide channel of which entrance and exit are communicated with the inlet and the outlet, and a temperature controller containing liquid material therein and connected with the barrel body via an inflow pipe and a drain pipe connecting in the inflow hole and the drain hole. An accommodating channel passes through the inside of the barrel body and extends from the inflow hole to the drain hole. The temperature controller conveys the liquid material in the accommodating channel to regulate internal environment of the barrel body into low-temperature to condense the binder gas through the guide channel into solid, and high-temperature to make the solid binder molten to sink. | 07-10-2014 |
20140334961 | METHOD OF MANUFACTURING A HYDROGEN STORAGE DEVICE - A method of manufacturing a hydrogen storage device includes the steps: (1) mix metal powder, backbone binder and wetting agent to make a canister shell feedstock; (2) mix metal powder, salts, backbone binder and wetting agent to make a porous structure feedstock; (3) feed the canister shell feedstock in an injection molding machine to form a green part of canister shell; (4) feed the porous structure feedstock in the green part of canister shell to form a. green part of porous structure integral with the green part of canister shell by injection molding; (5) dissolve the salts out of the green part of porous structure to form pores; (6) remove the wetting agent from the green parts of canister shell and porous structure; (7) remove the backbone binder from the green parts of canister shell and porous structure to form the hydrogen storage device. | 11-13-2014 |
20150034129 | DEWAXING DEVICE AND METHOD OF DEWAXING USING THE DEWAXING DEVICE - A dewaxing device and a method of dewaxing using the dewaxing device are shown. The dewaxing device includes a dewaxing system including a rinsing device and a storage device, and a recycling system connected with the storage device. The storage device includes a first solvent trough and a second solvent trough of which each is connected with the rinsing device and is equipped with a heating equipment. When the first solvent trough is connected with the rinsing device, the second solvent trough is disconnected with the rinsing device; when the second solvent trough is connected with the rinsing device, the first solvent trough is disconnected with the rinsing device. So, the dewaxing device can provide two dewaxing processes and effectively reduce recycling frequency because the recycling process is done after soluble wax quantity of bromopropane solvent reaches the maximum value 16%. The production cost is accordingly reduced. | 02-05-2015 |
20150047681 | DEWAXING DEVICE - A dewaxing device includes a dewaxing system which includes a rinsing device and a storage device connected with the rinsing device via a circulation pipe, and a recycling system which includes a containing trough connected with the storage device and a recycling trough connected between the containing trough and the storage device. The recycling system further includes a rotating device, a condensing unit and a heating unit which cooperate to treat mixed solution with wax into pure chemical solvent in the containing trough. The rotating device is rotatably mounted above the containing trough with the bottom half thereof being dived into the mixed solution. The condensing unit and the heating unit are disposed at two opposite sides of the top half of the rotating device. The rotating device is rotated towards the condensing unit. | 02-19-2015 |
20150210347 | HIDDEN HYDRAULIC STRUCTURE OF BIKE DISC BRAKE - A hidden hydraulic structure of a bike disc brake is integrally disposed with a bike body tube. The hidden hydraulic structure of the bike disc brake includes a base, a piston and a linking member. The base includes an oil circuit. The piston is located in the base for controlling a pressure of the oil circuit. The piston is actuated by the linking member. Wherein a shape of the base is corresponded to a shape of the bike body tube, and the base is connected with the bike body tube to form a portion of the bike body tube, thereby increasing strength of the bike body tube. | 07-30-2015 |
20150298752 | DISTINGUISHING SYSTEM FOR SADDLE CONTACTING MODE - A distinguishing system for a saddle contacting mode includes a saddle and a deformable pressure sensing apparatus. The deformable pressure sensing apparatus is disposed on the saddle, wherein the deformable pressure sensing apparatus deforms in response to a sitting pressure, and a saddle type is determined in accordance with the deformation. The deformable pressure sensing apparatus can actually acquire the pelvis contact shape. The deformation is visible on the saddle after the sitting pressure is released, and the deformation can be compared with a comparison table to determine the suitable saddle type for the user instantly. Therefore, the distinguishing system could save the test time and reduce the production cost. | 10-22-2015 |
20160039245 | BICYCLE WHEEL - The bicycle wheel includes a rim, a hub, a driving device, a plurality of first side pulling spokes, a plurality of first side pushing spokes, and a plurality of second side spokes. The rim has a first side and a second side. The hub is located in a center of the rim. The driving device is connected to the hub which is located on the first side of the rim. Each of the first side pulling spokes and the first side pushing spokes is connected to the rim and the hub, and located on the first side of the rim, respectively. Each of the second side spokes is connected to the rim and the hub, and located on the second side of the rim. | 02-11-2016 |
Patent application number | Description | Published |
20120266983 | FAUCET DEVICE WITH TOUCH CONTROL AND DISPLAY CAPABILITIES - The present disclosure is related to a faucet device with touch control and display capabilities. The faucet device includes a gas providing unit, a faucet body, and a touch control and display system, wherein the faucet body and the touch control and display system are both coupled to the gas providing unit. The gas providing unit is for providing a predetermined gas to the faucet body, so as to enable the mixing of the predetermined gas with a water flow. The faucet body is equipped with a Venturi tube allowing for the predetermined gas to be transmitted automatically from the gas providing unit to the faucet body when the faucet body is turned on. The predetermined gas may not be transmitted to the faucet body when the water flow does not pass through the Venturi tube. | 10-25-2012 |
20150364408 | PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME - This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer having a first dielectric material layer and a first metal wire protruding from the first dielectric material layer; a conductive pillar layer formed on the first wiring layer and including a molding compound layer, a second dielectric material layer formed on the molding compound layer, and a metal pillar connected to the first metal wire; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer. | 12-17-2015 |
20150364435 | PACKAGE METHOD - A package method comprises the steps of: providing a metal carrier having a first surface and a second surface opposite to the first surface; forming a first wiring layer on the second surface of the metal carrier; forming a first conductive pillar layer on the first wiring layer; forming a dielectric material layer covering the first wiring layer, the first conductive pillar layer and the second surface of the metal carrier; exposing one end of the first conductive pillar layer; forming a second wiring layer on the exposed end of the first conductive pillar layer; forming a solder resist layer on the dielectric material layer and the second wiring layer; removing the metal carrier. | 12-17-2015 |
20150366064 | PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF - A package apparatus comprises a first conductive wiring layer, a first conductive pillar layer, a dielectric material layer, a second conductive wiring layer, a second conductive pillar layer, and a first molding compound layer. The first conductive wiring layer has a first surface and a second surface opposite to the first surface. The first conductive pillar layer is disposed on the first surface of the first conductive wiring layer, wherein the first conductive wiring layer and the first conductive pillar layer are disposed inside the dielectric material layer. The second conductive wiring layer is disposed on the first conductive pillar layer and the dielectric material layer. The second conductive pillar layer is disposed on the second conductive wiring layer, wherein the second conductive wiring layer and the second conductive pillar layer are disposed inside the first molding compound layer. | 12-17-2015 |
20160118327 | PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME - This disclosure provides a package substrate, a flip-chip package circuit and their fabrication method. The package substrate includes: a first wiring layer having a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer except for the first metal wire; a conductive pillar layer formed on the first wiring layer and including a metal pillar connected to the first metal wire, a molding compound layer with a protrusion part surrounding the metal pillar, and a second dielectric material layer formed on the molding compound layer; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer. | 04-28-2016 |