Patent application number | Description | Published |
20080203451 | CMOS image sensor and method for fabricating the same - A CMOS image sensor and a method for fabricating the same are provided, in which an N type region of a photodiode is prevented from adjoining a device isolation film and a dark current is reduced. The CMOS image sensor includes an interlayer dielectric film formed between a gate poly and a power line, a contact formed in the interlayer dielectric film, and an epitaxial layer connected with the contact and formed only in a blue photodiode region. | 08-28-2008 |
20080265297 | CMOS image sensor and method for manufacturing the same - A CMOS image sensor and a method for manufacturing the same are disclosed, in which a blue photodiode is imparted with a greater thickness to improve sensitivity of blue light. The blue photodiode of a CMOS image sensor includes a first lightly doped P-type epitaxial layer formed on a heavily doped P-type semiconductor substrate; a gate electrode of a transfer transistor formed on the first epitaxial layer; a first N-type blue photodiode region formed on the first epitaxial layer; and a second N-type blue photodiode region formed on the first epitaxial layer corresponding to the first blue photodiode region. | 10-30-2008 |
20090189206 | CMOS image sensor and method of fabricating the same - A CMOS image sensor and method for fabricating the same, wherein the CMOS image sensor has minimized dark current at the boundary area between a photodiode and an isolation layer. The present invention includes a first-conductivity-type doping area formed in the device isolation area of the substrate, the first-conductivity-type doping area surrounding the isolation area and a dielectric layer formed between the isolation layer and the first-conductivity-type doping area, wherein the first-conductivity-type doping area and the dielectric layer are located between the isolation layer and a second-conductivity-type diffusion area. | 07-30-2009 |
Patent application number | Description | Published |
20100026869 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor and a method for manufacturing the same are provided. The image sensor comprises a readout circuitry, an interlayer dielectric, an interconnection, and a CuInGaSe2 (CIGS) image sensing device. The readout circuitry is disposed on a first substrate. The interlayer dielectric is disposed over the first substrate. The interconnection is in the interlayer dielectric and electrically connected to the readout circuitry. The CIGS image sensing device is disposed over the interconnection and electrically connected to the readout circuitry through the interconnection. | 02-04-2010 |
20100103298 | Image Sensor and Method for Manufacturing the Same - Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes readout circuitry and an inter-layer dielectric layer on a first substrate, a metal line in the inter-layer dielectric layer and electrically connected with the readout circuitry, a plurality of contact plugs on the metal line, and an image sensing device on the contact plugs. The image sensing device is electrically connected to the metal line through the plurality of contact plugs. The method for manufacturing an image sensor includes forming a readout circuitry on a first substrate, forming an inter-layer dielectric layer on the first substrate, forming a metal line in the inter-layer dielectric layer such that the metal line is electrically connected with the readout circuitry, forming a plurality of contact plugs on the metal line per unit pixel, and forming an image sensing device on the plurality of contact plugs. | 04-29-2010 |
20100110247 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - Provided are an image sensor and a method for manufacturing the same. The image sensor comprises a readout circuitry, an electrical junction region, a poly contact, an interconnection, and an image sensing device. The readout circuitry is formed on a first substrate. The electrical junction region is formed in the first substrate. The electrical junction region is electrically connected to the readout circuitry. The poly contact is formed on the electrical junction region. The interconnection is formed on the poly contact. The image sensing device is formed on the interconnection. The image sensing device is electrically connected to the readout circuitry through the interconnection, the poly contact, and the electrical junction region. | 05-06-2010 |
Patent application number | Description | Published |
20090096950 | THIN FILM TRANSISTOR PANEL - A thin film transistor panel is provided. The thin film transistor panel includes: a substrate; gate lines formed on the substrate; data lines insulated from the gate lines and intersecting the gate lines; thin film transistors which are connected to the gate lines and the data lines and have drain electrodes; capacitive coupling electrodes connected to the drain electrodes; and pixel electrodes which are formed in the pixels surrounded by the gate lines and the data lines and include first pixel electrodes connected to the drain electrodes and second pixel electrodes which are separated from the first pixel electrodes and overlap with the capacitive coupling electrodes, wherein the first and second pixel electrodes of different pixel electrodes have a left-right symmetrical structure. | 04-16-2009 |
20100208674 | METHOD FOR RECEIVING PREAMBLE FROM OTHER COMMUNICATION SYSTEM AND METHOD FOR ADAPTIVELY CHANGING THE MEASUREMENT GAP TO DISCOVER THE OTHER COMMUNICATION SYSTEM - A method for receiving a preamble signal of another communication system and a method for adaptively changing a measurement gap to discover another communication system are disclosed. A method for receiving a preamble signal from a base station of a second communication system by a communicating mobile station in a first communication system includes receiving measurement gap scheduling information from a base station of the first communication system, if a preamble signal of the second communication system is not received during an assigned measurement gap, changing the measurement gap, and receiving the preamble signal of the second communication system during the changed measurement gap. | 08-19-2010 |
20100290411 | METHOD OF ALLOCATING RADIO RESOURCE IN BROADBAND WIRELESS ACCESS SYSTEM - A method for allocating resource regions in a wireless access system is provided. This method collectively allocates resources in non-consecutive frames. Specifically, a message, including allocation information used to collectively and non-consecutively allocate identical resource regions, is received from a base station and data is transmitted or received through the allocated resource regions. Since identical resource regions are collectively allocated in multiple frames, it is possible to reduce both the number of transmissions of a MAP message and MAP overhead in a network. | 11-18-2010 |
20120306848 | DIGITAL EYESIGHT MEASURING APPARATUS - Disclosed is a digital eyesight device, which comprises an ASIC (Application Specific Integrated Circuit) which includes a data storing part which stores a graphic data on an eyesight measurement table, an internal memory part which retrieves a graphic data from the data storing part; an embedded processor which has an internal processor part processing a graphic data, an external graphic processor which converts a 1-channel type graphic data processed by the embedded processor into a 2-channel type graphic data, a first bus which is connected between the embedded processor and the external graphic processor and is connected with the embedded processor in a signal transmission way, and a second bus which is electrically connected with the external graphic processor, said ASIC having an interface function interfacing the signal of the embedded processor to the external graphic processor and converting a 1-port 2-channel graphic data generated by the external graphic processor into a 2-port 2-channel graphic data; and a large size panel which receives a 2-port 2-channel type graphic data from the ASIC and displays it. | 12-06-2012 |
20150062524 | DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel is provided. A first substrate includes a display area and a peripheral area. The peripheral area surrounds the display area. A second substrate is disposed on the first substrate. The second substrate faces the first substrate along a first direction. A liquid crystal layer is interposed between the first substrate and the second substrate. A multi-layered sealant is disposed on the peripheral area of the first substrate. The multi-layered sealant surrounds the liquid crystal layer. The multi-layered sealant includes a first sealant layer including an acrylate resin having a functional group having at least 3 carbon atoms, and a second sealant layer including an epoxy resin having a (meth)arcylate group. | 03-05-2015 |
20150091035 | SEMICONDUCTOR DEVICE STRUCTURE - The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material. | 04-02-2015 |
20160103342 | LIQUID CRYSTAL DISPLAY PANEL - A liquid crystal display (LCD) panel includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The liquid crystal layer includes liquid crystals with negative dielectric anisotropy and a hindered amine light stabilizer (HALS). | 04-14-2016 |
Patent application number | Description | Published |
20120247948 | SPUTTERING TARGET OF MULTI-COMPONENT SINGLE BODY AND METHOD FOR PREPARATION THEREOF, AND METHOD FOR PRODUCING MULTI-COMPONENT ALLOY-BASED NANOSTRUCTURED THIN FILMS USING SAME - The present invention relates to a sputtering target of a multi-component single body, a preparation method thereof, and a method for fabricating a multi-component alloy-based nanostructured thin film using the same. The sputtering target according to the present invention comprises an amorphous or partially crystallized glass-forming alloy system composed of a nitride forming metal element, which is capable of reacting with nitrogen to form a nitride, and a non-nitride forming element which has no or low solid solubility in the nitride forming metal element and does not react with nitrogen or has low reactivity with nitrogen, wherein the nitrogen forming metal element comprises at least one element selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Y, Mo, W, Al, and Si, and the non-nitride forming element comprises at least one element selected from Mg, Ca, Sc, Ni, Cu, Ag, In, Sn, La, Au, and Pb. | 10-04-2012 |
20140346038 | CRYSTALLINE ALLOY HAVING GLASS-FORMING ABILITY, PREPARATION METHOD THEREOF, ALLOY TARGET FOR SPUTTERING, AND PREPARATION METHOD THEREOF - Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The present invention also provides an alloy sputtering target that is manufactured by using the crystalline alloy, and a method of manufacturing the alloy target. According to an aspect of the present invention, provided is a crystalline alloy having glass-forming ability which is formed of three or more elements having glass-forming ability, wherein the average grain size of the alloy is in a range of 0.1 μm to 5 μm and the alloy includes 5 at % to 20 at % of aluminum (Al), 15 at % to 40 at % of any one or more selected from copper (Cu) and nickel (Ni), and the remainder being zirconium (Zr). | 11-27-2014 |
20160068943 | SPUTTERING TARGET OF MULTI-COMPONENT SINGLE BODY AND METHOD FOR PREPARATION THEREOF, AND METHOD FOR PRODUCING MULTI-COMPONENT ALLOY-BASED NANOSTRUCTURED THIN FILMS USING SAME - The present invention relates to a sputtering target of a multi-component single body, a preparation method thereof, and a method for fabricating a multi-component alloy-based nanostructured thin film using the same. The sputtering target according to the present invention comprises an amorphous or partially crystallized glass-forming alloy system composed of a nitride forming metal element, which is capable of reacting with nitrogen to form a nitride, and a non-nitride forming element which has no or low solid solubility in the nitride forming metal element and does not react with nitrogen or has low reactivity with nitrogen, wherein the nitrogen forming metal element comprises at least one element selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Y, Mo, W, Al, and Si, and the non-nitride forming element comprises at least one element selected from Mg, Ca, Sc, Ni, Cu, Ag, In, Sn, La, Au, and Pb. | 03-10-2016 |
Patent application number | Description | Published |
20120074215 | METHOD FOR GENERATING AN IMAGE FILE FOR FORGERY VERIFICATION AND A METHOD FOR FORGERYVERIFICATION OF AN IMAGE FILE - The present invention is related to a method for generating an image file for forgery verification and a method for forgery verification. A method for generating an image file for forgery verification according to the present invention consists of a generating a bit map of the image file, a generating a horizontal check logic, a vertical check logic, and a check logic of each region from the bit map, a generating a two-dimensional bar code from the horizontal check logic, the vertical check logic, and the check logic of each region, and a generating an image file for forgery verification into which the two-dimensional bar code is inserted. A method for forgery verification according to the present invention consists of a generating a first horizontal check logic, a first vertical check logic, and a first check logic of each region from the bit map by generating a bit map of an image file for forgery verification into which a two-dimensional bar code is inserted, a generating a second horizontal check logic, a second vertical check logic, and a second check logic of each region from the two-dimensional bar code, and a comparing the first and the second horizontal check logics, the first and the second vertical check logics, and the first and the second check logics of each region. | 03-29-2012 |
20120255029 | SYSTEM AND METHOD FOR PREVENTING THE LEAKING OF DIGITAL CONTENT - There are disclosed a system and method for preventing the leaking of digital content. The system for preventing the leaking of digital content may include a digital content layer generation unit for generating a digital content layer displaying digital content, a security layer generation unit for generating a security layer including security information based on information about a user terminal, and an information display unit for displaying the security layer generated by the security layer generation unit and the digital content layer generated by the digital content layer generation unit in the display device of the user terminal in an overlapping form so that the security information looks like overlapping with the digital content. Accordingly, the illegal leaking of digital content through photographing or screen capture can be prevented. | 10-04-2012 |