Patent application number | Description | Published |
20140042530 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a substrate including a first region and a second region, a trench-gate transistor in the first region, the trench-gate transistor including a first trench in the substrate, a gate filling at least part of the first trench, and a source in the substrate and on each sidewall of the first trench, a first field diffusion junction in the second region, an interlayer insulating film on the substrate, the interlayer insulating film covering the trench-gate transistor and the first field diffusion junction, a first contact in the first region, the first contact passing through the interlayer insulating film and contacting the source, and a second contact in the second region, the second contact passing through the interlayer insulating film and contacting the first field diffusion junction, the first contact and the second contact having an equal height and including a same material. | 02-13-2014 |
20140042531 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a trench in a substrate, a gate filling a part of the trench, a tilted source on a side wall of the trench, the tilted source partially overlapping the gate, an interlayer insulating film on the substrate and filling the trench, and a contact hole penetrating parts of the interlayer insulating film and the substrate and contacting the tilted source, the contact hole having a tilted surface at an angle that is equal to or larger than 80 degrees and smaller than 90 degrees. | 02-13-2014 |
20140252368 | HIGH-ELECTRON-MOBILITY TRANSISTOR - A high-electron-mobility transistor (HEMT) device includes a plurality of semiconductor layers formed on a substrate, wherein a two-dimensional electron gas (2DEG) layer is formed in the semiconductor layers; an etch-stop layer formed on the plurality of semiconductor layers; a p-type semiconductor layer pattern formed on the etch-stop layer; and a gate electrode formed on the p-type semiconductor layer pattern. | 09-11-2014 |
20140252369 | NITRIDE-BASED SEMICONDUCTOR DEVICE - A nitride-based semiconductor device including a substrate; a GaN-containing layer on the substrate; a nitride-containing layer on the GaN layer; a channel blocking layer on the nitride-containing layer, the channel blocking layer including a nitride-based semiconductor; a gate insulation layer on the channel blocking layer; and a gate electrode on the gate insulation layer. | 09-11-2014 |
20140253241 | HIGH ELECTRON MOBILITY TRANSISTOR DEVICE - A high electron mobility transistor (HEMT) device includes a buffer layer on a substrate; a face-inversion layer on a part of the buffer layer; a plurality of semiconductor layers on the face-inversion layer and on the buffer layer; and a source electrode, a drain electrode, and a gate electrode on the plurality of semiconductor layers. The HMT device has a stable, normally Off characteristic. | 09-11-2014 |
20140291758 | SEMICONDUCTOR DEVICE HAVING PLANAR SOURCE ELECTRODE - A semiconductor device includes a channel layer on a substrate; cell trench patterns in the channel layer; and a source pattern on the cell trench patterns. The source pattern includes: grooves, each having inclined sidewalls and bottom that extends in a horizontal direction in a portion of the channel layer between the cell trench patterns, source regions at the inclined sidewalls of the grooves, source isolation regions at the bottoms of the grooves, and a source electrode at interior regions of the grooves and that has a planar upper surface. | 10-02-2014 |
20150021616 | NITRIDE-BASED SEMICONDUCTOR DEVICES - A nitride-based semiconductor device includes a barrier structure on a substrate, a nitride semiconductor layer on the barrier structure, and a source electrode, a drain electrode, and a gate electrode on the nitride semiconductor layer to be separated from each other. The barrier structure includes a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity on the first semiconductor layer, a third semiconductor layer having the first conductivity on the second semiconductor layer, and a fourth semiconductor layer having the second conductivity on the third semiconductor layer. A two-dimensional electrode gas (2DEG) channel is formed in the nitride semiconductor layer. | 01-22-2015 |
20150044854 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a method of fabricating a semiconductor device. The method of fabricating a semiconductor device includes preparing a substrate in which a scribe lane region and a chip region are defined, forming a trench in the scribe lane region of the substrate, forming a stopper layer in a part in the trench, and forming an alignment mark material on the stopper layer. | 02-12-2015 |