Carcia
Anthony Carcia, Vancouver, WA US
Patent application number | Description | Published |
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20140064816 | LOCKING MECHANISM - An apparatus can comprise a locking mechanism comprising an elongated slot to receive a pin. The apparatus can also comprise an encoder strip adhered to the locking mechanism. The apparatus can further comprise a tension spring coupled to the locking mechanism. The tension spring can provide a force in a given direction to pull the locking mechanism in the given direction. | 03-06-2014 |
Anthony Carcia, Portland, OR US
Patent application number | Description | Published |
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20150271927 | INTEGRATED SOLDERING DEVICE - An integrated soldering device comprising a wire feed mechanism, a heater configured to heat the wire, and an air recirculation system. The heated wire is fed from the device functions as the soldering tip as the device is used. The air recirculation system collects fumes and smoke generated by the soldering process. | 09-24-2015 |
Francis A. Carcia, Enfield, CT US
Patent application number | Description | Published |
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20150145461 | INPUT EMI FILTER FOR MOTOR DRIVE INCLUDING AN ACTIVE RECTIFIER - A poly-phase motor drive includes an input EMI filter having a poly-phase filter input and a poly-phase filter output and an active rectifier connected to the filter output. The input EMI filter includes notch filters tuned at active rectifier and motor drive inverter switching frequencies and diverts common-mode current into DC bus. The active rectifier has a DC output. A motor drive inverter is connected to the DC output. The motor drive inverter has a poly-phase motor control output. | 05-28-2015 |
Peter Carcia, Wilmington, DE US
Patent application number | Description | Published |
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20150072119 | MULTI-LAYER STRUCTURE INCLUDING AN INTERLAYER TO REDUCE STRESS IN THE STRUCTURE AND METHOD OF FORMING SAME - A multi-layer structure including an interlayer to relieve stress in the structure, a device including the structure, and a method of forming the device and structure are disclosed. The structure includes a substrate having a first coefficient of thermal expansion, an interlayer, and a coating having a second coefficient of thermal expansion. The interlayer reduces stress in the structure that would otherwise exist in the structure as a result of the difference in coefficients of thermal expansion of the substrate and the coating. | 03-12-2015 |