Patent application number | Description | Published |
20080237685 | Semiconductor memory device, method of fabricating the same, and devices employing the semiconductor memory device - In one embodiment, the semiconductor memory device includes a semiconductor substrate having projecting portions, a tunnel insulation layer formed over at least one of the projecting semiconductor substrate portions, and a floating gate structure disposed over the tunnel insulation layer. An upper portion of the floating gate structure is wider than a lower portion of the floating gate structure, and the lower portion of the floating gate structure has a width less than a width of the tunnel insulating layer. First insulation layer portions are formed in the semiconductor substrate and project from the semiconductor substrate such that the floating gate structure is disposed between the projecting first insulation layer portions. A dielectric layer is formed over the first insulation layer portions and the floating gate structure, and a control gate is formed over the dielectric layer. | 10-02-2008 |
20090221138 | Method of manufacturing semiconductor device - A method of manufacturing a semiconductor device, including forming a plurality of gate structures on a substrate, the gate structures each including a hard mask pattern stacked on a gate conductive pattern, forming an insulating layer pattern between the gate structures at least partially exposing a top surface of the hard mask pattern, forming a trench that exposes at least a top surface of the gate conductive pattern by selectively removing the hard mask pattern, and forming a silicide layer on the exposed gate conductive pattern. | 09-03-2009 |
20090309154 | SELECTION TRANSISTOR - Provided are a selection transistor and a method of fabricating the same. A selection transistor can be formed on an active region in a semiconductor substrate to include a gate electrode that includes recessed portions of a sidewall of the gate electrode which are recessed inward adjacent lower portions of the gate electrode to define a T-shaped cross section of the gate electrode. A tunnel insulating layer can be located between the gate electrode and the active region. | 12-17-2009 |
20110233610 | Nonvolatile Memory Devices Having Memory Cell Transistors Therein with Lower Bandgap Source/Drain Regions - Nonvolatile memory devices include a plurality of nonvolatile memory cell transistors having respective channel regions within a semiconductor layer formed of a first semiconductor material and respective source/drain regions formed of a second semiconductor material, which has a smaller bandgap relative to the first semiconductor material. The source/drain regions can form non-rectifying junctions with the channel regions. The source/drain regions may include germanium (e.g., Ge or SiGe regions), the semiconductor layer may be a P-type silicon layer and the source/drain regions of the plurality of nonvolatile memory cell transistors may be P-type germanium or P-type silicon germanium. | 09-29-2011 |
20110233636 | Semiconductor Memory Device and Method of Manufacturing the Same - A non-volatile memory device and a method of manufacturing the non-volatile memory device are disclosed. The non-volatile memory device includes a substrate, at least two gate structures on the substrate, and at least one impurity region in portions of the substrate between the at least two gate structures. The center of the at least one impurity region is horizontally offset from the center of a region between the at least two gate structures. | 09-29-2011 |
20120037975 | SEMICONDUCTOR DEVICES - A semiconductor device has an isolation layer pattern, a plurality of gate structures, and a first insulation layer pattern. The isolation layer pattern is formed on a substrate and has a recess thereon. The gate structures are spaced apart from each other on the substrate and the isolation layer pattern. The first insulation layer pattern is formed on the substrate and covers the gate structures and an inner wall of the recess. The first insulation layer pattern has a first air gap therein. | 02-16-2012 |
20120132982 | Non-Volatile Memory Devices - A non-volatile memory device includes gate structures, an insulation layer pattern, and an isolation structure. Multiple gate structures being spaced apart from each other in a first direction are formed on a substrate. Ones of the gate structures extend in a second direction that is substantially perpendicular to the first direction. The substrate includes active regions and field regions alternately and repeatedly formed in the second direction. The insulation layer pattern is formed between the gate structures and has a second air gap therein. Each of the isolation structures extending in the first direction and having a first air gap between the gate structures, the insulation layer pattern, and the isolation structure is formed on the substrate in each field region. | 05-31-2012 |
20130293808 | CURABLE COMPOSITION - A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell. | 11-07-2013 |
20130296514 | CURABLE COMPOSITION - A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell. | 11-07-2013 |
20130296515 | CURABLE COMPOSITION - A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell. | 11-07-2013 |
20130296521 | CURABLE COMPOSITION - A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell. | 11-07-2013 |
20140088251 | CURABLE COMPOSITION - Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions in a long time, and not inducing whitening and surface stickiness. | 03-27-2014 |
20140088281 | CURABLE COMPOSITION - This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness. | 03-27-2014 |
20140103389 | CURABLE COMPOSITION - Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness. | 04-17-2014 |
20140110748 | CURABLE COMPOSITION - Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness. | 04-24-2014 |
20140114042 | CURABLE COMPOSITION - Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions in a long time and having no whitening and surface stickiness. | 04-24-2014 |
20140114043 | CURABLE COMPOSITION - Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time, and having no whitening and surface stickiness. | 04-24-2014 |
20140132892 | CURABLE COMPOSITION - A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided. | 05-15-2014 |
20140249288 | METHOD FOR PRODUCING ORGANOPOLYSILOXANE - A method of preparing an organopolysiloxane is provided. An organopolysiloxane, which has both a linear or cross-linking structure derived from a trifunctional siloxane unit and a linear structure derived from a difunctional siloxane unit among the molecular structures and also has a sufficiently long linear structure, can be effectively prepared. Also, the organopolysiloxane can be synthesized so that it can have a sufficiently high molecular weight, and a target product showing excellent physical properties can be effectively prepared by minimizing a ratio of a functional group such as an alkoxy group or a hydroxyl group in the synthesized organopolysiloxane. | 09-04-2014 |
20140319575 | ORGANOPOLYSILOXANE - Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness | 10-30-2014 |