Patent application number | Description | Published |
20080204971 | Integrated multilayer chip capacitor module and integrated circuit apparatus having the same - An integrated multilayer chip capacitor module including: plurality of multilayer chip capacitors arranged close to one another and co-planar with one another; and a capacitor support accommodating the multilayer chip capacitors, wherein each of the multilayer chip capacitors includes a rectangular parallelepiped capacitor body and a plurality of first and second external electrodes formed on at least two sides of the capacitor body, and the external electrodes on adjacent sides of adjacent ones of the multilayer chip capacitor in the capacitor support are electrically connected to each other by a conductive adhesive material. | 08-28-2008 |
20090034154 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically connected to the internal electrodes through the leads. The average number of leads in each internal electrode is smaller than half (½) of the total number of external electrodes. The leads of the internal electrodes having opposite polarities and adjacent in the lamination direction are disposed to be adjacent to each other as seen from the lamination direction. All the internal electrodes having the same polarity are electrically connected to each other in the capacitor. | 02-05-2009 |
20090073634 | Circuit board for mounting multilayer chip capacitor and circuit board apparatus including the multilayer chip capacitor - A circuit board including: a substrate having a mounting area for mounting a vertical multilayer chip capacitor having first and second external electrodes of a first polarity and a third external electrode of a second polarity; first to third pads arranged on the mounting area, the first and second pads having the first polarity and disposed separately from each other on the mounting area, the third pad having the second polarity and disposed between the first and second pads to be connected to the third external electrode; at least one first via formed in the substrate and connected to the first pad; at least one second via formed in the substrate and connected to the second pad; and a plurality of third vias formed in the substrate and connected to the third pad. The first via is disposed adjacent to the third pad relative to a central line of the first pad, the second via is disposed adjacent to the third pad relative to a central line of the second pad, one or more of the third vias are disposed adjacent to the first via relative to a central line of the third pad, and the rest of the third vias are disposed adjacent to the second via relative to the central line of the third pad. | 03-19-2009 |
20090086403 | MULTILAYER CAPACITOR - There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode. | 04-02-2009 |
20100149769 | CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE - A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode. | 06-17-2010 |
20130119827 | DIELECTRIC COMPOSITION AND CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a dielectric composition, including; a base powder including Ba | 05-16-2013 |
20130120900 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. | 05-16-2013 |
20130194715 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D | 08-01-2013 |
20130229748 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T | 09-05-2013 |
20130314843 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is | 11-28-2013 |
20140133064 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-15-2014 |
20140138136 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 05-22-2014 |
20140174800 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided an embedded multilayer ceramic electronic component, including a ceramic body including dielectric layers, first internal electrodes and second internal electrodes disposed to face each other with the dielectric layers interposed therebetween, a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, and a conductive paste layer formed on the first external electrode and the second external electrode, wherein the first and second external electrodes include a first conductive metal and glass, and the conductive paste layers include a second conductive metal. | 06-26-2014 |
20140185186 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV. | 07-03-2014 |
Patent application number | Description | Published |
20130120899 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm. | 05-16-2013 |
20130201603 | ARRAY-TYPE MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided an array-type multilayered ceramic electronic component including: a ceramic body; a plurality of external electrodes formed on one surface of the ceramic body and the other surface thereof opposing the one surface; and a plurality of internal electrode multilayered parts formed in the ceramic body and connected to the external electrodes, respectively, wherein when a gap between the internal electrode multilayered parts is G and internal electrode density is D, 40%≦D≦57%, 10 μm≦G≦200 μm, and G≧(0.0577×D | 08-08-2013 |
20130250476 | ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t | 09-26-2013 |
20130286535 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 10-31-2013 |
20140022692 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied. | 01-23-2014 |
20140116766 | MULTILAYERED CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers. | 05-01-2014 |
20140151101 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN - There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer. | 06-05-2014 |
20140151102 | MULTILAYERED CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayered ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer, a lower cover layer formed below the active layer and being thicker than the upper cover layer; and first and second external electrodes formed to cover both end surfaces of the ceramic body, wherein a ratio of an area Y of a region overlapped between the first and second internal electrodes to a total area X of the active layer and the upper cover layer on a cross section of the ceramic body in length-thickness (L-T) directions is in a range of 0.5 to 0.9. | 06-05-2014 |
20140153156 | MULTILAYERED CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - A multilayered ceramic capacitor includes a ceramic body in which a plurality of dielectric layers having an average thickness of 0.2 to 2.0 μm are stacked; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and thicker than the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the dielectric layer is configured of dielectric grains, and when an average thickness of the dielectric layer is defined as td, an average thickness of the first and second internal electrodes is defined as te, and an average grain size of the dielectric grains is defined as Da, Da≦td/3 and 0.2 μm06-05-2014 | |
20140166351 | MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD FOR MOUNTING THE SAME - A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined. | 06-19-2014 |
20140168849 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, disposed vertically on upper and lower surfaces of the ceramic body and forming capacitance; an upper cover layer formed upwardly of the active layer; a lower cover layer formed downwardly of the active layer and having a thickness greater than that of the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the active layer includes a first block in which a first region I and a second region II formed, and a second block in which a third region III, and a fourth region IV formed. | 06-19-2014 |
20140168852 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed having a thickness greater than that of the upper cover layer; and first and second external electrodes, wherein when an average of a length of an upper portion, a length of a middle portion, and a length of a lower portion of the ceramic body is I, and an average of values obtained by adding a length of an upper portion, a length of a middle portion, and a length of a lower portion of the first external electrode and a length of an upper portion, a length of a middle portion, and a length of a lower portion of the second external electrode is BW, BW/I satisfies a range of 0.105≦BW/I≦1.049. | 06-19-2014 |
20140174806 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of electrodes formed to be alternately exposed to both end surfaces of the ceramic body; an upper cover layer; a lower cover layer having a thickness greater than that of the upper cover layer; and external electrodes, wherein when a distance from an end portion of the lowermost internal electrode of the active layer to an end portion of the external electrode covering a portion of a lower surface of the ceramic body is E, the shortest distance from the end portion of the external electrode to the lowermost internal electrode of the active layer is T, and a margin of the ceramic body in the length direction is F, 1.2≦E/T and 30 μm≦F are satisfied. | 06-26-2014 |
20140182907 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied. | 07-03-2014 |
20140185184 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR - A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042≦(B+C)/A≦1.537 is satisfied. | 07-03-2014 |
20140185189 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein when it is defined that a thickness of a band of the first and second external electrodes is T1 and a thickness of the ceramic body is T2, a ratio (T1/T2) of the thickness of the band of the first or second external electrode to the thickness of the ceramic body is equal to or less than 0.18. | 07-03-2014 |
20140209362 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD HAVING MULTILAYER CERAMIC CAPACITOR MOUNTED THEREON - A multilayer ceramic capacitor includes: a ceramic body having laminated dielectric layers having an average thickness of 0.2-2.0 μm; an active layer including first and second internal electrodes alternately exposed through end surfaces of the ceramic body having the dielectric layer interposed therebetween and contributing to capacitance formation; upper and lower cover layers respectively formed above and below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes covering the end surfaces of the ceramic body, wherein a bottommost internal electrode adjacent to the lower cover layer has an oxide layer formed on at least one of top and bottom surfaces thereof, and when lengths and thicknesses of the bottommost internal electrode and the oxide layer are denoted by ‘L | 07-31-2014 |
20140262463 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other. | 09-18-2014 |
20140290998 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD FOR MULTILAYER CERAMIC CAPACITOR - There is provided multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers laminated therein, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, with the dielectric layers interposed therebetween, and having capacitance formed therein, an upper cover layer formed on an upper portion of the active layer, a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer, first and second dummy electrode terminals provided in the lower cover layer to be alternately exposed through both end surfaces of the lower cover layer, and first and second external electrodes covering the both end surfaces of the ceramic body. | 10-02-2014 |
20140368967 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - There is provided a multilayer ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers; first and second external electrodes, wherein 0.75×W≦T≦1.25×W, 0.081≦b/(a×(W−b))≦2.267, and 0.267≦c/L≦0.940 are satisfied, where T denotes a thickness of the ceramic body, a denotes a thickness of the lower cover layer, b denotes a width of the first or second internal electrode, L denotes a length of the ceramic body, c denotes a distance between outer edges of the first and second external electrodes, and d denotes a distance between inner edges of the first and second external electrodes. | 12-18-2014 |
20150014037 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers stacked in a width direction, a plurality of first and second internal electrodes, first and second lead parts having at least one space part and extended from the first internal electrode to be exposed through the bottom surface of the ceramic body and be spaced apart from each other in a length direction, a third lead part positioned between the first and second lead parts and extended from the second internal electrode, first and second external electrodes formed on the bottom surface of the ceramic body and electrically connected to the first and second lead parts, respectively, and a third external electrode formed between the first and second external electrodes and electrically connected to the third lead part. | 01-15-2015 |
20150016020 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 01-15-2015 |
20150021077 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body. | 01-22-2015 |
20150021078 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 μm≦G01-22-2015 | |
20150021079 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied. | 01-22-2015 |
20150021080 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body. | 01-22-2015 |
20150022942 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body with a dielectric layer interposed therebetween; upper and lower cover layers formed on upper and lower surfaces of the active layer; and first and second external electrodes formed on the end surfaces of the ceramic body, wherein when a thickness of the ceramic body is defined as T, a thickness of the active layer is defined as S, a thickness of the lower cover layer is defined as C, and a distance from an end of a lowermost internal electrode in a length direction to an end of a band portion of an external electrode close to the end of the lowermost internal electrode is defined A, 0.25≦S/T≦0.75 and 3≦A/C≦10 are satisfied. | 01-22-2015 |
20150022943 | MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN - There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6. | 01-22-2015 |
20150041197 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers; first internal electrodes and second internal electrodes having first and second leads; first dummy electrodes and second dummy electrodes; and first and second external electrodes, wherein when a length from ends of the first and second external electrodes formed on first and second lateral surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is G, a length of the first and second external electrodes formed on the first and second lateral surfaces of the ceramic body up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is M, 30 μm≦G02-12-2015 | |
20150041198 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via. | 02-12-2015 |
20150047887 | MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR - There is provided a mounting circuit board of a multilayer ceramic capacitor including a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes extended from both end surfaces of the ceramic body to a portion of a lower surface thereof; and a printed circuit board having first and second electrode pads so that the first and second external electrodes are mounted thereon, wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic body. | 02-19-2015 |
20150049412 | MULTILAYER CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND PRESSING PLATE FOR MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a ceramic body including a plurality of dielectric layers stacked therein; first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having each of the dielectric layers disposed therebetween; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein a difference in rigidity between upper and lower portions of the ceramic body is 4% or less. | 02-19-2015 |
20150053471 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 μm≦G02-26-2015 | |
20150053472 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0. | 02-26-2015 |
20150060121 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G103-05-2015 | |
20150075853 | MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied. | 03-19-2015 |
Patent application number | Description | Published |
20140185188 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser. | 07-03-2014 |
20140367152 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes facing each other with one dielectric layer therebetween and alternately exposed to the first or second side surface; upper and lower cover layers disposed on and below the active layer; and a first external electrode disposed on the first side surface and a second external electrode disposed on the second side surface. Thickness T and width W of the ceramic body satisfy 0.75W≦T≦1.25W, gap G between the first and second external electrodes satisfies 30 μm≦G≦0.9W, and an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater. | 12-18-2014 |
20140368968 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween and alternately exposed to the first or second side surface; and a first external electrode disposed on the first side surface and electrically connected to the first internal electrodes and a second external electrode disposed on the second side surface and electrically connected to the second internal electrodes. When length of the ceramic body is L and length of the first and second external electrodes in the length direction of the ceramic body is L1, 0.2≦L1/L≦0.96 is satisfied. | 12-18-2014 |
20150014040 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided. | 01-15-2015 |
20150016019 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD - A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer. | 01-15-2015 |
20150022937 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second external electrodes disposed on first and second side surfaces of the ceramic body, a first dummy electrode disposed on a first end surface of the ceramic body; and third and fourth external electrodes disposed on first and second end surfaces of the magnetic body. The composite element may include a first metal frame disposed on a first end surface of the composite element, a second metal frame disposed on a second end surface of the composite element, and third metal frames disposed on one or more of first and second side surfaces of the composite element. | 01-22-2015 |
20150035621 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component includes an input terminal portion receiving power converted by a power management unit, a power stabilizing unit stabilizing the power and including a composite body including a capacitor and a coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed so as to face each other with a respective dielectric layer interposed therebetween, and capacitor electrodes electrically connected to the internal electrodes, and the coil being wound so as to encompass the capacitor and being buried in a magnetic material portion, and an output terminal portion supplying the stabilized power. | 02-05-2015 |
20150041199 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L≧0.6 may be satisfied, and a width BW of each of the first-polarity and second-polarity external electrodes formed on the first and second main surfaces of the ceramic body may satisfy 150 μm≦BW≦350 μm. | 02-12-2015 |
20150041202 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on a second side surface of the composite body; and a ground terminal disposed on a first side surface of the composite body and connected to the internal electrodes of the capacitor. | 02-12-2015 |
20150042414 | COMPOSITE ELECTRONIC COMPONENT - A composite electronic component may include: an input terminal part receiving power converted by a power managing part; a power stabilizing part stabilizing the power and including a composite body including a capacitor and a toroidal coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed to face each other with the respective dielectric layers interposed therebetween, and capacitor electrodes electrically coupled to the internal electrodes, and the toroidal coil being wound around the capacitor, and the capacitor and the toroidal coil being embedded in a magnetic material of the composite body; and an output terminal part supplying the stabilized power. | 02-12-2015 |
20150043185 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes. | 02-12-2015 |
20150047890 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body so as to be spaced apart from each other. When a height of a portion of the external electrode formed on one side surface of the ceramic body in a width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10≦d/T. | 02-19-2015 |
20150090485 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - A multilayer ceramic capacitor may include: three external electrodes disposed on amounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≦LG*log [1/AT]≦0.00150. | 04-02-2015 |
20150098202 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - A multilayer ceramic electronic component embedded in a board may include: a ceramic body including dielectric layers; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body; and first and second external electrodes formed on both end portions of the ceramic body, respectively. The first external electrode may include a first base electrode and a first terminal electrode, the second external electrode may include a second base electrode and a second terminal electrode, 400 nm≦Ra≦600 nm may be satisfied when a surface roughness in a region of 50 μm×50 μm in the first and second terminal electrodes is defined as Ra, and 130 nm≦Ra′≦400 nm may be satisfied when a surface roughness in a region of 10 μm×10 μm in the first and second terminal electrodes is defined as Ra′. | 04-09-2015 |
20150114702 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF - A multilayer ceramic capacitor may include a ceramic body and an active layer. The ceramic body includes three external electrodes disposed on amounting surface thereof so as to be spaced apart from each other, and first, second, and third lead parts extending from first and second internal electrodes of the ceramic body so as to be exposed to the mounting surface of the ceramic body. One side of at least one of the first, second, and third lead parts connected to the mounting surface of the ceramic body may be at least partially formed as an inclined extension portion that is inclined with respect to an outer periphery of the first or second internal electrode. | 04-30-2015 |
20150114705 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 μm or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 μm or more. | 04-30-2015 |
20150124370 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes may include: first and second internal conductive layers; first and second insulating layers; and first and second external conductive layers. | 05-07-2015 |
20150223340 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component to be embedded in a board, a thickness of a ceramic body in an overall chip may be increased by not allowing an increase in a thickness of an external electrode to occur, while forming a band surface of the external electrode having a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, thereby improving chip strength and preventing the occurrence of damage such as breakage, or the like, a manufacturing method thereof, and a printed circuit board having the multilayer ceramic electronic component. | 08-06-2015 |
20150243438 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is b | 08-27-2015 |
20150279569 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 10-01-2015 |
20150302992 | MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME - There are provided a multilayer ceramic capacitor and a circuit board having the same. The multilayer ceramic capacitor may include: first and second internal electrodes connected to first and second external electrodes, respectively, and disposed to face each other; and third and fourth internal electrodes connected to the first and second external electrodes, respectively, and disposed to face each other, a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from that of the first and second internal electrodes with the first and second external electrodes, and the first and second external electrodes including first and second conductive layers disposed in inner portions thereof and first and second conductive resin layers disposed in outer portions thereof, respectively. | 10-22-2015 |
20150318114 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is b | 11-05-2015 |
20150325370 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor may include: a ceramic body; a plurality of first internal electrodes disposed in the ceramic body; a plurality of second internal electrodes stacked alternately with the first internal electrodes in the ceramic body; first and second external electrodes connected to the first internal electrodes, respectively; a third external electrode extended from one side surface of the ceramic body to a portion of a surface opposing a mounting surface of the ceramic body and connected to the second internal electrodes; a fourth external electrode extended from the other side surface of the ceramic body to a portion of the surface opposing the mounting surface of the ceramic body; and an intermitting part disposed on the surface opposing the mounting surface of the ceramic body and connecting the third and fourth external electrodes to each other. | 11-12-2015 |
20150325372 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body so as to be spaced apart from each other. When a height of at least one portion of the external electrode formed on one side surface of the ceramic body in a width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10≦d/T. | 11-12-2015 |
20150364260 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - A multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between a first or second lead part of the first internal electrode and a third lead part of the second internal electrode is defined as LG, the following Equation may be satisfied: 0.00044≦LG*log[1/AT]≦0.00150. | 12-17-2015 |
20150373852 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided. | 12-24-2015 |