Patent application number | Description | Published |
20120025209 | OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTICS DIE WITH MICRO STRUCTURE ALIGNMENT - A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels. | 02-02-2012 |
20130004167 | OPTICAL FRAME ATTACHED WITH ALIGNMENT FEATURES MICROFABRICTATED IN DIE - A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature. | 01-03-2013 |
20130273672 | SEMICONDUCTOR SUBSTRATE FOR AN OPTICAL TRANSMITTER APPARATUS AND METHOD - Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed. | 10-17-2013 |
20140175477 | EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES - Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame. | 06-26-2014 |
20140270655 | OPTICAL CONNECTOR ASSEMBLY - Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed. | 09-18-2014 |
20150028432 | ASSEMBLY AND PACKAGING OF MEMS DEVICE - A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate. | 01-29-2015 |
20160062066 | OPTICAL CONNECTOR ASSEMBLY - Methods, apparatuses, and systems related to optical connector assemblies are described. In some embodiments, the connector assemblies may include an optical assembly, having an optical interconnect and an optical module, to be coupled with a host electrical connector. The connector assembly may further include springs, disposed on the optical interconnect or the host electrical connector, to facilitate a coupling of the optical interconnect with the optical module. Other embodiments are described and claimed. | 03-03-2016 |
20160087172 | EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES - Methods and systems may provide an alignment scheme for components that may reduce positional deviation between the components. The method may include placing a first component on top of a substrate, wherein the first component includes a receiving alignment feature, and coupling a second component to the first component, wherein the coupling includes inserting a protruding alignment feature of the second component into the receiving alignment feature of the first component. In one example, the first component includes an edge-emitting semiconductor die and the second component include one or more of an optical lens and an alignment frame. | 03-24-2016 |
20160093791 | APPARATUS AND METHOD FOR SEALING A MEMS DEVICE - A method and apparatus for sealing a device with a MEMS device with an active region is disclosed. A substrate with an opening is disposed relative to the MEMS device so as to align the active region of the MEMS device with the opening. A sealant is disposed between the MEMS device and the substrate so as to form a seal around the active region. The device includes one or more flow limiting features to inhibit the flow of sealant to the active region. | 03-31-2016 |