Patent application number | Description | Published |
20120065615 | NEEDLE-FREE INJECTORS AND DESIGN PARAMETERS THEREOF THAT OPTIMIZE INJECTION PERFORMANCE - A needle free injector system and a method for delivering a formulation using this system are disclosed. The method comprises actuating a needle free injector to pressurize a liquid formulation and force the formulation through an orifice in a skin puncture phase followed by injection of the formulation during a delivery phase. The skin puncture phase is defined by a pressure profile vs. time curve after actuation which has a main pressure peak with a maximum pressure. The delivery phase occurs at a lower pressure than the maximum pressure of the main peak pressure. The device may have one or more orifices and pressurizing the formulation during the puncture phase and delivery phase to extrude the formulation through each orifice is structured so as to improve characteristics of needle free delivery. | 03-15-2012 |
20140142500 | PISTON CLOSURES FOR DRUG DELIVERY CAPSULES - A drug capsule and a method for making a drug capsule for a drug delivery device, such as an auto injector or needle-free injector, with improved stability and container closure integrity. The injector comprises a drug capsule sealed by a piston fabricated from PTFE modified by the inclusion of a co-polymer of PPVE, preferably in an amount less than 1% by weight, resulting in better performance while the device is stored and subjected to temperature cycling. | 05-22-2014 |
20140308352 | COMPOSITIONS AND METHODS INVOLVING POLYMER, SOLVENT, AND HIGH VISCOSITY LIQUID CARRIER MATERIAL - Compositions may include a pharmaceutical active agent, a high viscosity liquid carrier material (HVLCM), a lactic acid-based polymer, and an organic solvent. Related compositions and methods are also disclosed. | 10-16-2014 |
Patent application number | Description | Published |
20130110610 | SYSTEM AND METHOD FOR ENABLING USE OF LOYALTY PROGRAM POINTS AS A STORED VALUE PAYMENT DEVICE | 05-02-2013 |
20130110611 | SYSTEM AND METHOD FOR CONDUCTING SEMI-OPAQUE SALES TRANSACTIONS | 05-02-2013 |
20130110612 | SYSTEM AND METHOD FOR ENABLING USE OF POINTS FROM A LOYALTY PROGRAM AS PAYMENT | 05-02-2013 |
20130159087 | METHOD AND SYSTEM FOR ENABLING USE OF LOYALTY PROGRAM POINTS AS FORM OF PAYMENT - A method and system for enabling use of loyalty program points as form of payment. In one preferred embodiment, the method may include the steps of receiving from an e-commerce agent, a request for a loyalty points price along with a transaction information package comprising a cash price and user identification information; sending the user identification information to a loyalty program and requesting user account authentication from the loyalty program; querying the loyalty program for a user information package comprising a cash-to-points conversion factor; calculating a loyalty points price based on the cash price and the cash-to-points conversion factor; sending to the e-commerce agent, the loyalty points price; receiving from the e-commerce agent, confirmation of transaction completion and a number of loyalty points utilized; and sending instructions to the loyalty program to debit from the updated loyalty program points balance the number of loyalty points utilized in the transaction. | 06-20-2013 |
20130304526 | METHODS FOR CROSS-SELLING FLIGHTS AND TRAVEL-RELATED GOODS - One variation of a method for cross-selling flight reservations and travel-related goods includes: receiving a detail of a flight itinerary from a flight reservation interface of an airline; receiving a discounted fare for the flight itinerary; querying a travel-related good inventory system for a standalone price and a discounted price for a travel-related good based on the detail of the flight itinerary; calculating a package rate for the flight itinerary and the travel-related good according to the discounted fare of the flight itinerary and the discounted price of the travel-related good; calculating a savings amount for the package rate over a total standalone rate for the flight itinerary and the standalone price for the travel-related good; and returning a travel package comprising the travel-related good and a flight reservation specified in the flight itinerary, the package rate for the travel package, and the savings amount to the flight reservation interface. | 11-14-2013 |
Patent application number | Description | Published |
20130315238 | Method and Apparatus for Extending Multipoint Control Protocols to Mixed Media Access Systems - A method and apparatus for extending multipoint control protocols to mixed media access systems. A medium-to-medium adaptor can be provided in an adaptor node that can interface with an upstream optical line terminal in a PON domain and a downstream device in a non-PON domain. The medium-to-medium adaptor enables an implementation of end-to-end services across multiple quality of service (QoS) domains by passing all traffic with controlled delay and without contention. | 11-28-2013 |
20130315593 | System and Method for Applying an Extended Multipoint Protocol to Wireless Access Systems - A system and method for applying an extended multipoint control protocols to wireless access systems. A medium-to-medium adaptor can be provided in an adaptor node that can interface with an upstream optical line terminal in a PON domain and a downstream device in a non-PON wireless domain. The medium-to-medium adaptor enables an implementation of end-to-end services across multiple quality of service (QoS) domains by passing all traffic with controlled delay and without contention. | 11-28-2013 |
20140079102 | Physical Layer (PHY) Link Signaling for Cable Networks - Embodiments include systems and methods for enabling a physical layer (PHY) link signaling channel between a network termination modem and a cable modem in a cable network. The PHY link signaling channel is embedded within the same multi-carrier channel as the data and enables PHY link up between the network termination modem and cable modem without involvement of higher layers (e.g., MAC). The PHY link signaling channel can be implemented in the downstream (from the network termination modem to the cable modem(s)) or in the upstream from a cable modem to the network termination modem. Embodiments are applicable to any known cable network, and particularly to cable networks implementing the DOCSiS and EPoC standards. | 03-20-2014 |
20140079399 | Time to Time-Frequency Mapping and Demapping for Ethernet Passive Optical Network over Coax (EPoC) - Embodiments include, but are not limited to, systems and methods for enabling Orthogonal Frequency Division Multiple Access (OFDMA) in the upstream in an Ethernet Passive Optical Network over Coax (EPoC) network. Embodiments include systems and methods for translating Ethernet Passive Optical Network (EPON) upstream time grants to OFDMA resources represented by individual subcarriers of an upstream OFDMA frame. In an embodiment, the translation of EPON upstream time grants to OFDMA resources ensures that Coaxial Network Units (CNUs) sharing an OFDMA frame do not use overlapping subcarriers within the frame. Embodiments further include systems and methods for timing upstream transmissions by the CNUs in order for the transmissions to be received within the same upstream OFDMA frame at a Fiber Coax Unit (FCU). Embodiments further include systems and methods for re-generating a data burst from OFDMA resources for transmission from the FCU to an Optical Line Terminal (OLT). | 03-20-2014 |
20140133856 | Multiple Downstream Modulation Profiles for Ethernet Passive Optical Network over Coax (EPoC) - Embodiments provide systems and methods for supporting the use of multiple downstream modulation profiles in an Ethernet Passive Optical Network over Coax (EPoC) network. This includes, at the Fiber Coax Unit (FCU), processing downstream traffic to determine its intended destination Coaxial Network Unit (CNU) and using a customized downstream modulation profile for the traffic based on its intended destination CNU. In addition, with the downstream modulation profile used for the downstream traffic varying in time, a downstream map indicating upcoming downstream modulation profiles in the downstream traffic is sent along with the downstream traffic from the FCU. A CNU can read the downstream map to determine upcoming downstream modulation profiles in the downstream traffic and can decide to decode a given transmitted modulation profile in the downstream traffic when the transmitted modulation profiles matches one or more downstream modulation profiles associated with the CNU. | 05-15-2014 |
20140341577 | Ethernet Passive Optical Network Over Coaxial (EPoC) System Rate Mechanism - An Ethernet passive optical network over coaxial (EPOC) system rate mechanism. A network device is provided that includes a physical layer device (PHY) that is configured for coupling to a coaxial cable, a medium independent interface that facilitates data transmission at 10 Gbit/s or greater, and a reconciliation sublayer that is coupled to the PHY via the medium independent interface. The reconciliation sublayer has a codeword detector that is configured to detect a reserved codeword that is received from the PHY over the medium independent interface. The codeword detector can be configured to forward a rate control signal to a media access control (MAC) based on the detection of the reserved codeword. | 11-20-2014 |
Patent application number | Description | Published |
20080212965 | METHOD AND APPARATUS FOR DYNAMICALLY ALLOCATING UPSTREAM BANDWIDTH IN PASSIVE OPTICAL NETWORKS - One embodiment of the present invention provides a system that facilitates dynamic allocation of upstream bandwidth in a passive optical network which includes a central node and at least one remote node. Each remote node is coupled to at least one logical entity, which corresponds to a device or a user, that transmits upstream data to the central node and receives downstream data from the central node. The central node is coupled to an external network outside of the passive optical network through a shared out-going uplink. | 09-04-2008 |
20110058813 | Ethernet Passive Optical Network Over Coaxial (EPOC) - Embodiments of the present invention exploit the existing capabilities of the Ethernet Passive Optical Network (EPON) MAC layer, designed for fiber optics communications, to provide a low cost MAC layer with upper layer connectivity over a hybrid fiber coaxial (HFC) network. In particular, embodiments allow for the EPON MAC to be used end-to-end (i.e., from an optical line terminal (OLT) to a coaxial network unit (CNU)) in a HFC network, thereby fully leveraging the packet processing capabilities, QoS functions, and management features of the EPON MAC. Furthermore, embodiments enable unified provisioning and management for both fiber and coaxial network units in a HFC network. | 03-10-2011 |
20110123194 | METHOD AND APPARATUS FOR DYNAMICALLY ALLOCATING UPSTREAM BANDWIDTH IN PASSIVE OPTICAL NETWORKS - One embodiment of the present invention provides a system that facilitates dynamic allocation of upstream bandwidth in a passive optical network which includes a central node and at least one remote node. Each remote node is coupled to at least one logical entity, which corresponds to a device or a user, that transmits upstream data to the central node and receives downstream data from the central node. The central node is coupled to an external network outside of the passive optical network through a shared out-going uplink. | 05-26-2011 |
20110262132 | Daisy Chainable ONU - Embodiments of a scalable optical network unit (ONU) architecture for multi-dwelling units (MDUs) that has a low initial cost (or first port cost) and a low maintenance cost are provided herein. The ONU architecture is scalable in that a growing number of end users can share a single drop fiber that couples the ONU to a passive optical network. The ONU architecture utilizes a multiplexer module to allow the ONU to be daisy chained with one or more additional ONUs. | 10-27-2011 |
20120045209 | Cost-Effective Multi-Rate Upstream for 10GEPON Based on High Efficiency Coding - Systems and methods are disclosed to provide an upstream rate between 1 Gbps and 10 Gbps in a cost effective manner in a 10GEPON. In an embodiment, an optical network unit (ONU) transmitter includes a burst transceiver and a physical layer (PHY) including a high performance digital to analog converter (DAC), a pulse amplitude modulation (PAM) module configured to encode end user data using a modulation scheme having more than two levels, and a laser. The ONU transmitter transmits the encoded end user data to an optical line terminal (OLT) receiver, which demodulates the data using a PAM demodulator and sends it to a service provider. | 02-23-2012 |
20120076495 | Method and Apparatus for Supporting Differentiated Performance for Multiple Categories of Packets in a Passive Optical Network - Embodiments of an apparatus including a user network interface configured to receive from a network a packet to be transmitted upstream over a PON are provided herein. The packet is marked with a first category type or a second category type. The apparatus further includes an upstream first in, first out (FIFO) queue configured to store the packet if the packet is marked with the first category type or the second category type. | 03-29-2012 |
20120257891 | Traffic Switching In Hybrid Fiber Coaxial (HFC) Network - Embodiments enable an Ethernet over Coaxial (EoC) Coaxial Media Converter (CMC) that implements only a subset of the functions (e.g., MAC and PHY) of a cable modem termination system (CMTS). The CMC sits between an optical line terminal (OLT) and a plurality of cable modems (CMs) that it serves. From the network management side at the OLT, the CMC appears and can be managed like an optical network unit (ONU). From the subscriber side, the CMC provides the same connectivity functions to the CMs as a CMTS and serves to terminate coaxial connections from the CMs. | 10-11-2012 |
20120257892 | Method for Sub-Rating an Ethernet Passive Optical Network (EPON) Medium Access Control (MAC) Based Communication Link - Embodiments allow for EPON MAC traffic to be sub-rated according to available bandwidth and/or transmission capacity of the physical medium. EPON MAC traffic sub-rating is performed in the PHY layer. The PHY layer performing the sub-rating may be located anywhere in the communication path supporting the end-to-end EPON MAC link. Because the sub-rating is performed in the PHY layer, the EPON MAC layer at either end of the EPON MAC link is unaware of the sub-rating being performed, and thus continues to operate as it would normally according to the IEEE standard that it implements. | 10-11-2012 |
20120257893 | Unified Network Management of Hybrid Fiber Coaxial (HFC) Network - Embodiments enable a network operator to use any (and a single) network management system (NMS) that it desires to manage a network having mixed fiber to the home optical network units (ONUs) and coaxial connected cable modems. For example, embodiments enable a cable company operator to use a DOCSIS (Data Over Cable Service Interface Specification) NMS (which the cable company already uses to manage its DOCSIS network) to manage such mixed network, by a simple addition of a DOCSIS Mediation Layer (DML) module between the NMS and the optical line terminal (OLT). On the other hand, embodiments enable a telephone company operator to use a standard EPON (Ethernet Passive Optical Network) OLT NMS with minor OLT and OAM (Operations, Administration, and Maintenance) protocol modifications to manage the same mixed network. | 10-11-2012 |
20130051403 | Method and Apparatus for Dynamically Allocating Upstream Bandwidth in Passive Optical Networks - One embodiment of the present invention provides a system that facilitates dynamic allocation of upstream bandwidth in a passive optical network which includes a central node and at least one remote node. Each remote node is coupled to at least one logical entity, which corresponds to a device or a user, that transmits upstream data to the central node and receives downstream data from the central node. The central node is coupled to an external network outside of the passive optical network through a shared out-going uplink. | 02-28-2013 |
20130202286 | Ethernet Passive Optical Network Over Coaxial (EPOC) Protection Switching - Protection switching methods, systems, and architectures are provided for hybrid Ethernet Passive Optical Network (EPON)-Ethernet Passive Optical Network Over Coaxial (EPOC) networks. Protection switching embodiments enable protection of the EPON portion and/or the EPOC portion of the hybrid network. In embodiments, protection switching may be initiated by an Optical Line Terminal (OLT), a coaxial media converter (CMC), or an optical network unit (ONU)/coaxial network unit (CNU) in the hybrid network. | 08-08-2013 |
20130202293 | Systems and Methods for Ethernet Passive Optical Network Over Coaxial (EPOC) Power Saving Modes - Systems and methods for Ethernet Passive Optical Network Over Coaxial (EPOC) power saving modes are provided. The EPOC power savings modes allow an EPOC coaxial network unit (CNU) to enter a sleep mode based on user traffic characteristics. The sleep mode may include powering down one or more module of the EPOC CNU, including radio frequency (RF) transmit/receive circuitry and associated circuitry. In embodiments, the EPOC CNU may enter sleep mode based on instructions from an optical line terminal (OLT) or based on its own determination. Embodiments further include systems and methods that allow the EPOC CNU to maintain synchronization with a servicing coaxial media converter (CMC) when it enters a sleep mode. | 08-08-2013 |
20140072304 | Ethernet Passive Optical Network Over Coaxial (EPoC) Physical Layer Link and Auto-Negotiation - A PHY auto-negotiation and link up procedure for Ethernet Passive Optical Network Over Coax (EPOC) is provided. The procedure is compliant with the Ethernet Passive Optical Network (EPON) standard and can be used to bring an EPOC network to user traffic readiness. In addition, the procedure, or a variation thereof, can be used to enable periodic maintenance of the coaxial link of the EPOC network, thereby maintaining adequate communication conditions. | 03-13-2014 |
20140133855 | Overhead Reduction in Ethernet Passive Optical Network (EPON) - Embodiments reduce overhead in Ethernet Passive Optical Network (EPON) networks by reducing the amount of switching among Optical Network Units (ONUs) done by the Optical Line Terminal (OLT). In one embodiment, Logical Link Identifiers (LLIDs) hosted by the same ONU are linked at the OLT such that the OLT grants same ONU LLIDs consecutively when appropriate. This reduces the optics related delay associated with switching among ONUS. At the same time, the linking of LLIDs hosted by the same ONU allows for data from multiple LLIDs to be grouped together within a single Forward Error Correction (FEC) block at the ONU, when appropriate, reducing FEC overhead. | 05-15-2014 |
Patent application number | Description | Published |
20100098906 | PREPREGS WITH IMPROVED PROCESSING - Systems and methods for the fabrication of prepregs possessing enhanced ability for the removal of gases from within prepregs and prepreg layups prior to and/or during at least a portion of consolidation and cure process to form composite structures are disclosed. In certain embodiments, perforations of selected configurations may be introduced into the prepregs prior to, during, and after layup. The perforations provide routes for gases trapped within and between the perforated prepregs and prepreg lay-ups to escape during consolidation and cure process, reducing the residual porosity within the resulting composite. For example, composites having residual porosities less than 10 vol. %, on the basis of the volume of the composite, may be achieved in this manner. | 04-22-2010 |
20100098927 | PROCESSING OF POLYMER MATRIX COMPOSITES - Systems and methods for the reduction of volatile component content from shaped prepregs and prepreg layups and the layups and composites formed therefrom are disclosed. One or more shaped prepregs or prepreg layups are placed within an enclosure and a flow of a non-condensing gas is introduced adjacent at least one surface of the shaped prepregs or prepreg layups, accelerating the rate and/or the completeness of removal of volatile components from the shaped prepregs or prepreg layups. The shaped prepregs or prepreg layups may be further subjected to heat, vacuum, and external pressure to facilitate removal of the volatile components. Shaped prepregs and prepreg layups with volatiles reduced in this manner may be further consolidated with heat, external pressure and/or vacuum. Beneficially, reduced matrix bleed and reduced fiber movement may be achieved during processing, reducing manufacturing time and improving part quality. | 04-22-2010 |
20100222461 | EPOXY COMPOSITIONS WITH IMPROVED MECHANICAL PERFORMANCE - Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone. Furthermore, this elevated degree of curing of the polymer composition may be achieved with substantially no reduction in tack life and/or out life of the prepreg, adhesive or film or cured state mechanical properties of composites, adhesives or other products fabricated therefrom, such as open hole compression strength and compressive strength after impact. The glass transition temperature of the cured polymer compositions is similarly unaffected. | 09-02-2010 |
20100304119 | PARTICLE-TOUGHENED FIBER-REINFORCED POLYMER COMPOSITES - Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature. It is further discovered that the relative placement of the toughening particles influences composite mechanical properties, such as compression after impact (CAI) strength. | 12-02-2010 |
20100305274 | PARTICLE-TOUGHENED POLYMER COMPOSITIONS - Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature. | 12-02-2010 |
Patent application number | Description | Published |
20130218511 | WEIGHT-SENSING SURFACES WITH WIRELESS COMMUNICATION FOR INVENTORY TRACKING - Methods, systems, and devices are described for identifying and determining quantity data for consumable items from a plurality of weight sensing devices. A consumption metric for the consumable items is determined based on the identification and quantity data. Consumption-related information is provided based on the consumption metric. Consumption-related information may be used for a number of purposes, including for providing aggregate consumption information to suppliers, and health advice and recipes to users, for example. | 08-22-2013 |
20140156281 | VOICE-CONTROLLED CONFIGURATION OF AN AUTOMATION SYSTEM - Methods and apparatus are provided for configuring control of an automation system for a home or other space, using audio input to a controller. Activation of an appliance in the automation system initiates the providing of the capabilities of the appliance to the controller and a data collection process via an audible interface. Audible user input is converted to an audio signal, and then processed by the controller to determine control input for the appliance. The audible input may also be used for user authentication. Subsequently, the controller controls the appliance based on the control input. | 06-05-2014 |
20140198618 | DETERMINING ROOM DIMENSIONS AND A RELATIVE LAYOUT USING AUDIO SIGNALS AND MOTION DETECTION - Methods and apparatus are provided for determining room dimensions and layout. A method includes receiving an audio signal from at least one other detection apparatus. The method includes determining a spatial orientation of a detection apparatus along a substantially planar surface. The method includes calculating at least one dimension along the planar surface based in part on the received audio signal and the determined spatial orientation of the detection apparatus. Methods and apparatus are provided for determining room layout. The method includes detecting a mobile object in a first room. The method includes receiving an indication of detection of the mobile object in a second room subsequent to the detection in the first room. The method includes providing an indication that the first and second rooms are adjacent rooms based on the detection of the mobile object in the second room subsequent to the detection in the first room. | 07-17-2014 |
Patent application number | Description | Published |
20080227369 | Apparatus and Method for Confined Area Planarization - A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an electrolyte solution. A cathode is disposed within the chamber in exposure to the electrolyte solution. A cation exchange membrane is disposed over a lower opening of the chamber. A top surface of the cation exchange membrane is in direct exposure to the electrolyte solution to be maintained within the chamber. A fluid supply channel is defined to expel fluid at a location adjacent to a lower surface of the cation exchange membrane. A vacuum channel is defined to provide suction at a location adjacent to the lower surface of the cation exchange membrane, such that the fluid to be expelled from the fluid supply channel is made to flow over the lower surface of the cation exchange membrane. | 09-18-2008 |
20100319726 | SUBSTRATE PREPARATION USING MEGASONIC COUPLING FLUID MENISCUS - A method for cleaning a substrate is provided. The method includes receiving the substrate using a carrier that forms a circular opening, the substrate being positioned in the circular opening of the carrier. The holding of the substrate enables exposure of both a first side and a second side of the substrate at a same time. Then, moving the substrate along a direction, and while moving the substrate: (i) applying a chemistry onto the first side of the substrate, where the first side of the substrate having material to be removed; (ii) forming a fluid meniscus against the second side of the substrate at a location that is opposite a location onto which the chemistry is applied; and (iii) applying megasonic energy to the fluid meniscus while the fluid meniscus is applied against the second side. The megasonic energy increases mass transport of the chemistry to enhance removal of the material to be removed from the first side. | 12-23-2010 |
20110011335 | Electroless Plating Method and Apparatus - An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided. | 01-20-2011 |
20110306203 | INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRUCTURE - An interconnect structure is provided, including a layer of dielectric material having at least one opening and a first barrier layer on sidewalls defining the opening. A ruthenium-containing second barrier layer overlays the first barrier layer, the second barrier layer having a ruthenium zone, a ruthenium oxide zone, and a ruthenium-rich zone. The ruthenium zone is interposed between the first barrier layer and the ruthenium oxide zone. The ruthenium oxide zone is interposed between the ruthenium zone and the ruthenium-rich zone. | 12-15-2011 |
20130061887 | METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME - A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer. | 03-14-2013 |
Patent application number | Description | Published |
20080271992 | Apparatus and method for plating semiconductor wafers - An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided. | 11-06-2008 |
20090321250 | Apparatus for Plating Semiconductor Wafers - An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided. | 12-31-2009 |
20100108652 | SYSTEM METHOD AND APPARATUS FOR DRY-IN, DRY-OUT, LOW DEFECT LASER DICING USING PROXIMITY TECHNOLOGY - A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described. The method of dicing a substrate including placing a substrate in a substrate dicing system, forming a meniscus between a proximity head and a first surface of the substrate, dicing the substrate at a desired dicing location and simultaneously capturing any particles and contaminants generated by dicing the substrate within the meniscus, the meniscus including the desired dicing location and moving the meniscus in a desired dicing direction. | 05-06-2010 |
Patent application number | Description | Published |
20080235042 | NETWORK REPUTATION AND PAYMENT SERVICE - This document discusses, among other things, example embodiments of a transaction system that may receive, over a network, a first set of transaction data associated with a transaction for an item. In an example embodiment, a reputation application may adjust a rating associated with the transaction when the first set of transaction data indicates a purchase or a return of the item. | 09-25-2008 |
20080235123 | MICRO PAYMENTS - In one example embodiment, a system and method is shown that includes receiving financial data generated by a widget residing on a web page, the financial data including at least one of donation, or purchase data. The system and method may further include transmitting a display update to update the widget, the updating based upon the financial data. Some example embodiments may include, selecting a widget using an input device to generate data including at least one of donation or purchase data. Moreover, the system and method may include transmitting the at least one of donation or purchase data. Further, the system and method may include storing the at least one of donation or purchase data to a cookie. | 09-25-2008 |
20100235280 | METHOD AND SYSTEM TO VERIFY A TRANSACTION - A method and system to verify a transaction are described. The system may include an escrow module to receive funds from a client, a communication module to receive a request from the provider to redeem a provider set of tokens, and a redemption module to selectively redeem the provider set of tokens. The funds received by the escrow module are associated with a transaction between the client and a provider. The redemption module may be configured to examine the provider set of tokens and selectively redeem the provider set of tokens based on the results of the examination. | 09-16-2010 |
20110178897 | SYSTEMS AND METHODS FOR PROCESSING INCOMPLETE TRANSACTIONS OVER A NETWORK - In accordance with one or more embodiments of the present disclosure, a system and method for facilitating electronic commerce over a network includes communicating with a user via a user device and a merchant via a merchant device over the network, storing an incomplete purchase transaction between the user and the merchant, generating a portable checkout link to the incomplete purchase transaction, providing the portable checkout link to the user over the network, allowing the user to select the incomplete purchase transaction for processing, and processing the incomplete purchase transaction upon user selection. The system and method may include notifying the user of the incomplete purchase transaction over the network. | 07-21-2011 |
20120136753 | NETWORK REPUTATION AND PAYMENT SERVICE - This document discusses, among other things, example embodiments of a transaction system that may receive, over a network, a first set of transaction data associated with a transaction for an item. In an example embodiment, a reputation application may adjust a rating associated with the transaction when the first set of transaction data indicates a purchase or a return of the item. | 05-31-2012 |
Patent application number | Description | Published |
20090138393 | SYSTEM AND METHOD FOR DELIVERING FINANCIAL SERVICES - A delivery system and method allow a financial institution to provide financial services to a plurality of remote devices, such as personal computers, personal data assistants, and screen phones. In addition to providing services to these remote devices, the system and method provide services to automatic teller machines (ATMs), external service providers, and internally within the financial institution to staff terminals and to the individual branches of the financial institution. The delivery of financial services is not limited to any particular network but rather may be provided through dial-in access, Internet access, on-line service provider access, or other types of delivery networks. The system is comprised of a set of re-usable global components which are modular and are organized into services sets. By separating the components of the system into independent components, the system and method can be developed and tested on a component level rather than the entire system level, thereby substantially reducing the development and maintenance cycle time. The system and method operate in sessions and, for instance, employ a dialog component for gathering information from a customer, a rule broker component for providing answers to the various legal and regulatory rules in a particular country, a language man component for selecting appropriate language, a transaction executor component for performing transactions, and a presentation manager component for formatting outputs to the customer. The system and method provide state-of-the art interfaces with interface components and support legacy applications with legacy app bridge components. A system management aspect of invention makes use of an agent set that provides a communication mechanism such that managed components of the system can be queried for their status, as well as the concept of instrumentation in which software monitors the hardware devices that are part of the system. | 05-28-2009 |
Patent application number | Description | Published |
20130144128 | OCULAR INSERT APPARATUS AND METHODS - A comfortable insert comprises a retention structure sized for placement under the eyelids and along at least a portion of conjunctival sac of the upper and lower lids of the eye. The retention structure resists deflection when placed in the conjunctival sac of the eye and to guide the insert along the sac when the eye moves. The retention structure can be configured in many ways to provide the resistance to deflection and may comprise a hoop strength so as to urge the retention structure outward and inhibit movement of the retention structure toward the cornea. The insert may move rotationally with deflection along the conjunctival sac, and may comprise a retention structure having a cross sectional dimension sized to fit within folds of the conjunctiva. The insert may comprise a release mechanism and therapeutic agent to release therapeutic amounts of the therapeutic agent for an extended time. | 06-06-2013 |
20130226295 | Intraocular, Accommodating Lens And Methods Of Use - An intraocular lens is adapted for insertion into a capsular bag having a zonular contact region. The intraocular lens comprises a shape changing optical element and an accommodating element comprising at least one force transmitting element and a plurality of spaced apart contacting elements each adapted to contact a portion of the zonular contact region and transmit compressive displacement radially inward at an oblique angle to the optical element and configured to cooperate with at least one of the ciliary muscle of the mammalian eye, the zonules of the mammalian eye and the vitreous pressure in the eye to effect an accommodating shape and a disaccommodating shape change to the optical element. | 08-29-2013 |
20140135918 | INTRAOCULAR, ACCOMMODATING LENS AND METHODS OF USE - An intraocular lens is adapted for insertion into a capsular bag having a zonular contact region. The intraocular lens comprises a shape changing optical element and an accommodating element comprising at least one force transmitting element and a plurality of spaced apart contacting elements each adapted to contact a portion of the zonular contact region and transmit compressive displacement radially inward at an oblique angle to the optical element and configured to cooperate with at least one of the ciliary muscle of the mammalian eye, the zonules of the mammalian eye and the vitreous pressure in the eye to effect an accommodating shape and a disaccommodating shape change to the optical element. | 05-15-2014 |
20140378886 | Glaucoma Treatment Device - Methods and devices are adapted for implanting into the eye. An incision is formed in the cornea of the eye and a shunt is inserted through the incision into the anterior chamber of the eye. The shunt includes a fluid passageway. The shunt is passed along a pathway from the anterior chamber through the scleral spur of the eye into the suprachoroidal space and positioned in a first position such that a first portion of the fluid passageway communicates with the anterior chamber and a second portion of the fluid passageway communicates with the suprachoroidal space to provide a fluid passageway between the suprachoroidal space and the anterior chamber. | 12-25-2014 |
Patent application number | Description | Published |
20100028890 | COMPOSITIONS, METHODS, AND KITS FOR ANALYZING DNA METHYLATION - Compositions, methods, and kits for reducing strand amplification bias using bisulfite treated gDNA are provided. Methods for detecting and for quantitating the amplified bisulfite treated gDNA and inferring the presence, absence, and/or degree of methylation of target cytosine(s) in the gDNA are also provided. Such methods typically employ tailed first primer pairs, which can, but need not comprise nucleotide analogs, and optionally second primer pairs. | 02-04-2010 |
20100087641 | Method and Materials for Quaternary Amine Catalyzed Bisulfite Conversion of Cytosine to Uracil - The invention provides methods and materials for the conversion of cytosine to uracil. A nucleic acid, such a gDNA, is reacted with bisulfate, such as magnesium bisulfite, in the presence of a quaternary amine catalyst. Examples of suitable quaternary amine catalysts include but are not limited to quaternary ammonium compounds, quaternary alkyl ammonium salts, quaternary alkyl ammonium halides, quaternary methyl ammonium bromide, quaternary ammonium chloride, tetraethyl ammonium hydroxide, tetraethylammonium chloride, tetrabutyl ammonium chloride, tetrabutyl ammonium bromide. The invention also contemplates kits of premeasured ingredients for carrying out the methods of the invention either on an individual sample or on a plurality of samples. | 04-08-2010 |
20110195405 | COMPOSITIONS, METHODS, AND KITS FOR ANALYZING DNA METHYLATION - Compositions, methods, and kits for reducing strand amplification bias using bisulfite treated gDNA are provided. Methods for detecting and for quantitating the amplified bisulfite treated gDNA and inferring the presence, absence, and/or degree of methylation of target cytosine(s) in the gDNA are also provided. Such methods typically employ tailed first primer pairs, which can, but need not comprise nucleotide analogs, and optionally second primer pairs. | 08-11-2011 |
Patent application number | Description | Published |
20110227603 | Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures - A device and method using one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. The nano-structure is in connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the nano-structure is breached or altered. One or more electrically conductive nano-structures interconnect and reroute one or more electrical connections between one or more ICs to create an “invisible” set of electrical connections on the chip or stack to obfuscate an attempt to reverse engineer the device. microscope. | 09-22-2011 |
20120068333 | Wire Bond Through-Via Structure and Method - A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer. | 03-22-2012 |
20120068336 | Method for Fabricating a Neo-Layer Using Stud Bumped Bare Die - A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer. | 03-22-2012 |
20120068341 | Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method - A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity. | 03-22-2012 |
20120069528 | Method for Control of Solder Collapse in Stacked Microelectronic Structure - A process and product made from the process is disclosed to minimize solder collapse during solder reflow. | 03-22-2012 |
20120094092 | Method for Defining an Electronically Conductive Metal Structure on a Three-Dimensional Element and a Device Made From the Method - A method for defining an electrically conductive metalized structure, which may comprise an electrode or trace, on the surface of a three-dimensional element. The three-dimensional element may comprise a glass microsphere or shell resonator. A laser direct write grayscale photolithographic process is used in conjunction with electrically conductive metal deposition processes to define one or more electrically conductive metal structures on the surfaces of the three dimensional element. | 04-19-2012 |
20120126001 | Self-Calibrating Targeting Sight - A targeting sight having viewing optics, a focal plane array and an alignment frame having an aperture that defines a target area that is mounted proximal the muzzle of a weapon. Electronic processing means is provided to define a crosshair in the viewing optics. The alignment frame is illuminated with a beam and the reflected portion of the beam is received by the focal plane array and is processed to position the crosshair with respect to the aperture. | 05-24-2012 |
20120185636 | Tamper-Resistant Memory Device With Variable Data Transmission Rate - A high capacity, secure and tamper-resistant computer data memory device. The device uses a plurality of dedicated memory controller elements in communication with an anti-tamper module that generates a tamper response when a predetermined tamper event occurs. The tamper response may be provided as the erasure or zeroization of the contents of a memory in the devices such as erasing one or more encryption keys. The elements of the device are preferably provided in a stacked configuration with rerouted I/O pads to obfuscate the I/O and function of the devices in the stack. In one embodiment, a data transfer governance means is provided. In a further embodiment, a current negotiation means is disclosed to permit the device to request a predetermined current from a host device. In a yet further embodiment, a portable safe house computing device is provided. | 07-19-2012 |
Patent application number | Description | Published |
20120205801 | Anti-Tamper Wrapper Interconnect Method and a Device - A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads. | 08-16-2012 |
20120211886 | Method for Fabricating a Small Footprint Chip-Scale Package and a Device Made from the Method - A method for fabricating an integrated circuit chip-scale package and a device made from the method. One or more IC chips are mounted on a carrier and a stud bump defined on an IC pad. The stud-bumped IC is encapsulated to define a potted assembly layer which is thinned to expose the stud bump. Conductive first traces are defined and coupled to the stud bump to reroute the IC pads. A dielectric layer is provided and vias defined there through to expose the first traces. Electrically conductive second traces are disposed on the dielectric layer surface that are coupled to the first traces to reroute the IC pads to define a chip scale package. | 08-23-2012 |
20130020572 | Cap Chip and Reroute Layer for Stacked Microelectronic Module - A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bump columns are defined on an exposed conducive pad on a conductive reroute layer. One or more active or passive electronic elements, or both may be electrically coupled to one or more exposed conductive pads. The layer is encapsulated in an encapsulant and the stud bump columns exposed by removing a portion of the encapsulant. A second set of electrically conductive reroute layers is defined on the layer and electrically coupled to the stud bumps. The sacrificial substrate is removed to provide a cap chip or reroute layer. | 01-24-2013 |
20130141137 | Stacked Physically Uncloneable Function Sense and Respond Module - A physically uncloneable function (PUF) sense and response module fabricated from a stack of integrated circuit chip layers. At least one of the PUF chips in the stack has a unique identifier resulting from random effects of fabrication processes. The PUF chip generates the fingerprint at power-on resulting that in turn is used to generate a private key. The private key generates a public key used to communicate with the outside world. The encrypted data from the outside world is decrypted with the private key. The public key is stored for comparison with pubic keys generated at subsequent power-up operations. If the key changes, tampering is indicated and a predetermined tamper response event is generated such as the erasing of the contents of a memory. | 06-06-2013 |
Patent application number | Description | Published |
20110031749 | Energy harvesting buoy - An energy-harvesting buoy is provided comprising an air-pressure generator, such as a piezo-electric generator, or any other generator that can harvest energy from an air pressure. The energy harvesting buoy consists of a first float and a second float. An air pressure is created when relative vertical motion occurs between the first float and the second float which drives an air pressurization means such as a piston driven air pump using a linkage member pivotably mounted between the respective floats. The generator uses the air pressure from the air pressurization means to drive the generator to generate electrical power. | 02-10-2011 |
20110031982 | Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures - A device and method are disclosed comprising one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package (such as a TSOP, BGA or other prepackaged IC) a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. | 02-10-2011 |
20110147568 | High density array module and connector - In a preferred embodiment of the invention, a high density interconnect structure is provided comprised of a dielectric structure and one or more compressible conductive member for the electrical connection of a plurality of inputs and outputs of a three-dimensional module to external circuitry using a compression frame and a flex connector. The compression frame has a surface equal to or less than the surface area of the module surface upon which it is mounted and permits a plurality of modules to be “butted” together to provide, for instance, a buttable focal plane array module comprising a mosaic of buttable focal plane arrays. | 06-23-2011 |