Patent application number | Description | Published |
20080299288 | Durable, heat-resistant multi-layer coatings and coated articles - A method of providing a durable protective coating structure which comprises at least three layers, and which is stable at temperatures in excess of 400° C., where the method includes vapor depositing a first layer deposited on a substrate, wherein the first layer is a metal oxide adhesion layer selected from the group consisting of an oxide of a Group IIIA metal element, a Group IVB metal element, a Group VB metal element, and combinations thereof; vapor depositing a second layer upon said first layer, wherein said second layer includes a silicon-containing layer selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride; and vapor depositing a third layer upon said second layer, wherein said third layer is a functional organic-comprising layer. Numerous articles useful in electronics, MEMS, nanoimprinting lithography, and biotechnology applications can be fabricated using the method. | 12-04-2008 |
20080312356 | Vapor-deposited biocompatible coatings which adhere to various plastics and metal - A method of providing a biocompatible PEG-comprising coating on a substrate, without the use of an underlying adhesion layer. The coating is vapor deposited onto the substrate from a precursor which includes a PEG-derived moiety and an amino silane-containing functional group which reacts with the substrate. The substrate may be metal or plastic, where plastic excludes polyimide and polycarbonate. The substrate may be plasma treated prior to deposition of the PEG-comprising coating. | 12-18-2008 |
20090269705 | Lighography method - Embodiments of the invention relate to lithography method useful for patterning at sub-micron resolution. This method comprised of deposition and patterning self-assembled monolayer resists using rolling applicator and rolling mask exposure apparatus. Typically the application of these self-assembled monolayers involves contacting substrate materials with a rotatable applicator in the shape of cylinder or cone wetted with precursor materials. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact with self-assembled monolayer. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating mask surface comprises metal nano holes or nanoparticles. | 10-29-2009 |
20090297989 | Method and device for patterning a disk - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of rotationally symmetric disk materials, like magnetic and optical disks, where a rotatable mask is used to image a radiation-sensitive material. Typically the rotatable mask comprises a cone. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the disk is in contact or close proximity with the disk. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating cone surface comprises metal nano holes or nanoparticles. | 12-03-2009 |
20090305513 | Material deposition over template - Embodiments of the invention relate to a method of functional materials deposition using a polymer template fabricated on a substrate. Such template forms an exposed and masked areas of the substrate material, and can be fabricated using polymer resists or Self-assembled monolayers. Deposition is performed using an applicator, which is fabricated in the shape of cylinder or cone made of soft elastomeric materials or laminated with soft elastomeric film. Functional materials, for example, metals, semiconductors, sol-gels, colloids of particles are deposited on the surface of applicator using liquid immersion, soaking, contact with wetted surfaces, vapor deposition or other techniques. Then wetted applicator is contacted the surface of the polymer template and rolled over it's surface. During this dynamic contact functional material is transferred selectively to the areas of the template. Patterning of functional material is achieved by lift-off of polymeric template after deposition. According to another embodiment, where self-assembled monolayers are used as template, selective deposition of functional materials is achieved either due to low surface energy of SAM or reactivity of terminal groups. | 12-10-2009 |
20100035163 | Fabrication of nanostructured devices - Embodiments of the invention relate to methods useful in the fabrication of nanostructured devices for optics, energy generation, displays, consumer electronics, life sciences and medicine, construction and decoration. Instead of nanostructuring using colloids of particles, special vacuum deposition methods, laser interference systems (holography), and other low-throughput limited surface area techniques, we suggest to use nanotemplate created by novel nanolithography method, “Rolling mask” lithography. This method allows fast and inexpensive fabrication of nanostructures on large areas of substrate materials in conveyor-type continuous process. Such nanotemplate is then used for selective deposition of functional materials. One of embodiments explains deposition of functional materials in the exposed and developed areas of the substrate. Another embodiment uses selective deposition of the functional material on top of such template. Alternatively, nanotemplate is deposited and patterned on functional material, and then used as an etch mask to transfer nanostructure into the functional material using dry or wet etching process. | 02-11-2010 |
20100068489 | Wear-resistant, carbon-doped metal oxide coatings for MEMS and nanoimprint lithography - The carbon-doped metal oxide films described provide a low coefficient of friction, typically ranging from about 0.05 to about 0.4. Applied over a silicon substrate, for example, the carbon-doped metal oxide films provide anti-stiction properties, where the measured work of adhesion for a coated MEMS cantilever beam is less than 10 μJ/m | 03-18-2010 |
20100123885 | Large area nanopatterning method and apparatus - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a rotatable mask is used to image a radiation-sensitive material. Typically the rotatable mask comprises a cylinder. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact or close proximity with the substrate. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating cylinder surface comprises metal nano holes or nanoparticles. | 05-20-2010 |
20100137984 | CONTROLLED VAPOR DEPOSITION OF BIOCOMPATIBLE COATINGS FOR MEDICAL DEVICES - An intraocular lens with a hydrophilic polymer coating composition and method of preparing same are provided. Specifically, a composition suitable for reducing tackiness in intraocular lenses is provided wherein an acrylic intraocular lens is treated by vapor deposition with an alkoxy silyl terminated polyethylene glycol polymer composition. | 06-03-2010 |
20100173494 | Method and apparatus for anisotropic etching - We suggest a method of anisotropic etching of the substrates, where ultra-thin and conformable layers of materials are used to passivate sidewalls of the etched features. According to an exemplary embodiment such sidewall passivation layer is a Self-assembled monolayer (SAM) material deposited in-situ etching process from a vapor phase. According to another exemplary embodiment such sidewall passivation layer is an inorganic-based material deposited using Atomic Layer Deposition (ALD) method. SAM or ALD layers deposition can be carried out in a pulsing regime alternating with an sputtering and/or etching processes using process gasses with or without plasma. Alternatively, SAM deposition process is carried out continuously, while etch or sputtering process turns on in a pulsing regime. Alternatively, SAM deposition process and etch or sputtering processes are carried out continuously. Both types of suggested passivation materials give advantage over state-of-the-art methods in ability to carefully control thickness and uniformity of the layers, thus enable anisotropic etching process for high aspect ratio nanosize features. | 07-08-2010 |
20100303687 | FLUIDIC DEVICES WITH DIAPHRAGM VALVES - This invention provides fluidic devices, in particular microfluidic devices, with diaphragm valves having low failure rates. Low failure rates are achieved by inhibiting sticking of the diaphragm to functional surfaces such as valve seats, valve chamber and fluidic channels and conduits. One way to implement this is to provide exposed surfaces facing the diaphragm, particularly valve seats, with a low energy material, such as a noble metal, a perfluorinated polymer, a self-assembled monolayer, hard diamond, diamond-like carbon or a metal oxide. In other embodiments, the valves are provided with ridges and the diaphragm is adhered to the fluidic or actuation layer with an adhesive material. | 12-02-2010 |
20110126911 | Composite Plastic Articles - This invention provides composite plastic articles and methods of making them. The articles can be fluidic or microfluidic devices having fluidic conduits and, optionally, pneumatic conduits that regulate flow in the fluidic conduits. The articles comprise a first substrate coated with a layer of a material that comprises, or onto which have been introduced, reactive groups. For example, the substrate can be a plastic coated with an oxide or a siloxane onto which hydroxyl groups have been introduced. These articles are covalently bonded with other articles comprising reactive groups on their surfaces, for example, polysiloxanes treated to have silanol groups. Certain articles have specified locations on their surfaces that are not bonded to the other piece. For example, the coating can be removed from these locations before bonding. Such locations can be useful as functional elements of various devices, such as valve seats in valves of microfluidic devices. | 06-02-2011 |
20110210480 | Nanostructures with anti-counterefeiting features and methods of fabricating the same - Embodiments of the invention relate to methods of anti-counterfeiting for nanostructures and nanostructured devices. Specifically we describe a method of embedding a coded micro- or nanopatterns in nanostructures fabricated using Near-field rolling mask lithography, where areas of such features can be embedded into a transparent cylindrical or conic frame, or fabricated on the surface of flexible film laminated on the surface of the frame. Alternatively, specific coded nanofeatures distribution can be created using modulation of intensity or wavelength of the light source along the width or length of such cylinder or cone, or modulation of flexible film thickness or contact pressure between the rotatable mask and a substrate. | 09-01-2011 |
20120045884 | PROTECTIVE THIN FILMS FOR USE DURING FABRICATION OF SEMICONDUCTORS, MEMS, AND MICROSTRUCTURES - A method of protecting a substrate during fabrication of semiconductor, MEMS devices. The method includes application of a protective thin film which typically has a thickness ranging from 3 angstroms to about 1,000 angstroms, wherein precursor materials used to deposit the protective thin film are organic-based precursors which include at least one fluorine-comprising functional group at one end of a carbon back bone and at least one functional bonding group at the opposite end of a carbon backbone, and wherein the carbon backbone ranges in length from 4 carbons through about 12 carbons. In many applications at least a portion of the protective thin film is removed during fabrication of the devices. | 02-23-2012 |
20120162629 | LARGE AREA NANOPATTERNING METHOD AND APPARATUS - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a rotatable mask is used to image a radiation-sensitive material. Typically the rotatable mask comprises a cylinder. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact or close proximity with the substrate. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating cylinder surface comprises metal nano holes or nanoparticles. | 06-28-2012 |
20120224159 | METHOD AND APPARATUS FOR PATTERNING A DISK - An apparatus to carry out patterning of a disk includes a rotatable mask having a cone shape and a nanopattern on an exterior surface of said mask and a radiation source configured to supply radiation of a wavelength of 436 nm or less from said nanopattern, while said nanopattern is in contact with a radiation-sensitive layer of material. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 09-06-2012 |
20120274004 | NANOPATTERNING METHOD AND APPARATUS - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a movable nanostructured film is used to image a radiation-sensitive material. The nanopatterning technique makes use of Near-Field photolithography, where the nanostructured film used to modulate light intensity reaching radiation-sensitive layer. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a movable film comprises metal nano holes or nanoparticles. | 11-01-2012 |
20120282554 | LARGE AREA NANOPATTERNING METHOD AND APPARATUS - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a rotatable mask is used to image a radiation-sensitive material. Typically the rotatable mask comprises a cylinder. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact or close proximity with the substrate. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating cylinder surface comprises metal nano holes or nanoparticles. | 11-08-2012 |
20130208251 | LARGE AREA NANOPATTERNING METHOD AND APPARATUS - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a rotatable mask is used to image a radiation-sensitive material. Typically the rotatable mask comprises a cylinder. The nanopatterning technique makes use of Near-Field photolithography, where the mask used to pattern the substrate is in contact or close proximity with the substrate. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a rotating cylinder surface comprises metal nano holes or nanoparticles. | 08-15-2013 |
20130224636 | MASK FOR NEAR-FIELD LITHOGRAPHY AND FABRICATION THE SAME - Methods for fabricating nanopatterned cylindrical photomasks are disclosed. A master pattern having nanometer scale features may be formed on a master substrate. A layer of an elastomer material may be formed on a surface of a transparent cylinder. The master pattern may be transferred from the master to the layer of elastomer material on the surface of the transparent cylinder. Alternatively, a nanopatterned cylindrical photomask may be fabricated by forming a pattern having nanometer scale features on an elastomer substrate and laminating the patterned elastomer substrate to a surface of a cylinder. In another method, a layer of elastomer material may be formed on a surface of a transparent cylinder and a pattern having nanometer scale features may be formed on the elastomer material by a direct patterning process. | 08-29-2013 |
20130320509 | MOISTURE BARRIER COATINGS - A moisture barrier coating for protecting a substrate from moisture, comprises an inorganic layer disposed over the substrate, the inorganic layer comprising an oxide or nitride of an element selected from the group consisting of silicon, aluminum, titanium, zirconium, hafnium and combinations thereof; and an organic silicon-containing layer disposed over the inorganic layer. | 12-05-2013 |
20130320510 | DURABLE, HEAT-RESISTANT MULTI-LAYER COATINGS AND COATED ARTICLES - An article having a surface treated to provide a protective coating structure in accordance with the following method: vapor depositing a first layer on a substrate, wherein said first layer is a metal oxide adhesion layer selected from the group consisting of an oxide of a Group IIIA metal element, a Group IVB metal element, a Group VB metal element, and combinations thereof; vapor depositing a second layer upon said first layer, wherein said second layer includes a silicon-containing layer selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride; and vapor depositing a third layer upon said second layer, wherein said third layer is a functional organic-comprising layer, wherein said functional organic-comprising layer is a SAM. | 12-05-2013 |
20140037920 | PATTERNING OF HARD-TO-DRY-ETCH SUBSTRATES - A hard-to-dry-etch material may be patterned by forming a layer of dry-etchable material on a surface of the hard-to-dry etch substrate, and dry etching the dry-etchable material. The hard-to-dry etch substrate produces substantial quantities of non-volatile etch byproducts that redeposit when subject to the dry etching. The dry-etchable material has similar material properties to the hard-to-dry-etch substrate material is formed. The dry-etchable material is one that does not produce substantial quantities of non-volatile etch byproducts that redeposit when the dry-etchable material is subject to the dry etching. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 02-06-2014 |
20140202986 | HIGH ASPECT RATIO PATTERNING USING NEAR-FIELD OPTICAL LITHOGRAPHY WITH TOP SURFACE IMAGING - Rolling mask lithography may be performed to expose selected portions of a radiation sensitive layer to a radiation pattern that leaves selected portions of a top surface of the radiation sensitive layer resistant to development by a developer and non-selected portions susceptible to development by the developer. A structure of the selected portions is then rendered resistant to an etch process. The radiation sensitive layer is then flood exposed to a second radiation that leaves the radiation sensitive layer resistant to development by the developer. The radiation sensitive layer is then selectively etched using the etch-resistant selected portions as an etch mask. | 07-24-2014 |
20140212533 | CYLINDRICAL MASTER MOLD AND METHOD OF FABRICATION - Aspects of the present disclosure describe cylindrical molds that may be used to produce cylindrical masks for use in lithography. A structured porous layer may be deposited on an interior surface of a cylinder. A radiation-sensitive material may be deposited over the porous layer in order to fill pores formed in the layer. The radiation-sensitive material in the pores may be cured by exposing the cylinder with a light source. The uncured resist and porous layer may be removed, leaving behind posts on the cylinder's interior surface. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 07-31-2014 |