Patent application number | Description | Published |
20100208432 | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use - A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM | 08-19-2010 |
20100328895 | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use - A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications. | 12-30-2010 |
20130248163 | High Temperature Stable Thermally Conductive Materials - Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period. | 09-26-2013 |
20130344632 | Thermal Management Within an LED Assembly - This invention is directed to a method for applying a thermal management composition between an LED mounted circuit board and a heat sink, comprising the steps of; (a) applying a deposit of a thermal management composition onto either a second surface of the LED mounted circuit board or onto a surface of a heat sink, through a deposition tool the deposition tool having at least one aperture ( | 12-26-2013 |