| Patent application number | Description | Published |
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| 20090288770 | SURFACE-PROMOTED CURE OF ONE-PART CATIONICALLY CURABLE COMPOSITIONS - The present invention relates to cationically curable compositions for curing on a surface comprising a cationically curable component, and an initiator component capable of initiating cure of the cationically curable component. The initiator comprises at least one metal salt, which is chosen so that it is reduced at the surface, and where the standard reduction potential of the initiator component is greater than the standard reduction potential of the surface, and where when the composition is placed in contact with the surface, the metal salt of the initiator component of the composition is reduced at the surface, thereby initiating cure of the cationically curable component of the composition. No catalytic component is required in the composition for efficient cure. | 11-26-2009 |
| 20100160476 | FLAME-RETARDANT ADDITIVES - The present invention relates to a curable preparation, containing an epoxy resin system, an initiator, and at least one flame-retardant agent, selected from a compound of the formula KA, wherein K=mono, di, oligo, and/or polphosphonium cation, and A=low-coordinating anion, and to the sue of the compounds of the general formula KA as a flame-retardant agent for resins systems. | 06-24-2010 |
| 20100285309 | PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS AND COATINGS - The present invention relates to aqueous-based primer composition, comprising at least one thermosetting, self-emulsifying epoxy resin composition; at least one thermosetting, non-self-emulsifying resin composition; water; and at least one curative. | 11-11-2010 |
| 20110257285 | EPOXIDE-BASED STRUCTURAL FOAM HAVING IMPROVED TENACITY - Disclosed is a thermally expandable and curable material containing: | 10-20-2011 |
| 20110297318 | METAL-TO-POLYMER BONDING USING AN ADHESIVE BASED ON EPOXIDES - A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E | 12-08-2011 |
| 20110301255 | EPOXIDE-BASED STRUCTURAL FOAM COMPRISING THERMOPLASTIC POLYURETHANES - Disclosed is a thermally expandable and curable material containing: a) at least one epoxide prepolymer; b) at least one heat-activated curing agent for the prepolymer; c) at least one foaming agent; and d) at least one thermoplastic, non-reactive polyurethane selected from among polyurethanes containing a polyester chain. Also disclosed are the use of such a material for stiffening or reinforcing components as well as an extruded or injection-molded article made of such a material. | 12-08-2011 |
| 20140239481 | ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS - Provided herein are electronic devices assembled with thermally insulating layers. | 08-28-2014 |
| Patent application number | Description | Published |
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| 20120121878 | ADHESIVE FILM OR ADHESIVE TAPE BASED ON EPOXIDES - A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites. | 05-17-2012 |
| 20120128987 | EPOXY RESIN-BASED COMPOSITION MODIFIED FOR IMPACT RESISTANCE - A resin component for a one- or two-component adhesive, a matrix resin, or a structural foam, comprising: C1) at least one epoxy resin, having an average of more than one epoxy group per molecule, that does not correspond to the definition of component C2); C2) at least one oligomeric or polymeric urethane-group-free polyether compound. A one- or two-component epoxy adhesive, structural foam, or matrix material for composites, comprising the aforesaid resin components. | 05-24-2012 |
| 20120156412 | Use of Low-Temperature Foamable Epoxide Resins in Hollow Chamber Structures - A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO | 06-21-2012 |
| 20120161565 | METHOD FOR ATTACHING A MAGNET ON OR IN A ROTOR OR STATOR - The invention relates to a method for adhesively bonding a magnet onto the surface or into a slot of a rotor or stator of an electric motor or a generator, wherein i) the surface or surfaces to be glued of the magnet, rotor or stator are pre-coated with an adhesive that is not liquid at 22° C. and that does not cure without an activation step, iii) the magnet is brought into contact with the rotor or stator at the adhesive location, and iv) the adhesive is activated by heating or by high-energy radiation so that it cures, characterized in that the adhesive comprises a) at least one reactive epoxide prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers. The adhesive preferably comprises a blowing agent. The invention further relates to a corresponding pre-coated magnet. | 06-28-2012 |
| 20120207925 | PREMIX AND METHOD FOR PRODUCING A THERMALLY EXPANDABLE AND CURABLE EPOXY-BASED COMPOUND - A two-component premix for preparing a heat-expandable and heat-curable epoxy-based material, comprises an isocyanate, a diol or polyol, an epoxy prepolymer, a heat-activatable hardener for epoxy prepolymers, and a heat-activatable blowing agent. | 08-16-2012 |
| 20140037966 | IMPACT-MODIFIED ADHESIVES - The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated. | 02-06-2014 |
| 20140039118 | HYBRID MATRIX FOR FIBER COMPOSITE MATERIALS - A fiber composite material obtainable by (a) mixing the components of a multi-component agent immediately before use, wherein component A of the multi-component agent contains at least one compound having two or more isocyanate groups, component B of the multi-component agent contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, and at least one of the components of the multi-component agent contains at least one epoxide prepolymer, (b) introducing the resulting application preparation into a mold in which fibers and optionally further additives are present, the resulting mixture containing at least one latent hardener for epoxide prepolymers, (c) pre-curing the resulting mixture at a temperature from 5° C. to 90° C., and (d) then finally curing the pre-cured fiber composite material at temperatures from 100° C. to 240° C., wherein the fiber composite material being removed from the mold after step (c) or step (d). | 02-06-2014 |
| 20140209951 | OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF - Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices. | 07-31-2014 |
| 20140264165 | OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF - Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices. | 09-18-2014 |
