Bang, CA
Anne Bang, San Diego, CA US
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20090263896 | METHODS FOR PURIFYING ENDODERM AND PANCREATIC ENDODERM CELLS DERIVED FROM HUMAN EMBRYONIC STEM CELLS - The present disclosure relates to compositions and methods comprising cell surface markers for hES-derived cells, in particular, endoderm lineage cells including pancreatic endoderm-type cells, derived from hES cells. | 10-22-2009 |
20100112691 | Stem Cell Aggregate Suspension Compositions and Methods of Differentiation Thereof - The present invention relates to methods for production of undifferentiated or differentiated embryonic stem cell aggregate suspension cultures from undifferentiated or differentiated embryonic stem cell single cell suspensions and methods of differentiation thereof. | 05-06-2010 |
20120034692 | ENDOCRINE PRECURSOR CELLS, PANCREATIC HORMONE-EXPRESSING CELLS AND METHODS OF PRODUCTION - Disclosed herein are cell cultures and enriched cell populations of endocrine precursor cells, immature pancreatic hormone-expressing cells and mature pancreatic hormone-expressing cells. Also disclosed herein are methods of producing such cell cultures and cell populations. | 02-09-2012 |
20120045830 | STEM CELL AGGREGATE SUSPENSION COMPOSITIONS AND METHODS OF DIFFERENTIATION THEREOF - The present invention relates to methods for production of undifferentiated or differentiated embryonic stem cell aggregate suspension cultures from undifferentiated or differentiated embryonic stem cell single cell suspensions and methods of differentiation thereof. | 02-23-2012 |
20130122520 | METHODS FOR PURIFYING ENDODERM AND PANCREATIC ENDODERM CELLS DERIVED FROM HUMAN EMBRYONIC STEM CELLS - The present disclosure relates to compositions and methods comprising cell surface markers for hES-derived cells, in particular, endoderm lineage cells including pancreatic endoderm-type cells, derived from hES cells. | 05-16-2013 |
20140154801 | ENDOCRINE PRECURSOR CELLS, PANCREATIV HORMONE-EXPRESSING CELLS AND METHOS OF PRODUCTION - Disclosed herein are cell cultures and enriched cell populations of endocrine precursor cells, immature pancreatic hormone-expressing cells and mature pancreatic hormone-expressing cells. Also disclosed herein are methods of producing such cell cultures and cell populations. | 06-05-2014 |
Anne Bang, La Jolla, CA US
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20150018240 | THERANOSTICS PLATFORM AND METHODS OF USE - Theranostics platforms for identifying drugs and nutraceuticals for treatment of rare disease are described. The platforms comprise (a) a cell-phenotype image-enhancing instrument; (b) a drug/nutraceutical library; and (c) a computer-implemented system for analyzing a response of an optically-visible rare-disease cell phenotype to a drug or nutraceutical from the drug/nutraceutical library. | 01-15-2015 |
Christopher A. Bang, Northridge, CA US
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20140197904 | Method for Fabricating Miniature Structures or Devices such as RF and Microwave Components - Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations). | 07-17-2014 |
20140231264 | Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-21-2014 |
Christopher A. Bang, Studio City, CA US
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20100288186 | FORMATION OF SILICON SHEETS BY IMPINGING FLUID - Techniques are generally disclosed for forming crystalline bodies. An example system, device or method for forming crystalline bodies may include a crucible for containing molten crystalline material and a support for accommodating a seed on an end thereof, the support being movable along a translation axis in a pull direction to draw the seed crystal from the molten crystalline, thereby initiating growth of a crystalline body along a growth path. Further examples may include one or more nozzles configured to be coupled to a fluid source, the nozzles being positioned relative to the growth path for shaping the crystal body as the molten crystalline is pulled in the pull direction along the growth path. | 11-18-2010 |
David Bang, San Diego, CA US
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20090261433 | One-Mask MTJ Integration for STT MRAM - A method for integrating a magnetic tunnel junction (MTJ) device into an integrated circuit includes providing in a semiconductor back-end-of-line (BEOL) process flow a substrate having a first interlevel dielectric layer and at least a first metal interconnect. Over the first interlevel dielectric layer and the first metal interconnect, magnetic tunnel junction material layers are deposited. From the material layers a magnetic tunnel junction stack, coupled to the first metal interconnect, is defined using a single mask process. The magnetic tunnel junction stack is integrated into the integrated circuit. | 10-22-2009 |
20100057411 | PREDICTIVE MODELING OF CONTACT AND VIA MODULES FOR ADVANCED ON-CHIP INTERCONNECT TECHNOLOGY - A computer program product estimates performance of a back end of line (BEOL) structure of a semiconductor integrated circuit (IC). Code executes on a computer to dynamically predict an electrical resistance of the BEOL structure based on input data specific to multiple layers of the BEOL structure. The BEOL structure can be a contact or a via. The layers of the contact/via include an inner filling material and an outer liner. The code accounts for a width scatter effect of the inner filling material, as well as a slope profile of the contact/via. | 03-04-2010 |
20110284994 | Electrically Broken, but Mechanically Continuous Die Seal for Integrated Circuits - A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die. | 11-24-2011 |
David Bang, La Jolla, CA US
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20080304205 | INTERTWINED FINGER CAPACITORS - Capacitive structures in integrated circuits are disclosed. The capacitive structures are formed on a substrate. Each capacitive structure includes a first conductive finger and a second conductive finger. The first and second conductive fingers are arranged in parallel with each other and separated from each other by a dielectric material. The first finger is connected to a first interconnect and the second conductive finger is connected to a second interconnect. A first capacitor is formed from a first group of the plurality of capacitive structures having respective interconnects coupled together. A second capacitor is formed from a second group of the plurality of capacitive structures having respective interconnects coupled together. The capacitive structures of the first group are intertwined with the capacitive structures of the second group. | 12-11-2008 |
20090146681 | METHOD AND APPARATUS FOR ESTIMATING RESISTANCE AND CAPACITANCE OF METAL INTERCONNECTS - Techniques for estimating resistance and capacitance of metal interconnects are described. An apparatus may include an interconnect, a set of pads, a set of isolation circuits, and a test circuit. The set of pads may be coupled to the interconnect and used for simultaneously applying a current through the interconnect and measuring a voltage across the interconnect. The current and voltage may be used to estimate the resistance of the interconnect. The test circuit may charge and discharge the interconnect to estimate the capacitance of the interconnect. The isolation circuits may isolate the pads from the interconnect when the test circuit charges and discharges the interconnect. The apparatus may further include another interconnect, another set of pads, and another set of isolation circuits that may be coupled in a mirror manner. Resistance and/or capacitance mismatch between the two interconnects may be accurately estimated. | 06-11-2009 |
Henry Bang, Saratoga, CA US
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20080198490 | PRML channel with zero-mean noise reduction - A hard disk drive with a read channel that averages data before the data is provided to a viterbi detector of the channel. Averaging the data reduces the zero mean noise in the data. | 08-21-2008 |
Jae Young Bang, Los Angeles, CA US
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20120089960 | EXTENSIBLE COLLABORATIVE SOFTWARE MODELING - Multiple architects may concurrently create and modify a model of computer software, each on their own client at a different location. Each change that is made to a model is forwarded to a server for analysis. The server may determine whether the change creates a conflict. If no conflict is detected, the change may be approved, saved, and propagated by the server to all of the other clients that are working on the same model. If a conflict is detected, on the other hand, the change may not be approved by the server. The server may instead provide notice of the conflict. | 04-12-2012 |
Jihoon Bang, Fremont, CA US
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20140300778 | TECHNIQUE FOR REDUCING THE POWER CONSUMPTION OF A VIDEO ENCODER ENGINE - Raw video data is captured, processed, and then stored within a set of buffers. An encoder engine is configured to encode the video data for storage. A feedback controller dynamically adjusts the clock frequency of the encoder engine based on the number of buffers currently occupied by the video data. The feedback controller is tuned so that the clock frequency of the encoder engine will be increased when the number of buffers occupied by video data increases, and the clock frequency of the encoder engine will be decreased when the number of buffers occupied by the video data decreases. | 10-09-2014 |
Kyong-Mo Bang, Fremont, CA US
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20130175699 | STACKABLE MICROELECTRONIC PACKAGE STRUCTURES - A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package. | 07-11-2013 |
20140199811 | STACKABLE MICROELECTRONIC PACKAGE STRUCTURES - A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the substrate contacts and being spaced apart from one another on the first surface so as to provide an interconnect area of the first surface between the first and second microelectronic elements. A plurality of package terminals at the second surface are electrically interconnected with the substrate contacts for connecting the package with a component external thereto. A plurality of stack terminals are exposed at the first surface in the interconnect area for connecting the package with a component overlying the first surface of the substrate. The assembly further includes a second microelectronic package overlying the first microelectronic package and having terminals joined to the stack terminals of the first microelectronic package. | 07-17-2014 |
Min-Ki Bang, El Cerrito, CA US
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20080267689 | LIQUID APPLICATOR - Disclosed are liquid applicators for dispensing liquid to a surface such as a bathroom wall, and working the liquid against the surface. The applicators may have a compressible reservoir for the cleaning liquid. Upon compressing the reservoir the liquid is driven to a scrubbing pad in a controlled fashion. A check valve prevents back flow to the reservoir from the pad. A blister pack can house the scrubbing pad even when the pad is attached to the reservoir. In another form the applicator can be tipped and rested on its side between uses. | 10-30-2008 |
Munhui Diane Bang, Oakland, CA US
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20110072556 | Expandable Pocket - An expandable pocket is described. In one or more implementations, a pocket is comprised of a front panel attached to a back panel. The front panel is configured to expand. Additionally, the front panel is configured to substantially maintain alignment of a portion of a stripe disposed on the front panel with a portion of the stripe disposed on the back panel. The front panel is configured to maintain this alignment when the front panel is expanded and when the front panel is not expanded. | 03-31-2011 |
Sungyong Bang, East Palo Alto, CA US
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20120168125 | Multi-Function Automotive Radiator and Condenser Airflow System - A vehicle thermal management system is provided that includes two or more heat exchangers configured in a non-stacked arrangement, where separate air inlets corresponding to each of the heat exchangers allow a direct intake of ambient air. Corresponding to each heat exchanger is a set of adjustable louvers that control ambient air flowing directly into the heat exchanger. The adjustable louvers may be adjustable between two positions; fully opened or fully closed. Alternately, the adjustable louvers may be adjustable over a range between fully opened and fully closed. Alternately, each set of adjustable louvers may be comprised of multiple groups of independently controllable louvers. Air ducts may be used to couple the output from one heat exchanger to the input of a different heat exchanger. | 07-05-2012 |
Won Bang, Santa Clara, CA US
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20080286444 | In Situ Substrate Holder Leveling Method and Apparatus - Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is directed to a method of adjusting a spacing between a gas distribution member and a substrate support disposed generally opposite from the gas distribution member, wherein the substrate support is configured to support a substrate on which to form a layer with improved thickness uniformity. The method comprises forming a layer on the substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations. The spacing adjustment amount is positive to increase the spacing between the substrate support at the location and the gas distribution member if the thickness is greater at the location than at the reference location. The spacing adjustment amount is negative to decrease the spacing between the substrate support at the location if the thickness is smaller at the location than at the reference location. | 11-20-2008 |
Won Bang, Gilroy, CA US
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20080296304 | SLIT VALVE - Embodiments of a valve assembly for a process chamber having improved seal performance are provided herein. In some embodiments, a valve assembly for a process chamber includes a housing having an opening disposed in a wall thereof and through which a substrate may be transferred; a door movably coupled to the housing in a plane substantially parallel to the wall of the housing for selectively sealing the opening; a compressible sealing member disposed at least partly between an upper surface of the door and a corresponding surface of the housing for forming a seal therebetween by compression of the compressible sealing member in a direction substantially perpendicular to the wall when the door is in a closed position; and a mechanism for restricting the exposure of the compressible sealing member to an environment on a process chamber side of the housing. | 12-04-2008 |
Won B. Bang, Santa Clara, CA US
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20090113684 | Uniformly Compressed Process Chamber Gate Seal for Semiconductor Processing Chamber - Techniques for a door system for sealing an opening between two chambers in a semiconductor processing system are described. The opening has at least one angled corner. The door system includes a door, actuator, and sealing member. The door is moveable in the plane and has at least one angled corner to align the door with the opening. The actuator moves the door to selectively open and close the opening. The sealing member seals the opening when the door is in a closed position. The door is sized to apply substantially uniform seal compression to the sealing member when in the closed position. | 05-07-2009 |
20110120017 | VARIABLE SEAL PRESSURE SLIT VALVE DOORS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT - Techniques for a door system for sealing an opening between two chambers in a semiconductor processing system are described. A sealing member seals the opening when a door is in a closed position. To selectively open and close the opening, an actuator moves the door. A valve actuator switch provides a first or second pressure to the actuator depending on the pressure inside a first chamber. In one embodiment, a sensor monitors the pressure inside the first chamber. | 05-26-2011 |
Won B. Bang, Gilroy, CA US
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20090042407 | Dual Top Gas Feed Through Distributor for High Density Plasma Chamber - A gas distributor for use in a semiconductor process chamber comprises a body. The body includes a first channel formed within the body and adapted to pass a first fluid from a first fluid supply line through the first channel to a first opening. A second channel is formed within the body and adapted to pass a second fluid from a second fluid supply line through the second channel to a second opening. The first and second openings are arranged to mix the fluids outside the body after the fluids pass through the openings. | 02-12-2009 |
20090197356 | Substrate positioning on a vacuum chuck - We have discovered a method of using the vacuum chuck/heater upon which a substrate wafer is positioned to determine whether the wafer is properly placed on the vacuum chuck. The method employs measurement of a rate of increase in pressure in a confined space beneath the substrate. Because the substrate is not hermetically sealed to the upper surface of the vacuum chuck/heater apparatus, pressure from the processing chamber above the substrate surface tends to leak around the edges of the substrate and into the space beneath the substrate which is at a lower pressure. A pressure sensing device, such as a pressure transducer is in communication with a confined volume present beneath the substrate. The rate of pressure increase in the confined volume is measured. If the substrate is well positioned on the vacuum chuck/heater apparatus, the rate of pressure increase in the confined volume beneath the substrate is slow. If the substrate is not well positioned on the vacuum chuck/heater apparatus, the rate of pressure increase is more rapid. | 08-06-2009 |
20100006032 | CHAMBER COMPONENTS FOR CVD APPLICATIONS - Apparatus for use with a processing chamber are provided. In one aspect a blocker plate is provided including an annular plate having an inner portion of a first thickness and the annular plate having an aperture pattern including a center portion, a first patterned portion concentrically disposed around the center portion and comprising a first plurality of apertures having a first number of apertures, an second patterned portion concentrically disposed around the first patterned portion and comprising a second plurality of apertures having a second number of apertures greater than the first number of apertures, a perimeter portion concentrically disposed around the second patterned portion, and an outer portion comprising a raised concentric portion disposed on a perimeter of the annular plate. In another aspect, a second, third, and fourth blocker plates are provided. Additionally, a mixing apparatus and a liquid evaporating apparatus for use in a processing chamber are provided. | 01-14-2010 |
20120074126 | WAFER PROFILE MODIFICATION THROUGH HOT/COLD TEMPERATURE ZONES ON PEDESTAL FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT - A substrate support comprising a top ceramic plate providing a substrate support surface for supporting a substrate during substrate processing, a substrate pedestal having coolant channels formed therein and a thermoelectric deck sandwiched between the top ceramic plate and substrate pedestal. The thermoelectric deck includes a plurality of embedded thermoelectric elements that can either heat or cool the substrate support surface. | 03-29-2012 |