Patent application number | Description | Published |
20080215282 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 09-04-2008 |
20090057889 | Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling - One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts. | 03-05-2009 |
20090210188 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 08-20-2009 |
20090251164 | PROCESS AND TEMPERATURE INSENSITIVE FLICKER NOISE MONITOR CIRCUIT - In an apparatus and method for monitoring defects in wafers, a monitoring circuit is fabricated on an area of each one of the wafers. The monitoring circuit includes representative devices that replicate similar devices located in a die area of the wafers. Defects if present in the representative devices contribute to a generation of a noise, thereby causing an imbalance in a differential signal measurable across selected ones of the representative devices. A digitizing circuit that uses a common mode voltage as a reference to measure the imbalance digitizes the differential signal to a digital signal, the digital signal being indicative of the noise generated by the defects. The digital signal is stored over a configurable time interval to form a digital bit stream. The digital bit stream is compared to a reference to determine whether the defects are within an allowable range. | 10-08-2009 |
20090265672 | METHOD AND SYSTEM FOR ENTRY AND VERIFICATION OF PARASITIC DESIGN CONSTRAINTS FOR ANALOG INTEGRATED CIRCUITS - A method of designing an analog integrated circuit (IC), a parasitic constraint analyzer and a method of determining a layout of an analog IC complies with parasitic constraints. In one embodiment, the method of designing an analog IC includes: (1) creating a schematic of an analog integrated circuit based on a set of specifications, (2) attaching parasitic constraints to the schematic, (3) creating a layout of the analog integrated circuit based on the schematic including the parasitic constraints, (4) extracting parasitic values from parasitic elements of the layout and (5) comparing the extracted parasitic values with the parasitic constraints to verify compliance therewith. | 10-22-2009 |
20100099368 | MONOLITHIC FM-BAND TRANSMIT POWER AMPLIFIER FOR MOBILE CELLULAR DEVICES AND METHOD OF OPERATION THEREOF - An FM-band transmit power amplifier and a method of transmitting in multiple bands. In one embodiment, the FM-band transmit power amplifier has an input and an output and includes: (1) a pre-filter including a charge-pump based integrator coupled to the input and a passive notch filter having a notch frequency in a band other than an FM band and (2) an output driver coupled between the passive pre-filter and the output and having PMOS and NMOS transconductors configured to receive an output from the passive filter. | 04-22-2010 |
20100162061 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 06-24-2010 |
20100197053 | PROCESS AND TEMPERATURE INSENSITIVE FLICKER NOISE MONITOR CIRCUIT - In an apparatus and method for monitoring defects in wafers, a monitoring circuit is fabricated on an area of each one of the wafers. The monitoring circuit includes representative devices that replicate similar devices located in a die area of the wafers. Defects if present in the representative devices contribute to a generation of a noise, thereby causing an imbalance in a differential signal measurable across selected ones of the representative devices. A digitizing circuit that uses a common mode voltage as a reference to measure the imbalance digitizes the differential signal to a digital signal, the digital signal being indicative of the noise generated by the defects. The digital signal is stored over a configurable time interval to form a digital bit stream. The digital bit stream is compared to a reference to determine whether the defeats are within an allowable range. | 08-05-2010 |
20110084864 | SINGLE-ENDED POLAR TRANSMITTING CIRCUIT WITH CURRENT SALVAGING AND SUBSTANTIALLY CONSTANT BANDWIDTH - An embodiment of the invention provides a single-ended polar transmitting circuit. The single-ended polar transmitting circuit comprises a DAC, a differential-to-single-ended converter, a GmC filter and a load. The GmC filter comprises two gain stages, two filters, two switching devices, a translinear loop and a current mirror. When a second clock signal is high, a first current is conducted through the load, a second switching device and a second gain stage. When a first clock signal is high, a second current is conducted through a first switching device and the second gain stage. The first gain stage has a transconductance Gm | 04-14-2011 |
20110161757 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 06-30-2011 |
20110199972 | Wireless Chip-to-Chip Switching - Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface. | 08-18-2011 |
20110214027 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 09-01-2011 |
20120062286 | TERAHERTZ PHASED ARRAY SYSTEM - Microelectronics have now developed to the point where radiation within the terahertz frequency range can be generated and used. Here, an integrated circuit or IC is provided that includes a phased array radar system, which uses terahertz radiation. In order to accomplish this, several features are employed; namely, a lower frequency signal is propagated to transceivers, which multiplies the frequency up to the desired frequency range. To overcome the losses from the multiplication, an injection locked voltage controlled oscillator (ILVCO) is used, and a high frequency power amplifier (PA) can then be used to amplify the signal for transmission. | 03-15-2012 |
20120068238 | LOW IMPEDANCE TRANSMISSON LINE - Transmission lines employing transmission line units or elements within integrated circuits (ICs) are well-known. Typically, different heights for these transmission line units can vary the characteristics of the cell (and transmission line), and there is typically a tradeoff between impedance and space (layout) specifications. Here, a transmission line is provided, which is generally comprised of elements of the same general width, but having differing or tapered heights that allow for impedance adjustments for high frequency applications (i.e., 160 GHz). For example, a transmission line that is coupled to a balun, with the transmission line units decreasing in height near the balun's center tap to adjust the impedance of the transmission line for the balun, is shown. | 03-22-2012 |
20120068890 | HIGH SPEED DIGITAL INTERCONNECT AND METHOD - In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth. | 03-22-2012 |
20120068891 | CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK - In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth. | 03-22-2012 |
20120086589 | PIPELINED CONTINUOUS-TIME SIGMA DELTA MODULATOR - Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise. | 04-12-2012 |
20120096325 | In or relating to 1149.1tap linking modules - Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 04-19-2012 |
20120261579 | ANALOG BASEBAND CIRCUIT FOR A TERAHERTZ PHASED ARRAY SYSTEM - A method for determining the position of a target is provided. Several emitted pulses of terahertz radiations are emitted from a phased array (which has several transceivers) in consecutive cycles (typically). These emitted pulses are generally configured to be reflected by a target so as to be received by the phased array within a scan range (which includes a digitization window with several sampling periods). Output signals from each of the transceivers are then combined to generate a combined signal for each cycle. The combined signal in each sampling period within the digitization window for emitted pulses is averaged to generate an averaged signal for each sampling period within the digitization window. These averaged signals are then digitized. | 10-18-2012 |
20120304029 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 11-29-2012 |
20120313895 | TOUCH SCREEN - A method for determining the location of an object on a touch panel is provided. Initially, a pulse of terahertz radiation is transmitted through a touch panel, which formed of a dielectric material such that the pulse generates a evanescent field in a region adjacent to a touch surface of the touch panel. A reflected pulse is generated by an object located within the region adjacent to the touch surface of the touch panel, and a position of the object on the touch surface of the touch panel is triangulated at least in part from the reflected pulse. | 12-13-2012 |
20120322400 | CURRENT MODE BLIXER WITH NOISE CANCELLATION - Blixers, which are a relatively recent development, have not be studied as extensively as many older circuit designs. Here, a blixer is provided that improves linearity and reduces noise over other conventional blixer designs. To accomplish this, the blixer provided here uses a differential amplifier and/or a dummy path within its mixing circuit to perform noise reduction (and improve linearity). | 12-20-2012 |
20120326906 | PIPELINED CONTINUOUS-TIME SIGMA DELTA MODULATOR - Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise. | 12-27-2012 |
20130099824 | REDUCED OFFSET COMPARATOR - An apparatus is provided. The apparatus comprises backend circuitry and pairs of redundant input circuits. Each pair of redundant input circuits is configured to form a differential pair of transistors, and each redundant input circuit includes a multiplexer and a set of transistors. The multiplexer is coupled to the backend circuitry, and each transistor from the set of transistors has a first passive electrode, a second passive electrode, and a control electrode. The first passive electrode of each transistor from the set of transistors is coupled to the multiplexer, and the control electrodes from the set of transistors are coupled together. | 04-25-2013 |
20130120186 | DELAY LOCKED LOOP - A method for providing a plurality of narrow pulses is provided. A first pulse having a first width is received by a delay line having a plurality of delay cells. This first pulse has a first width. In response to this first pulse, a plurality of second pulses is generated by the delay line, where each second pulse has a second width that is less than the first width. First and second delay pulses are also generated by the delay line, and a delay for each delay cell in the delay line can then be adjusted if a rising edge of the second delay pulse is misaligned with a falling edge of the first delay pulse. | 05-16-2013 |
20130124936 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 05-16-2013 |
20130139017 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 05-30-2013 |
20130147533 | PHASE AVERAGED PULSE WIDTH MODULATOR - A method is provided. A noise shaped signal having a plurality of instants is generated with each instant being associated with at least one of a plurality of output levels. A next phase is selected for each instant, where each next phase is a circularly shifted phase based at least in part on a previous phase for the associated output level for its instant. A plurality of PWM signals is then generated using the phase for each instant, and an amplified signal is generated from the plurality of PWM signals. | 06-13-2013 |
20130156089 | DIGITAL TIME-INTERLEAVED RF-PWM TRANSMITTER - A method for transmitting radio frequency (RF) signals is provided. In-phase (I) and quadrature (Q) signals are received and filtered using sigma-delta modulation. I and Q pulse width modulation signals are generated from the filtered I and Q signals and interleaved so as to generate a time-interleaved signal. The time-interleaved signal is then amplified to generate the RF signals. | 06-20-2013 |
20130210376 | LINC TRANSMITTER WITH IMPROVED EFFICIENCY - A radio frequency (RF) transmitter is provided. The RF transmitter includes first and second drivers that are configured to receive first and second sets of complementary RF signals. Restoration circuits are coupled to the first and second drivers, and a bridge circuit is coupled to the first and second restoration circuits. By having the restoration circuits and the bridge circuit, a common mode impedance and a differential impedance can be provided, where the common mode impedance is lower than the differential impedance. | 08-15-2013 |
20130234795 | FREE-FLY CLASS D POWER AMPLIFIER - A method is provided. A first enable signal is asserted so as to enable a first driver, where the first driver has a first output and a first parasitic capacitance. A second enable signal is asserted so as to enable a second driver, where the second driver has a second output and a second parasitic capacitance. The first and second outputs are coupled together by a switching network when the second driver is enabled. Pulses from complementary first and second radio frequency (RF) signals are applied to the first driver, where there is a first set of free-fly intervals between consecutive pulses from the first and second RF signals, and pulses from complementary third and fourth RF signals are applied to the second driver, wherein there is a second set of free-fly interval between consecutive pulses from the third and fourth RF signals. | 09-12-2013 |
20130241663 | PULSE WIDTH MODULATION SCHEME WITH REDUCED HARMONICS AND SIGNAL IMAGES - A method is provided. An input signal is received, and a noise-shaped signal is generated from the input signal. The noise-shaped signal is formed from a plurality of noise-shaping levels. A pulse stream is generated from the noise-shaped signal over a plurality of periods, where each period has a plurality of frames. The pulse stream also includes a plurality of pulse sets, where each pulse set is associated with at least one of the noise-shaping levels, and, for each pulse set having a total pulse width for its period that is less than its period and greater than zero, each pulse set includes at least one pulse in each frame for its period. | 09-19-2013 |
20130249590 | TSV Testing Using Test Circuits and Grounding Means - This disclosure describes a novel method and apparatus for testing TSVs within a semiconductor device. According to embodiments illustrated and described in the disclosure, a TSV may be tested by stimulating and measuring a response from a first end of a TSV while the second end of the TSV held at ground potential. Multiple TSVs within the semiconductor device may be tested in parallel to reduce the TSV testing time according to the disclosure. | 09-26-2013 |
20130258892 | Wireless Chip-to-Chip Switching - Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface. | 10-03-2013 |
20130265732 | INTERCHIP COMMUNICATION USING A DIELECTRIC WAVEGUIDE - An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. | 10-10-2013 |
20130265733 | INTERCHIP COMMUNICATION USING AN EMBEDDED DIELECTRIC WAVEGUIDE - An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. | 10-10-2013 |
20130265734 | INTERCHIP COMMUNICATION USING EMBEDDED DIELECTRIC AND METAL WAVEGUIDES - An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide. | 10-10-2013 |
20130305108 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 11-14-2013 |
20140040689 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 02-06-2014 |
20140097810 | Systems and Methods of Tone Management in Hysteretic Mode DC to DC Converter - As disclosed herein, two hysteresis levels, a high level a low level, may be used to set a period (and the switching frequency) of the output voltage of a DC-DC converter, as well as the output ripple of the converter. These two thresholds may be changed using a set of switches. By controlling the sequence and the duration of the on-time of the switches, spectral spurs in the output can be controlled and the amplitude and the frequency band of interest can be reduced. Additional spur reduction may be possible by randomizing the control of the switches. | 04-10-2014 |
20140111366 | FINE GRAINED DUTY CYCLING AND TIMING CONTROL FOR PULSED RADAR - A method is provided. A first edge on a first gating signal is generated, and a local oscillator and a shared clocking circuit with the first edge on the first gating signal. A second edge on a second gating signal is generated following the first edge on the first gating signal, and a receiver circuit is activated with the second edge on the second gating signal, where the receiver circuit includes a mixer. A transmit pulse following the first edge on the first gating signal is generated with the transmit pulse having a third edge. A switch that short circuits outputs of the mixer is then released following the later of the third edge of the transmit pulse and a delay. | 04-24-2014 |
20140181608 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 06-26-2014 |
20140215282 | 1149.1 TAP LINKING MODULES - IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations. | 07-31-2014 |
20140292354 | CAPACITIVE SENSOR - A capacitive sensor has at least first and second conductive areas so that a first capacitance is formed between the first conductive area and a surface, and a second capacitance is formed between the second conductive area and the surface, and the ratio of the first capacitance to the second capacitance has a predetermined value only when the sensor is at a predetermined distance from the surface. | 10-02-2014 |
20140359387 | TAP AND LINKING MODULE FOR SCAN ACCESS OF MULTIPLE CORES WITH IEEE 1149.1 TEST ACCESS PORTS - An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation. | 12-04-2014 |
20140368376 | CALIBRATION SCHEME FOR GAS ABSORPTION SPECTRA DETECTION - A technique for removing the background from a transmission spectrum including determining performance characteristics of a detector, measuring a transmission spectrum that includes an absorption line, determining performance characteristics of a gas cell, and removing a background spectrum from the transmission spectrum by combining the transmission spectrum with the performance characteristics of the detector and the performance characteristics of the gas cell. | 12-18-2014 |
20140368377 | DETECTION AND LOCKING TO THE ABSORPTION SPECTRA OF GASSES IN THE MILLIMETER-WAVE REGION - A frequency reference device that includes a frequency reference generation unit to generate a frequency reference signal based on an absorption line of a gas. | 12-18-2014 |
20140369520 | Negative Audio Signal Voltage Protection Circuit and Method for Audio Ground Circuits - Self-grounded circuitry ( | 12-18-2014 |