Patent application number | Description | Published |
20090314079 | HOT-FILM AIR MASS METER HAVING FREQUENCY-MODULATED SIGNAL DETECTION - A method for measuring an air mass flow flowing in a main flow direction, and a hot-film air mass meter by which the method is able to be realized. The method and the hot-film air mass meter are especially suitable for use in the induction tract of an internal combustion engine. The hot-film air mass meter includes a sensor chip having a chip surface across which an air mass flow is able to flow. The chip surface in turn has a measuring surface, the measuring surface including a central hot-film air mass meter circuit having at least one central heating element and at least two temperature sensors. The method is implemented so that the at least one central heating element is periodically heated using a frequency ω. With the aid of at least two temperature sensors, at least two measuring signals are detected. The measuring signals and/or at least one differential signal of the at least two measuring signals are modulated using the frequency ω. | 12-24-2009 |
20100000321 | YAW RATE SENSOR - A yaw rate sensor includes a drive mass element which is situated above a surface of a substrate and is drivable to vibrate by a drive device along a first axis extending along the surface, having a detection mass element, which is deflectable under the influence of a Coriolis force along a second axis perpendicular to the surface, and having a detection device by which the deflection of the detection mass element along the second axis is detectable. Due to the arrangement of the second axis perpendicular to the surface, the yaw rate sensor may be integrated into a chip together with additional yaw rate sensors suitable for detection of rotations about axes of rotation in other directions. | 01-07-2010 |
20100206076 | SENSOR ELEMENT - A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass. | 08-19-2010 |
20100225255 | DRIVE ELEMENT AND METHOD FOR OPERATING A DRIVE ELEMENT - A drive element is provided having a substrate, a seismic mass, a drive electrode and a counter-electrode, one of the two electrodes being connected to the substrate and the other of the two electrodes being connected to the seismic mass; and the drive electrode and the counter-electrodes being provided for the excitation of motion of the seismic mass in a main direction of motion; and in addition, the drive electrode includes a first and a second partial electrode, which are switchable separately from each other. | 09-09-2010 |
20100232119 | Method for producing an electronic module - A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module. | 09-16-2010 |
20110048132 | Microsystem - A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint. | 03-03-2011 |
20110050251 | Capacitive sensor and actuator - A capacitive sensor and a capacitive actuator having at least one seismic mass deflectably mounted on a substrate. A comb electrode having comb fingers is mounted on the seismic mass, and a comb electrode having comb fingers is mounted on the substrate in such a way that the comb fingers are situated parallel to a deflection direction of the seismic mass and interlock in a comb-like manner. The characteristic curve of the sensor or actuator is adjusted by optimizing the geometry of at least one comb electrode, in particular of at least one comb finger. | 03-03-2011 |
20110060543 | Method for self-adjustment of a triaxial acceleration sensor during operation, and sensor system having a three -dimentional acceleration sensor - A method for self-adjustment of a triaxial acceleration sensor during operation includes: calibrating the sensor; checking the self-adjustment for an interfering acceleration, with the aid of a measurement equation and estimated values for sensitivity and offset; repeating the adjustment if an interfering acceleration is recognized; and accepting the estimated values for sensitivity and offset as calibration values if an interfering acceleration is not recognized. The step of checking the self-adjustment includes: estimating sensitivity and/or offset and the variance thereof; determining an innovation as the difference between a measured value of the measurement equation and an estimated value of the measurement equation; testing the innovation for a normal distribution; and recognizing the interfering acceleration in the event of a deviation from the normal distribution. | 03-10-2011 |
20110088469 | ROTATION-RATE SENSOR HAVING TWO SENSITIVE AXES - A method and system are provided including a rotation-rate sensor having a substrate, a bearing, a vibrating structure suspended on the bearing by springs in a rotatable manner for performing a planar driving vibration motion, and drive means for producing the planar driving vibration motion of the vibrating structure. The rotation-rate sensor has first evaluation means for detecting a rotation in a first axis of rotation and second evaluation means for detecting a rotation in a second axis of rotation. | 04-21-2011 |
20110109327 | Sensor for capacitive detection of a mechanical deflection - A sensor for capacitive detection of a mechanical deflection includes a substrate having a first substrate electrode and a second substrate electrode; and a mass movable relative to the substrate. The mass is divided into: a first electrically separate region having a first ground electrode; and a second electrically separate region of the mass having a second ground electrode. At least one portion of the first ground electrode is situated in a first region between the first substrate electrode and the second substrate electrode, and forms a first differential capacitor. At least one portion of the second ground electrode is situated in a second region between the first substrate electrode and the second substrate electrode, and forms a second differential capacitor. | 05-12-2011 |
20110120208 | Method for adjusting an acceleration sensor, and acceleration sensor - A method for adjusting an acceleration sensor which includes a substrate and a seismic mass, the acceleration sensor having first and further first electrodes attached to the substrate on a first side, counter-electrodes of the seismic mass being situated between the first and further first electrodes, the acceleration sensor having further second electrodes on a second side and further fourth electrodes on a fourth side opposite the second side, an essentially equal first excitation voltage being applied to the first and further first electrodes in a first step for exciting a first deflection of the seismic mass along a first direction, the first deflection being compensated in a second step by applying a first compensation voltage to the further second and further fourth electrodes. | 05-26-2011 |
20110140692 | Method for determining the sensitivity of an acceleration sensor or magnetic field sensor - A method for determining the sensitivity of a sensor provides the following steps: a) first and second deflection voltages are applied to first and second electrode systems of the sensor, respectively, and first and second electrostatic forces are exerted on an elastically suspended seismic mass of the sensor by the first and second electrode systems, respectively, and a restoring force is exerted on the mass as a result of the elasticity of the mass, and a force equilibrium is established among the first and second electrostatic forces and the restoring force, and the mass assumes a deflection position characteristic of the force equilibrium, and an output signal characteristic of the force equilibrium and of the deflection position is measured; and b) the sensitivity of the sensor is computed on the basis of the first and second deflection voltages. | 06-16-2011 |
20110174076 | Multiaxial micromechanical acceleration sensor - A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane. | 07-21-2011 |
20110192229 | MICRO ELECTRICAL MECHANICAL MAGNETIC FIELD SENSOR UTILIZING MODIFIED INERTIAL ELEMENTS - A micro electrical-mechanical system (MEMS) is disclosed. The MEMS includes a substrate, a first pivot extending upwardly from the substrate, a first lever arm with a first longitudinal axis extending above the substrate and pivotably mounted to the first pivot for pivoting about a first pivot axis, a first capacitor layer formed on the substrate at a location beneath a first capacitor portion of the first lever arm, a second capacitor layer formed on the substrate at a location beneath a second capacitor portion of the first lever arm, wherein the first pivot supports the first lever arm at a location between the first capacitor portion and the second capacitor portion along the first longitudinal axis, and a first conductor member extending across the first longitudinal axis and spaced apart from the first pivot axis. | 08-11-2011 |
20110296917 | MICROMECHANICAL COMPONENT HAVING A TEST STRUCTURE FOR DETERMINING THE LAYER THICKNESS OF A SPACER LAYER AND METHOD FOR MANUFACTURING SUCH A TEST STRUCTURE - A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer. | 12-08-2011 |
20120025277 | MEASURING ELEMENT - A measuring element for recording a deflection includes a region which is situated on a semi-conductor substrate and an electrode for influencing a conductivity of the region, the electrode being mounted deflectably in relation to the region, in such a way that an overlap region is formed between the electrode and the region, the overlap region having a dimension that is variable with a deflection of the electrode. A change in the output signal of the measuring element is a function of the conductivity of the region and is controllable by a change in the dimension of the overlap region, the change in the dimension of the overlap region having a non-linear relationship with the deflection of the electrode so that a change in the output signal of the measuring element has a non-linear relationship with the deflection of the electrode. | 02-02-2012 |
20120036915 | SENSOR SYSTEM AND METHOD FOR CALIBRATING A SENSOR SYSTEM - A sensor system having a substrate and a mass which is movably suspended relative to the substrate is described, the sensor system including detection arrangement for detecting a deflection of the seismic mass relative to the substrate along a deflection direction, the detection arrangement including a first measuring electrode affixed to the substrate and a second measuring electrode affixed to the substrate, and a first overlap, which is perpendicular to the deflection direction, between the first measuring electrode and the seismic mass along the deflection direction is greater than a second overlap, which is perpendicular to the deflection direction, between the second measuring electrode and the seismic mass. | 02-16-2012 |
20120038065 | Method for Producing an Electrical Circuit and Electrical Circuit - A method for producing an electrical circuit having at least one semiconductor chip is disclosed. The method includes forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side. The wiring layer has at least one conductor loop for the purpose of forming an electrical coil. | 02-16-2012 |
20120060604 | YAW-RATE SENSOR - A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis. | 03-15-2012 |
20120061860 | Method for Constructing an Electrical Circuit, and Electrical Circuit - A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip. | 03-15-2012 |
20120104978 | Device for resonantly driving a micromechanical system - A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached. | 05-03-2012 |
20120129291 | METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT - A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material. | 05-24-2012 |
20120187509 | Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components - A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches. | 07-26-2012 |
20120291543 | MICROSYSTEM - A microsystem, e.g., a micromechanical sensor, has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint. | 11-22-2012 |
20130299927 | HYBRID INTERGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer. | 11-14-2013 |
20130327147 | Micromechanical Device for Measuring an Acceleration, a Pressure or the Like and a Corresponding Method - A micromechanical device measures an acceleration, a pressure or the like. It comprises a substrate having at least one fixed electrode, a seismic mass moveably arranged on the substrate, at least one ground electrode, which is arranged on the seismic mass, and resetting means for returning the seismic mass into an initial position, wherein the fixed electrode and the ground electrode are configured in one measurement plane for measuring an acceleration, a pressure or the like in the measurement plane, and wherein the fixed electrode and the ground electrode are configured for measuring an acceleration, pressure or the like acting on the seismic mass perpendicular to the measurement plane. The disclosure likewise relates to a corresponding method and a corresponding use. | 12-12-2013 |
20130327163 | MICROELECTROMECHANICAL SENSOR MODULE AND CORRESPONDING PRODUCTION METHOD - A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module. | 12-12-2013 |
20140326070 | YAW-RATE SENSOR - A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis. | 11-06-2014 |