Atsushi Matsuo
Atsushi Matsuo, Okaya JP
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20130264908 | VIBRATOR ELEMENT, MANUFACTURING METHOD OF VIBRATOR ELEMENT, SENSOR UNIT, AND ELECTRONIC APPARATUS - A vibration gyro-element includes a base portion, an excitation vibrating arm and a detection vibrating arm extending from the base portion, and a first adjustment vibrating arm and a second adjustment vibrating arm extending from the base portion and vibrating along with excitation vibration of the excitation vibrating arm, wherein an output signal of the first adjustment vibrating arm at least is out of phase with respect to an output signal of leakage vibration of the detection vibrating arm, and wherein an amplitude of the output signal of the first adjustment vibrating arm is larger than an amplitude of the output signal of the second adjustment vibrating arm. | 10-10-2013 |
20150114116 | VIBRATING REED, ANGULAR VELOCITY SENSOR, ELECTRONIC DEVICE, MOVING OBJECT, AND METHOD FOR MANUFACTURING VIBRATING REED - The vibrating reed includes a detection unit that vibrates along the thickness direction of a piezoelectric body when detecting. The detection unit includes a first main surface and a second main surface that face each other in the thickness direction, outside surfaces, a groove that has a groove bottom at a position between the first main surface and the second main surface in a depth direction from an opening provided in the first main surface, an outside surface electrode that is formed on the outside surfaces, and an inside surface electrode that is formed on an inside surface which is opposite the outside surfaces. At least one of the outside surfaces has a non-electrode-formed area where the outside surface electrode is not provided in an area from the end surface which positioned on the second main surface side in the thickness direction to the second main surface. | 04-30-2015 |
20150114126 | VIBRATING REED, ANGULAR VELOCITY SENSOR, ELECTRONIC DEVICE, AND MOVING OBJECT - The vibrating reed includes a first main surface and a second main surface that face each other in the thickness direction of a piezoelectric body and a detection unit that vibrates along the thickness direction when detecting. The detection unit includes a groove of which a groove bottom is positioned at a position beyond a midplane between the first main surface and the second main surface in the depth direction from an opening formed in the first main surface, an inside surface electrode that is formed on an inside surface facing the inside of the groove, an outside surface electrode that is formed on an outside surface which is opposite the inside surface with the piezoelectric body interposed therebetween, and a pair of groove bottom electrodes that is provided further on the groove bottom at an interval than the midplane and face inside the groove. | 04-30-2015 |
20150268107 | PHYSICAL QUANTITY DETECTING DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT - A physical quantity detecting device includes a vibrating element and a charge amplifier. The vibrating element includes a first detection electrode, a second detection electrode, a third detection electrode, and a fourth detection electrode. The first and fourth detection electrodes have the same electrical polarity, the second and third detection electrodes have the same electrical polarity, and the first and second detection electrodes have opposite electrical polarities. The first and fourth detection electrodes are connected to the charge amplifier, and the second and third detection electrodes are connected to the charge amplifier. | 09-24-2015 |
Atsushi Matsuo, Isehara-Shi JP
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20130150521 | AQUEOUS BINDER FOR INORGANIC- FIBER HEAT-INSULATING SOUND-ABSORBING MEMBER, INORGANIC- FIBER HEAT-INSULATING SOUND-ABSORBING MEMBER AND METHOD FOR PRODUCING INORGANIC- FIBER HEAT-INSULATING SOUND-ABSORBING MEMBER - An aqueous binder for an inorganic fiber heat-insulating sound-absorbing member is cured by heating at low temperatures and is capable of providing a strong binder cured product. The inorganic fiber heat-insulating sound-absorbing member is produced by applying an aqueous binder to inorganic fibers and heating the resulting inorganic fibers at 180-220° C. The aqueous binder contains 5.5-10 parts by mass of an ammonium salt of an inorganic acid per 100 parts by mass of the total of an acrylic resin that has an acid value of 350-850 mgKOH/g and a crosslinking agent that contains at least one alkanol amine. The ratio of the total mole number of hydroxy groups, amino groups and imino groups in the crosslinking agent relative to the mole number of carboxyl groups in the acrylic resin is 0.8-1.5. The pH of the aqueous binder is adjusted to 5.0-8.0 by a basic compound. | 06-13-2013 |
Atsushi Matsuo, Chiyoda-Ku JP
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20150077841 | OPTICAL FILTER - Provided is an optical filter integrally provided with a light blocking film capable of suppressing stray light. An optical filter may be used for an imaging apparatus having a built-in image sensing device on which light from a subject or a light source is incident. The optical filter includes: an optical filter main body arranged between the subject or the light source and the image sensing device and having a transmission property for the incident light; and a frame-shaped light blocking film integrally formed on at least one surface of the optical filter main body. The light blocking film satisfies the following condition (1) and/or condition (2). (1) A concavity/convexity is formed on at least a part of an inner peripheral surface of the light blocking film. (2) A thin part is formed on at least a part of an inner edge of the light blocking film. | 03-19-2015 |
Atsushi Matsuo, Azumino-Shi JP
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20150279887 | SEMICONDUCTOR WAFER, METHOD FOR MANUFACTURING LIGHT RECEIVING SENSOR, AND LIGHT RECEIVING SENSOR - A semiconductor wafer includes a semiconductor substrate, a dielectric multilayer film formed on the semiconductor substrate and serving as an optical filter on a light receiving sensor, and a light detection region formed in the semiconductor substrate, with the Poisson ratio VS, Young's modulus ES, the radius r, and the thickness b of the semiconductor substrate, stress σ in the dielectric multilayer film, and the thickness d of the dielectric multilayer film satisfy a relationship 1.0×10 | 10-01-2015 |
Atsushi Matsuo, Okaya-Shi JP
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20150381143 | RESONATOR ELEMENT, METHOD FOR MANUFACTURING RESONATOR ELEMENT, RESONATOR, GYRO SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - To improve durability against impact, a quartz crystal resonator element includes a recess in a plan view. The quartz crystal resonator element further includes a first principal surface and a second principal surface that are front and rear surfaces facing away from each other and a side surface disposed between the first principal surface and the second principal surface, and the side surface is formed of flat surfaces and curved surfaces formed by dry etching and alternately arranged. The quartz crystal resonator element preferably has a base and at least one resonating arm extending from the base. | 12-31-2015 |