Patent application number | Description | Published |
20090010590 | METHOD AND APPARATUS FOR COUPLING OPTICAL SIGNALS ONTO A SEMICONDUCTOR CHIP - A first optical coupler is configured to direct optical signals from an optical fiber onto one or more first optical channels located on a semiconductor chip, wherein the one or more first optical channels have dimensions that are within a specified tolerance of the dimensions of the optical fiber. One or more second optical couplers are configured to direct the optical signals from the one or more first optical channels to one or more second optical channels located on the semiconductor chip, wherein the one or more second optical channels have a specified sub-micron size. | 01-08-2009 |
20090067851 | MULTI-CHIP SYSTEMS WITH OPTICAL BYPASS - Embodiments of a system that includes an array of single-chip modules (CMs) are described. This array includes a first CM, a second CM coupled to the first CM, and a third CM coupled to the second CM. A given CM, which can be the first CM, the second CM or the third CM, includes a semiconductor die that is configured to communicate data signals with other CMs through electromagnetically coupled proximity communication. These proximity connectors are proximate to a surface of the semiconductor die. Moreover, the first CM and the third CM are configured to optically communicate optical signals with each other via the second CM through an optical signal path. | 03-12-2009 |
20090085183 | INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION - Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die. | 04-02-2009 |
20090085233 | ALIGNMENT FEATURES FOR PROXIMITY COMMUNICATION - Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane. | 04-02-2009 |
20090089466 | PROXIMITY COMMUNICATION PACKAGE FOR PROCESSOR, CACHE AND MEMORY - A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections. The bridge communicates with the processor via conductive (e.g. wire) connections and optionally proximity connections. Spacing between opposing pads of the proximity connection(s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter(s) constrain a minimum distance between opposing pads of the proximity connection(s). | 04-02-2009 |
20090179334 | APPARATUS FOR FACILITATING PROXIMITY COMMUNICATION BETWEEN CHIPS - One embodiment of the present invention provides a system for facilitating proximity communication between semiconductor chips. The system includes a base chip and a bridge chip, each of which includes an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The active face of the bridge chip is bonded to the active face of the base chip. Then, an identified portion of the active face of the bridge chip is thinned via etching and is removed by planarizing the back face of the bridge chip, thereby creating an opening in the bridge chip that exposes a portion of the active face of the base chip. | 07-16-2009 |
20090280601 | METHOD AND APPARATUS FOR FACILITATING PROXIMITY COMMUNICATION AND POWER DELIVERY - The described embodiments provide a system that facilitates inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip and a second integrated circuit chip, both of which whose surfaces have corresponding etch pit wells configured to align with each other. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby aligning the first integrated circuit chip with the second integrated circuit chip. In some embodiments the etch pit wells include conductive structures for routing power through a conductive shaped structure. | 11-12-2009 |
20100115349 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 05-06-2010 |
20100247021 | OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption. | 09-30-2010 |
20100247022 | DUAL-LAYER THERMALLY TUNED OPTICAL DEVICE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented using two semiconductor layers (such as silicon), one of which includes a heater and the other includes a thermally tunable optical waveguide. Spatially separating these two functions in the optical device results in more efficient heat transfer between the heater and the optical waveguide, reduced heat transfer to the surroundings, and reduced optical losses in the optical waveguide relative to existing silicon-based optical devices. | 09-30-2010 |
20100247029 | THERMAL TUNING OF AN OPTICAL DEVICE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased. | 09-30-2010 |
20100266240 | MULTI-CHIP SYSTEM INCLUDING CAPACITIVELY COUPLED AND OPTICAL COMMUNICATION - Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate. | 10-21-2010 |
20100266276 | BROADBAND AND WAVELENGTH-SELECTIVE BIDIRECTIONAL 3-WAY OPTICAL SPLITTER - Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes. | 10-21-2010 |
20100266295 | OPTICAL-SIGNAL-PATH ROUTING IN A MULTI-CHIP SYSTEM - Embodiments of a system are described. This system includes an array of chip modules (CMs) that are configured to communicate data signals with each other via optical communication. In a given CM module, optical signal paths, such as waveguides, are routed in the same way as in the other CMs in the array. In this way, a common optical design in the CMs may be used in the system to prevent data conflicts during the optical communication. | 10-21-2010 |
20100290736 | OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE - Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption. | 11-18-2010 |
20100327460 | CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING - A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other. | 12-30-2010 |
20100327466 | TECHNIQUE FOR FABRICATING MICROSPRINGS ON NON-PLANAR SURFACES - A processing technique facilitating the fabrication of the integrated circuit with microsprings at different vertical positions relative to a surface of a substrate is described. During the fabrication technique, microsprings are lithographically defined on surfaces of a first substrate and a second substrate. Then, a hole is created through a first substrate. Moreover, the integrated circuit may be created by rigidly mechanically coupling the two substrates to each other such that the microsprings on the surface of the second substrate are within a region defined at least in part by an edge around the hole. Subsequently, photoresist that constrains the microsprings on the surfaces of the two substrates may be removed. In this way, microsprings at the different vertical positions can be fabricated. | 12-30-2010 |
20100329607 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 12-30-2010 |
20100329685 | OPTICAL DEVICE WITH REDUCED THERMAL TUNING ENERGY - An optical device that includes multiple optical modulators having actual operating wavelengths at a given temperature is described. Because of differences between the actual operating wavelengths and target operating wavelengths of the optical modulators, heating elements may be used to thermally tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average thermal tuning energy associated with the heating elements. | 12-30-2010 |
20110069925 | MACRO-CHIP INCLUDING A SURFACE-NORMAL DEVICE - A multi-chip module (MCM) is described. This MCM includes two substrates having facing surfaces. Disposed on a surface of a first of these substrates, there is an optical waveguide, having an eigenmode in the plane of the surface, and an optical coupler, which redirects optical signals to and/or from the optical waveguide and a direction normal to the surface. Furthermore, disposed on a surface of a second of the substrates, which faces the surface of the first substrate, and which overlaps the optical coupler, there is an optoelectronic device. This optoelectronic device, which has an eigenmode in a direction perpendicular to the surface of the second substrate, selectively receives or provides the optical signal to and/or from the optical coupler. For example, the selective receiving or providing may be controlled by selectively applying a potential to the quantum-well device, thereby changing the optical properties of the optoelectronic device. | 03-24-2011 |
20110069973 | EDGE-COUPLED OPTICAL PROXIMITY COMMUNICATION - An optical module is described. This optical module includes at least two optical devices that communicate with each other using edge-to-edge optical coupling of an optical signal between optical components in the two optical devices. Note that the edge-to-edge optical coupling may occur without mode converters at edges of either of the optical devices. Furthermore, the edge-to-edge optical coupling may be facilitated by an alignment substrate, which is mechanically coupled to the two optical devices. This alignment substrate aligns the edges of the two optical devices so that they are approximately parallel to each other, and aligns the optical components in the two optical devices. | 03-24-2011 |
20110074011 | MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates. | 03-31-2011 |
20110075380 | SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released. | 03-31-2011 |
20110091157 | THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS - A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip. | 04-21-2011 |
20110111559 | INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION - Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die. | 05-12-2011 |
20110136297 | INTEGRATED CIRCUIT CHIP THAT SUPPORTS THROUGH-CHIP ELECTROMAGNETIC COMMUNICATION - One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip. | 06-09-2011 |
20110147907 | ACTIVE PLASTIC BRIDGE CHIPS - A system for proximity communication between semiconductor chips includes a package assembly. The package assembly includes a plurality of bridge circuits made of organic or plastic semiconductor material. A plurality of base chips are assembled to the package assembly. The package assembly positions and aligns the plurality of base chips such that the bridge circuits bridge the base chips and enable proximity communication between the base chips. | 06-23-2011 |
20110169522 | FAULT-TOLERANT MULTI-CHIP MODULE - A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components. | 07-14-2011 |
20110170819 | ELECTRO-OPTIC MODULATOR WITH INVERSE TAPERED WAVEGUIDES - An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss. | 07-14-2011 |
20110233789 | ADHESIVE-BONDED SUBSTRATES IN A MULTI-CHIP MODULE - A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces. | 09-29-2011 |
20110235962 | OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY - An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced. | 09-29-2011 |
20110255822 | LOW-POWER, BROADBAND OPTICAL SWITCH - An optical switch is described that includes two optical waveguides, which are defined in a semiconductor layer, positioned proximate to an intermediate component, such as a micro-resonator or a directional coupler. Material underneath a portion of either or both optical waveguides is removed so that the portion of either or both optical waveguides is free standing, and a group of electrodes is proximate to the free-standing portion of either or both optical waveguides. During operation of the optical switch, a spacing-control circuit applies an electrical signal to the group of electrodes. An electrostatic force associated with the electrical signal modifies a spacing between the free-standing portion of either or both optical waveguides and the intermediate component, thereby substantially increasing optical coupling between either or both optical waveguides and the intermediate component to convey a broadband optical signal between the optical waveguides. | 10-20-2011 |
20110255823 | SLOTTED OPTICAL WAVEGUIDE WITH ELECTRO-OPTIC MATERIAL - An optical waveguide is described. This optical waveguide may be defined in a semiconductor layer, and may include a vertical slot that includes an electro-optic material having an electric-field-dependent index of refraction, and the electro-optic material may be other than a semiconductor in the semiconductor layer. Alternatively, the optical waveguide may include a vertical stack with two semiconductor layers that surround and partially overlap an intermediate layer, which includes the electro-optic material. | 10-20-2011 |
20110278718 | ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES - A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM. | 11-17-2011 |
20110281395 | SELF-ASSEMBLY OF MICRO-STRUCTURES - Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed. | 11-17-2011 |
20110302465 | MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION - In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. | 12-08-2011 |
20110310917 | MULTIPLE-WAVELENGTH LASER - In a multiple-wavelength laser source, a multiple-mode laser outputs a set of wavelengths in a range of wavelengths onto an optical waveguide, where a spacing between adjacent wavelengths in the set of wavelengths is smaller than a width of channels in an optical link. Furthermore, a set of ring-resonator filters in the multiple-wavelength laser source, which are optically coupled to the optical waveguide, output corresponding subsets of the set of wavelengths for use in the optical link based on free spectral ranges and quality factors of the set of ring-resonator filters. These subsets may include one or more groups of wavelengths, with another spacing between adjacent groups of wavelengths that is larger than the width of the given channel in the optical link. In addition, the one or more groups of wavelengths may include one or more wavelengths, with the spacing between adjacent wavelengths in the given group of wavelengths. | 12-22-2011 |
20120093184 | STRUCTURES AND METHODS FOR ADJUSTING THE WAVELENGTHS OF LASERS VIA TEMPERATURE CONTROL - One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths. | 04-19-2012 |
20120177318 | WAVEGUIDE ELECTRO-ABSORPTION MODULATOR - During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes. | 07-12-2012 |
20120189025 | MONOLITHIC LASER SOURCE USING RING-RESONATOR REFLECTORS - In a laser source, a first optical waveguide includes a gain medium, and a second optical waveguide includes a phase tuner which adjusts a phase value of the phase tuner to specify the wavelength of the laser source. Furthermore, the laser source includes a first ring resonator and a second ring resonator, which, respectively, are optically coupled to the first optical waveguide and the second optical waveguide at opposite ends of the laser source. In particular, coupling wavelengths of the first and second ring resonators may match a wavelength of the optical signal, thereby defining an optical resonance cavity in the laser source and selecting a laser mode of the laser source which is associated with the wavelength. Additionally, the laser source includes an optical amplifier that receives and amplifies the optical signal output from the optical resonance cavity. | 07-26-2012 |
20120207424 | OPTICAL MODULATOR WITH THREE-DIMENSIONAL WAVEGUIDE TAPERS - An integrated circuit that includes an optical waveguide defined in a semiconductor layer is described. In this integrated circuit, light is coupled between the optical waveguide and an optical modulator, which is disposed on the optical waveguide, using 3-dimensional (3-D) taper structures that are proximate to the ends of the optical modulator. The cross-sectional areas of these 3-D taper structures transition, over a distance, from that of the optical waveguide (distal from the optical modulator) to that of optical modulator (proximate to the ends of the optical modulator). In this way, a spatial extent of an optical mode in the optical waveguide and a spatial extent of the optical mode in the optical modulator may be approximately matched to reduce the optical loss when the light is coupled to or from the optical modulator. | 08-16-2012 |
20120207479 | OPTICAL DEVICE WITH REDUCED THERMAL TUNING ENERGY - An optical device that includes multiple optical modulators having target operating wavelengths that are distributed over a band of wavelengths and actual operating wavelengths is described. For example, the target operating wavelengths of adjacent optical modulators may be separated by a wavelength increment. Moreover, because of differences between the actual operating wavelengths and the target operating wavelengths of the optical modulators, tuning elements may be used to tune the optical modulators so that the actual operating wavelengths match corresponding carrier wavelengths in a set of optical signals. Furthermore, control logic in the optical device may assign the optical modulators to the corresponding carrier wavelengths based at least on differences between the carrier wavelengths and the actual operating wavelengths, thereby reducing an average tuning energy associated with the tuning elements. | 08-16-2012 |
20120220056 | MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates. | 08-30-2012 |
20120230695 | WAVELENGTH-DIVISION MULTIPLEXING FOR USE IN MULTI-CHIP SYSTEMS - Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM). | 09-13-2012 |
20120237155 | SCALABLE SILICON PHOTONIC MULTIPLEXERS AND DEMULTIPLEXERS - An optical multiplexer/demultiplexer is described. In this optical multiplexer/demultiplexer, multiple coupled-waveguide grating devices are optically coupled to a bus optical waveguide. A given coupled-waveguide grating device has a band-pass filter characteristic that encompasses multiple optical channels, thereby providing coarse optical filtering. Moreover, the optical multiplexer/demultiplexer includes multiple add/drop filters (such as ring resonators) that optically couple to the coupled-waveguide grating devices. A given add/drop filter has a filter bandwidth corresponding to a given optical channel, thereby providing fine optical filtering. Furthermore, the band-pass filter characteristic of the given coupled-waveguide grating device is approximately equal to or less than a free spectral range (FSR) of the given add/drop filter. | 09-20-2012 |
20120321251 | THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS - A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip. | 12-20-2012 |
20120326322 | CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES - A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package. | 12-27-2012 |
20130015578 | INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGESAANM Thacker; Hiren D.AACI San DiegoAAST CAAACO USAAGP Thacker; Hiren D. San Diego CA USAANM Cunningham; John E.AACI San DiegoAAST CAAACO USAAGP Cunningham; John E. San Diego CA USAANM Shubin; IvanAACI San DiegoAAST CAAACO USAAGP Shubin; Ivan San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate. | 01-17-2013 |
20130016423 | HYBRID LASER SOURCE WITH RING-RESONATOR REFLECTORAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - A laser source includes a semiconductor optical amplifier (SOA) as a gain medium that receives and amplifies an optical signal characterized by at least a wavelength associated with a lasing mode of the laser source. This laser source includes a first optical waveguide and a second optical waveguide optically coupled to the SOA. Furthermore, a wavelength-selective reflector is optically coupled to the first optical waveguide and the second optical waveguide, where a closed loop defined by the SOA, the first optical waveguide, the wavelength-selective reflector and the second optical waveguide defines a cavity of the laser source. | 01-17-2013 |
20130016744 | LASER SOURCE WITH TUNABLE-GRATING-WAVEGUIDE REFLECTIONSAANM Li; GuoliangAACI San DiegoAAST CAAACO USAAGP Li; Guoliang San Diego CA USAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA USAANM Luo; YingAACI San DiegoAAST CAAACO USAAGP Luo; Ying San Diego CA US - A laser source includes an optical cavity having a length exceeding a first predefined distance (such as 6 mm), where a wavelength spacing between optical modes associated with the optical cavity is less than a second predefined distance (such as 100 pm). Moreover, a gain medium in the laser source amplifies the optical signal. Furthermore, tunable-grating waveguides in the laser source, which are optically coupled to ends of the optical cavity, reflect a portion of the optical signal back into the optical cavity, and at least one of the tunable-grating waveguides transmits a remainder of the optical signal out of the optical cavity. | 01-17-2013 |
20130016941 | ARBITRATED OPTICAL NETWORK USING TUNABLE DROP FILTERSAANM Koka; PranayAACI AustinAAST TXAACO USAAGP Koka; Pranay Austin TX USAANM McCracken; Michael O.AACI AustinAAST TXAACO USAAGP McCracken; Michael O. Austin TX USAANM Schwetman, JR.; Herbert D.AACI AustinAAST TXAACO USAAGP Schwetman, JR.; Herbert D. Austin TX USAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a multi-chip module (MCM), integrated circuits are coupled by optical waveguides. These integrated circuits receive optical signals from a set of light sources which have fixed carrier wavelengths. Moreover, a given integrated circuit includes: a transmitter that modulates at least one of the optical signals when transmitting information to at least another of the integrated circuits; and a receiver that receives at least one modulated optical signal having one of the carrier wavelengths when receiving information from at least the other of the integrated circuits. Furthermore, the MCM includes tunable drop filters optically coupled to the optical waveguides and associated integrated circuits, wherein the tunable drop filters pass adjustable bands of wavelengths to receivers in the integrated circuits. Additionally, control logic in the MCM provides a control signal to the tunable drop filters to specify the adjustable bands of wavelengths. | 01-17-2013 |
20130016970 | OPTICAL NETWORK WITH SWITCHABLE DROP FILTERSAANM Koka; PranayAACI AustinAAST TXAACO USAAGP Koka; Pranay Austin TX USAANM McCracken; Michael O.AACI AustinAAST TXAACO USAAGP McCracken; Michael O. Austin TX USAANM Schwetman, JR.; Herbert D.AACI AustinAAST TXAACO USAAGP Schwetman, JR.; Herbert D. Austin TX USAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a multi-chip module (MCM), integrated circuits are coupled by optical waveguides. These integrated circuits receive optical signals from a set of light sources which have fixed carrier wavelengths. Moreover, a given integrated circuit includes: a transmitter that modulates at least one of the optical signals when transmitting information to at least another of the integrated circuits; and a receiver that receives at least one modulated optical signal having one of the carrier wavelengths when receiving information from at least the other of the integrated circuits. Furthermore, the MCM includes switchable drop filters optically coupled to the optical waveguides and associated integrated circuits, wherein the switchable drop filters pass adjustable bands of wavelengths to receivers in the integrated circuits. Additionally, control logic in the MCM provides a control signal to the switchable drop filters to specify the adjustable bands of wavelengths. | 01-17-2013 |
20130016980 | OPTICAL NETWORK WITH TUNABLE OPTICAL LIGHT SOURCESAANM Koka; PranayAACI AustinAAST TXAACO USAAGP Koka; Pranay Austin TX USAANM McCracken; Michael O.AACI AustinAAST TXAACO USAAGP McCracken; Michael O. Austin TX USAANM Schwetman, JR.; Herbert D.AACI AustinAAST TXAACO USAAGP Schwetman, JR.; Herbert D. Austin TX USAANM Zheng; XuezheAACI San DiegoAAST CAAACO USAAGP Zheng; Xuezhe San Diego CA USAANM Krishnamoorthy; Ashok V.AACI San DiegoAAST CAAACO USAAGP Krishnamoorthy; Ashok V. San Diego CA US - In a multi-chip module (MCM), integrated circuits are coupled by optical waveguides. These integrated circuits receive optical signals from a set of tunable light sources. Moreover, a given integrated circuit includes: a transmitter that modulates at least one of the optical signals when transmitting information to at least another of the integrated circuits; and a receiver that receives at least one modulated optical signal having a given carrier wavelength associated with the given integrated circuit when receiving information from at least the other of the integrated circuits. Furthermore, control logic in the MCM provides a control signal to the set of tunable light sources to specify carrier wavelengths in the optical signals output by the set of tunable light sources, thereby defining routing of at least the one of the optical signals in the MCM during communication between at least a pair of the integrated circuits. | 01-17-2013 |
20130037905 | HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY - In a hybrid integrated module, a semiconductor die is mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical device fabricated on a silicon-on-insulator (SOI) wafer in which the backside silicon handler has been completely removed, thereby facilitating improved device performance and highly efficient thermal tuning of the operating wavelength of the optical device. Moreover, the semiconductor die may be a VLSI chip that provides power, and serves as a mechanical handler and/or an electrical driver. The thermal tuning efficiency of the substrateless optical device may be enhanced by over 100× relative to an optical device with an intact substrate, and by 5× relative to an optical device in which the substrate has only been removed in proximity to the optical device. | 02-14-2013 |
20130038920 | PULSE-WIDTH-MODULATED THERMAL TUNING OF OPTICAL DEVICES - An optical device that includes a wavelength-sensitive optical component, which has an associated thermal time constant, is described. Note that an operating wavelength of the wavelength-sensitive optical component is a function of several physical parameters including temperature. Moreover, the optical device includes a heating mechanism that provides heat to the wavelength-sensitive optical component. Furthermore, the optical device includes a driver circuit that provides a pulse-width modulated signal to the heating mechanism. Note that an average pulse-width modulated heat provided by the heating mechanism, and which corresponds to the pulse-width modulated signal, thermally tunes the wavelength-sensitive optical component to a target operating wavelength. Additionally, note that the target operating wavelength corresponds to a target operating temperature of the wavelength-sensitive optical component. | 02-14-2013 |
20130039661 | ECHELLE GRATING WITH CYCLIC FREE-SPECTRAL RANGE - An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device. | 02-14-2013 |
20130071121 | WAVELENGTH-DIVISION MULTIPLEXING FOR USE IN MULTI-CHIP SYSTEMS - Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM). | 03-21-2013 |
20130121635 | DIRECT INTERLAYER OPTICAL COUPLER - In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate. | 05-16-2013 |
20130136389 | OPTICAL DEVICE WITH ECHELLE GRATING AND WAVEFRONT TAILORING - An optical de-MUX includes a sub-wavelength grating that magnifies an input optical signal. In particular, along a direction perpendicular to a propagation direction of the optical signal, the sub-wavelength grating has a spatially varying effective index of refraction that is larger at a center of the sub-wavelength grating than at an edge of the sub-wavelength grating. Moreover, the optical de-MUX includes an optical device that images and diffracts the optical signal using a reflective geometry, and which provides different diffraction orders to output ports. For example, the optical device may include an echelle grating. | 05-30-2013 |
20130195446 | DYNAMIC-GRID COMB OPTICAL SOURCE - An optical source uses feedback to maintain a substantially fixed spacing between adjacent wavelengths in a set of wavelengths in a wavelength comb output by the optical source. In particular, a set of light sources in the optical source provide optical signals having the set of wavelengths. Moreover, the optical signals are output at diffraction angles of an optical device in the optical source (such as an echelle grating), and optical detectors in the optical source determine optical metrics associated with the optical signals. Furthermore, control logic in the optical source provides control signals to the set of light sources based on the determined optical metrics. | 08-01-2013 |
20130195461 | ENERGY-EFFICIENT OPTICAL SOURCE - An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources. | 08-01-2013 |
20130265624 | SURFACE-NORMAL OPTICAL COUPLING USING A HOLOGRAPHIC RECORDING MATERIAL - An integrated circuit includes a holographic recording material substantially filling a cavity in a semiconductor layer. During operation of the integrated circuit, a holographic pattern in the holographic recording is reconstructed and used to diffract an optical signal propagating in a plane of an optical waveguide, which is defined in the semiconductor layer out of the plane through the cavity. In this way, the holographic recording material may be used to couple the optical signal to an optical fiber or another integrated circuit. | 10-10-2013 |
20130301981 | OPTICAL COMPONENTS HAVING A COMMON ETCH DEPTH - An optical device is described. This optical device includes multiple components, such as a ring resonator, an optical waveguide and a grating coupler, having a common etch depth (which is associated with a single etch step or operation during fabrication). Moreover, these components may be implemented in a semiconductor layer in a silicon-on-insulator technology. By using a common etch depth, the optical device may provide: compact active devices, multimode ultralow-loss optical waveguides, high-speed ring resonator modulators with ultralow power consumption, and compact low-loss interlayer couplers for multilayer-routed optical links. Furthermore, the single etch step may help reduce or eliminate optical transition loss, and thus may facilitate high yield and low manufacturing costs. | 11-14-2013 |
20130308903 | OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY - An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide. | 11-21-2013 |
20130315526 | SINGLE-LAYER FULL-MESH, POINT-TO-POINT NETWORK - An MCM may include a single optical routing layer that provides point-to-point connectivity among N chips in the MCM, such as all-to-all connectivity or full-mesh point-to-point connectivity. Moreover, the optical routing layer may include: N optical waveguides optically coupled to the N chips and a cyclic de-multiplexer, optically coupled to the N optical waveguides, that routes optical signals among the N optical waveguides without optical-waveguide crossing in the optical routing layer. For example, the cyclic de-multiplexer may include: an array-waveguide-grating (AWG) wavelength router and/or an echelle-grating wavelength router. | 11-28-2013 |
20130320567 | BATCH PROCESS FOR THREE-DIMENSIONAL INTEGRATION - A chip package is described which includes a first chip having a first surface and first sides having a first side-wall angle, and a second chip having a second surface and second sides having a second side-wall angle, which faces and is mechanically coupled to the first chip. The chip package is fabricated using a batch process, and the chips in the chip package were singulated from their respective wafers after the chip package is assembled. This is accomplished by etching the first and second side-wall angles and thinning the wafer thicknesses prior to assembling the chip package. For example, the first and/or the second side walls can be fabricated using wet etching or dry etching. Therefore, the first and/or the second side-wall angles may be other than vertical or approximately vertical. | 12-05-2013 |
20140029940 | INTEGRATED MULTI-CHANNEL WAVELENGTH MONITOR - An optical-source monitor images and diffracts received optical signals using an optical device that has a reflective geometry. For example, the optical device may include a diffraction grating on a curved surface, such as an echelle grating. By imaging and diffracting the optical signals, the optical device may couple to the optical signals on different diffraction orders of the optical device (which have different carrier wavelengths) from input optical waveguides to corresponding output optical waveguides. Then, output power monitors may measure the output power levels of the optical signals, and control logic may provide wavelength control signals to optical sources that provide the optical signals based on measured output power levels. | 01-30-2014 |
20140086585 | OPTICAL DEVICE WITH A CMOS-COMPATIBLE ECHELLE GRATING - An optical multiplexer/de-multiplexer (MUX/de-MUX) includes a two-dimensional pattern of features in a propagation region that conveys an optical signal having wavelengths. A given feature in this pattern has a characteristic length and the features have an average pitch, both of which are less than fundamental smallest of the wavelengths divided by an effective index of refraction of the propagation region. Moreover, an optical device in the optical MUX/de-MUX images and diffracts the optical signal using a reflective geometry, and provides the imaged and diffracted optical signal to output ports. For example, the optical device may include an echelle grating. | 03-27-2014 |
20140119738 | SINGLE-LAYER OPTICAL POINT-TO-POINT NETWORK - In a multi-chip module (MCM), first and second optical waveguides convey optical signals among integrated circuits. The first and second optical waveguides may be implemented in a first layer or plane on a substrate. Moreover, bridge chips in a second plane may be used to couple the optical signals between the first or second optical waveguides and the integrated circuits. By using a single layer for optical routing, the MCM may provide a point-to-point network among the integrated circuits without optical-waveguide crossing. | 05-01-2014 |
20140166864 | SELF-REGISTERED COMB LASER SOURCE - An integrated optical source is described. This optical source outputs one or more optical signals that provide a comb of wavelengths for use in wavelength-division-multiplexing (WDM) optical interconnects or links. In particular, a shared echelle grating is used as a wavelength-selective filter or control device for multiple lasing cavities to achieve self-registered and accurate lasing-channel spacing without inter-channel gain competition. Furthermore, the optical source can be used to provide all the wavelength channels in one optical waveguide or in separate optical waveguides. Therefore, the optical source may be used with cascaded ring-resonator modulators and/or electro-absorption-based broadband modulators. | 06-19-2014 |
20140169737 | TRANSCEIVER WITH SELF-REGISTERED WAVELENGTHS - An integrated optical component outputs and receives an optical signal that provides a comb of modulated wavelengths for use in wavelength-division-multiplexing (WDM) optical interconnects or links. In particular, a shared echelle grating is used as a wavelength-selective filter or control device for multiple lasing cavities to achieve self-registered and accurate lasing-channel spacing without inter-channel gain competition for multiplexing modulated wavelength channels into one transmit port, and for receiving and de-multiplexing WDM wavelength channels simultaneously. The wavelength alignment between a pair of such transceivers can be achieved by tuning the echelle grating on one side using thermal-optical or electro-optical effects. Furthermore, tunable ring-resonator modulators, broadband electro-absorption modulators (EAMs) or Mach-Zehnder Interferometer (MZI) optical modulators on the shared output waveguide outside of the lasing cavities can be used to modulate the wavelengths. The optical component can be used to provide all the wavelength channels in one optical waveguide. | 06-19-2014 |
20140246571 | REFLECTION-ENHANCED PHOTO-DETECTOR - An integrated optical device includes a photo-detector (such as germanium) optically coupled to an optical waveguide. This photo-detector is deposited on the optical waveguide, and an optical signal propagating in the optical waveguide may be evanescently coupled to the photo-detector. In order to increase the absorption length of the photo-detector, a mirror (such as a distributed Bragg reflection grating) is included in the optical waveguide near the end of the photo-detector. This mirror reflects the optical signal back toward the photo-detector, thereby increasing the absorption of the optical signal by the photo-detector. In addition, absorption may be reduced by using electrical contacts that are electrically coupled to the photo-detector at locations where the optical mode of the optical signal is largely in the underlying optical waveguide, and by using a fingered metal layer to couple to the electrical contacts. | 09-04-2014 |
20140264854 | MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES - A multi-chip module (MCM) is described. This MCM includes at least two substrates that are mechanically coupled and aligned by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. The positive features may be self-populated into the negative features on at least one of the substrates using a hydrophilic layer in the negative feature. This hydrophilic layer may be used in conjunction with a hydrophobic layer surrounding the negative features on a top surface of at least one of the substrates. | 09-18-2014 |
20140268312 | HYBRID OPTICAL SOURCE WITH SEMICONDUCTOR REFLECTOR - A hybrid optical source that provides an optical signal having a wavelength is described. This hybrid optical source includes an edge-coupled optical amplifier (such as a III-V semiconductor optical amplifier) aligned to a semiconductor reflector (such as an etched silicon mirror). The semiconductor reflector efficiently couples (i.e., with low optical loss) light out of the optical amplifier in a direction approximately perpendicular to a plane of the optical amplifier. A corresponding optical coupler (such as a diffraction grating or a mirror) fabricated on a silicon-on-insulator chip efficiently couples the light into a sub-micron silicon-on-insulator optical waveguide. The silicon-on-insulator optical waveguide couples the light to additional photonic elements (including a reflector) to complete the hybrid optical source. | 09-18-2014 |
20140270784 | STACKABLE PHOTONIC INTERCONNECT MODULE - An interconnect module for communicating electrical signals and optical signals is described. In particular, an integrated circuit in the interconnect module receives and transmits the electrical signals with other components in a system that includes the interconnect module via an electrical connector. In addition, the integrated circuit receives and transmits electrical signals to a hybrid silicon-photonic bridge chip that performs electrical-to-optical and optical-to-electrical conversion. In turn, this bridge chip receives and transmits optical signals via an optical fiber. The interconnect module can be remateably connected to a backplane in the system, and can be arranged in a stacked configuration with other instances of the interconnect module. In these ways, the interconnect module facilitates dense, modular or scalable, and compact electrical and optical communication in the system. | 09-18-2014 |
20140321803 | HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER - A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects. | 10-30-2014 |
20140321804 | HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER - A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit. | 10-30-2014 |
20150063753 | ENHANCED COUPLING STRENGTH GRATINGS - The present invention includes an optical waveguide with a grating and a method of making the same for increasing the effectiveness of the grating. In one example, the grating is at least partially covered by a liner layer disposed on at least a portion of a grating; and a cover layer disposed on the liner layer, wherein a first material selected for the core and ridges and a second material selected for the liner layer are selected to provide a difference in the index of refraction between the first and second material that is sufficient to provide a contrast therebetween. | 03-05-2015 |
20150071585 | BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES - A fabrication technique for cleaving a substrate in an integrated circuit is described. During this fabrication technique, a trench is defined on a back side of a substrate. For example, the trench may be defined using photoresist and/or a mask pattern on the back side of the substrate. The trench may extend from the back side to a depth less than a thickness of the substrate. Moreover, a buried-oxide layer and a semiconductor layer may be disposed on a front side of the substrate. In particular, the substrate may be included in a silicon-on-insulator technology. By applying a force proximate to the trench, the substrate may be cleaved to define a surface, such as an optical facet. This surface may have high optical quality and may extend across the substrate, the buried-oxide layer and the semiconductor layer. | 03-12-2015 |
20150086149 | TUNABLE SILICON GRATING COUPLERS - A photonic integrated circuit (PIC) is described. This PIC includes a grating coupler for surface-normal coupling that has an alternating pattern of grating teeth and grating trenches, where the grating trenches are filled with an electro-optical material. By applying an electric potential to the grating teeth, the index of refraction of the electro-optical material can be modified. | 03-26-2015 |
20150086219 | ENHANCED OPTICAL MODULATION USING SLOW LIGHT - A photonic integrated circuit (PIC) is described. This PIC includes a semiconductor-barrier layer-semiconductor diode in an optical waveguide that conveys an optical signal, where the barrier layer is an oxide or a high-k material. Moreover, semiconductor layers in the semiconductor-barrier layer-semiconductor diode may include geometric features (such as a periodic pattern of holes or trenches) that create a lattice-shifted photonic crystal optical waveguide having a group velocity of light that is lower than the group velocity of light in the first semiconductor layer and the second semiconductor layer without the geometric features. The optical waveguide is included in an optical modulator, such as a Mach-Zehnder interferometer (MZI). | 03-26-2015 |