Patent application number | Description | Published |
20080291454 | Inspection Systems and Methods for Extending the Detection Range of an Inspection System by Forcing the Photodetector into the Non-Linear Range - An inspection system and method is provided herein for increasing the detection range of the inspection system. According to one embodiment, the inspection system may include a photodetector having a plurality of stages, which are adapted to convert light scattered from a specimen into an output signal, and a voltage divider network coupled for extending the detection range of the photodetector (and thus, the detection range of the inspection system) by saturating at least one of the stages. This forces the photodetector to operate in a non-linear manner. However, measurement inaccuracies are avoided by calibrating the photodetector output to remove any non-linear effects that may be created by intentionally saturating the at least one of the stages. In one example, a table of values may be generated during a calibration phase to convert the photodetector output into an actual amount of scattered light. | 11-27-2008 |
20090040511 | SYSTEMS, CIRCUITS AND METHODS FOR EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM BY AVOIDING DETECTOR SATURATION - Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. The step of detecting may include monitoring an anode current of the PMT detector, and detecting features, defects or light scattering properties of the specimen using the anode current until the anode current reaches a predetermined threshold. Thereafter, the method may use a dynode current of the PMT for detecting the features, defects or light scattering properties of the specimen. | 02-12-2009 |
20090096505 | SYSTEMS, CIRCUITS AND METHODS FOR REDUCING THERMAL DAMAGE AND EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM - Inspection systems, circuits, and methods are provided to enhance defect detection by reducing thermal damage to large particles by dynamically altering the incident laser beam power level supplied to the specimen during a surface inspection scan. In one embodiment, an inspection system includes an illumination subsystem for directing light to a specimen at a first power level, a detection subsystem for detecting light scattered from the specimen, and a power attenuator subsystem for dynamically altering the power level directed to the specimen based on the scattered light detected from the specimen. For example, the power attenuator subsystem may reduce the directed light to a second power level, which is lower than the first, if the detected scattered light exceeds a predetermined threshold level. In addition reducing thermal damage, the systems and methods described herein may be used to extend the measurement detection range of an inspection system by providing a variable-power inspection system. | 04-16-2009 |
20110051132 | Method and apparatus for producing and Measuring dynamically focussed, steered, and shaped oblique laser illumination for spinning wafer inspection system - A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface. | 03-03-2011 |
20110315897 | Extending the lifetime of a Deep UV laser in a Wafer Inspection tool - Disclosed herein is a method and apparatus for automatic correction of beam waist position drift in real time, using wafer inspection data taken during normal tool operation. | 12-29-2011 |
20130016346 | Wafer Inspection - Systems configured to inspect a wafer are provided. | 01-17-2013 |
20130208269 | Extended Defect Sizing Range for Wafer Inspection - Various embodiments for extended defect sizing range for wafer inspection are provided. | 08-15-2013 |
20130250385 | Laser with Integrated Multi Line or Scanning Beam Capability - A method and system for providing illumination is disclosed. The method may include providing a laser having a predetermined wavelength; performing at least one of: beam splitting or beam scanning prior to a frequency conversion; converting a frequency of each output beam of the at least one of: beam splitting or beam scanning; and providing the frequency converted output beam for illumination. | 09-26-2013 |
20140071437 | Monitoring Incident Beam Position in a Wafer Inspection System - Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction. | 03-13-2014 |
20140071457 | Method and System for Tilt and Height Control of a Substrate Surface in an Inspection System - A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator. | 03-13-2014 |
20140278188 | Scanning Inspection System With Angular Correction - A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position. | 09-18-2014 |