Patent application number | Description | Published |
20080303415 | Organic Electroluminescence Element, Display and Illuminator - An organic electroluminescence element comprising an anode and a cathode having therebetween: at least two or more light emission layers exhibiting different emission peaks and an intermediate layer provided between the light emission layers, wherein at least one of the light emission layers comprises a phosphorescent compound as a light emission compound; and an excited triplet energy of a compound forming the intermediate layer is larger than an excited triplet energy of the phosphorescent compound. | 12-11-2008 |
20090072715 | ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY AND ILLUMINATOR - Disclosed is a long-life organic electroluminescent element which can be driven at low voltage. Also disclosed are a display and illuminator using the same. Specifically disclosed is an organic electroluminescent element comprising on a substrate, an anode, a cathode and an organic compound layer arranged between the anode and the cathode and including at least one light emission layer. This organic electroluminescent element is characterized in that the organic compound layer includes an electron transport material-containing layer which contains an electron transport material represented by Formula (a) and at least one substance selected from the group consisting of metals, salts of the metals and electron-donating compounds. Formula (a) Ar1-(Ar2)n [In the formula, Ar1 represents a group derived from an aromatic hydrocarbon ring or a group derived from an aromatic heterocycle; Ar2 represents a group derived from an aromatic heterocycle; and n represents an integer of 2 or more. | 03-19-2009 |
20100093548 | SUPERCONDUCTING STRUCTURE, APPARATUS FOR PROCESSING SUPERCONDUCTING STRUCTURE, AND METHOD FOR PROCESSING SUPERCONDUCTING STRUCTURE - A superconducting structure includes an NbN thin-film as a first superconducting thin-film layer on the upper surface of a substrate, an NbN thin-film as a second superconducting thin-film layer above the NbN thin-film, and a MgO thin-film as a protective thin-film provided between the NbN thin-film and the NbN thin-film. | 04-15-2010 |
20110209903 | ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD OR PRINTED CIRCUIT BOARD SUBSTRATE - The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface. | 09-01-2011 |
20130220679 | COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD - Provided is a copper foil with a carrier capable of realizing wiring at line/space=15 μm/15 μm or less on a printed circuit board on which the copper foil is laminated. Further provided is a printed circuit board or a multilayer printed circuit board capable of realizing fine-pattern wiring at line/space=15 μm/15 μm or less using the copper foil. The copper foil is obtained by forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more, and peeling off the copper foil from the carrier foil. The copper foil with a carrier is obtained by forming a release layer and a copper foil in this order on a carrier foil that is said copper foil, wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 μm or more in a mean spacing Sm as defined in JIS-B-06012-1994. A roughening treatment layer as necessary and a surface treatment layer are formed in this order on a surface of the copper foil. | 08-29-2013 |
20130327448 | HIGH-STRENGTH alpha+beta TITANIUM ALLOY HOT-ROLLED SHEET EXCELLENT IN COLD COIL HANDLING PROPERTY AND PROCESS FOR PRODUCING THE SAME - A high-strength α+β type hot-rolled titanium alloy sheet containing 0.8 to 1.5 mass % Fe, 4.8 to 5.5 mass % Al, 0.030 mass % N, O and N, wherein cracks are prevented from spreading, wherein: (a) ND represents normal direction of a hot-rolled sheet; RD represents hot rolling direction; TD represents hot rolling width direction; θ represents the angle formed between c axis and ND; φ represents angle formed between plane including c axis and ND, and a plane including ND and TD; (b1) XND represents highest (0002) relative intensity of X-ray reflection by grains when θ is from 0° to 30°; (b2) XTD represents the highest (0002) relative intensity of the X-ray reflection caused by grains when θ is from 80° to 100° and φ is ±10°. (c) The high-strength α+β type hot-rolled titanium alloy sheet has a value for XTD/XND of at least 4.0. Q(%)=[O]+2.77·[N]. | 12-12-2013 |
20130327449 | alpha + beta Titanium Alloy Sheet Excellent In Cold Rollability And Cold Handling Property And Process For Producing The Same - An α+β type hot-rolled titanium alloy sheet, wherein: (a) ND represents the normal direction of a hot-rolled sheet; RD represents the hot rolling direction; TD represents the hot rolling width direction; θ represents the angle formed between the orientation of c axis and the ND; φ represents the angle formed between a plane including the orientation of the c axis and the ND, and a plane including the ND and the TD; (b1) XND represents the highest (0002) relative intensity of the X-ray reflection caused by crystal grains when θ is from 0° to 30° and φ is within the entire circumference; (b2) XTD represents the highest (0002) relative intensity of the X-ray reflection caused by crystal grains when θ is from 80° to 100° and φ is ±10°. (c) The α+β type titanium alloy sheet has a value for XTD/TND of at least 5.0. | 12-12-2013 |
20150064055 | TITANIUM ALLOY FOR GOLF CLUB FACE - An α+β-type titanium alloy which, has a high Young's modulus and strength-ductility balance is provided as a material for a face of a driver, iron, or other golf club. | 03-05-2015 |