Akihiro Nomura
Akihiro Nomura, Shizuoka-Shi JP
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20110073995 | SEMICONDUCTOR DEVICE, FABRICATION METHOD OF THE SEMICONDUCTOR DEVICES - In a semiconductor device, a YAG substrate is formed as a single-crystal substrate of any of surface orientations (100), (110), and (111). In the fabrication of the semiconductor device, a TMAl gas is first fed onto the YAG substrate so as to form a nucleation layer made of aluminum, which is a group-III element. Then, an NH | 03-31-2011 |
20130075754 | SEMICONDUCTOR DEVICE, FABRICATION METHOD OF THE SEMICONDUCTOR DEVICES - In a semiconductor device, a YAG substrate is formed as a single-crystal substrate of any of surface orientations (100), (110), and (111). In the fabrication of the semiconductor device, a TMAl gas is first fed onto the YAG substrate so as to form a nucleation layer made of aluminum, which is a group-III element. Then, an NH | 03-28-2013 |
20140211449 | LIGHT EMITTING MODULE - The light emitting module includes a plurality of light emitting elements; a fluorescent substance resin layer containing a fluorescent substance which is excited by light emitted from the plurality of light emitting elements to emit visible light; a reflective surface configured to reflect light emitted from the plurality of light emitting elements and the fluorescent substance resin layer; and a light guiding body layer provided between the reflective surface and the fluorescent substance resin layer, and configured to guide light emitted from the plurality of light emitting elements or the fluorescent substance. | 07-31-2014 |
Akihiro Nomura, Moriyama-Shi JP
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20090155608 | Electroconductive Bonding Material and Electronic Apparatus - An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D | 06-18-2009 |
20110132637 | CONDUCTIVE RESIN COMPOSITION AND CHIP-TYPE ELECTRONIC COMPONENT - A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a terminal glycidyl group, a conductive silver powder, and a solvent, and has a yield value of 3.6 Pa or less. In addition, the conductive powder can have a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less. Furthermore, the conductive powder can be spherical, and the ratio of the conductive powder in solids constituting the conductive resin composition can be 42 to 54 vol %. | 06-09-2011 |
Akihiro Nomura, Shizuoka JP
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20110316033 | LIGHT EMITTING MODULE, METHOD OF MANUFACTURING THE LIGHT EMITTING MODULE, AND LAMP UNIT - In a light emitting module, a light wavelength conversion member | 12-29-2011 |
Akihiro Nomura, Tokyo JP
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20120246917 | CONTINUOUS PRESS APPARATUS FOR ELECTRODE BAND PLATE - A continuous press apparatus presses an electrode band plate having a band-shaped metal foil collector on which an electrode active material is formed at intervals in a longitudinal direction. The apparatus includes a pair of press rollers, gap adjusting means for adjusting a gap between the press rollers, detecting means for detecting that a rear end of the electrode active material portion arrives at the position between the press rollers, and the gap adjusting means adjust the gap between the press rollers in response to the detection. | 10-04-2012 |
Akihiro Nomura, Anjo-Shi JP
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20130075122 | WORK MACHINE HAVING MAIN POLE - A work machine includes a main pole internally including a rotation shaft, a tool unit located at one end of the main pole, and a power unit located at another end of the main pole. The main pole includes a first partial pole, a second partial pole and a joint member that joints them to each other. The first partial pole includes a positioning member. The joint member includes a positioning hole configured to engage with the positioning member and a guide groove extending from the positioning hole. The guide groove is configured to guide the positioning member to the positioning hole and to allow the positioning member to escape in at least a section thereof. | 03-28-2013 |
Akihiro Nomura, Nagaokakyo-Shi JP
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20140218886 | ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE - An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1−T3<50° C. | 08-07-2014 |
Akihiro Nomura, Aichi JP
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20140208598 | VEGETATION CUTTER - A vegetation cutter comprises a frame rod having a front end portion and a rear end portion, and assuming a hollow tube having an open front end; a cutter head mounted on the front end portion of the frame rod and including a drive motor, a cooling fan to be rotated by the drive motor, and a rotary cutter to be rotated by the drive motor; and a power head mounted on the rear end portion of the frame rod and providing electric power for the drive motor. The frame rod is provided with an air intake aperture located at a position rearward than the cutter head and communicating through the hollow tube toward the cutter head. The frame rod is comprised of a front part rod and a rear part rod separably coupled together by means of a tubular joint. The air intake aperture is located on the front part rod. | 07-31-2014 |
20140352160 | VEGETATION CUTTER - A vegetation cutter comprises: a frame rod having a longitudinal axis and a front end; a rotary cutter mounted on the front end of the frame rod; a drive motor for driving the rotary cutter; a grip disposed around the frame rod and having an external surface to be held by a user; a power switch trigger arranged on the grip for energizing the drive motor; and a safety lock mechanism for rendering the power switch trigger inoperative when the safety lock mechanism is in a lock position and for rendering the power switch trigger operative when the safety lock mechanism is in a release position. The safety lock mechanism includes a manipulating knob for selectively setting the safety lock mechanism in the lock position and in the release position. The manipulating knob is disposed on the grip at a position circumferentially opposite to the power switch trigger and is turnable around an axis which is parallel to the longitudinal axis of the frame rod to selectively bring the safety lock mechanism to the lock position and the release position. | 12-04-2014 |