Patent application number | Description | Published |
20100066229 | Lighting Module - A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented. | 03-18-2010 |
20100067229 | Lighting Module - A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented. | 03-18-2010 |
20100067240 | Optical Cup For Lighting Module - A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented. | 03-18-2010 |
20100067241 | Optical Disk For Lighting Module - An optical disk for use in converting light emitted from a light-emitting diode chip to white light. The optical disk includes a tapered surface such that a center area of the disk has a width greater than a width of an outer area of the disk. The optical disk is formed of a silicone having at least one weight percent mix of phosphor. Various embodiments of this generally described optical disk are also presented. | 03-18-2010 |
20100078151 | CERAMIC HEAT PIPE WITH POROUS CERAMIC WICK - A heat pipe for transporting heat from light emitting elements includes a sealed body made of a non-porous ceramic, a vapor channel inside the body that extends between two heat transfer locations spaced apart on an exterior surface of the body, a ceramic wick inside the body that extends between the two heat transfer locations, and a working fluid that partially fills the vapor transport channel. In a method of making this heat pipe, the body and wick are desirably formed together as a seamless monolithic structure made of the same ceramic material. Using a ceramic makes the heat pipe corrosion resistant and allows electrical components like LEDs to be mounted directly on the body because the ceramic is a dielectric. | 04-01-2010 |
20110310608 | LED LIGHT SOURCE | 12-22-2011 |
20120261688 | LED WAVELENGTH-CONVERTING STRUCTURE INCLUDING A THIN FILM STRUCTURE - A wavelength-converting structure for a wavelength-converted light emitting diode (LED) assembly. The wavelength-converting structure includes a thin film structure having a non-uniform top surface. The non-uniform top surface is configured increase extraction of light from the top surface of a wavelength-converting structure. | 10-18-2012 |
20130001596 | DEPOSITION OF ESD PROTECTION ON PRINTED CIRCUIT BOARDS - A method and apparatus for providing electro-static discharge (ESD) protection to light emitting diode (LED) systems on printed circuit boards (PCBs). Protection is provided by ESD diodes deposited on the PCBs configured as flexible substrates. Various deposition techniques are employed including chemical vapor deposition, pulsed laser deposition and atomic layer deposition. | 01-03-2013 |
20130003345 | LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE - A light emitting diode (LED) lighting apparatus including an array of first optic elements overlying an array of LED chips, wherein each of the LED chips is configured to emit light of a first wavelength range through a light emitting surface of the overlying first optic element. The array of first optic elements are also underlying an array of second optic elements, wherein each of the second optic elements is configured to convert light of the first wavelength range to be emitted through the light emitting surface of the underlying first optic element to light of a second wavelength range different from the first wavelength range. | 01-03-2013 |
20130003373 | LED LIGHTING APPARATUS, SYSTEMS AND METHODS OF MANUFACTURE - A light emitting diode (LED) lighting system including a lighting apparatus comprising at least one printed circuit board having an array of light emitting diode (LED) chips mounted thereto, the printed circuit board including a segmented conductor pathway configured to electrically couple at least a portion of the array of LED chips, and a portion of the printed circuit board forming a card edge connector, the card edge connector including a portion of the segmented conductor pathway which provides an electrical contact configured to electrically couple the segmented conductor pathway to a power source. | 01-03-2013 |
20130313603 | Wavelength Converter for an LED, Method of Making, and LED Containing Same - A wavelength converter for an LED is described that comprises a substrate of monocrystalline garnet having a cubic crystal structure, a first lattice parameter and an oriented crystal face. An epitaxial layer is formed directly on the oriented crystal face of the substrate. The layer is comprised of a monocrystalline garnet phosphor having a cubic crystal structure and a second lattice parameter that is different from the first lattice parameter wherein the difference between the first lattice parameter and the second lattice parameter results in a lattice mismatch within a range of ±15%. The strain induced in the phosphor layer by the lattice mismatch shifts the emission of the phosphor to longer wavelengths when a tensile strain is induced and to shorter wavelengths when a compressive strain is induced. Preferably, the wavelength converter is mounted on the light emitting surface of a blue LED to produce an LED light source. | 11-28-2013 |
20140022761 | Luminescent Converter and LED Light Source Containing Same - A luminescent converter for a light emitting diode is herein described. The converter comprises a translucent substrate and a thin-film layer deposited on the substrate wherein the thin-film layer is comprised of a phosphor. The translucent substrate may further comprise a solid, ceramic phosphor such as YAG:Ce. | 01-23-2014 |
20140126208 | MODULAR LIGHTING TECHNIQUES - Techniques and architecture are disclosed for providing a modular lighting system/luminaire having an integrated heat sink assembly. In some cases, the system/luminaire may comprise a plurality of individual modular light sources which have been operatively coupled with one another. In some instances, a modular light source may include one or more light engines (e.g., light emitting diodes or LEDs) which have been operatively coupled with an individual heat sink module. When assembled, the plurality of heat sink modules may define, in the aggregate, a plurality of heat conduits which dissipate thermal energy from the light engines by convective heat transfer. Also, in some cases, the heat sink modules may be electrically isolated from one another, allowing for the heat sink assembly itself, in part or in whole, to function as part of the desired circuit. | 05-08-2014 |
20150062838 | SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES - This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be pre-printed with circuit paths, the conductive ink coupling the device to the circuit paths. | 03-05-2015 |