52nd week of 2019 patent applcation highlights part 73 |
Patent application number | Title | Published |
20190394864 | ELECTRONIC ARRANGEMENT, OPTICAL GAS SENSOR INCLUDING SUCH AN ELECTRONIC ARRANGEMENT, AND METHOD FOR CONTROLLING THE POWER OF A RADIATION SOURCE USING SUCH AN ELECTRONIC ARRANGEMENT - An electronic arrangement includes a radiation source. A controlled voltage converter is configured to provide a lamp voltage for the radiation source for operating the radiation source in an ON state for a pulse duration, and to regulate the lamp voltage such that a reference voltage at a feedback terminal of the voltage converter is maintained substantially constant. A voltage source is connected to the feedback terminal and configured to provide, via the feedback terminal for acting on the regulation of the voltage converter, a time-dependent control voltage having a predefined time profile. The voltage converter is configured to select a time profile for the lamp voltage as a function of the predefined time profile of the time-dependent control voltage such that a power of the radiation source deviates from a constant power value by no more than 25% during at least 90% of the pulse duration. | 2019-12-26 |
20190394865 | METHOD OF OPERATING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method of operating a semiconductor apparatus includes generating a target material droplet; exciting the target material droplet to generate radiation for exposing a wafer; receiving, by a catcher, the target material droplet after exciting the target material droplet, in which the catcher has a front section, a rear section, and a drain port at the rear section; heating the rear section of the catcher such that the target material droplet in the rear section is in a liquid phase; and maintaining a temperature of the front section of the catcher lower than a temperature of the rear section of the catcher. | 2019-12-26 |
20190394866 | Plasma Source - The invention concerns a plasma source including a quarter wave antenna ( | 2019-12-26 |
20190394867 | Nozzle Assembly, Device for Generating an Atmospheric Plasma Jet, Use Thereof, Method for Plasma Treatment of a Material, in Particular of a Fabric or Film, Plasma Treated Nonwoven Fabric and Use Thereof - A nozzle assembly for generating an atmospheric plasma jet includes an inlet, through which the jet can be introduced into the nozzle assembly, and a channel connected to the inlet so that the plasma jet introduced is conducted through the channel. Multiple nozzle openings are provided in the channel wall along the channel, through which a plasma jet can exit the assembly. The cross section of the channel in the region of a nozzle opening is shaped in such a way that a virtual medial plane runs between a virtual first tangent plane of the cross section through the nozzle opening and a virtual second tangent plane of the cross section opposite thereto and parallel to the first tangent plane divides the cross section into a first cross-sectional area at the nozzle opening. The cross-sectional surface of the first cross-sectional area differs from the cross-sectional surface of the second. | 2019-12-26 |
20190394868 | EUV LIGHT GENERATOR - An EUV light generator including the following components: A. an electron storage ring including a first linear section and a second linear section; B. an electron supplier configured to supply the electron storage ring with an electron bunch; C. a high-frequency acceleration cavity disposed in the first linear section and configured to accelerate the electron bunch in such a way that a length Lez of the electron bunch satisfies “0.09 m≤Lez≤3 m;” and D. an undulator disposed in the second linear section and configured to output EUV light when the electron bunch enters the undulator. | 2019-12-26 |
20190394869 | FLEXIBLE SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME - A display device including a display module configured to display an image, a printed circuit board provided below the display module, and a flexible substrate including a first bonding region, a bending region, and a second bonding region. The flexible substrate may be bent at the bending region and may be used to connect the display module to the printed circuit board. The flexible substrate may include a circuit layer electrically connecting the display module to the printed circuit board, a cover layer on the circuit layer, and a bubble-prevention layer, which is provided between the cover layer and the circuit layer and is overlapped with each of the first and second bonding regions of the flexible substrate. | 2019-12-26 |
20190394870 | WIRING SUBSTRATE - A wiring substrate includes a plurality of wiring layers, a component mounting part on which an electronic component can be mounted, and a component non-mounting part on which an electronic component cannot be mounted. A portion located in the component non-mounting part of one wiring layer of the plurality of the wiring layers includes a plurality of first through-holes having an elongated shape as seen from above and aligned with predetermined intervals with longitudinal directions of the first through-holes being faced toward a direction perpendicular to a longitudinal direction of the wiring substrate. | 2019-12-26 |
20190394871 | THREE-DIMENSIONAL DECOUPLING INTEGRATION WITHIN HOLE IN MOTHERBOARD - Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer mounted on a motherboard. The semiconductor package also includes a hole in motherboard (HiMB) that is formed in the motherboard. The semiconductor package has one or more capacitors mounted on an electrical shield. The electrical shield may be embedded in the HiMB of the motherboard. Accordingly, the semiconductor package has capacitors vertically embedded between the electrical shield and the HiMB of the motherboard. The semiconductor package may also have one or more HiMB sidewalls formed on the HiMB, where each of the one or more HiMB sidewalls includes at least one or more plated through holes (PTHs) with an exposed layer. The PTHs may be electrically coupled to the capacitors as the capacitors are vertically embedded between the electrical shield sidewalls and the HiMB sidewalls (i.e., three-dimensional ( | 2019-12-26 |
20190394872 | PRINTED CIRCUIT SUBSTRATE - A printed circuit substrate includes a circuit unit, a first main frame ground interconnection, a first sub frame ground interconnection spaced away from the first main frame ground interconnection in a first direction, and a first conductive via connecting the first main frame ground interconnection and the first sub frame ground interconnection to each other. In plan view from the first direction, a second outer periphery of the first sub frame ground interconnection is surrounded by a first outer periphery of the first main frame ground interconnection . Thus, a printed circuit substrate that can prevent the circuit unit from malfunctioning can be provided. | 2019-12-26 |
20190394873 | IMAGE FORMING APPARATUS PROVIDED WITH COMMONIZED PRINTED CIRCUIT BOARD - An image forming unit forms a black image. A motor drives the image forming unit. A control circuit controls the motor. A first connector to which the motor is connected via a control line. A second connector to which a control target is not connected. A substrate on which the control circuit, the first connector, and the second connector are arranged. A predetermined mark is formed on the substrate through silk screen printing. A distance between the predetermined mark and the second connector is shorter than a distance between the predetermined mark and the first connector. If the substrate is disposed in a multi-color image forming apparatus configured to form a color image, a control target for the multi-color image forming apparatus is connected to the second connector. | 2019-12-26 |
20190394874 | MULTILAYER SUBSTRATE - A multilayer substrate that includes a first ceramic layer that is a dense body, a second ceramic layer that has open pores, and a resin layer adjacent the second ceramic layer, wherein a material of the resin layer is present in the open pores of the second ceramic layer. | 2019-12-26 |
20190394875 | STRETCHABLE STRUCTURE COMPRISING A CONDUCTIVE PATH AND A METHOD FOR MANUFACTURING THE STRUCTURE - A stretchable structure comprises or is configured to receive a conductive path and an interface region. The interface region comprises a peripheral line comprising at least one inwardly curved portion, such as an “inverted teardrop” or a fjord like recess pointing essentially towards the center area of the interface region. The interface region is arranged to receive said stretchable conductive path via said inwardly curved portion of said peripheral line of said interface region. In this way the interface region minimizes strains or other twisting or stretching forces directed to the conductor entering into the opening of the inwardly curved portion of the interface region. | 2019-12-26 |
20190394876 | REDUCED CAPACITANCE LAND PAD - A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area. | 2019-12-26 |
20190394877 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first build-up layer, and a second build-up layer. Each build-up layer includes a first insulating layer including reinforcing material, a second resin insulating layer not containing reinforcing material, a first via conductor through the first insulating layer, and a second via conductor through the second insulating layer such that the top diameter of the first via conductor is substantially equal to the top diameter of the second via conductor and that the bottom diameter of the first via conductor is smaller than the bottom diameter of the second via conductor. The conductor layer on the first insulating layer includes a metal foil, a seed layer and an electrolytic plating film. The conductor layer on the second insulating-layer includes a seed layer and an electrolytic plating film and has thickness substantially equal to thickness of the conductor layer on the first insulating-layer. | 2019-12-26 |
20190394878 | Component Carrier With Integrated Inductor and Manufacturing Method - Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure. | 2019-12-26 |
20190394879 | LIGHT EMITTING DEVICE WITH EXTENDABLE AND FLEXIBLE CARRIER - A light-emitting device comprises a flexible carrier having a plurality of segmentations, a light-emitting unit and a connecting wire. The flexible carrier has a carrier part and an extendable part. The light-emitting unit is set on the carrier part. The extendable part has a plurality of segmentations. The flexible carrier has a continuous common surface. | 2019-12-26 |
20190394880 | DISPLAY DEVICE - A display device includes a display substrate with a display area, a first peripheral area, and a second peripheral area, the display area having first and second sides extending in directions crossing each other, the first peripheral area adjacent to the first side, and the second peripheral area adjacent to the second side, a first driving substrate attached to the first peripheral area, the first driving substrate including a first driving circuit portion and a first link wire connected to the first driving circuit portion, a second driving substrate attached to the second peripheral area, the second driving substrate including a second driving circuit portion and a second link wire connected to the second driving circuit portion, and a flexible circuit board attached to the first driving substrate, the flexible circuit board including a third link wire connected to the first and second link wires. | 2019-12-26 |
20190394881 | WEARABLE ELECTRONICS FORMED ON INTERMEDIATE LAYER ON TEXTILES - One manner of producing more desirable clothing with electronic capabilities is to manufacture electronics, such as the charging wires or devices themselves, directly onto the textile materials. Textile materials generally do not support the manufacturing of electronic devices, in part because the surface of the textile is too rough for electronic devices or the processes used to manufacture electronic devices. An intermediate layer may be placed on the textile material to reduce the roughness of the surface of the textile material and provide other beneficial characteristics for the placement of electronic devices directly on the textile material. | 2019-12-26 |
20190394882 | WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF - The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present. | 2019-12-26 |
20190394883 | PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS VIA UTILIZATION OF ADHESIVE MATERIAL - Implementations of the disclosure describe techniques for eliminating or reducing hot tearing in via-in-pad plated over (VIPPO) solder joints by incorporating an adhesive into a printed circuit board assembly (PCBA). In an embodiment, the adhesive is an adhesive containing fluxing agent that prevents tearing by reducing a differential in thermal expansion caused by a coefficient of thermal expansion (CTE) mismatch between a plated metal of the VIPPO pads and the PCB substrate. | 2019-12-26 |
20190394884 | Connecting an Electronic Component to an Interactive Textile - This document describes techniques and apparatuses for connecting an electronic component to an interactive textile. Loose conductive threads of the interactive textile are collected and organized into a ribbon with a pitch that matches a corresponding pitch of connection points of the electronic component. Next, non-conductive material of the conductive threads of the ribbon are stripped to expose the conductive wires of the conductive threads. After stripping the non-conductive material from the conductive threads of the ribbon, the connection points of the electronic component are bonded to the conductive wires of the ribbon. The conductive threads proximate the ribbon are then sealed using a UV-curable or heat-curable epoxy, and the electronic component and the ribbon are encapsulated to the interactive textile with a water-resistant material, such as plastic or polymer. | 2019-12-26 |
20190394885 | Method and Apparatus for Flexible Circuit Cable Attachment - A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength. | 2019-12-26 |
20190394886 | MULTILAYER WIRING BOARD - A multilayer wiring board having a high degree of freedom of wiring design and realizing high-density wiring, and a method to simply manufacture the multilayer wiring board is provided. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically connected to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via. | 2019-12-26 |
20190394887 | ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN - The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated. | 2019-12-26 |
20190394888 | PATTERNING OF ELECTROLESS METALS - The present invention relates to methods and systems that utilize a catalyst or thin metal film by atomic level deposition (ALD) of one or more metals that allows fine traces deposition to the trench formed in a dielectric material, thereby minimizing potential physical damage due to embedded conductor format and making the fine space between traces to prevent electromigration in the traces. | 2019-12-26 |
20190394889 | LOCATING DEVICE - A locating device includes casing including position-limiting member defining therein receiving space and two opposing receiving slots and mounting structure on two opposite side walls thereof, fitting member having recess, through hole cut through recess, axle structure provided in recess and positioning structure for positioning in mounting structure of casing, and operating device set including lever having pivot connection head inserted through through hole into receiving space, pivot connection portion located on pivot connection head and pivotally connected to axle structure and sliding slot located on pivot connection head and sliding rod movably mounted in sliding slot and having end portion located on each of two opposite ends thereof and disposed in receiving slot. Operating device set is movable relative to fitting member between an open position where the positioning structure is unlocked from mounting structure, and a close position where the positioning structure is locked to mounting structure. | 2019-12-26 |
20190394890 | Electronic Device with Hinge Defining an Asymmetrical Service Loop for a Flexible Display and Corresponding Systems and Methods - An electronic device includes a hinge coupling at least a first device housing to a second device housing. A flexible display is coupled to the first device housing and the second device housing and spans the hinge. The first device housing defines a curvilinear recess forming at least some of the flexible display into an asymmetrical service loop when the first device housing and the second device housing pivot about the hinge from an axially displaced open position to a closed position. Additional hinges and device housings can be added to accommodate flexible displays of varying lengths. | 2019-12-26 |
20190394891 | CUSTOMIZABLE MARKETING APPARATUS - Embodiments are directed to systems, apparatuses, and methods for personalizing marketing materials such as video brochures. In one aspect, an electronic marketing system is provided that includes an electronic display device powered and a housing. A window is cut into the housing which allows the electronic display to be seen through at least a portion of the housing. A second window provides a view of an insert in the housing. A method is also provided for personalizing marketing materials and can include printing a custom design on an insert, cutting out at least a portion of the insert, arranging the cut out portion of the insert to show through a die cut window of the video brochure, and adhering the cut out portion of the insert to the video brochure in the arranged position. | 2019-12-26 |
20190394892 | Transmission Control Apparatus and Method for Fastening a Signal Input Element to a Circuit Board Element of a Transmission Control Apparatus - A transmission control apparatus, particularly for a motor vehicle, includes a circuit board element, a signal input element, a base, and a first fixing layer. The base includes a hollow space for receiving at least a part of the signal input element and is fastened on a first surface of the circuit board element. The signal input element is at least partially fastened in the hollow space and is electrically connected to the circuit board element via the base. The circuit board element includes a cut-out for inserting the signal input element into the hollow space through the circuit board element. The first fixing layer is configured for sealing the area between the base and the circuit board element and is arranged on the first surface of the circuit board element and on a part of the base. | 2019-12-26 |
20190394893 | LOCATING DEVICE - A locating device includes a guiding member, a sliding assembly and a pulling assembly. The guiding member includes a guiding space, and the sliding assembly includes a shaft part. The pulling assembly includes a pulling member, and the pulling member includes a sliding member inserted into the guiding space. An axis coupling part is disposed between the sliding member and the pulling member and pivotally connected to the shaft part. When the pulling member of the pulling assembly is operated to open or close, the sliding member is longitudinally moved in the guiding space to make the sliding assembly simultaneously move laterally, so as to form an open state or a closed state. As a result, a complicated assembly operation using screw for locking can be omitted, and the effect of decreasing whole operational difficulty and improving whole assembling speed can be achieved. | 2019-12-26 |
20190394894 | ELECTRONIC DEVICE INCLUDING MAGNET - An electronic device includes a first housing including a first side surface, a second housing including a second side surface that may face at least a portion of the first side surface, a first magnet group disposed adjacent to the first side surface in the first housing and including a first designated pattern along a lengthwise direction, and a second magnet group disposed adjacent to the second side surface in the second housing and including a second designated pattern along a lengthwise direction, wherein the first designated pattern of the first magnet group and the second designated pattern of the second magnet group are alternately magnetized with an N pole or an S pole, and wherein the first housing and the second housing are coupled together to be rotatable by the first magnet group and the second magnet group. | 2019-12-26 |
20190394895 | ARRANGEMENT OF SUPPORT ELEMENTS OF ELECTRONIC MODULES - The present disclosure relates to an arrangement of support elements for holding electronic function modules; having a first support element, wherein the first support element has a top side and a bottom side, wherein a first web receptacle is formed in the top side, and wherein a second web receptacle is formed in the bottom side; and a second support element, wherein the second support element has a first side web and a second side web, wherein the first side web can be inserted into the first web receptacle, and wherein the second side web can be inserted into the second web receptacle. | 2019-12-26 |
20190394896 | LOCATING DEVICE - A locating device includes a guiding member, a sliding member and a pulling assembly. The guiding member includes a guiding channel inwardly cut through a top thereof, and the sliding member has side plates which each has a locating part. The pulling assembly comprises a pulling body having a guiding element, a fastening element disposed on a side thereof opposite to the guiding element. When the pulling body is in an open state, the fastening element is not located on the locating part; when the pulling body performs a locking operation, the guiding element is slid in the guiding channel and the sliding member is simultaneously slid in another direction opposite to the guiding element; when the pulling body is in a locked state, the fastening element is located on the locating part. Therefore, operational difficulty can be reduced and assembly speed can be improved. | 2019-12-26 |
20190394897 | Plug Assembly - A plug assembly includes a lower cover, an upper cover mounted on the lower cover, and a circuit board. The upper cover is equipped with a heat-conducting element. The circuit board is mounted between the upper cover and the lower cover. The circuit board has two first contact portions contacting with the lower cover and the upper cover, and a plurality of second contact portions. The circuit board is equipped with a chip. The chip is mounted on and covers the plurality of the second contact portions. The chip contacts with the heat-conducting element. The circuit board opens at least one perforation. At least one of the lower cover and the upper cover protrudes towards the circuit board to form at least one fastening portion passing through the at least one perforation and contacting with the at least one of the upper cover and the lower cover. | 2019-12-26 |
20190394898 | THERMAL INTERFACE MATERIAL SHEET AND METHOD OF MANUFACTURING A THERMAL INTERFACE MATERIAL SHEET - A thermal interface material sheet, method of manufacturing a thermal interface material sheet and an electrical device. The thermal interface material sheet is to be disposed between a heat generating electrical component and a cooling device, the thermal interface material sheet comprising at least one thin film sensor and electrical conductors connected to the at least one thin film sensor for measuring a property related to the heat generating electrical component. | 2019-12-26 |
20190394899 | HEAT DISSIPATION DEVICE AND METHOD, AND ELECTRONIC DEVICE - A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device. | 2019-12-26 |
20190394900 | COOLING SYSTEM, COOLING DEVICE, AND ELECTRONIC SYSTEM - A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump. | 2019-12-26 |
20190394901 | Housing for an Electric or Electronic Device - A housing includes a cup-shaped, plastic housing case; a cooling channel guided in the housing case for fluid cooling of an electric or electronic device situated in an interior of the housing case; and a planar shielding body integrated into the housing case and traversing walls of the housing case for shielding from electromagnetic radiation. The shielding body is a metallic wire cage or trough. The cooling channel is a metallic tubing. The shielding body and the cooling channel are connected to form a frame-like, pre-assembled assembly. The pre-assembled assembly, consisting of the shielding body and the cooling channel, is extrusion-coated with a plastic or encapsulated in a plastic to form the housing case. | 2019-12-26 |
20190394902 | SELF-ORGANIZING THERMODYNAMIC SYSTEM - Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes. | 2019-12-26 |
20190394903 | ASSEMBLABLE COOLING FIN ASSEMBLY AND ASSEMBLY METHOD THEREOF - An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot. | 2019-12-26 |
20190394904 | Plug Assembly - A plug assembly includes an upper cover, a heat-conducting element, a heat-conducting pipe, a circuit board and a lower cover. A rear end of a top of the upper cover is equipped with a plurality of heat dissipation fins. The heat-conducting element includes a first heat-conducting element equipped on a bottom surface of the upper cover, and a second heat-conducting element fastened to a bottom surface of the first heat-conducting element. A top of the first heat-conducting element opens a receiving space. The heat-conducting pipe is received in the receiving space. The heat-conducting pipe extends rearward through a rear end of the receiving space. The circuit board is mounted in the upper cover and contacts with the second heat-conducting element. The lower cover is mounted to the upper cover. | 2019-12-26 |
20190394905 | Heat Dissipation Structure for Electronic Device and Electronic Device - An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame. | 2019-12-26 |
20190394906 | CONTROL OF IONIC COOLING IN WIRELESS CHARGING SYSTEMS - In accordance with some embodiments of the present invention, an ion cooling engine (ICE) controlled by a transmitting or receiving device cools a transmit or receive coil and possibly other parts of a wireless power transmitter or receiver system. In some embodiments, the ICE includes a low-voltage circuit controlled by the transmitting device and coupled to a high voltage circuit that generates the airflow. Other features are also provided. | 2019-12-26 |
20190394907 | Vehicle Power Module Assembly - A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot. | 2019-12-26 |
20190394908 | ARRANGEMENT HAVING A HOUSING AND A POWER ELECTRONICS CIRCUIT ARRANGED ON A HOUSING BASE IN THE HOUSING - An arrangement has a housing and a power electronics circuit arranged on a housing base in the housing. A cavity with connections, which lead to the housing exterior, for supplying and discharging a cooling liquid is formed in the housing base. Cooling coils through which the cooling liquid can flow are formed on that side of the housing base which is averted from the cavity. A fan which is driven by an electric motor is arranged in the housing in such a way that the air flow of the fan is cooled by the cooling coils and then draws heat from the power electronics circuit. | 2019-12-26 |
20190394909 | Receiving Device and Method for Production - A receiving device for a system for inductive power transfer has a housing with a cover part and a base part as housing parts. The housing includes an inside volume for accommodating at least one winding structure. At least one of the housing parts has at least one heat sink on an outer side. A method for producing the receiving device is also disclosed. | 2019-12-26 |
20190394910 | ATTACHABLE PORTABLE PROTECTIVE CONTAINERS - Apparatus for protecting sensitive equipment from impact, dust, dirt, moisture, smoke, and flame comprised of a container that attaches to load bearing equipment used by military, law enforcement and related professions. Apparatus for an attachable protective case capable isolating sensitive equipment from electromagnetic radiation. The apparatus can include an attachment component pivotably associated with the container. A distal end of the attachment component can include a locking feature releasably engageable with a corresponding locking feature disposed on a portion of the container such that the attachment component captures a portion of material of a separate device between the attachment component and the container. | 2019-12-26 |
20190394911 | ELECTROMAGNETIC-WAVE-ABSORBING COMPOSITE SHEET - An electromagnetic-wave-absorbing composite sheet comprising an electromagnetic-wave-shielding film laminated on an electromagnetic-wave-absorbing film; the electromagnetic-wave-absorbing film comprising a single- or multi-layer thin metal film formed on a surface of a plastic film, the thin metal film being provided with large numbers (pluralities) of substantially parallel, intermittent, linear scratches with irregular widths and intervals in plural directions; the electromagnetic-wave-shielding film being a conductive metal foil, a plastic film having a thin conductive metal film or coating, or a carbon sheet; and an area ratio of the electromagnetic-wave-shielding film to the electromagnetic-wave-absorbing film being 10-80%. | 2019-12-26 |
20190394912 | OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHIELD USING SMT SHIELD WALL COMPONENTS - An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure. | 2019-12-26 |
20190394913 | INSPECTION APPARATUS, COMPONENT MOUNTING SYSTEM, AND COMPONENT MOUNTING METHOD - There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus. | 2019-12-26 |
20190394914 | ON-DEMAND METHOD OF MAKING PCB PALLETS USING ADDITIVE MANUFACTURING - A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base. | 2019-12-26 |
20190394915 | ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC COMPONENT HOUSING METHOD - Disclosed herein is an electronic component housing package that includes a carrier tape having a through hole for housing an electronic component, a base film stuck to the carrier tape and having a lower degree of rigidity than the carrier tape, and a release layer formed on a predetermined area of the base film so as to be exposed to the through hole of the carrier tape. | 2019-12-26 |
20190394916 | Rhododenron plant named Triton - The present invention relates to a new and distinct variety of plant named ‘Triton.’ The variety is botanically identified as | 2019-12-26 |
20190394917 | Rhododenron plant named kurachouchou - The present invention relates to a new and distinct variety of plant named ‘Kurachouchou.’ The variety is botanically identified as | 2019-12-26 |
20190394918 | Rhododenron plant named Kurachiffon - The present invention relates to a new and distinct variety of plant named ‘Kurachiffon.’ The variety is botanically identified as | 2019-12-26 |
20190394919 | Rhododenron Plant named KURAANGEL - The present invention relates to a new and distinct variety of plant named ‘Kuraangel.’ The variety is botanically identified as | 2019-12-26 |
20190394920 | Agapanthus plant named 'WP003' - A new cultivar of | 2019-12-26 |