52nd week of 2009 patent applcation highlights part 43 |
Patent application number | Title | Published |
20090317942 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR FABRICATING THE SAME - A thin film transistor substrate includes an insulating substrate, a gate electrode formed on the insulating substrate, a first gate insulating film formed on the gate electrode and having an opening for exposing at least part of the gate electrode, a second gate insulating film covering the gate electrode exposed by the opening and having a larger dielectric constant than the first gate insulating film, a source electrode and a drain electrode disposed apart from each other in a central area of the second gate insulating film and defining a channel region there between, and an organic semiconductor layer formed in the channel region. A method for forming the TFT substrate is also provided. Thus, the present invention provides a TFT substrate in which a characteristic of a TFT is improved. | 2009-12-24 |
20090317943 | Alignment of Semiconducting Nanowires on Metal Electrodes - The present invention relates to a method for aligning semiconducting nanowires on a metal electrode ( | 2009-12-24 |
20090317944 | MOLDED RECONFIGURED WAFER, STACK PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING THE STACK PACKAGE - A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side surfaces of the semiconductor chips; through-electrodes formed in the molding part; and re-distribution lines formed to connect the through-electrodes and adjacent bonding pads with each other. | 2009-12-24 |
20090317945 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. | 2009-12-24 |
20090317946 | METHOD FOR PROVIDING AND REMOVING DISCHARGING INTERCONNECT FOR CHIP-ON-GLASS OUTPUT LEADS AND STRUCTURES THEREOF - Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links. | 2009-12-24 |
20090317947 | Semiconductor package with heat sink, stack package using the same and manufacturing method thereof - A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided. | 2009-12-24 |
20090317948 | METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method is provided for manufacturing a QFN type semiconductor integrated circuit device using a multi-device lead frame having a tie bar for tying external end portions of plural leads, wherein sealing resin filled between an outer periphery of a mold cavity and the tie bar is removed by a laser and thereafter a surface treatment such as solder plating is performed. | 2009-12-24 |
20090317949 | ESD Protecting Circuit and Manufacturing Method Thereof - An ESD protecting circuit and a manufacturing method thereof are provided. The ESD protecting circuit includes a device isolation layer, first and second high-concentration impurity regions, a third high-concentration impurity region of a complementary type, first and second conductive wells, and a fourth conductive impurity region. The ESD protecting circuit is configured as a field transistor without a gate electrode, and the high breakdown voltage characteristics of the field transistor are lowered by implanting impurity ions, providing an ESD protecting circuit with a low breakdown voltage and low leakage current. Because the leakage current is reduced, the ESD protecting circuit can be used for an analog I/O device that is sensitive to current fluxes. Also, an N-type well may protect a junction of the field transistor. | 2009-12-24 |
20090317950 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method which sequentially forms a gate oxide film and gate electrode material over a semiconductor layer of an SOI substrate and patterns the material into gate electrodes. The method further comprises the steps of forming sidewalls made of an insulator to cover side surfaces of the gate electrode; ion-implanting into the semiconductor layer on both sides of the gate electrode to form drain/source regions; partially etching the sidewalls to expose upper parts of the side surfaces of the gate electrode; depositing a metal film to cover the tops of the drain/source regions and of the gate electrode and the exposed upper parts of the side surfaces of the gate electrode; and performing heat treatment on the SOI substrate to form silicide layers respectively in the surfaces of the gate electrode and of the drain/source regions. | 2009-12-24 |
20090317951 | SEMICONDUCTOR DEVICE - A semiconductor device has an n-channel MIS transistor and a p-channel MIS transistor on a substrate. The n-channel MIS transistor includes a p-type semiconductor region formed on the substrate, a lower layer gate electrode which is formed via a gate insulating film above the p-type semiconductor region and which is one monolayer or more and 3 nm or less in thickness, and an upper layer gate electrode which is formed on the lower layer gate electrode, whose average electronegativity is 0.1 or more smaller than the average electronegativity of the lower layer gate electrode. The p-channel MIS transistor includes an n-type semiconductor region formed on the substrate and a gate electrode which is formed via a gate insulating film above the n-type semiconductor region and is made of the same metal material as that of the upper layer gate electrode. | 2009-12-24 |
20090317952 | Memory Device and Method for Manufacturing the Same - A split gate (flash) EEPROM cell and a method for manufacturing the same is disclosed, in which a control gate and a floating gate are formed in a vertical structure, to minimize a size of the cell, to obtain a high coupling ratio, and to lower a programming voltage. The split gate EEPROM cell includes a semiconductor substrate having a trench; a tunneling oxide layer at sidewalls of the trench; a floating gate, a dielectric layer and a control gate in sequence on the tunneling oxide layer; a buffer dielectric layer at sidewalls of the floating gate and the control gate; a source junction in the semiconductor substrate at the bottom surface of the trench; a source electrode in the trench between opposing buffer dielectric layers, electrically connected to the source junction; and a drain junction on the surface of the semiconductor substrate outside the trench. | 2009-12-24 |
20090317953 | Memory Device and Method for Manufacturing the Same - A split gate (flash) EEPROM cell and a method for manufacturing the same is disclosed, in which a control gate and a floating gate are formed in a vertical structure, to minimize a size of the cell, to obtain a high coupling ratio, and to lower a programming voltage. The split gate EEPROM cell includes a semiconductor substrate having a trench; a tunneling oxide layer at sidewalls of the trench; a floating gate, a dielectric layer and a control gate in sequence on the tunneling oxide layer; a buffer dielectric layer at sidewalls of the floating gate and the control gate; a source junction in the semiconductor substrate at the bottom surface of the trench; a source electrode in the trench between opposing buffer dielectric layers, electrically connected to the source junction; and a drain junction on the surface of the semiconductor substrate outside the trench. | 2009-12-24 |
20090317954 | Method for forming vertical channel transistor of semiconductor device - A method for forming a vertical channel transistor of a semiconductor device includes forming a plurality of pillar patterns over a substrate, forming a gate insulation layer encapsulating the resultant pillar pattern structure, forming a surrounding gate electrode conduction layer surrounding the sidewalls of the pillar pattern including the gate insulation layer, filling a sacrificial layer to a predetermined height of a surrounding gate electrode in a gap region between neighboring pillar patterns having the surrounding gate electrode conduction layer, and forming the surrounding gate electrode by removing a portion of the surrounding gate electrode conduction layer exposed by the sacrificial layer. | 2009-12-24 |
20090317955 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate and a memory electrode and a first STI region for isolating the first transistor, and a CMOS section formed at the semiconductor substrate and including a second transistor having a CMOS electrode and a gate dielectric and a second STI region for isolating the second transistor. The height of the top surface of the first STI region is set equal to or smaller than the height of the top surface of the second STI region. | 2009-12-24 |
20090317956 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming a silicon substrate having first and second surfaces, the silicon substrate including no oxide film or an oxide film having a thickness no greater than 100 nm, forming a first oxide film at least on the second surface of the silicon substrate, forming a first film by covering at least the first surface, forming a mask pattern on the first surface by patterning the first film, forming a device separating region on the first surface by using the mask pattern as a mask, forming a gate insulating film on the first surface, forming a gate electrode on the first surface via the gate insulating film, forming a source and a drain one on each side of the gate electrode, and forming a wiring layer on the silicon substrate while maintaining the first oxide film on the second surface. | 2009-12-24 |
20090317957 | Method for Forming Isolation Structures - A trench is formed in the surface of a provided semiconductor body. An oxide is deposited in the trench and a cap is deposited on the oxide, wherein the combination of the cap and the oxide impart a mechanical stress on the semiconductor body. | 2009-12-24 |
20090317958 | METHOD FOR FORMING MEMRISTOR MATERIAL AND ELECTRODE STRUCTURE WITH MEMRISTANCE - Ion Implantation is used to form the memristor material and electrode structure with memristance. First, numerous electron-rich element atoms are implanted into a layer made of transition metal or non-metal. Then, a treating process (such as annealing) is proceeded to expel some electron-rich element atoms away the layer. After that, some electron-rich element vacancy rich regions are formed inside the layer, and then a memristor material is formed. Significantly, the usage of ion implantation can precisely control and flexibly adjust the distribution of the implanted atoms, and then both the amount and distribution of these depleted regions can be effectively adjusted. Hence, the quality of the memristor material is improved. | 2009-12-24 |
20090317959 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A manufacturing method for manufacturing a super-junction semiconductor device forms an oxide film and a nitride film on an n-type epitaxial layer exhibiting high resistance on an n-type semiconductor substrate exhibiting low resistance. The portion of the nitride film in the scribe region is left unremoved by patterning and an alignment marker is opened through the nitride film. After opening a trench pattern in the oxide film, trenches having a high aspect ratio are formed. The portion of the oxide film outside the scribe region is removed and a p-type epitaxial layer is buried in the trenches. The overgrown p-type epitaxial layer is polished with reference to the nitride film, the polished surface is finished by etching, and the n-type epitaxial layer surface is exposed. | 2009-12-24 |
20090317960 | WAFER BONDING APPARATUS - Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit ( | 2009-12-24 |
20090317961 | BEAM HOMOGENIZER AND LASER IRRADIATION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The inhomogeneous energy distribution at the beam spot on the irradiated surface is caused by a structural problem and processing accuracy of the cylindrical lens array forming an optical system. | 2009-12-24 |
20090317962 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR PRODUCTION EQUIPMENT AND STORAGE MEDIUM - A method for manufacturing a semiconductor device, semiconductor production equipment, and a storage medium, which suppress abnormal arc discharge occurring when plasma is excited while preventing misalignment of a substrate placed on an electrostatic chuck, are provided. The method includes a first process in which a substrate is placed on an electrostatic chuck in a reaction container and a first electrostatic chuck voltage is applied to the electrostatic chuck to absorb the substrate onto the electrostatic chuck, a second process in which the first electrostatic chuck voltage is reduced to a second electrostatic chuck voltage, a third process in which a high-frequency voltage is applied between parallel plate electrodes in the reaction container to generate plasma, and a fourth process in which the second electrostatic chuck voltage is changed to a third electrostatic chuck voltage higher than the second electrostatic chuck voltage. | 2009-12-24 |
20090317963 | PLASMA DOPING PROCESSING DEVICE AND METHOD THEREOF - An amount of leakage of a substrate-cooling gas into a vacuum container is measured by using a flow-rate measuring device so that the flow rate of a diluting gas that is the same as the substrate-cooling gas is controlled by a control device or a plasma doping time is prolonged, in accordance with the amount of leakage. | 2009-12-24 |
20090317964 | PLATEN FOR REDUCING PARTICLE CONTAMINATION ON A SUBSTRATE AND A METHOD THEREOF - Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity. | 2009-12-24 |
20090317965 | ELECTRICAL CONTACT FOR TERMINATING A COAXIAL CABLE - An electrical contact is provided for terminating an electrical conductor of a coaxial cable. The electrical contact includes a body having a first element extending between a cable receiving end portion and a contact portion. The first element includes a first surface configured to engage the electrical conductor. A second element extends from the cable receiving end portion of the first element. The second element includes a second surface configured to engage the electrical conductor. The first and second elements are configured to hold a portion of the electrical conductor therebetween such that the coaxial cable extends outwardly from the cable receiving end portion of the first element. | 2009-12-24 |
20090317966 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device manufacturing method has forming a metal film containing platinum by depositing a metal on a source/drain diffusion layer primarily made of silicon formed on a semiconductor substrate and on a device isolation insulating film; forming a silicide film by silicidation of an upper part of the source/drain diffusion layer by causing a reaction between silicon in the source/drain diffusion layer and the metal on the source/drain diffusion layer by a first heating processing; forming a metal oxide film by a oxidation processing to oxidize selectively at least a surface of the metal film on the device isolation insulating film; increasing the concentration of silicon in the silicide film by a second heating processing; and selectively removing the metal oxide film and an unreacted part of the metal film on the device isolation insulating film. | 2009-12-24 |
20090317967 | SEMICONDUCTOR DEVICE HAVING VERTICAL CHANNELS AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device which can prevent leakage current caused by gate electrodes intersecting element isolation layers in a major axis of an active region, and which further has vertical channels to provide a sufficient overlap margin, and a semiconductor device manufactured using the above method. The device includes gate electrodes formed on element isolation layers that are disposed between active regions and have top surfaces that are higher than the top surfaces of the active regions. Since the gate electrodes are formed on the element isolation layers, leakage current in a semiconductor substrate is prevented. In addition, the gate electrodes are formed using a striped shape mask pattern, thereby obtaining a sufficient overlap margin compared to a contact shape or bar shape pattern. | 2009-12-24 |
20090317968 | Method for Manufacturing Memory Element - A conductive paste including conductive particles each of which has a size of greater than or equal to 0.1 μm and less than or equal to 10 μm, a resin, and a solvent is placed over a first conductor and the solvent is vaporized. In this manner, a second conductor having the conductive particles and a memory layer including the resin between the first conductor and the conductive particles is formed. | 2009-12-24 |
20090317969 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD AND STRUCTURE FOR IMPLEMENTING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is extended to an upper surface of the projection. Therefore, productivity of the semiconductor is improved. | 2009-12-24 |
20090317970 | METHOD FOR FORMING AN ON-CHIP HIGH FREQUENCY ELECTRO-STATIC DISCHARGE DEVICE - A method for forming an on-chip high frequency electro-static discharge device on an integrated circuit is described. In one embodiment of the method, a capped first dielectric layer with more than one electrode formed therein is provided. A second dielectric layer is deposited over the capped first dielectric layer. A first hard mask dielectric layer is deposited over the second dielectric layer. A cavity trench is formed through the first hard mask dielectric layer and the second dielectric layer to the first dielectric layer, wherein the cavity trench is formed in the first dielectric layer between two adjacent electrodes. At least one via is formed through the second dielectric layer about the cavity trench. A metal trench is formed around each of the at least one via. A release opening is formed over the cavity trench. A third dielectric layer is deposited over the second dielectric layer, wherein the third dielectric layer hermetically seals the release opening to provide electro-static discharge protection. | 2009-12-24 |
20090317971 | RESTORING LOW DIELECTRIC CONSTANT FILM PROPERTIES - A method for restoring the dielectric constant of a low dielectric constant film is described. A porous dielectric layer having a plurality of pores is formed on a substrate. The plurality of pores is then filled with an additive to provide a plugged porous dielectric layer. Finally, the additive is removed from the plurality of pores. | 2009-12-24 |
20090317972 | METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING METAL SILICIDE LAYERS AND DESIGN STRUCTURES FOR THE DEVICES - Methods of forming metal silicide layers. The methods include: forming a silicon-rich layer between dielectric layers; contacting the silicon-rich layer with a metal layer and heating the silicon rich-layer and the metal layer to diffuse metal atoms from the metal layer into the silicon layer to form a metal silicide layer. | 2009-12-24 |
20090317973 | METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING METAL SILICIDE LAYERS AND DESIGN STRUCTURES FOR THE DEVICES - Electronic devices and design structures of electronic devices containing metal silicide layers. The devices include: a thin silicide layer between two dielectric layers, at least one metal wire abutting a less than whole region of the silicide layer and in electrical contact with the silicide layer. | 2009-12-24 |
20090317974 | POLISHING COMPOSITION FOR SILICON WAFER, POLISHING COMPOSITION KIT FOR SILICON WAFER AND METHOD OF POLISHING SILICON WAFER - The present invention provides a polishing composition which can remove a natural oxidized layer on a silicon wafer and can efficiently polish the silicon wafer. The polishing composition of the present invention comprises colloidal ceria and an alkaline polishing composition. The polishing composition of the present invention may further comprise a chelating agent. The present invention includes a polishing method comprising removing an oxidized layer with colloidal ceria; a polishing method comprising removing an oxidized layer with colloidal ceria and polishing a silicon wafer with an alkaline polishing composition; and a polishing method comprising polishing a silicon wafer with a polishing composition comprising colloidal ceria and an alkaline polishing composition. Further, the present invention relates to a polishing composition kit comprising colloidal ceria and an alkaline polishing composition. | 2009-12-24 |
20090317975 | METHOD FOR FORMING AN 0N-CHIP HIGH FREQUENCY ELECTRO-STATIC DISCHARGE DEVICE - A method for forming an on-chip high frequency electro-static discharge device is described. In one embodiment, a wafer with a multi-metal level wiring is provided and a hermetically sealed gap is formed therein to provide electro-static discharge protection for an integrated circuit. | 2009-12-24 |
20090317976 | ETCHING SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - An etching system includes: a vacuum chamber; a stage for mounting a workpiece, the stage being disposed within the vacuum chamber; a first electrode located within the vacuum chamber and above the stage; a second located between the first electrode and a ceiling of the vacuum chamber; a gas supply for introducing a process gas into the vacuum chamber; a variable capacitance element connected to the second electrode; and a radio frequency power supply connected to the first electrode and connected through the variable capacitance element to the second electrode. The radio frequency power supply supplies radio frequency power to the first and second electrodes to produce an inductively coupled plasma in the process gas within the vacuum chamber. | 2009-12-24 |
20090317977 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A manufacturing method for a semiconductor device includes: forming a first deposition film on a surface of a member in a chamber configured to perform plasma etching of a wafer, by introducing a first seasoning gas into the chamber; forming a second deposition film on the first deposition film to coat the first deposition film by introducing a second seasoning gas into the chamber; loading the wafer into the chamber; and performing plasma etching of the wafer. | 2009-12-24 |
20090317978 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - In one aspect of the present invention, a method of manufacturing semiconductor device may include forming a second core on a member to be processed, and a first core on the second core, the second core located below the first core and having a width larger than that of the first core, forming a coating film on a top surface and side surfaces of the first core, and a top surface and side surfaces of the second core, processing the coating film into sidewall masks by partially removing the coating film in a manner that portions of the coating film, which are located on the side surfaces of the first and second cores, are left remaining, etching the first and second cores by using the sidewall masks as a mask so as to remove the first core and portions of the second core which are not covered with the sidewall masks from above, so that an etching mask including the sidewall masks and portions of the second core which remain directly below the sidewall masks is formed, and etching the member by using the etching mask as a mask, so that the member is patterned. | 2009-12-24 |
20090317979 | METHOD FOR PATTERNING AN ACTIVE REGION IN A SEMICONDUCTOR DEVICE USING A SPACE PATTERNING PROCESS - Disclosed here in is a method for patterning an active region in a semiconductor device using a space patterning process that includes forming a partition pattern having partition pattern elements arranged in a square shape on a semiconductor substrate; forming a spacer on side walls of the partition pattern; removing the partition pattern; separating the spacer into first and second spacer portions to expose a portion of the semiconductor substrate; and etching the exposed portion of the semiconductor substrate to form a trench, wherein portions of the semiconductor substrate overlapped with the first and second spacer portions define an active region. | 2009-12-24 |
20090317980 | FILTER, SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A filter connectable to an external circulating system, the circulating system being included by a substrate treatment apparatus which etches a substrate with an H | 2009-12-24 |
20090317981 | Substrate treating apparatus and method for selectively etching substrate surface - Provided is a substrate treating method for selectively etching a surface of a substrate. In the substrate treating method, an etchant is supplied to a center portion of a rotating substrate through a first nozzle, and an etch prevention fluid is supplied through a second nozzle disposed at a predetermined position apart from the center portion of the substrate so as to dilute the etchant. | 2009-12-24 |
20090317982 | ATOMIC LAYER DEPOSITION APPARATUS AND METHOD FOR PREPARING METAL OXIDE LAYER - An atomic layer deposition apparatus comprises a reaction chamber, a heater configured to heat a semiconductor wafer positioned on the heater, an oxidant supply configured to deliver oxidant-containing precursors having different oxidant concentrations to the reaction chamber, and a metal supply configured to deliver a metal-containing precursor to the reaction chamber. The present application also discloses a method for preparing a dielectric structure comprising the steps of placing a substrate in a reaction chamber, performing a first atomic layer deposition process including feeding an oxidant-containing precursor having a relatively lower oxidant concentration and a metal-containing precursor to form an thinner interfacial layer on the substrate, and performing a second atomic layer deposition process including feeding the oxidant-containing precursor having an oxidant concentration higher than that used to grow the first metal oxide layer and the metal-containing precursor into the reaction chamber. | 2009-12-24 |
20090317983 | Process for Producing Silicon Carbide Semiconductor Device - In a bipolar silicon carbide semiconductor device in which an electron and a hole recombine with each other during current passage within a silicon carbide epitaxial film grown from a surface of a silicon carbide single crystal substrate, an object described herein is the reduction of defects which are the nuclei of a stacking fault which is expanded by current passage, thereby suppressing the increase of the forward voltage of the bipolar silicon carbide semiconductor device. In a method for producing a bipolar silicon carbide semiconductor device, the device is subjected to a thermal treatment at a temperature of 300° C. or higher in the final step of production. Preferably, the above-mentioned thermal treatment is carried out after the formation of electrodes and then the resulting bipolar silicon carbide semiconductor device is mounted in a package. | 2009-12-24 |
20090317984 | Rotary Connector Device - There are provided a body, a rotor, a free motion spacer including a group of spacer sections arranged circularly between the body and the rotor and a reverse guide section in which a guide face is provided to be opposed to a roller in the group of spacer sections in the circumferential direction to form a reverse insert section and capable of turning with rotation of the rotor, and a flat cable which is reversed by inserting the reverse section into the reverse insert section in the free motion spacer and is wound around the outer and inner peripheral sides of the group of spacer sections where ribs | 2009-12-24 |
20090317985 | Magnetic Interconnection Device - According to one embodiment, a first magnetic coupling element is coupled to a first conductive element of a first electrical circuit. A second magnetic coupling element is coupled to a second conductive element of a second electrical circuit. The second magnetic coupling element is operable to attract the first magnetic coupling element using a magnetic force such that electrical contact is made between the first conductive element and the second conductive element | 2009-12-24 |
20090317986 | SKIVED ELECTRICAL CONTACT FOR CONNECTING AN IC DEVICE TO A CIRCUIT BOARD AND METHOD OF MAKING A CONTACT BY SKIVING - The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed. | 2009-12-24 |
20090317987 | ELECTRICAL CONNECTOR - An electrical connector including a housing, conductive contacts arranged in the housing, each of which has a fixed beam fixed to the housing, a movable beam having a contacting projection and an engaging portion and a connecting strut for connecting the movable beam with the fixed beam, and an actuator rotatable for taking up first and second stations selectively and for engaging with the engaging portion of the conductive contact to cause the contacting projection of the conductive contact to come into press-contact with one of connecting terminals arranged on a circuit board having been inserted into the housing when rotated to shift from the first station to the second station, wherein a first side edge portion of the connecting strut on the side of the contacting projection of the movable beam is substantially perpendicular to the fixed beam and a second side edge portion of the connecting strut on the side of the engaging portion of the movable beam slants from the movable beam to the fixed beam so that a first end portion of the connecting strut connected with the fixed beam is wider in a direction along which the fixed beam elongates than a second end portion of the connecting strut connected with the movable beam, and the movable beam swings with a fulcrum at the second end portion of the connecting strut. | 2009-12-24 |
20090317988 | BURN-IN SOCKET WITH ADAPTER FOR LOADING IC PACKAGE - A burn-in socket for receiving an IC package comprises a base defining a cavity for receiving the IC package and an adapter retained in the cavity. The adapter has two-pieces configuration and comprises a loading board for loading the IC package and a positioning board assembled upon the bottom plate of the loading board for positioning the IC package. | 2009-12-24 |
20090317989 | THROUGH BOARD INVERTED CONNECTOR - A connector assembly is configured to be mounted to a substrate that has an opening extending between a mounting side and an opposing side. The connector assembly includes a housing and one or more contacts. The housing has a front end and a back end, with an interior chamber extending inwards from a mating interface. The front end of the housing is configured to be partially inserted through the opening in the substrate until a housing mounting surface engages the mounting side of the substrate. The contact extends between a mating end and a contact mounting surface. The contact mounting surface is configured to be mounted to the mounting side of the substrate. The housing and contact mounting surfaces are substantially coplanar in a mounting plane, and a distance between the mating interface and the mounting plane is at least as great as a thickness of the substrate. | 2009-12-24 |
20090317990 | THROUGH BOARD INVERTED CONNECTOR - A connector assembly includes a housing and a contact. The housing extends from a front end to an opposite back end. The housing includes an interior chamber inwardly extending from the front end that is configured to receive a mating connector through the front end of the housing. The contact is joined with the housing and extends between a mating end and a mounting surface. The mating end is configured to engage a mating contact of the mating connector. The mounting surface is configured to be mounted to a substrate to electrically couple the mating connector with the substrate. The housing extends through an opening in the substrate such that the housing protrudes from opposite sides of the substrate. | 2009-12-24 |
20090317991 | OBJECT FITTING/REMOVING DRIVE UNIT, AND CONNECTOR UNIT - An object fitting/removing drive unit which is capable of enhancing accuracy of positioning and fitting of objects to be connected. To determine a position of a header connector on an imaginary plane which is orthogonal to a fitting/removing direction of a cable connector, cutouts which are fitted in flanges to position the flanges are formed in an inner frame. | 2009-12-24 |
20090317992 | OBJECT FITTING/REMOVING DRIVE UNIT, AND CONNECTOR UNIT - An object fitting/removing drive unit capable of fitting objects to each other, even if there is not enough working space in a fitting/removing direction of one object. Operation members holding cable connectors are accommodated in an inner frame in a manner movable in the fitting/removing direction. The inner frame is movably supported by outer frames along a direction orthogonal to the fitting/removing direction between initial and fitting-completed positions. A coupling member engaged with header connectors is movably supported by the outer frames along a direction orthogonal to the fitting/removing direction. When the inner frame is moved from the initial position to the fitting-completed position by being pressed by the coupling member, the outer frames guide the operation members toward the header connectors to fit the cable connectors and the header connectors to each other. A drive force transferring unit transfers driving force in the orthogonal direction. | 2009-12-24 |
20090317993 | Lever-Type Connector - There is provided a lever-type connector capable of preventing the dropping off from an inner housing from an outer housing to remain at a mating connector side, when the lever-type connector is separated from the mating connector. A lever-type connector is provided with an inner housing, an outer housing that is attached to the inner housing and that prevents the separation of a second seal; sliders that are received in slider receiving slots to move slidably and that have cam grooves into which cam pins arranged at the mating connector are inserted; and a lever that is provided at the outer housing to be movable and that slides the sliders. When the lever-type connector is separated from the mating connector, the sliders pull the inner housing in a direction away from the mating connector. | 2009-12-24 |
20090317994 | Rotary connector device - A rotary connector device is provided for restraining an error of rotational transmission between a steering wheel and a steering-angle sensor and restricting an increase of a steering-wheel detection error, making it possible to perform timely vehicle control. The rotary connector has: a body which is supported at a combination switch side and is adapted to pass a steering shaft; a rotor adapted to pass the steering shaft; and an attachment adapted to rotatably couple the rotor to the body and conjunctively rotate relative to the rotor, sensor-engagement recessed portions engaging with a steering-angle sensor to transmit a rotation, the recessed portions being provided at the attachment, wherein wheel-engagement protrusions engaging with a steering wheel are provided at the attachment. | 2009-12-24 |
20090317995 | Rotary Connector Device - There are provided the body supported to the side of the combination switch and having the circular wall, the rotor connected rotatably to the body and coaxial with the wall section, the free motion spacer formed circularly between the body and the rotor and capable of freely turning with rotation of the rotor, the first guide section and the roller constituting the second guide section which are provided in the free motion spacer, the first flat cable arranged along in the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the first flat cable are fixed to the body and the rotor respectively and the first flat cable is reversed by always making the convex side of the reversing section in the first flat cable contact the first guide section, and the second flat cable arranged along the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the second flat cable are fixed to the body and the rotor respectively and the second flat cable is reversed by always making the concave side of the reversing section of the second flat cable contact the roller. | 2009-12-24 |
20090317996 | Light string with improved shunt system - This utility model relates to a decorative light, and particularly, to a decorative light capable of avoiding an open circuit condition on an entire string of bulbs that operate in series when an individual bulb is removed. The decorative light comprises a socket, a bulb base, a bulb and two terminals, wherein the socket is provided with a retainer therein, which has an opening laterally extending therethrough, and an elastic, conductive ring or coil with a thickness smaller than a width of the opening is disposed within the opening. When the elastic ring or coil is in a natural state, the elastic ring extends outside the retainer through the opening at two sides of the retainer. The bulb base is further provided with an inserting partition at the bottom thereof The elastic conductive ring has two states: one is a separating state where the bulb base is inserted into the socket. In this first state, the inserting partition of the bulb base separates one side of the elastic ring or coil from the corresponding terminals. The other state is a conducting state of the two terminals when the bulb base is removed from the socket. In this second state both sides of the elastic, conductive ring or coil provide contact with the two terminals respectively. This utility model provides a decorative light capable of preventing failure of the complete string of bulbs when any bulb is removed. | 2009-12-24 |
20090317997 | SYSTEM AND METHOD FOR CONNECTING A POWER CABLE WITH A SUBMERSIBLE COMPONENT - A technique is provided for connecting a power cable to a submersible component. A connector system is used to form the connection and comprises a plurality of individual connectors for connecting power carrying conductors to the submersible component. Each of the individual connectors is separately connectable to the submersible component which enables improved sealing with respect to the submersible component. In multi-phase power applications, individual connectors can be used for each phase. | 2009-12-24 |
20090317998 | Cold cathode fluorescent lamp connecting structure for backlight module - A cold cathode fluorescent lamp connecting structure for a backlight module includes a cold cathode fluorescent lamp connecting unit having a cold cathode fluorescent lamp insertion end and a wire inlet. At least one cold cathode fluorescent lamp socket communicable with the wire inlet is formed at the cold cathode fluorescent lamp insertion end to extend into the cold cathode fluorescent lamp connecting unit in a extending predetermined direction for a cold cathode fluorescent lamp to insert into the cold cathode fluorescent lamp socket. The cold cathode fluorescent lamp connecting unit is characterized in that at least one slit is formed on the cold cathode fluorescent lamp connecting unit to extend in the same extending direction as the cold cathode fluorescent lamp insertion socket by a predetermined length and communicate with the cold cathode fluorescent lamp socket. A wire can be extended into the cold cathode fluorescent lamp connection unit via the wire inlet and pulled out of the cold cathode fluorescent lamp connecting unit via the slit to enable convenient connection and maintenance of the cold cathode fluorescent lamp. | 2009-12-24 |
20090317999 | FLOATING CONNECTOR FOR MICROWAVE SURGICAL DEVICE - A floating connector adapted for use with microwave surgical instruments is presented. The disclosure provides for the use of cost-effective and readily available non-floating connectors in a floating housing which can compensate for dimensional variations and misalignments between the connectors. Multiple connectors of varying types can therefore be used within a single support housing without requiring the costly precision manufacturing processes normally associated with such multiple connector assemblies. The floating connector is suitable for use with electrical connections as well as fluidic connections. | 2009-12-24 |
20090318000 | Electrical Contactor - In an electrical contactor a first terminal ( | 2009-12-24 |
20090318001 | CONNECTOR - The present invention provides a connector that has high contact reliability and versatility enabling the reliable electric connection of flexible printed boards with a spread in thickness and flexible printed boards with different thicknesses. In this connector, a wider portion of a connection terminal fixed to a base is lifted with a control lever in which rotatable shafts extending coaxially from end surfaces on both sides are rotatably supported on the base. In particular, bearing grooves extending in the vertical direction are provided at a pair of support clasps that are attached to respective end surfaces on both sides of the base. The rotary shafts of the control lever are mated with, and supported by, the bearing grooves rotatably and slidably in the vertical direction. | 2009-12-24 |
20090318002 | CONNECTING MEMBER - Provided is a connecting member by which an electric wire can be branched easily with high reliability. Receptacle connecting ends ( | 2009-12-24 |
20090318003 | AXIAL MULTI-WIRE BARREL CONNECTOR FOR INTERCONNECTING A CONTROLLER CONSOLE TO CATHETER INCLUDING A DISTALLY MOUNTED ULTRASOUND TRANSDUCER ASSEMBLY - A connector assembly is disclosed for coupling a signal wire bundle from a controller console to a hand-operated catheter assembly. The connector includes a female connector component having a cylindrical cavity, wire fingers disposed within the cylindrical cavity, a guide peg disposed on a surface of the cylindrical cavity at a point proximate an opening of the cylindrical cavity, and a central pin disposed on a base surface at a closed end of the cylindrical cavity. The connector also includes a male connector component having a substantially cylindrical shape having a non-uniform transverse cross-section radius. The male connector component comprises a set of signal leads disposed along arcs of a cylindrical surface of the male connector, a slot defined within the male connector's surface is arranged to accept the guide peg of the female connector component and constrain the relative positions of the male connector and female connector during engagement. | 2009-12-24 |
20090318004 | LOW PROFILE PHOTOVOLTAIC CONNECTOR - A low profile PV (LPPV) connector for placement in space restricted areas. The connector includes a plug and receptacle for interconnecting PV solar arrays. The LPPV connector may be a locking connector or a non-locking connector. An extraction tool must be used to unlock an engaged locking connector. The LPPV connector includes a plug and a receptacle that are waterproof when mated. | 2009-12-24 |
20090318005 | CONNECTOR AND ELECTRONIC DEVICE SYSTEM - A connector includes a contact; a housing holding the contact; a cable inserted into the housing; a lock mechanism held in the housing and lockable with an opponent connector; and an operating portion having a tube shape covering the cable, operably connected to the housing, and releasing the lock in response to an operation. | 2009-12-24 |
20090318006 | CONNECTOR - A connector capable of preventing a contact portion of a contact from being damaged. The contact is held by a housing having an accommodating portion for accommodating an inserting portion of an inverter board. The contact has a contact portion which is capable of being brought into contact with the inserting portion accommodated in the accommodating portion along the direction of the thickness of the inverter board. A slider which brings the contact portion of the contact into and out of contact with the inserting portion of an inverter board by sliding is slidably mounted on the housing. | 2009-12-24 |
20090318007 | ELECTRICAL INTERCONNECTION SYSTEMS AND METHODS OF ASSEMBLING THE SAME - An electrical interconnection system is described. The electrical interconnection system comprises a first contact and a second contact configured electrically couple together. The system also comprises a receptacle assembly including a receptacle shell and a first retaining ring secured within the receptacle shell. The receptacle assembly is configured to couple the first contact to the receptacle shell. The system further comprises a plug assembly including a plug shell and a second retaining ring secured within the plug shell. The plug assembly is configured to couple the second contact to the plug shell. The receptacle shell and the plug shell are further configured to align the first contact and the second contact for coupling together. | 2009-12-24 |
20090318008 | Audio Arrangement for a Mobile Unit - An arrangement includes (a) a housing situating an integrated circuit that includes first contacts and (b) a connector. The housing includes a window which exposes at least a portion of the first contacts. The connector includes second contacts disposed at a first end of the connector. The second contacts removably couple to the first contacts. A second end of the connector is coupled to an output device. The connector establishes an electrical connection for an exchange of multimedia data between the integrated circuit and the output device. | 2009-12-24 |
20090318009 | CONNECTOR RETAINER - A connector body retainer for a high temperature electrical connector used in a high temperature gas sensor retains the ceramic body portions while also permitting their hinged movement. The connector body retainer includes a pair of retainer bands each having a generally u-shaped or c-shaped profile with a base portion and a pair of opposed extending legs, the legs of each band extending toward the other in opposing arrangement to provide the retainer, with each retainer band having an outer surface, an inner surface, a hinge end and an insertion end. The legs of the respective bands which are in opposing arrangement are joined together by a respective pair of outwardly arched hinges proximate the hinge end and will allow the ceramic body portions to hinge open to receive a gas sensor at a relatively low insertion force and hinge closed to provide a relatively higher contact force. | 2009-12-24 |
20090318010 | Electrical connector with aligning means and assembly combination thereof - An electrical connector with an aligning means includes an insulating body, a plurality of terminals, a lower casing, and an aligning casing. The terminals are provided on the insulating body. The lower casing is provided on the bottom of the insulating body. The aligning casing is provided on the top of the insulating body. Both sides of the aligning casing are bent and extend to form two opposite aligning portions. Via the above arrangement, the electrical connector with an aligning means can be achieved and generate an aligning effect. Thus, the electrical connector having an aligning means can be inserted with a docking connector more quickly, and the contact therebetween will not become poor due to an external force. Furthermore, the work hours for assembling can be reduced. The present invention further provides an assembly combination of the electrical connector with aligning means. | 2009-12-24 |
20090318011 | Wire Piercing Electrical Connector - A wire piercing connector assembly, including a body including a cavity having two or more conductive protrusions, a disk connectable into the cavity, the disk including a first side and a second side, a plurality of channels extending from the first side to the second side of the disk, wherein each channel includes two first openings on the first side and one second opening on the second side, two or more wires, each wire extending into one of the first openings of one of the channels and at least partially out another of the first openings of the channel, and wherein at least one of the conductive protrusions extends into the second opening of the channel and at least partially pierces the wire to establish an electrical connection between the at least one conductive protrusion and the wire. | 2009-12-24 |
20090318012 | ELECTRICAL APPARATUS WITH A CONTACTING DEVICE - An electrical apparatus, in particular a sensor or a control unit, includes at least one component that has at least one contacting device such as a pin or a wire, where the contacting device engages a clamping section of a housing part to produce an electrical connection and has a longitudinal axis, the clamping section being formed as part of a sliding device that is situated in the housing part and is movable transversely to the longitudinal axis of the contacting device. | 2009-12-24 |
20090318013 | CABLE ASSEMBLY HAVING CONNECTOR WITH INTERIOR FRAMEWORK - A cable assembly ( | 2009-12-24 |
20090318014 | High Temperature Connector Body - A ceramic connector body for a high temperature electrical connector, such as those used in high temperature gas sensors, incorporates a pair of opposing ceramic body portions which are operative for pivoting engagement and to be fixed in a connector body retainer which also enables their pivoting, hinged movement. The pivoting engagement permits the ceramic body portions to hinge open to receive a gas sensor with a low insertion force and a hinge close to provide the desired contact force. The ceramic body portions are also operative to house conductive terminals which provide electrical contact for power and signal communication with a gas sensor. | 2009-12-24 |
20090318015 | CONNECTOR JACK WITH REDUCED HOST PCB FOOTPRINT, ASSEMBLY THEREOF AND FABRICATION METHOD OF THE SAME - A connector jack with reduced host PCB footprint and an assembly of the same are provided. The provided connector jack is constructed based on a housing defining at least a front face with a plug receiving cavity on the surface thereof and with a plurality of electrical contacts positioned within the cavity, and a bottom face having a recess area on the surface thereof and adapted for mounting on a circuit board. In the present invention, at least a portion of the housing is made of a transparent or translucent material so that the status indicators located within the recess will be visible through the transparent portion of the front face of the jack housing, and the recess area occupies a substantial portion of the bottom face and allows to place additional components on the circuit board at least partially within the recess area. | 2009-12-24 |
20090318016 | FIXING SYSTEM AND FASTENING ELEMENT WHICH CAN BE USED THEREFOR - The invention relates to a fixing system for electronic and/or electric components—called E components in short—such as chips, circuits, transponders, cables ( | 2009-12-24 |
20090318017 | Small Foot Print Rugged Low Cost RF Connector with Improved Performance - An RF launch architecture that includes a circuit board including a conducting trace on a first side with a via proximate to the conducting trace and extending from the first side through the circuit board to a second side. Also included is an RF coaxial cable that has 1) a ferrule, coupled with a metallic shield of the cable, coupled with the second side and in electrical communication with the second side, 2) an insulator extending through the via to exit from the first side, wherein the ferrule surrounds a portion of a periphery of the insulator; and 3) a center core located within the insulator and extending through the via to exit from the first side, the center core extending above the insulator. | 2009-12-24 |
20090318018 | COAXIAL CABLE CONNECTOR HOUSING - A housing is provided for a coaxial cable connector that terminates a coaxial cable. The housing includes a cable-receiving end portion configured to engage an insulating cover of the coaxial cable, a mating end portion configured to engage another coaxial connector, and a base extending between the cable-receiving end portion and the mating end portion. The base is configured to engage an outer electrical conductor of the coaxial cable. The housing also includes an electrical contact. The electrical contact includes an extension extending outwardly from the electrical contact, wherein the extension is configured to engage the outer electrical conductor of the coaxial cable. | 2009-12-24 |
20090318019 | ELECTRICAL CONNECTOR FOR TERMINATING A COAXIAL CABLE - An electrical connector is provided for terminating a coaxial cable. The electrical connector includes an electrically conductive housing extending a length between a cable-receiving end portion configured to engage an insulating cover of the coaxial cable and a mating end portion configured to engage another electrical connector. The housing includes an outer electrical contact. An insulating member is held by the housing. An inner electrical contact is held by the insulating member. The inner electrical contact includes a slot configured to receive an inner electrical conductor of the coaxial cable. | 2009-12-24 |
20090318020 | ADAPTER FOR A COAXIAL CABLE CONNECTOR - An adapter is provided for mating first and second coaxial cable connectors having first and second receptacle contacts, respectively. The adapter includes an inner electrical contact extending between opposite first and second plug contact end portions. The first plug contact end portion is configured to be received within the first receptacle contact of the first coaxial cable connector. The second plug contact end portion is configured to be received within the second receptacle contact of the second coaxial cable connector. The adapter also includes an outer electrical contact defining a receptacle. The outer electrical contact is configured to hold the inner electrical contact within the receptacle. | 2009-12-24 |
20090318021 | ULTRAMINIATURE COAX CONNECTOR - An ultraminiature coax connector (UMCC) is provided for terminating a coaxial cable. The UMCC includes an electrically conductive housing extending between a cable-receiving end portion and a mating end portion. The cable-receiving end portion being is configured to engage an insulating cover of the coaxial cable. The mating end portion is configured to engage another UMCC. The housing includes an outer electrical contact at the mating end portion. The outer electrical contact includes an outer diameter in the range of approximately one millimeter to approximately four millimeters or an inner diameter in the range of approximately one millimeter to approximately four millimeters. An insulating member is by the housing. An inner electrical contact is held by the insulating member. The inner electrical contact includes a plug contact portion that is configured to be received by a receptacle contact portion of the other UMCC. | 2009-12-24 |
20090318022 | Plug connector having a secondary lock for an electrical plug connection - A plug connector for an electrical plug connection including a contact chamber housing, having a plurality of contact chambers for receiving a contact body each, which is introducible into the contact chamber and is primarily engaged in the contact chamber housing in its end position, and having a secondary locking element which is guided displaceably across the direction of introduction of the contact bodies and which, in its locking position, respectively protrudes laterally into the contact chambers with a locking projection for secondarily locking the contact bodies primarily engaged there. The contact chamber housing is subdivided into a plurality of contact chamber housing sections each having at least one series of contact chambers by one or more parallel separating gaps, each of the contact chambers being open toward a separating gap or an outside of the contact chamber housing parallel thereto, the secondary locking element is a frame subdivided into compartments by one or more parallel partitions, the partitions engaging into the separating gaps when the secondary locking element is plugged onto the contact chamber housing, closing the laterally open contact chambers, and the secondary locking element plugged onto the contact chamber housing is displaceably guided across the direction of introduction of the contact bodies into the locking position. | 2009-12-24 |
20090318023 | ELECTRICAL CONNECTOR WITH SLOTTED SHIELD - A connector housing includes a housing and a shield. The housing has an interior chamber extending between housing mating and back ends. The inner surface has loading and transition portions, with the loading portion located proximate to the housing mating end and the transition portion located proximate to the housing back end. The shield is shaped to fit in the interior chamber and extends between a shield mating end and a shield back end. The shield back end includes a ground contact opening. The shield includes a rim protruding from the shield back end that extends around a portion of an outer periphery of the shield back end. The rim includes a plurality of rim ends separated by a gap. The rim engages the transition portion to prevent the shield being removed through the housing mating end and the gap exposes a portion of the transition portion. | 2009-12-24 |
20090318024 | ELECTRICAL CONNECTOR HAVING REDUCED SIZE - An electrical connector ( | 2009-12-24 |
20090318025 | SHIELD CONNECTOR - A shield connector includes a housing that has a metal terminal, a conductive inner shield shell that contains the housing, and a conductive outer shield shell that contains the inner shield shell. The inner shield shell includes a first shell body in a tubular shape for covering an outer face of the housing. The outer shield shell includes a second shell body in a tubular shape, and a fixing portion which fixes the inner shield shell. The fixing portion has an annular wall which is formed inside of the second shell body along in a circumferential direction of the second shell body. An inner face of the annular wall is tightly face-contacted on an outer face of the first shell body of the inner shield shell over an entire circumference of the outer face of the first shell body. | 2009-12-24 |
20090318026 | ELECTRICAL CONNECTOR WITH ADDITIONAL MATING PORT - An electrical connector includes an electrical receptacle and an electrical plug for mating with the electrical receptacle. The electrical receptacle includes a first port, a second port communicating with the first port. The second port can accommodate a standard B-type USB 2.0 plug. The first and the second ports can be combined to receive the electrical plug for high-speed signal transmission. | 2009-12-24 |
20090318027 | LIGHT-EMITTING DIODE AND A FAIRY LIGHT WITH THE LIGHT-EMITTING DIODE - A light-emitting diode (LED) has a body and two terminals protruding from a bottom of the body. Each terminal has at least one distal and proximal positioning protrusions. A fairy light of the LED has a casing, two wires being mounted in the casing and a partition being mounted between the wires. The distal and proximal positioning protrusions of the terminals of the LED hold insulating shells and electric cords of the wires. Thus, the LED is easily, securely and stably to be electrically connected to the wires so an assembling procedure can be done with automatic machines. Furthermore, the LED is held in position with the partition being mounted between the wires. Therefore, not only assembling processes but also assembling components of the LED and the fairy light with the LED are saved. Consequently, manufacturing costs are saved. | 2009-12-24 |
20090318028 | Connecting Hardware With Multi-Stage Inductive And Capacitive Crosstalk Compensation - A connector and method of crosstalk compensation within a connector is disclosed. The method includes determining an uncompensated crosstalk, including an uncompensated capacitive crosstalk and an uncompensated inductive crosstalk, of a wired pair in a connector. The uncompensated crosstalk includes common mode and differential mode crosstalk. The method includes applying at least one inductive element to the wired pair, where the at least one inductive element is configured and arranged to provide balanced compensation for the inductive crosstalk caused by the one or more pairs. The method further includes applying at least one capacitive element to the wired pair, where the at least one capacitive element is configured and arranged to provide balanced compensation for the capacitive crosstalk caused by the one or more wired pairs. | 2009-12-24 |
20090318029 | Board-to-board connector for mounting on a circuit board - A board-to-board connector for mating with another connector has a housing and a plurality of terminals. The terminals and housing interact at a reference surface to accurately locate the terminals relative to the housing. The housing includes an elongated recess that extends parallel to a longitudinal axis of the housing and has a plurality of terminal receiving cavities spaced therealong. Each cavity includes a terminal retention wall with a reference surface on one side thereof and a terminal alignment opening extending from the cavity. Each terminals is disposed in a terminal receiving cavity. Each terminal includes a U-shaped retention portion, an L-shaped resilient contact portion extending from the U-shaped retention portion and has a contact projection thereon. A tail portion for interconnection to a circuit member is also provided. The U-shaped retention portion includes first and second spaced apart legs and a connecting portion therebetween with the U-shaped retention portion dimensioned to securely receive the terminal retention wall of the housing between the spaced apart legs. The first leg is positioned along and engages the reference surface in order to accurately position the terminal within the terminal receiving cavity, and a terminal alignment projection extends from the U-shaped retention portion and projects into the terminal alignment opening to further position and secure the terminal within the cavity. | 2009-12-24 |
20090318030 | ELECTRIC CARD CONNECTOR AND MANUFACTURING METHOD THEREOF - An electric card connector and a manufacturing method thereof are proposed. The electric card connector includes a base having a plurality of electrically conductive terminals, and a lid having a pair of arms formed at two sides thereof for holding an electric card. Pivot parts are provided at the two sides of the lid and hinge parts are formed on the base corresponding to the pivot parts so that when the lid lies on the base, the pivot parts are allowed to slide along the hinge parts without substantial spin. Tenons are formed at front ends of the arms and a latching portion is provided at a front end of the base corresponding to the tenons so that when the lid slides along the base to engage the tenons with the latching portion, the lid and base are mutually positioned and restricted from relative movement. | 2009-12-24 |
20090318031 | Transfer plug with an attractive-shaped accessory - A transfer plug or a socket and the like with an attractively-shaped accessory includes a attractively-shaped accessory combined with an outer surface of the transfer plug or the socket and the like for giving an ornamental appearance. Further, the attractively-shaped accessory is provided with an electronic appliance so that the transfer plug or the socket and the like may appear lively and attractive and practical as well. Besides, the attractively-shaped accessory can be replaced with another one with a different shape from the transfer plug or the socket and the like, enabling a consumer to always change it for boosting interest and atmosphere. | 2009-12-24 |
20090318032 | CONNECTION APPARATUS FOR PARALLEL RUNNING GENERATORS - In an apparatus for connecting two generators to run in parallel, having plugs connectable to each generator output socket, an output socket connected to an electrical load, conductive paths that connect the plugs to the output socket while merging to a common path at a junction before the output socket, and a switching circuit that opens/closes the conductive paths, there are equipped with a connecting path that interconnects the conductive paths before the junction, a dummy load installed at the connecting path and current sensors installed at each conductive path. Disconnection of the plug from the socket is detected from the detected currents and the conductive paths are opened not to connect the generators to the electrical load, thereby preventing an output of the other of the generators from appearing at the terminals of the disconnected plug, and further preventing misjudging current change of the instantaneous no load condition as plug disconnection. | 2009-12-24 |
20090318033 | ELECTRICAL CONNECTOR WITH A COMPLIANT CABLE STRAIN RELIEF ELEMENT - An electrical connector includes a housing including a rear end. The housing has a cable bore configured to receive a cable, and the housing has an outer pocket positioned radially outward from, and surrounding portions of, the cable bore. A strain relief element is coupled to the housing. The strain relief element includes an end wall having an opening therein. The strain relief element has a flexible beam extending axially inward from the end wall proximate to the opening that is configured to engage the cable. The strain relief element also has a mounting tab extending axially inward from the end wall that is received in the outer pocket and that engages the housing to secure the strain relief element to the housing. | 2009-12-24 |
20090318034 | ELECTRICAL CONNECTORS AND MATING CONNECTOR ASSEMBLIES - An electrical connector includes a terminal body defining at least two openings therein. Electrical terminals positioned in each of the at least two openings defined by the terminal body include respective crimp sections that extend beyond an end of the terminal body. A separator fin attached to the end of the terminal body extends beyond the crimp sections of the electrical terminals and is located between the at least two openings in the terminal body so that the separator fin defines a structure that is closed on an inner side to physically separate the crimp sections of the electrical terminals and open on an outer side so that the crimp sections of the electrical terminals are exposed. | 2009-12-24 |
20090318035 | Direct Battery Configuration - A battery contact apparatus has one fixed contact formed on a printed circuit board and a displaced movable contact. At least one battery is insertable into the space between the contacts. The movable contact biases the battery toward the fixed contact to provide a complete electrical circuit. | 2009-12-24 |
20090318036 | CONNECTOR FOR ELECTRICAL CONNECTION - In a connector, a fixed member is configured to be fixed to a substrate. An insertion member is arranged separate from the fixed member and configured to be insertable into an insertion part of a mating connector. Pairs of contacts are arranged on side surfaces of the insertion part of the mating connector to connect the fixed member and the insertion member to each other. Each contact includes a first fixed part fixed to the fixed member, a second fixed part fixed to the insertion member, and a contact part to contact with a contact piece of the mating connector. A cross-sectional shape of a portion of each contact between the first fixed part and the second fixed part is such that the insertion member is displaceable relative to the fixed member in an arranging direction of the pair of contacts and a direction perpendicular to the arranging direction. | 2009-12-24 |
20090318037 | Cell Connector For Electronically Contacting Planar Power Sources, And Use Thereof - The present invention relates to a cell connector (CC) for electrical contacting of planar current sources, the cell connector being able to be contacted electrically with the current source merely in regions. The cell connector thereby comprises at least one electrically conductive layer which is configured as a transit region and via contact regions which constitute merely a fraction with respect to the total surface area of the transit region is contacted with the current source. | 2009-12-24 |
20090318038 | COWLING STRUCTURE FOR OUTBOARD MOTOR - In cowling structure for an outboard motor, a through hole is formed below an upper-cowling joining surface of a lower cowling; control cables are supported with a cable supporting groove of a back side plate, and the back side plate is fixed to the through hole; a sealing member that is covered on the outside of the control cables, is fitted into the through hole; a groove of a front side plate is placed around the control cables, and the front side plate is set onto the sealing member; and the sealing member is fixed to the lower cowling by a bolt together with the front side plate. The cowling structure for an outboard motor can prevent water intrusion by removing a notch on an upper-cowling joining surface of a lower cowling. | 2009-12-24 |
20090318039 | Boat engine cooling system - The boat engine cooling system provides cooling of the engine of a boat or other nautical vehicle through both chemical coolant, such as an antifreeze solution, and environmental water; i.e., the water the vehicle is passing through. In use, heated engine coolant is expelled by the engine and passes through a coolant inlet port formed through a hollow tank, where it is transported through a coolant pipe to the engine. Further, water from the environment (i.e., the lake, ocean or other body of water the vehicle is passing through) is injected into a cooling reservoir in the hollow tank through a water inlet port. The engine coolant passing through a central portion of the coolant pipe is cooled by the water in the cooling reservoir prior to circulating back through the engine. | 2009-12-24 |
20090318040 | BUOYAGE AND ENVIRONMENTAL MONITORING INSTRUMENT FOR USE ON REGATTA COURSES, COMPRISING AN INFLATABLE PNEUMATIC PLATFORM AND A MODULAR MAST WHICH CAN BE FOLDED AND TRANSPORTED IN A REDUCED-SIZE COMPACT PACKING CONTAINER - The present invention relates to an instrument for marking and environmental monitoring in regatta courses. Incorporated by inflatable pneumatic platform and modular mast, foldable and transportable in compact packing of reduced size. It is intended to simultaneously define the area of conducting such nautical trials, at the same time as the environmental conditions thereof are characterized, in both meteorological and oceanographic terms. The system comprises an inflatable pneumatic float ( | 2009-12-24 |
20090318041 | SWIMMING AID - A device for use in swimming comprising an elongate elastic member for positioning on the posterior forearm of a swimmer's arm, a first attachment means for attaching one end to a distal portion of the arm near the hand or wrist of the swimmer, and a second attachment means for attaching the other end to an intermediate portion of the arm near the swimmer's elbow. The device vibrates and creates turbulence on the posterior side of the forearm, enabling the swimmer to modify his or her stroke to maximise the generated turbulence, encouraging correct stroke technique. | 2009-12-24 |