51st week of 2010 patent applcation highlights part 45 |
Patent application number | Title | Published |
20100323499 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is disclosed in which, after semiconductor function regions and patterns of interlayer insulating films including required contact holes are formed on one main surface side of a semiconductor substrate, an aluminum film or an aluminum alloy film which is thick is formed all over the main surface side of the semiconductor substrate and brought into conductive contact with the surface of the semiconductor substrate including bottom surfaces of the contact holes so as to form a required electrode film. Formation of the aluminum film or the aluminum alloy film is divided into a plurality of steps so that the thickness of the aluminum film or the aluminum alloy film is formed gradually, and between every two of the plurality of steps of forming the aluminum film or the aluminum alloy film, there is provided a step of performing isotropic etching to flatten irregularities in a surface of the aluminum film or the aluminum alloy film formed in the previous step. The method for manufacturing a semiconductor device prevents the formation of voids in the surface of an Al electrode film on the surface side of a semiconductor substrate. | 2010-12-23 |
20100323500 | System and Process for Producing Nanowire Composites and Electronic Substrates Therefrom - The present invention relates to a system and process for producing a nanowire-material composite. A substrate having nanowires attached to a portion of at least one surface is provided. A material is deposited over the portion to form the nanowire-material composite. The process further optionally includes separating the nanowire-material composite from the substrate to form a freestanding nanowire-material composite. The freestanding nanowire material composite is optionally further processed into a electronic substrate. A variety of electronic substrates can be produced using the methods described herein. For example, a multi-color light-emitting diode can be produced from multiple, stacked layers of nanowire-material composites, each composite layer emitting light at a different wavelength. | 2010-12-23 |
20100323501 | PLASMA TREATMENT APPARATUS, METHOD FOR FORMING FILM, AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR - A structure of the plasma treatment apparatus is employed in which an upper electrode has projected portions provided with first introduction holes and recessed portions provided with second introduction holes, the first introduction hole of the upper electrode is connected to a first cylinder filled with a gas which is not likely to be dissociated, the second introduction hole is connected to a second cylinder filled with a gas which is likely to be dissociated, the gas which is not likely to be dissociated is introduced into a reaction chamber from an introduction port of the first introduction hole provided on a surface of the projected portion of the upper electrode, and the gas which is likely to be dissociated is introduced into the reaction chamber from an introduction port of the second introduction hole provided on a surface of the recessed portion. | 2010-12-23 |
20100323502 | METHOD FOR MANUFACTURING SOI SUBSTRATE - The present invention provides a method for manufacturing an SOI substrate including at least: an oxygen ion implantation step of ion-implanting oxygen ions from one main surface of a single-crystal silicon substrate to form an oxygen ion implanted layer; and a heat treatment step of performing a heat treatment with respect to the single-crystal silicon substrate having the oxygen ion implanted layer formed therein to change the oxygen ion implanted layer into a buried oxide film layer, wherein acceleration energy for the oxygen ion implantation is previously determined from a thickness of the buried oxide film layer to be obtained, and the oxygen ion implantation step is carried out with the determined acceleration energy to manufacture the SOI substrate. Thereby, it is possible to provide an SOI substrate manufacturing method that enables efficiently manufacturing an SOI substrate having a continuous and uniform thin buried oxide film layer. | 2010-12-23 |
20100323503 | INTEGRATED EMITTER FORMATION AND PASSIVATION - Embodiments of the present invention provide a method for forming an emitter region in a crystalline silicon substrate and passivating the surface thereof by depositing a doped amorphous silicon layer onto the crystalline silicon substrate and thermally annealing the crystalline silicon substrate while oxidizing the surface thereof. In one embodiment, the deposited film is completely converted to oxide. In another embodiment, the doped amorphous silicon layer deposited onto the crystalline silicon substrate is converted into crystalline silicon having the same grain structure and crystal orientation as the underlying crystalline silicon substrate upon which the amorphous silicon was initially deposited during emitter formation. In one embodiment, at least a portion of the converted crystalline silicon is further converted into silicon dioxide during the emitter surface passivation. | 2010-12-23 |
20100323504 | LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - It is an object of the present invention to provide a laser irradiation apparatus being able to irradiate the irradiation object with the laser beam having homogeneous energy density without complicating the optical system. The laser irradiation apparatus of the present invention comprises a laser oscillator, an optical system for scanning repeatedly a beam spot of the laser beam emitted from the laser oscillator in a uniaxial direction over the surface of the irradiation object, and a position controlling means for moving the position of the irradiation object relative to the laser beam in a direction perpendicular to the uniaxial direction. | 2010-12-23 |
20100323505 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include forming a resist on a subject layer containing silicon. The method can etch the subject layer using the resist as a mask and with a gas containing a halogen element, which is introduced into a processing chamber. After the etching of the subject layer, the method can slim a planner size of the resist with oxygen gas and a gas containing a halogen element, which are introduced into the same processing chamber. | 2010-12-23 |
20100323506 | Method for fabricating semiconductor substrates and semiconductor devices - A method for fabricating a semiconductor layer comprising: a) growing a semiconductor layer on a foreign substrate; b) forming at least one opening on the semiconductor layer, wherein the opening exposes the interface between the semiconductor layer and the foreign substrate; and c) removing at least part of the semiconductor solid state material along the interface between the semiconductor layer and the foreign substrate. The removing step c) is preferably achieved by selective interfacial chemical etching. The semiconductor layer may be utilized as a substrate for fabrication of a wide variety of electronic and opto-electronic devices and integrated circuitry products. | 2010-12-23 |
20100323507 | SUBSTRATE PROCESSING APPARATUS AND PRODUCING METHOD OF DEVICE - A substrate processor enables realization of a proper process by combining advantages of a remote plasma and a plasma generated in an entire processing chamber. The substrate processor includes a conductive member ( | 2010-12-23 |
20100323508 | PLASMA GRID IMPLANT SYSTEM FOR USE IN SOLAR CELL FABRICATIONS - A method of ion implantation comprising: providing a plasma within a plasma region of a chamber; positively biasing a first grid plate, wherein the first grid plate comprises a plurality of apertures; negatively biasing a second grid plate, wherein the second grid plate comprises a plurality of apertures; flowing ions from the plasma in the plasma region through the apertures in the positively-biased first grid plate; flowing at least a portion of the ions that flowed through the apertures in the positively-biased first grid plate through the apertures in the negatively-biased second grid plate; and implanting a substrate with at least a portion of the ions that flowed through the apertures in the negatively-biased second grid plate. | 2010-12-23 |
20100323509 | Nonvolatile semiconductor memory device and method of manufacturing the same - Provided is a nonvolatile semiconductor memory device and a method of manufacturing the same. The nonvolatile semiconductor memory device may include a tunnel insulating layer formed on a semiconductor substrate, a charge trap layer including a dielectric layer doped with a transition metal formed on the tunnel insulating layer, a blocking insulating layer formed on the charge trap layer, and a gate electrode formed on the blocking insulating layer. The dielectric layer may be a high-k dielectric layer, for example, a HfO | 2010-12-23 |
20100323510 | Methods of Forming Dispersions of Nanoparticles, and Methods of Forming Flash Memory Cells - Some embodiments include methods of forming dispersions of nanoparticles. The nanoparticles are incorporated into first coordination complexes in which the nanoparticles are coordinated to hydrophobic ligands, and the first coordination complexes are dispersed within a non-polar solvent. While the first coordination complexes are within the non-polar solvent, the ligands are reacted with one or more reactants to convert the first coordination complexes into second coordination complexes that contain hydrophilic ligands. The second coordination complexes are then extracted from the non-polar solvent into water, to form a mixture of the second coordination complexes and the water. In some embodiments, the mixture may be dispersed across a semiconductor substrate to form a uniform distribution of the nanoparticles across the substrate. In some embodiments, the nanoparticles may then be incorporated into flash memory devices as charge-trapping centers. | 2010-12-23 |
20100323511 | NONVOLATILE MEMORIES WITH LATERALLY RECESSED CHARGE-TRAPPING DIELECTRIC - Charge-trapping dielectric ( | 2010-12-23 |
20100323512 | METAL OXIDE FILM FORMATION METHOD AND APPARATUS - [Problems] There is provided a metal oxide film forming method capable of controlling a film thickness of a metal oxide even if the metal oxide is subject to a self-limited thickness. | 2010-12-23 |
20100323513 | FABRICATION METHOD OF SEMICONDUCTOR DEVICE HAVING CONDUCTIVE BUMPS - A semiconductor device having conductive bumps and a fabrication method thereof are provided. The fabrication method mainly including steps of: providing a semiconductor substrate having a solder pad and a passivation layer formed thereon with a portion of the solder pads exposed from the passivation layer; disposing a first metal layer on the solder pad and a portion of the passivation layer around the solder pad; disposing a covering layer on the first metal layer and the passivation layer, and forming an aperture in the covering layer to expose a portion of the first metal layer, wherein a center of the aperture is deviated from that of the solder pad; deposing a metal pillar on the portion of the first metal layer; and deposing a solder material on an outer surface of the metal pillar for providing a better buffering effect. | 2010-12-23 |
20100323514 | RESTORATION METHOD USING METAL FOR BETTER CD CONTROLLABILITY AND CU FILING - Methods of making interconnect structures are provided. In one aspect of the innovation, when forming a trench or via in a dielectric layer, the sidewall surface of another via and/or trench is covered with a metal oxide layer. The metal oxide layer can prevent and/or mitigate surface erosion of the sidewall surface. As a result, the methods can improve the controllability of critical dimensions of the via and trench. | 2010-12-23 |
20100323515 | Method for making semiconductor electrodes - Disclosed is a method for making semiconductor electrodes. In the method, there is provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut from the photo-resist, thus forming semiconductor electrodes. | 2010-12-23 |
20100323516 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Disclosed is a semiconductor device including: a substrate; a wiring layer formed on the substrate and made of copper or a copper alloy; a copper diffusion barrier film formed on the wiring layer and made of an amorphous carbon film formed by CVD using a processing gas containing a hydrocarbon gas; and a low-k insulating film formed on the copper diffusion barrier film. | 2010-12-23 |
20100323517 | MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE - Cobalt is added to a copper seed layer, a copper plating layer, or a copper capping layer in order to modify the microstructure of copper lines and vias. The cobalt can be in the form of a copper-cobalt alloy or as a very thin cobalt layer. The grain boundaries configured in bamboo microstructure in the inventive metal interconnect structure shut down copper grain boundary diffusion. The composition of the metal interconnect structure after grain growth contains from about 1 ppm to about 10% of cobalt in atomic concentration. Grain boundaries extend from a top surface of a copper-cobalt alloy line to a bottom surface of the copper-cobalt alloy line, and are separated from any other grain boundary by a distance greater than a width of the copper-cobalt alloy line. | 2010-12-23 |
20100323518 | METHOD FOR PRODUCING A NANOPOROUS LAYER - The invention relates to a method for producing a nanoporous layer, wherein a layer made of gold and silver is deposited onto a substrate, particularly in an electrochemical or galvanic fashion, wherein the composition of said layer lies between 20% and 40% gold and 80% to 60% silver. The silver is subsequently selectively removed in order to obtain a nanoporous gold layer. | 2010-12-23 |
20100323519 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUITABLE FOR FORMING WIRING USING DAMASCENE METHOD - (a1) A concave portion is formed in an interlayer insulating film formed on a semiconductor substrate. (a2) A first film of Mn is formed by CVD, the first film covering the inner surface of the concave portion and the upper surface of the insulating film. (a3) Conductive material essentially consisting of Cu is deposited on the first film to embed the conductive material in the concave portion. (a4) The semiconductor substrate is annealed. During the period until a barrier layer is formed having also a function of improving tight adhesion, it is possible to ensure sufficient tight adhesion of wiring members and prevent peel-off of the wiring members. | 2010-12-23 |
20100323520 | Method of Forming Patterns of Semiconductor Device - A method of forming patterns of a semiconductor device comprises forming a number of first insulating patterns that define sidewalls by patterning a first insulating layer formed over a semiconductor substrate, forming second insulating patterns, each second insulating pattern comprising a horizontal portion having two ends and being parallel to the semiconductor substrate and spaced protruding portions protruding from both ends of the horizontal portion parallel to the sidewalls of the first insulating patterns, forming third insulating patterns each filling a space between the protruding portions, removing the protruding portions to form trenches, and forming conductive patterns within the respective trenches. | 2010-12-23 |
20100323521 | PATTERNING METHOD - A patterning method has a mask layer and undoped patterns sequentially formed on a target layer. A doping process is performed to surfaces of the undoped patterns to form doped patterns from the surfaces of the undoped patterns. A material is filled in the gaps between the doped patterns. A portion of the doped patterns are then removed to expose the top surfaces of the remaining undoped patterns. The material and the exposed undoped patterns are removed. A portion of the mask layer is removed using the remaining doped patterns as a mask to form a first pattern on the mask layer. A portion of the target layer is removed using the mask layer having the first pattern thereon as a mask so as to form on the target layer a second pattern complementary to the first pattern. | 2010-12-23 |
20100323522 | Polishing composition and polishing method - To provide a polishing composition which has a high removal rate and enables to suppress occurrence of dishing and erosion, in polishing of a surface to be polished in the production of a semiconductor integrated circuit device. A chemical mechanical polishing composition for polishing a surface to be polished of a semiconductor integrated circuit device comprises (A) fine oxide particles, (B) pullulan, and (C) water. The polishing composition further contains (D) an oxidizing agent, and (E) a compound represented by the formula 1: | 2010-12-23 |
20100323523 | Methods Of Plasma Etching Platinum-Comprising Materials, Methods Of Processing Semiconductor Substrates In The Fabrication Of Integrated Circuitry, And Methods Of Forming A Plurality Of Memory Cells - A platinum-comprising material is plasma etched by being exposed to a plasma etching chemistry that includes CHCl | 2010-12-23 |
20100323524 | Method of etching the back side of a wafer - To etch the back side of a wafer, the front side of the wafer is first coated with a positive photoresist to form a protective film. The surface of the protective film is hardened by heating, or by heating and ultraviolet curing. The wafer is then placed in a plasma etching apparatus with the hardened surface of the protective film in contact with an electrode of the etching apparatus, and the back side of the wafer is patterned by plasma etching. When the etching is completed, the front side of the wafer is separated from the electrode and the wafer is removed from the plasma etching apparatus. The hardened positive photoresist prevents the wafer from sticking to the electrode. | 2010-12-23 |
20100323525 | CD BIAS LOADING CONTROL WITH ARC LAYER OPEN - A method for etching a line pattern in an etch layer disposed below an antireflective coating (ARC) layer below a patterned mask is provided. The method includes opening the ARC layer, in which an ARC opening gas comprising CF3I, a fluorocarbon (including hydrofluorocarbon) containing gas, and an oxygen containing gas are provided, a plasma is formed from the ARC opening gas to open the ARC layer, and providing the ARC opening gas is stopped. Line pattern features are etched into the etch layer through the opened ARC layer. | 2010-12-23 |
20100323526 | METHOD OF PROCESSING SILICON SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE FOR LIQUID DISCHARGE HEAD - A method of processing a substrate including the following steps: providing a silicon substrate that has an etching mask layer with an opening portion at a first surface thereof and has plane orientation of {100} with the surface of the silicon being exposed from the opening portion; preparing a recessed portion that faces from the first surface to a second surface, which is an opposite surface of the first surface, in the opening portion of the silicon substrate; and forming a penetration port that passes through the first surface and the second surface of the silicon substrate by executing crystalline anisotropic etching in the silicon substrate using an etching liquid in which an etching rate for etching a (100) surface of silicon is higher than an etching rate for etching a (110) surface of silicon, from the recessed portion of the silicon substrate toward the second surface. | 2010-12-23 |
20100323527 | Selection and deposition of nanoparticles using CO2-expanded liquids - A method for size selection of nanostructures comprising utilizing a gas-expanded liquids (GEL) and controlled pressure to precipitate desired size populations of nanostructures, e.g., monodisperse. The GEL can comprise CO | 2010-12-23 |
20100323528 | Semiconductor manufacturing apparatus and method for manufacturing a semiconductor - Provided are a semiconductor manufacturing apparatus and method, capable of reliably and rapidly transporting a heated semiconductor wafer. the apparatus is provided for transporting a semiconductor wafer, which has been processed by desired treatment (for example, film formation) and is held by a susceptor equipped with a heater, to the outside by a transport arm which holds the semiconductor wafer by suction, by moving the susceptor to a certain position above a top of a wafer waiting stage and introducing the semiconductor wafer held by the susceptor onto the top of the wafer waiting stage. Then, the susceptor present on the top of the wafer waiting stage is moved in a horizontal direction. After a certain cooling time, the transport arm holds the semiconductor wafer placed on the wafer waiting stage by suction and transports the semiconductor wafer to outside. | 2010-12-23 |
20100323529 | METHOD FOR FORMING INSULATING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for forming an insulating film includes a step of preparing a substrate, which is to be processed and has silicon exposed on the surface; a step of performing first nitriding to the silicon exposed on the surface of the substrate, and forming a silicon nitride film having a thickness of 0.2 nm but not more than 1 nm on the surface of the substrate; and a step of performing first heat treatment to the silicon nitride film in N | 2010-12-23 |
20100323530 | MODIFIER FOR LOW DIELECTRIC CONSTANT FILM, AND METHOD FOR PRODUCTION THEREOF - There is provided a modifier for lowering relative dielectric constant of a low dielectric constant film used in semiconductor devices, the modifier of the low dielectric constant film being characterized in that it contains as an effective component a silicon compound represented by formula (1) | 2010-12-23 |
20100323531 | METHOD FOR FORMING INSULATING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for forming an insulating film includes a step of preparing a substrate, which is to be processed and has silicon exposed on the surface, a step of performing oxidizing to the silicon on the surface, and forming a silicon oxide thin film on the surface of the silicon, a step of performing first nitriding to the silicon oxide film and the base silicon thereof, and forming a silicon oxynitride film, and a step of performing first heat treatment to the silicon oxynitride film in N | 2010-12-23 |
20100323532 | METHOD OF THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE - The present invention generally describes one ore more methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed. | 2010-12-23 |
20100323533 | WIRE TO BOARD CONNECTOR - An electrical connector for connecting wires to components includes an insulative body member having a longitudinally extending leg defined between opposite longitudinal ends. A plurality of spaced apart side walls define adjacently disposed connector positions along the leg. A wire insertion opening is defined in a front wall of the body member at each of the connector positions. A connector element is disposed transverse to the leg at each of the connector positions. The connector element includes a first resilient contact arm extending above the side walls for pressing mating contact with a conductive pad of a separate respective component. The connector element includes a second resilient contact arm in biased engagement against a shoulder of the body member. Upon insertion of an exposed conductive wire core through the wire insertion opening, the wire core causes the second resilient contact arm to flex towards and remain in biased electrical contact engagement against the wire core. | 2010-12-23 |
20100323534 | APPARATUS FOR PCI EXPRESS ADD-IN CARD RETENTION - Apparatus for PCI express add-in card retention into PCI express female connector. Said apparatus prevents wiggling of PCI express add-in cards in case the PCI express connector has retention ridge or not. | 2010-12-23 |
20100323535 | System and Apparatus for Reducing Crosstalk - An electrical system includes a backplane, a first electrical component, and a second electrical component. The backplane includes a first column of connectors, a second column of connectors, a third column of connectors, and a fourth column of connectors. The backplane also includes a first plurality of conductive paths that couple the connectors in the first column to an alternating sequence of connectors in the third column and the fourth column. Additionally, the backplane includes a second plurality of conductive paths that couple the connectors in the second column to an alternating sequence of connectors in the fourth column and the third column. The first electrical component couples to the backplane through the first column and the second column. The second electrical component couples to the backplane through the third column and the fourth column. | 2010-12-23 |
20100323536 | BACKPLANE SYSTEM HAVING HIGH-DENSITY ELECTRICAL CONNECTORS - A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane. | 2010-12-23 |
20100323537 | Electrical connector having reversible wire dress - An electrical connector assembly is disclosed having a main housing portion, camming slide mounting in camming slide receiving guides of the main housing portion, a wire guide and a lever. The lever is operably coupled to the camming slides to translate the camming slides upon rotation of the lever. The lever is mounted to the wire guide, and the combination of the wire guide and the lever are reversible to reverse the orientation of the wires in the wire dress. | 2010-12-23 |
20100323538 | CONNECTOR ASSEMBLY HAVING ALIGNMENT MEMBERS FOR HOLDING A MODULE - An electrical connector for electrically coupling an electronic module and an electrical component. The connector includes a substrate that has first and second surfaces separated by a thickness. The substrate includes interconnects that extend through the substrate and are arranged in an array. The interconnects are configured to engage the module along the first surface and engage the electrical component along the second surface. The connector also includes alignment members that extend through openings in the substrate. The alignment members include heads that project beyond and away from the first surface. The heads are located about the substrate relative to each other to collectively form a module reception area therebetween to hold the module in a predetermined position and orientation with respect to the first surface and with respect to the interconnects. | 2010-12-23 |
20100323539 | RELAY MODULE, ELECTRICAL CENTER HAVING A RELAY MODULE AND METHOD OF ASSEMBLYING THE SAME - An electrical center includes a housing and a relay module that is disposed in a well of the housing. The relay module has a lower base, a printed circuit board assembly, plug in electronic components and a cover. The lower base includes a tray having a depending shroud at one end portion and a pair of laterally spaced couplers that are integrally attached to an end wall of the tray. The end portion of the tray that has the depending shroud has a plurality of apertures that extend through the end portion of the tray for receiving terminal portions that extend through the apertures. An opposite end portion of the tray has an upper pedestal that is part of a connector body that extends through the tray to a lower socket. The printed circuit board assembly has a printed circuit board that is attached to the top of the tray near a side edge, a plurality of relays that are attached to an upper portion of the printed circuit board. The relays are electrically connected to a plurality of terminals that are disposed beneath the relays. These terminals have portions that plug into the apertures and terminate in free ends disposed inside the shroud. The relay module also includes plug in electronic components that are plugged into the end portion of tray so that their metal terminal tabs extend through the apertures and into the space inside the shroud. The relay module also includes a main relay that is mounted on the pedestal for electrical connection to a wiring harness that plugs into the lower socket of the connector body. The relay module is retained in the well of the housing by an internal lock bar that engages the couplers at one end and an internal lock nib that engages a flexible lock arm of the relay module the other end. | 2010-12-23 |
20100323540 | MEHTOD AND APPARATUS FOR GROUNDING AND MOUNTING A HIGH AMPERAGE SINGLE POLE CONNECTOR - A combination grounding/mounting connector and method for mounting an electrical receptacle adapted to receive an electrical current carrying cable connector to a panel. The combination grounding/mounting connector device includes a first portion passing through an aperture formed in the receptacle and the panel for engaging a device for securing the electrical receptacle to the panel, the first portion accommodating connection to an electrical ground; and, a second portion providing an electrical ground connector when the first portion is connected to an electrical ground. | 2010-12-23 |
20100323541 | COAXIAL CABLE PORT LOCKING TERMINATOR AND METHOD OF USE THEREOF - Disclosed herein is a coaxial cable interface port locking terminator including an outer terminator housing and an inner connector body housed within the outer terminator housing. The coaxial cable interface port locking terminator further includes a ratcheting device in operable communication with the outer terminator housing and the inner connector body, the ratcheting device preventing rotation of the outer terminator housing with respect to the inner connector body when the outer terminator housing is rotated in the first direction, the ratcheting device including at least one separate component from the outer terminator housing and the inner connector body. Furthermore, rotation of the outer terminator housing in a second direction does not cause rotation of the inner connector body in the second direction. | 2010-12-23 |
20100323542 | ELECTRICAL CONNECTOR - An electrical connector assembly includes a first connector including a first housing having a contact and a second connector configured for connection with the first connector, wherein the second connector includes a second housing having a conductor. The first connector is configured for connection to the second connector in at least a first position and a second position. In the first position, the first connector is connected to the second connector, and the conductor of the second connector is not in electrical contact with the contact in the first connector. In the second position, the first connector is connected to the second connector, and the conductor of the second connector is in electrical contact with the contact in the first connector. | 2010-12-23 |
20100323543 | CARD CONNECTOR WITH LOCKING MECHANISM - An electrical card connector ( | 2010-12-23 |
20100323544 | ELECTRICAL CONNECTOR - A connector includes a housing, a pair of headers, a pair of crank levers, a pair of ejectors, and a pair of clip arms. When a printed substrate is inserted into the housing, the pair of crank levers is caused to pivot so as to raise the pair of ejectors. Then, by moving the pair of clip arms from a third groove to a second groove at which the width is narrower, a pair of projections fits a pair of locking holes so as to sandwich both sides of the printed substrate. The connector can securely lock the printed substrate since the header prevents widening of the distance of the pair of projections even in a case in which a force aimed to detach the printed substrate from the housing works is acting thereon. | 2010-12-23 |
20100323545 | Cable Clamp - The invention relates to electrical connector systems, in particular for airbag ignition systems, including a first connector provided with a plug-portion and a retainer adapted to act together with the plug-portion. The retainer further comprise includes a sleeve portion which is adapted to be arranged in a mating connector socket and which is in turn adapted to receive at least a part of the plug-portion of the first connector therein. The connector system includes a first sealing member adapted to provide a sealing between the sleeve portion and inner walls of the mating connector socket; and a second sealing member, which is adapted to be arranged between the retainer and the first connector to provide a sealing between retainer and first connector. | 2010-12-23 |
20100323546 | RUGGED REGISTERED JACK CONNECTION - Systems and methods are disclosed that include a first registered jack and a junction coupled to the first registered jack. These systems and methods also include a first source unit connected to the junction and a first layer encasing at least part of the first registered jack, the junction, and the first source unit. In addition, these systems and methods include an o-ring preventing surrounding the first layer and a housing encasing the first layer and the o-ring. | 2010-12-23 |
20100323547 | CORDSET ASSEMBLY - An extension cordset assembly includes a receptacle and a sealing gasket. The receptacle includes a receptacle main body, a receptacle connecting interface and first and second spade mating holes extending into the receptacle main body from the receptacle connecting interface. The receptacle is configured to mate with a plug having a standard spade configuration. The sealing gasket is positioned on the receptacle connecting interface and includes first and second spade openings aligned with the first and second spade mating holes, respectively. The sealing gasket is configured to provide a water-resistant seal between the receptacle and the plug. | 2010-12-23 |
20100323548 | DEVICE FOR LATCHING A CONNECTOR DEVICE AND ASSOCIATED TOOL - The invention related to a device ( | 2010-12-23 |
20100323549 | CONNECTOR PROTECTIVE COVER - A connector protective cover is provided which has a pair of cover members ( | 2010-12-23 |
20100323550 | CONNECTORS FOR ELECTRIC CORDS - An electrical connection device includes a first connector and a second connector capable of being mechanically and electrically connected to the first connector. A lock mechanism can lock the connection between the first and second connectors. The first connector has a cover capable of covering a connecting region between the first and second connectors. The second connector has an unlock device operable to unlock the lock mechanism. The unlock device is positioned not to interact with the cover when the first and second connectors are connected to each other. | 2010-12-23 |
20100323551 | SHARPENED, ORIENTED CONTACT TIP STRUCTURES - An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component. | 2010-12-23 |
20100323552 | PUMPING ASSEMBLY - Electric fuel pumps are already known with a pump housing and a ground terminal, which is provided on a terminal cover, for making contact with an electrical ground, in which the pump housing and the ground terminal are connected to one another via a ground connection, which has a first contact section for making contact with the pump housing and a second contact section for making contact with the ground terminal. The first contact section is provided on the outer circumference of a terminal cover and, after installation, is pressed with a contact pressure against the inner face of the pump housing. Since the inner face of the pump housing has increasingly been provided with an electrically insulating anticorrosion coating, however, when the terminal cover is pressed into the pump housing, touching contact with the pump housing does take place which is usually also electrically conductive, but as a result of the electrically insulating coating has a high electrical resistance. In the case of the conveying assembly according to the invention, the impedance of the contact-making is reduced. The invention provides that the first contact section is designed to have sharp edges in such a way that, when it is pushed into the pump housing, it passes locally through an electrically insulating layer formed on the pump housing. | 2010-12-23 |
20100323553 | Temperature Compensation Element for a Connection Unit - The aim of the invention is to reduce the temperature gradient at the connection terminals of a connection unit to which lines can be joined. The inventive temperature compensation element is made of at least one first strip of thermally conducting material on which terminal lugs are arranged in a row at essentially right angles to the strip and are insulted in relation to each other and the strip. The terminal lugs are connected to the strip in a thermally conductive manner and can be respectively contacted to the lines with corresponding contact terminals of the connection unit. | 2010-12-23 |
20100323554 | Connector structure - The present invention provides a connector structure, in which a connector is structured from a housing, a base and terminals, and the base and a plurality of the terminals are embedded in the housing. The base is structured from a first base and a second base, wherein the first base is internally configured with a plurality of ribs corresponding to first terminals. Accordingly, when the first terminals are assembled within the first base, a plurality of guide grooves of the first terminals accommodate the plurality of ribs within the first base, thus causing the guide grooves to extend over the ribs and become disposed within the first base, moreover, in conjunction with clasping of the second base, strengthening fixture of the first terminals, thereby preventing the first terminals from falling off due to frequent unplugging and plugging of the connector for a long period of time. | 2010-12-23 |
20100323555 | Meter Collar - A meter adapter in the form of a collar interposed between meter and associated socket, provides a smooth curved jaw configuration for meter terminal blades, and branch fuse safety features. | 2010-12-23 |
20100323556 | BACKLIGHT UNIT AND LAMP SOCKET THEREOF - A lamp socket includes a socket body, a flange and a plurality of support members. The flange is connected to the socket body and protrudes from the socket body horizontally. The plurality of support members are connected to the socket body. At least one engaging groove including at least two engaging widths is formed between the plurality of the support members and the flange, so as to secure the socket body to a bezel. | 2010-12-23 |
20100323557 | FLUID RESISTANT CONNECTOR AND SYSTEM - An elastomer moisture resistant connector for at least one conductor disposed at least partially within a jacket of elastomer material. The connector has a first elastomer portion, which has a first end and a second end. The first end of the first elastomer portion is adapted to be compressed against a support. The connector also has a second elastomer portion that is integrally molded with the first elastomer portion and extends from the second end of the first elastomer portion, and is configured to enclose at least a portion of the jacket. The connector also has a third elastomer portion that is integrally molded with the first elastomer portion, protrudes from the second end of the first elastomer portion, and is adapted to be compressed by an enclosure. | 2010-12-23 |
20100323558 | HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKAGING STRUCTURES - A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array. | 2010-12-23 |
20100323559 | COUPLER WITH UNIVERSAL ADAPTORS FOR ELECTRICITY, COMPRESSED AIR, FLUIDS, AND DATA - This invention provides a coupler having universal adaptors for compressed air, fluid, electricity, and/or data that enable a user to connect existing hoses or cords to the coupler, which is attached to a door base and/or window sash, thus allowing the door and/or window to be fully opened and closed. The body of the coupler is a U shaped clamp. The body has a thin base plate that is positioned under the door and/or window and two walls that contain electrical/pneumatic/data connectors. In one embodiment, the body is made of a durable plastic. The clamp is tightened via a tension screw with an adjustment knob or by a screwdriver. Embedded within the body are channels that allow passage of electricity, air, fluid, and/or data packets. | 2010-12-23 |
20100323560 | Audio Jack Connector - An audio jack connector has an insulating housing. The insulating housing has an inserting hole extending from a front to rear for receiving the audio plug connector and a plurality of recesses communicating with the inserting hole for receiving a plurality of terminals. An elastic body which is disposed in the inserting hole perpendicular to an extending direction of the inserting hole has two opposite tightening arms and a connecting portion interconnected with opposite ends of the tightening arms. A front end of the audio plug connector passes through the elastic body and is restrained by the elastic body. Two tightening arms of the elastic body are against the portions of the front end of the audio plug connector from opposite directions, when the audio plug connector is inserted into the inserting hole of the insulating housing. | 2010-12-23 |
20100323561 | ELECTRICAL CONNECTORS AND METHODS OF MANUFACTURING AND USING SAME - An electrical connector forms electrical contact by tightening of a movable, electrically-conductive spiral around un-insulated wire or wires. The spiral coils around the wire multiple times and tightens on the wire(s) when either one or the other end, or both ends, of the spiral is/are rotated relative to the other. One region of the spiral is preferably fixed to an insulating housing, while another region of the spiral may be rotated for the tightening on the wire and then preferably latched to the housing so that \the spiral remains in the tightened condition. A terminal end may extend from the spiral, or connectors without a terminal end may be used to electrically connect wires to each other that extend from and to other equipment not located on the connector itself. Multiple spirals may be provided in one connector, including spirals that tighten around separate wires at opposite ends of the connector. The connectors may be tightened quickly by hand, without tools, as one hand may grasp the housing or a housing portion, while the terminal end or another housing portion fixed to an end of the spiral (and consequently the spiral coils along with it) is twisted by the other hand. | 2010-12-23 |
20100323562 | ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR HOUSING - An electrical connector includes a terminal assembly, a housing body, a first rib member and a second rib member. The terminal assembly includes a terminal mounting block and at least one terminal mounted therein. The housing body surrounds the terminal assembly and is connected to the terminal mounting block. The housing body and the terminal mounting block define a cavity with the at least one terminal projecting into the cavity from the terminal mounting block. The housing body has a top wall, a bottom wall and a pair of side walls disposed apart from one another to interconnect the top and bottom walls. The first and second rib members are connected to respective ones of the pair of side walls and extend longitudinally. The first and second rib members are disposed between the top wall and the bottom wall. An electrical connector housing is also described. | 2010-12-23 |
20100323563 | High Power Fuse Terminal with Scalability - A female terminal receptor for an automotive fuse or a terminal includes three or more pairs of opposing beams and at least one U-shaped clamping member. The U-shaped clamping member has a first base portion laterally disposed between two pairs of opposing beams and at least one pair of first end portions disposed over at least one pair of opposing beams for applying a predetermined compression force. The opposing beams have a first metallic composition and the U-shaped clamping member has a second metallic composition, wherein the first metallic composition has a higher conductivity than the second metallic composition, and wherein the second metallic composition has a higher relaxation temperature than the first metallic composition. | 2010-12-23 |
20100323564 | Bifurcated Electrical Contact - A bifurcated electrical contact includes first and second contact beams of different beam lengths and contact zones curved transverse to the beam lengths. | 2010-12-23 |
20100323565 | Drive Device for a Watercraft - The invention relates to a drive device ( | 2010-12-23 |
20100323566 | KORT NOZZLE - In order to indicate a Kort nozzle configured rotatable around the rudder axis of a ship, for which the occurrence of recirculations or of swirls is avoided or reduced even with an angular position with respect to a longitudinal axis of the ship and a globally uniform flow pattern adjusts as far as possible, at least one opening is provided in each of two central areas of a nozzle ring enveloping a ship's propeller. | 2010-12-23 |
20100323567 | ADJUSTABLE FLEX WATERBOARD STRINGER - A waterboard with externally adjustable stiffness includes a stringer assembly having a rotatable beam to modulate the stiffness of the beam in a selected direction to impart a desired stiffness to the waterboard. | 2010-12-23 |
20100323568 | Foldable Watercraft Fin - Foldable or collapsible watercraft fins are described. Preferred examples of such fins are foldable surfboard, paddleboard, and kayak fins, one or more of which can be attached to a surfboard, paddleboard, or kayak. | 2010-12-23 |
20100323569 | Water Safety Airbag Structure - The present invention relates to an improved water safety airbag structure, which includes a case, a bag and a holding receptacle, and the bag provided with the holding receptacle is retained within the case. The bag and the holding receptacle are respectively filled with a powdered chemical and an acidic chemical liquid. When the user is in difficulties during activities on the water, oppositely directed external forces can be applied to the bag and two sides of the holding receptacle, thereby causing the powdered chemical and acidic chemical liquid within the bag and the holding receptacle to mix and produce a large amount of gas to inflate the bag, thus achieving the effectiveness to save the life of the person in difficulties on the water. | 2010-12-23 |
20100323570 | COPOLYMERS OF NANOPARTICLES, VINYL MONOMERS AND SILICONE - A copolymer comprises the reaction product of (a) (meth)acrylate functionalized nanoparticles, (b) vinyl monomer, and (c) silicone macromer. The (meth)acrylate functionalize nanoparticles are selected from the group consisting of silica nanoparticles, zirconia nanoparticles, titania nanoparticles, and combinations thereof. | 2010-12-23 |
20100323571 | APPLICATION OF MATERIALS TO FORM A MULTI-LAYER PRODUCT - A method of producing a multi-layer product that includes an extruded polymeric layer comprising an enhancer composition is disclosed. The disclosed product is produced by applying an enhancer composition ( | 2010-12-23 |
20100323572 | Fires Resistant Composite Material And Fabrics Made Therefrom - The present invention relates to fire resistant composite materials and to fire resistant fabric materials and mattresses made therefrom. The composite materials include (a) a substrate selected from the group consisting of cotton, rayon, lyocell and blends thereof; and (b) a coating consisting essentially of water, ammonium polyphosphate, binder material, cross-linking material, thickener material and a catalyst. The binder material bonds the ammonium polyphosphate, cross-linking material, thickener material and catalyst together and to the substrate such that the substrate is coated with the coating. | 2010-12-23 |
20100323573 | High flux and low fouling filtration media - Membranes suitable for microfiltration, ultrafiltration (UF) and nanofiltration (NF) filters are provided. Such membranes may include a nanofibrous scaffold, optionally in combination with a non-woven substrate and/or a coating of a polymer and a functionalized nanofiller. Suitable membranes may also include a coating of a polymer and a functionalized nanofiller on a substrate, which can include a non-woven membrane, a nanofibrous scaffold, or both. | 2010-12-23 |
20100323574 | 3D COMPOSITE FABRIC - A fabric includes a base pattern having at least twenty-eight weft fibers disposed in a staggered configuration and forming eight columns that comprise in alteration four weft fibers and three weft fibers, the weft fibers extending in seven layers. The fabric further includes at least twelve warp fibers disposed in at least four offset parallel planes, each of the planes containing at least three parallel warp fibers that follow paths that are distinct from one another. | 2010-12-23 |
20100323575 | BIODEGRADABLE FIBERS FORMED FROM A THERMOPLASTIC COMPOSITION CONTAINING POLYLACTIC ACID AND A POLYETHER COPOLYMER - A biodegradable fiber for use in forming a nonwoven web is provided. The fiber is formed from a thermoplastic composition comprising at least one polylactic acid in an amount from about 75 wt. % to about 99 wt. % and at least one polyether copolymer in an amount from about 1 wt. % to about 25 wt. %, wherein the polyether copolymer contains from about 40 mol. % to about 95 mol. % of a repeating unit (A) having the following formula. wherein, x is an integer from 1 to 250, the polyether copolymer further containing from about 5 mol. % to about 60 mol. % of a repeating unit (B) having the following formula. wherein, n is an integer from 3 to 20; and y is an integer from 1 to 150. Such polyether copolymers have been found to improve a variety of characteristics of the resulting thermoplastic composition, including its ability to be melt processed into fibers and webs, as well as its sensitivity to moisture. | 2010-12-23 |
20100323576 | Fabricating Method of Flexible Display Device - In a fabricating method of flexible display device, firstly, a sacrificial layer is formed on a first rigid substrate. Secondly, a first flexible substrate is formed on the sacrificial layer. The bonding force of the sacrificial layer absorbing a breaking-bond light may be broken and the first flexible substrate is transparent for the breaking-bond light. Moreover, the transmission rate of visible light of the first flexible substrate is larger than that of the sacrificial layer. Then, the sacrificial layer is illuminated by the breaking-bond light for breaking the bonding force of the sacrificial layer to separate the first rigid substrate from the first flexible substrate. Since the first rigid substrate has a high transmission rate of visible light, may be separated from the first flexible substrate by the first breaking-bond light with low energy, the cost of fabricating the flexible display device may display the images with real color. Therefore, the chromatic performance of the flexible display device may be enhanced. | 2010-12-23 |
20100323577 | METHOD FOR PRODUCING PLASMA DISPLAY PANEL - The present invention provides a method for producing a plasma display panel, including a step of providing a back substrate with a barrier rib to form a plurality of recesses separated each other by the barrier rib, and a step of applying a phosphor ink to the recesses using an inkjet device, wherein the phosphor ink contains a phosphor having a median particle diameter of not less than 1.0 μm, and a solvent, and an initial speed of the phosphor ink ejected from a nozzle hole of the inkjet device is not less than 4 m/s and not more than 10 m/s. | 2010-12-23 |
20100323578 | SYSTEM AND METHOD FOR REDIRECTING SMOKE EFFECTS IN A MODEL VEHICLE - A system and method is provided for selectively directing smoke in a model train or other model vehicle. In one embodiment, a directional fan is used to guide smoke to one of at least two output ports. When the fan is rotated in a first direction, air is drawn in through a first port and smoke is directed out of a second port. When the fan is reversed, the flow of air is reversed to draw air in through the second port and to direct smoke out through the first port. In another embodiment, multiple blower units are connected to a common smoke generating unit and can be selectively operated to direct smoke to plural locations within a model vehicle. The volume an speed of smoke can be variably controlled, and audio effects can be synchronized with smoke visual effects for added realism. | 2010-12-23 |
20100323579 | FOUR-CHANNEL TRANSVERSE DUAL ROTOR HELICOPTER - The present invention provides a four-channel transverse dual rotor helicopter, comprising a frame with a battery encapsulated inside it, an empennage breadthwise located at the afterbody of the frame, an aircraft wheel assembly fixed at the bottom of the frame, wherein, two cantilever bars of left and right are connected to the frame, breadthwise located at the two sides of the frame, and capable of rotating around axes of themselves; the left and right cantilever bars are separately via a group of linkage mechanism connected to left and right steering engines located at the frame for driving the left and right cantilever bars to rotate around axes of themselves; the ends of the left and right cantilever bars are separately provided with a group of rotor wing mechanism; the motors in the two groups of rotor wing mechanism, and the left and right steering engines are connected to a signal receiver located in the frame; the motors are variable speed motors. The present invention is easy to control, so as to make the beginner without controlling foundation also capable of controlling the helicopter to fly stably. At the same time, the simplified mechanical structure of the helicopter reduces the production cost, also greatly improves the performance stability of the helicopter. | 2010-12-23 |
20100323580 | SCULPTURAL CONSTRUCTION SYSTEM - The present invention provides a large variety of pieces having shapes that naturally occur in living things and nature. The objective is to construct art objects sculptures of people, animals, plants and other products of nature rather than representations of man made buildings, amusements or machinery. The assembled art objects have a soft texture due to the predominantly curved parts and almost total absence of straight edges or sharp corners. | 2010-12-23 |
20100323581 | Mobile for Infant Support Structure - A mobile mountable to an infant support structure includes a housing having a drive mechanism, a support arm extending from the housing, and an assembly supported from the support arm. The support arm is connected to the drive mechanism and movable relative to the housing in first and second opposite directions. The assembly includes a hub, a motion portion, and a hanging portion. The motion portion has a resilient component coupled to the hanging portion, which drives the hanging portion in a third direction when the support arm moves in the first direction. | 2010-12-23 |
20100323582 | SMALL VEHICLE ENERGIZED ON HANDHELD LAUNCHER - A toy vehicle assembly that includes a toy vehicle coupled to a hand-held launcher. The launcher includes a manually rotated platform that is rotated by a user. Rotation of the platform causes a mechanism within the toy vehicle to store energy. The user can place the toy vehicle adjacent to a surface and release the vehicle from the launcher. The stored energy then propels the vehicle. | 2010-12-23 |
20100323583 | Support For Tread Band Buffing - An apparatus and method of roughening the sole side surface of a tread band is provided wherein the sole side surface of a tread band is roughened with at least one abrasive roller. The bottom of at least one groove in a tread side of the tread band is supported while the abrasive roller is roughening the sole side surface opposite the supported groove. | 2010-12-23 |
20100323584 | POLISHING LIQUID FOR METAL FILM AND POLISHING METHOD - The invention relates to a polishing liquid for metal film comprising 7.0% by weight or more of an oxidizer for metal, a water-soluble polymer, an oxidized metal dissolving agent, a metal anticorrosive agent and water, provided that the total amount of the polishing liquid for metal film is 100% by weight,
| 2010-12-23 |
20100323585 | Method For Chemically Grinding A Semiconductor Wafer On Both Sides - A semiconductor wafer processed on both sides simultaneously, the wafer lying in freely movable fashion in a cutout in one of a plurality of carriers that rotate by means of a rolling apparatus, and one thereby being moved on a cycloidal trajectory, the semiconductor wafer being processed in material-removing fashion between two rotating ring-shaped working disks, wherein each working disk comprises a working layer comprising abrasive material, and wherein an alkaline medium comprising no abrasive material is supplied during the processing. | 2010-12-23 |
20100323586 | METHODS FOR PRODUCING AND PROCESSING SEMICONDUCTOR WAFERS - Semiconductor wafers are polished by a material-removing polishing process A, on both sides of the wafer, using an abrasive-free polishing pad, and a polishing agent which contains abrasive; and a material-removing polishing process B, on at least one side of the wafer, using a polishing pad with a microstructured surface containing no materials which contact the wafer which are harder than the semiconductor material, and a polishing agent is added which has a pH≧ to 10 and contains no substances with abrasive action. Preferred is a method for producing a semiconductor wafer, comprising the following ordered steps: separating a semiconductor single crystal into wafers; simultaneously processing both sides of the wafer by chip-removing processing; polishing the wafer, comprising a polishing process A and a polishing process B; and CMP of one side of the wafer, removing <1 μm. | 2010-12-23 |
20100323587 | CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS - A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure. | 2010-12-23 |
20100323588 | SYSTEM AND METHOD FOR DRYING GRIT USED FOR ABRASIVE BLASTING - A method and method for processing grit used for abrasive blasting may include receiving grit blasted onto a surface, where the grit includes moisture content. Air in which the grit being recycled is being processed may be heated. The moisture content may be evaporated from the grit using the heated air to produce dry recycled grit. The dried recycled grit may be stored. | 2010-12-23 |
20100323589 | CENTERLESS GRINDING MACHINE - A centerless grinding machine includes a frame with an upper base and includes a driven regulating wheel and a driven grinding wheel mounted to the frame. At least one of the wheels is mounted to the upper base and hangs downwardly from the upper base. At least one of the wheels is indexable laterally along an X direction. The wheels are for supporting and grinding a work piece placed between the grinding wheel and the regulating wheel. Preferably the upper base is spaced from and above the at least one wheel and the regulating wheel and the grinding wheel are operably mounted to the upper base such that the wheels hang downwardly from the upper base. | 2010-12-23 |
20100323590 | GRINDING MACHINE FOR BEARING RINGS - A bearing ring grinding machine having a grinding unit arranged to machine the bearings with micron-size tolerances and reduce a grinding cycle period. The grinding unit includes a fixed plate which supports a horizontally movable loader and sliding carriage. A carriage stopper, in the loader, holds the ring against the plate and between two lateral channels. The fixed plate has an opening for passage of a rotatable spindle, equipped with a magnetizable bush, to support the ring during machining and support stops for automatically positioning the ring on the bush. Initially, the carriage releases a ring to be ground which then passes toward the bush. The ring is then secured, machined, carried by a magnetic carrier of an automatic discharge device. | 2010-12-23 |
20100323591 | SELF-ALIGNING ROTARY BLADE HOLDER FOR SHARPENER - A universal blade sharpening machine is operable to securely hold and sharpen any one of multiple variously sized circular blades. The machine includes a blade-sharpening drive with an adjustable blade sharpener and also includes a universal blade holder that is rotatably powered by the drive. The blade holder includes a blade-receiving chassis that holds the blade during sharpening and is rotatable about a rotation axis of the blade holder. The chassis includes a plurality of radially spaced blade-retaining sections each associated with a respective one of the circular blades. | 2010-12-23 |
20100323592 | Switch Mechanism for a Power Cutter - A switch mechanism includes a support structure and an electric switch having an activator moveable between a first position where the electric switch is ON and a second position where the electric switch is OFF. A cam is connected to a first actuator, moveably mounted on the support structure, so that movement of the first actuator results in movement of the cant A bar is connected to a second actuator, moveably mounted on the support structure, so that movement of the second actuator results in movement of the bar. The cam engages the activator so that movement of the cam by movement of the first actuator results in the activator moving between its two positions. The bar engages the activator so that movement of the bar by movement of the second actuator results in the activator moving between its two positions. | 2010-12-23 |
20100323593 | DUST-PROTECTED HAND-HELD POWER TOOL - A battery-operated hand-held power tool ( | 2010-12-23 |
20100323594 | Grinding disc structure - An improved grinding disc structure includes a support disc having first through holes and second through holes; a main disc body, with a distal surface connected onto the support disc, and having dust exhaust holes, a longitudinal guiding portion at the center, and a longitudinal guiding portion with outwardly extended transverse guiding portions and each dust exhaust hole corresponding to each first through hole, and each transverse guiding portion corresponding to each second through hole, and each transverse guiding portion being not interconnected with each dust exhaust hole; a grinding layer, disposed on another distal surface of the main disc body, and having through holes corresponding to each dust exhaust hole and the longitudinal guiding portion, such that each dust exhaust hole and the longitudinal guiding portion achieve the dust collection effect for the external portion and center of the grinding disc. | 2010-12-23 |
20100323595 | HAND-HELD POWER TOOL, IN PARTICULAR HAND-GUIDED GRINDING MACHINE - A protective guard is provided for a hand-held power tool, in particular a hand-guided grinding machine. According to the invention, the tool is at least partially covered by the protective guard. The guard is supported in an elastically flexible fashion in the circumference direction of the bearing journal by means of a spring means that prestress locking elements of a locking mechanism in their engaged positions. | 2010-12-23 |
20100323596 | NOTCHED GRIND WHEEL AND METHOD TO MANUFACTURE A ROTOR BLADE RETENTION SLOT - A grind wheel includes a rim having at least one notch formed in the rim to grind a slot base of a blade retention slot within a rotor disk. | 2010-12-23 |
20100323597 | APPARATUS FOR PRECISION STEELING/CONDITIONING OF KNIFE EDGES - A knife edge enhancing apparatus includes a support having a support surface and knife blade clamping structure mounted to the support and located above the support surface. An object having a knife edge modifying surface which could be abrasive or non-abrasive is mounted to a holder which is freely slidable on the support surface so that the object surface can be manually moved into contact with a knife edge facet. At least one of the clamping structure and the object surface is angularly adjustable to control the angle of contact of the object surface with the knife edge facet. | 2010-12-23 |
20100323598 | APPARATUS TO AID IN THE EVISERATION OF FOOD ANIMALS AND METHOD FOR ITS USE - The current invention is an apparatus that can be used by hunters or slaughterhouses to reduce the risk of contamination during evisceration of an animal. | 2010-12-23 |